CN102082072A - Gas injection device and processing chamber equipped with the gas injection device - Google Patents

Gas injection device and processing chamber equipped with the gas injection device Download PDF

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Publication number
CN102082072A
CN102082072A CN2010101242387A CN201010124238A CN102082072A CN 102082072 A CN102082072 A CN 102082072A CN 2010101242387 A CN2010101242387 A CN 2010101242387A CN 201010124238 A CN201010124238 A CN 201010124238A CN 102082072 A CN102082072 A CN 102082072A
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China
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mentioned
supporting bracket
connecting block
gas
gas injection
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CN2010101242387A
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CN102082072B (en
Inventor
李敦熙
金范城
河周一
马熙铨
金东建
卢东珉
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TESCO Ltd
TES Co Ltd
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TESCO Ltd
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
    • C23C16/45563—Gas nozzles
    • C23C16/45565—Shower nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/3244—Gas supply means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Abstract

The invention provides a gas injection device and a processing chamber equipped with the gas injection device, wherein the deformation and damage of the gas injection plate is avoided.The gas injection device comprises a support plate equipped with a gas inlet, a gas injection plate, a plurality of connection blocks and an isolating film.The gas injection plate arranged at a distance from the support plate is equipped with a plurality of gas injection holes for injecting the gas flowing through the gas inlet toward the direction of the substrate to be processed.The connection blocks are arranged along the edge of the gas injection plate at intervals.One ends of the connection blocks are fixed to the gas injection plate and the other ends thereof are supported by the support plate, so that the connection blocks can move along with the thermal deformation of the gas injection plate.The isolating film formed among the connection blocks along the edge of the gas injection plate is used for sealing the space between the support plate and the gas injection plate.According to the above structure, the breakage caused by the thermal deformation of the gas injection plate can be avoided, thereby improving the deposition uniformity.

Description

Gas injection apparatus and possess the process chamber of this gas injection apparatus
Technical field
The present invention relates to gas injection apparatus and possess the process chamber of this gas injection apparatus, in more detail, relate on large-area processed substrate the gas injection apparatus of spray technology gas equably, and the process chamber that possesses this gas injection apparatus.
Background technology
Generally speaking, when products such as manufacturing liquid crystal indicator, solar cell, need to carry out the operation of the various types of films of deposition on processed substrates such as glass substrate, and to the deposition film carry out various manufacturing processes such as etched operation, these operations are carried out in the substrate board treatment that optimum condition is provided for corresponding operation.Especially, film forming operation on processed substrate, mainly (Chemical Vapor Deposition, CVD) device is finished by utilizing isoionic chemical vapour deposition (CVD).
Usually, the CVD device comprises: base plate supports portion, be formed at the inner space of process chamber, and be used for supporting and heating processed substrate; And gas injection apparatus, be formed at the top of base plate supports portion, be used for to processed substrate spray technology gas.Gas injection apparatus comprises: supporting bracket is formed with the gas inlet; The gas blowing plate is combined on the supporting bracket with supporting bracket separated by a distancely, is formed with a plurality of spray-holes that are used for gas jet.Gas by the gas inflow entrance that is formed on the supporting bracket flows into after the spatial diffusion between supporting bracket and gas jet tray, by the spray-hole of gas blowing plate, is ejected on the processed substrate equably.
In addition, in order to improve the efficient of thin film deposition, handle under about high temperature more than 200 ℃, therefore, in processing procedure, the gas blowing plate also is heated, and causes temperature to rise.Be heated if be fixed in the gas blowing plate of supporting bracket or chamber body,, the thermal deformation of gas blowing plate can take place then because of thermal expansion and contraction.Especially, along with the maximization of processed substrate, it is big that the gas blowing plate also becomes thereupon, and the temperature distortion of large-scale gas blowing plate is more serious, can reduce the thickness evenness of deposit film, when serious even gas blowing plate problems of crack can take place.
Summary of the invention
Therefore, the present invention makes in view of aforesaid problem points, and its purpose is to provide a kind of gas injection apparatus, can prevent the breakage that the gas blowing plate causes because of thermal deformation, improves deposition uniformity.
In addition, the invention provides the process chamber that possesses the above-mentioned gas injection apparatus.
A kind of gas injection apparatus provided by the invention comprises the supporting bracket, gas blowing plate, a plurality of connecting block and the barrier film that are formed with the gas inlet.The above-mentioned gas jet tray, with above-mentioned supporting bracket across a determining deviation setting, and possess a plurality of gas jetting holes, be used for and will spray to processed orientation substrate by the gas that the above-mentioned gas inflow entrance flows into.Mutually across the spacing setting, the one end is fixed and is combined on the above-mentioned gas jet tray above-mentioned connecting block along the edge of above-mentioned gas jet tray, and the other end is supported by above-mentioned supporting bracket, so that move along with the thermal deformation of above-mentioned gas jet tray.Above-mentioned barrier film is formed between the above-mentioned connecting block along the edge of above-mentioned gas jet tray, is used to seal the space between above-mentioned supporting bracket and the above-mentioned gas jet tray.
In the side of above-mentioned supporting bracket, be formed with the slot part of depression to the inside; In the other end of above-mentioned connecting block, be formed with insertion section outstanding from the side and that insert above-mentioned slot part, this insertion section is supported by above-mentioned supporting bracket and is removable.
Above-mentioned connecting block can comprise engagement groove, and this engagement groove is formed on the side perpendicular with being formed with the side of above-mentioned insertion section, the end that can insert above-mentioned barrier film.
On in above-mentioned connecting block and above-mentioned supporting bracket any, support the part of above-mentioned insertion section in above-mentioned supporting bracket, be formed with the direction restriction projection that is used to limit the thermal expansion direction, on in above-mentioned connecting block and above-mentioned supporting bracket another, be formed with the direction limiting groove that inserts above-mentioned direction restriction projection.The one example is that above-mentioned direction restriction projection is given prominence to and formed to an above-mentioned end direction from the above-mentioned insertion section of above-mentioned connecting block.Be formed with the above-mentioned connecting block of above-mentioned direction restriction projection, on four limits of above-mentioned supporting bracket, be provided with one respectively at least.
Between the slot part of the insertion section of above-mentioned connecting block and above-mentioned supporting bracket, be formed with the sliding mats that reduces to rub.
The above-mentioned gas injection apparatus can also comprise conductive member, and its above-mentioned supporting bracket and above-mentioned connecting block that will be applied with high frequency electric source is electrically connected.
The process chamber that another embodiment of the present invention relates to comprises: chamber body; Base plate supports portion is arranged on the inside of above-mentioned chamber body, is used to support processed substrate; And gas injection apparatus, in above-mentioned chamber body inside, be provided with vis-a-vis with the aforesaid substrate support portion, and and to above-mentioned processed orientation substrate gas jet.The above-mentioned gas injection apparatus comprises supporting bracket, gas blowing plate, a plurality of connecting block and the barrier film that is formed with the gas inlet.The above-mentioned gas jet tray, with above-mentioned supporting bracket across a determining deviation setting, and possess a plurality of gas jetting holes, be used for and will spray to processed orientation substrate by the gas that the above-mentioned gas inflow entrance flows into.Above-mentioned connecting block along the edge of above-mentioned gas jet tray mutually across the spacing setting, one end secure bond is on the above-mentioned gas jet tray, the other end is inserted in slot part that the side of above-mentioned supporting bracket forms and supported, so that move with the thermal deformation of above-mentioned gas jet tray.Above-mentioned barrier film is formed between the above-mentioned connecting block along the edge of above-mentioned gas jet tray, is used to seal the space between above-mentioned supporting bracket and the above-mentioned gas jet tray.
On in above-mentioned connecting block and above-mentioned supporting bracket any, support the part of above-mentioned connecting block in above-mentioned supporting bracket, be formed with the direction restriction projection that is used to limit the thermal expansion direction, on in above-mentioned connecting block and above-mentioned supporting bracket another, be formed with the direction limiting groove that inserts above-mentioned direction restriction projection.
According to the gas injection apparatus of said structure and possess the process chamber of this gas injection apparatus, by the connecting block that is combined on the gas blowing plate it is hung on the supporting bracket, so that move freely along with the thermal expansion of gas blowing plate, thereby, can prevent the breakage that distortion caused of gas blowing plate, and keep the determining deviation between gas blowing plate and the processed substrate, improve deposition uniformity.In addition,, make the thermal expansion of gas blowing plate take place, thereby reduce the thermal deformation along thickness direction of gas blowing plate along even direction by giving directivity.
Description of drawings
Fig. 1 is the figure of the process chamber schematic configuration that relates to of expression one embodiment of the invention.
Fig. 2 is the enlarged diagram of A part among Fig. 1.
Fig. 3 is the profile of the gas injection apparatus that dissects of the I-I ' line along Fig. 1.
Fig. 4 is the stereogram of the concrete structure of the connecting block that relates to of expression one embodiment of the invention.
Fig. 5 is the figure of the concrete structure of expression connecting block shown in Figure 3 and barrier film.
Fig. 6 is the enlarged diagram of the B part of Fig. 5.
Fig. 7 is the stereogram of the connecting block that relates to of expression another embodiment of the present invention.
Fig. 8 is the schematic diagram of the marriage relation of expression connecting block shown in Figure 7 and supporting bracket.
Reference numeral
100: process chamber 110: chamber body 120: base plate supports portion
200: gas injection apparatus 210: supporting bracket 214: slot part
216: direction limiting groove 220: gas blowing plate 230: connecting block
236: insertion section 238: direction restriction projection 240: barrier film
Embodiment
Below, in conjunction with the accompanying drawings preferred embodiment of the present invention is elaborated.Feature of the invention described above and effect the following detailed description of carrying out in conjunction with the drawings can be become more remove, and the general technical staff of the technical field of the invention can easily be implemented technological thought of the present invention.The invention is not restricted to following embodiment, can realize by other modes.The effect of each embodiment that puts down in writing in this specification is, public technology content more completely, and fully pass on technological thought of the present invention and feature to those skilled in the art.In the accompanying drawings, for explanation the present invention, respectively the thickness in device or film (layer) and zone is exaggerated demonstration with removing, and in addition, each device can also possess the various attachment devices of not putting down in writing in this specification.
Below, in conjunction with the accompanying drawings, further describe preferred embodiment of the present invention.
Fig. 1 is the figure of the process chamber schematic configuration that relates to of expression one embodiment of the invention, and Fig. 2 is the enlarged diagram of A part among Fig. 1, and Fig. 3 is the profile of the gas injection apparatus that dissects of the I-I ' line along Fig. 1.
As Fig. 1, Fig. 2 and shown in Figure 3, the process chamber 100 that one embodiment of the invention relate to comprises: chamber body 110; Base plate supports portion 120 is arranged at the inside of chamber body 110, supports processed substrate 122; And gas injection apparatus 200, in the inside of chamber body 110, be provided with vis-a-vis, to processed substrate 122 direction gas jet with aforesaid substrate support portion 120.
Chamber body 110 can comprise sub-body portion 112 and can be incorporated into the upper body portion 114 on the top of sub-body portion 112 with opening and closing.By the combination of sub-body portion 112 and upper body portion 114, formed the space that to handle processed substrate 122 in handling part main body 110 inside.Be formed with exhaust outlet 116 in the bottom of chamber body 110, be used for the inner space of chamber body 110 is evacuated.
Base plate supports portion 120 is used to support processed substrate 122, is set at the lower space of chamber body 110 inside.Inside in base plate supports portion 120 can be provided for heating the heater (not shown) of processed substrate 122 according to process conditions.
Gas injection apparatus 200 is positioned at the upper space of chamber body 110 inside, is provided with vis-a-vis with base plate supports portion 120, to processed substrate 122 spray technology gas equably.
Gas injection apparatus 200 comprises: supporting bracket 210; Gas blowing plate 220, separated by a distance and be provided with supporting bracket 210; A plurality of connecting blocks 230 link supporting bracket 210 and gas jet tray 220; And barrier film 240, be arranged between a plurality of connecting blocks 230.
Supporting bracket 210 is fixedly installed in the upper body portion 114 of chamber body 110, so that the inner space of sealing chamber body 110.Supporting bracket 210 can possess electrode function, so that the space between gas injection apparatus 200 and base plate supports portion 120 produces plasma.For this reason, supporting bracket 210 is made by the metal materials such as aluminium with conductivity, supplies with to supporting bracket 210 to be used to produce isoionic high frequency electric source (RF power supply).Between metal supporting bracket 210 and upper body portion 114, be formed for the insulator 270 of electric insulation.At specific region, for example middle body of supporting bracket 210, be formed with at least one gas inflow entrance 212, the required process gas of deposit films such as reacting gas, source gas is flowed into.
In addition, be formed with the slot part 214 that links with connecting block 230 in the side of supporting bracket 210.Slot part 214 can perhaps, also can only be formed on the zone that connecting block 230 is set around all sides of supporting bracket 210.
Gas blowing plate 220 is separated by a distance and be provided with in the bottom of supporting bracket 210.Gas blowing plate 220 comprises a plurality of gas jetting holes 222, and the gas that this gas jetting hole 222 is used for flowing into by gas stream hand-hole 212 sprays to processed substrate 122 directions.Gas jetting hole 222 forms by uniform density on the entire area of gas blowing plate 220, and the feasible amount that is ejected into the gas of processed substrate 122 keeps evenly at Zone Full.Gas blowing plate 220 can be made by the metal materials such as aluminium with conductivity.Because gas blowing plate 220 is electrically connected with connecting block 230, therefore, supplies to the high frequency electric source of supporting bracket 210, also can be supplied to gas blowing plate 220 by connecting block 230.
Gas blowing plate 220 by with the combining of each connecting block 230, be set at the bottom of supporting bracket 210.Each connecting block 230 is spaced from each other setting along the edge of gas blowing plate 220 and supporting bracket 210.For example, if supporting bracket 210 and gas blowing plate 220 have rectangular shape, then connecting block 230 is provided with more than one accordingly at least with each limit of gas blowing plate 220.
Fig. 4 is the stereogram of the connecting block concrete structure that relates to of expression one embodiment of the invention.
As Fig. 2 and shown in Figure 4, connecting block 230 comprises an end 232 that is positioned at gas blowing plate 220 1 sides and the other end 234 that is positioned at supporting bracket 210 1 sides.One end 232 of connecting block 230 by combination member secure bond such as screws on gas blowing plate 220.For this reason, can be formed with at least one first combined hole 233 that is used for combining in an end 232 of connecting block 230 with gas blowing plate 220 screw threads.
The other end 234 supported plates 210 of connecting block 230 support, and can move with the thermal deformation of gas blowing plate 220.For this reason, be formed with insertion section 236 outstanding from the side and that can insert the slot part 214 of supporting bracket 210 in the other end 234 of connecting block 230, this insertion section 236 is supported by above-mentioned supporting bracket 210 and is removable.
Therefore, in fact connecting block 230 has
Figure GSA00000032388000061
Shape.In the insertion section 236 that the other end 234 of connecting block 230 forms, the slot part 214 and the supported plate 210 that can insert supporting bracket 210 support, and do not fix by other combination member.Therefore, connecting block 230 can move freely on in-plane along with the thermal expansion of gas blowing plate 220.
In addition, as shown in Figure 1, gas injection apparatus 200 can also be included in the sliding mats 250 that forms between the slot part 214 of the insertion section 236 of connecting block 230 and supporting bracket 210.Sliding mats 250 reduces the frictional force between connecting blocks 230 and the supporting bracket 210, when connecting block 230 extends because of thermal expansion, helps it to be free to slide.
As mentioned above, if the end 232 at connecting block 230 is fixed under the state of gas blowing plate 220, the other end 234 is installed on the supporting bracket 210 movably, even the thermal expansion of gas blowing plate 220 takes place, also can farthest reduce the distortion of gas blowing plate 220 by the slip of connecting block 230.Thereby, can prevent the damage of gas blowing plate 220, keep the determining deviation between gas blowing plate 220 and the processed substrate 122, improve deposition uniformity.
In addition, connecting block 230 can comprise the engagement groove 235 that is used for barrier film 240 bindings.Engagement groove 235 is formed at and is provided with on two perpendicular sides of the side of insertion section 236, inserts the end of barrier film 240 and combination in engagement groove 235.In addition, connecting block 230 can be included in second combined hole 237 that forms on the side that is formed with insertion section 236.Second combined hole 237 is used for combining with the conductive member 260 (being shown in Fig. 6) that illustrates later.
Fig. 5 is the figure of the detailed structure of expression connecting block shown in Figure 3 and barrier film, and Fig. 6 is the enlarged diagram of the B part of presentation graphs 5.
As Fig. 5 and shown in Figure 6, barrier film 240 is formed between the connecting block 230 along the edge of gas blowing plate 220, and the space between confining gas jet tray 220 and the supporting bracket 210.For the space between confining gas jet tray 220 and the supporting bracket 210, in fact barrier film 240 has the height identical with connecting block 230, and its upper surface is close to supporting bracket 210, and lower surface is close to gas blowing plate 220.
As mentioned above, if utilize connecting block 230 and barrier film 240 to surround edge part between supporting bracket 210 and the gas jet tray 220, between supporting bracket 210 and gas jet tray 220, just be formed for the enclosure space of gaseous diffusion.Therefore, the spatial diffusion of process gas between supporting bracket 210 and gas jet tray 220 that flows into by gas inflow entrance 212 evenly is ejected on the processed substrate 122 by gas blowing plate 220 after the whole zone.
In addition, in the part of the end combination of the engagement groove 2235 of connecting block 230 and barrier film 240, exist to a certain degree trip every, therefore,, also can produce special distortion even thermal expansions take place barrier film 240, can freely extend.
Identical with supporting bracket 210 and gas blowing plate 220, connecting block 230 also can be made by the metal materials such as aluminium with conductivity.Therefore, supply with the high frequency electric source of supporting bracket 210, be applied on the gas blowing plate 220 by connecting block 230.; though be electrically connected fully between each connecting block 230 and the gas blowing plate 220, on supporting bracket 210, just place simply and supported, sliding component 250 etc. can be set between them; so, the electrical connection potentially unstable between supporting bracket 210 and the connecting block 230.Therefore, for stable electrical connection between supporting bracket 210 and the connecting block 230, gas injection apparatus 200 can also comprise conductive member 260.
Conductive member 260 is made by the metal material with conductivity, and has lamellarly, is used for supporting bracket 210 and connecting block 230 is electrically connected.For example, the side of connecting block 230 is fixed in by screw thread in an end of conductive member 260, and the lower surface of supporting bracket 210 is fixed in the other end by screw thread.As mentioned above, utilize independent conductive member 260 that supporting bracket 210 and connecting block 230 are electrically connected, thus, can stably be applied on the gas blowing plate 220 supplying with the high frequency electric source of supporting bracket 210.
In addition, when thermal expansion took place gas blowing plate 220, the thermal expansion of gas blowing plate 220 all can take place in all directions.At this moment, the direction by the restriction thermal expansion can farthest reduce the thermal deformation of gas blowing plate 220.For this reason, on the coupling member 230 mobile, can form the function that can limit moving direction along with the thermal expansion of gas blowing plate 220.
Fig. 7 is the stereogram of the connecting block that relates to of expression another embodiment of the present invention, and Fig. 8 is the expression connecting block shown in Figure 7 and the figure of the marriage relation between the supporting bracket.Connecting block as shown in Figure 7, except being formed with projection, all the other structures are identical in fact with the structure of connecting block shown in Figure 4, therefore, pay identical Reference numeral for same structure, and omit the detailed description that repeats.
As Fig. 3, Fig. 7 and shown in Figure 8, in order to limit the thermal expansion direction of gas blowing plate 220, connecting block 230a is included in the direction restriction projection 238 of the part formation of supported plate 210 supports.Particularly, direction restriction projection 238 is to give prominence to and form to an end 232 directions from the insertion section 236 that the other end 234 at connecting block 230a forms.In addition, in the slot part 214 of supporting bracket 210, be formed with the direction limiting groove 216 of the direction restriction projection 238 that can insert connecting block 230a.In addition, also can on connecting block 230a, form the direction limiting groove, on supporting bracket 210, form direction restriction projection.
By the combination of direction restriction projection 238 and direction limiting groove 216, limited along the moving of connecting block 23a length direction, can only move along the bonding position that direction limits projection 238 and direction limiting groove 216.
As shown in Figure 3, on four limits of supporting bracket 210, a connecting block 230a who is formed with direction restriction projection 238 is set at least respectively, and, preferably, be set at the middle body on each limit.Therefore,, limited the direction of the thermal expansion of gas blowing plate 220, only on the direction vertical, produced thermal expansion with each limit by being formed with the connecting block 230a of direction restriction projection 238.
As mentioned above,, thermal expansion is evenly taken place along four direction, can farthest reduce along the thermal deformation of gas blowing plate 220 thickness directions by giving directivity to the thermal expansion of gas blowing plate 220.In the detailed description of the present invention of above record; be illustrated with reference to the preferred embodiments of the present invention; but; those of ordinary skill in the art is to be understood that; under the situation that does not break away from the purport of the present invention put down in writing in the claim and technical scope; can make amendment, be out of shape the present invention or be equal to replacement, these all should belong in the claimed scope of the present invention.

Claims (10)

1. gas injection apparatus comprises:
Supporting bracket;
The gas blowing plate, with above-mentioned supporting bracket across the spacing setting, and be formed with a plurality of gas jetting holes that are used for gas jet;
A plurality of connecting blocks, mutually across the spacing setting, an end of each connecting block is fixed on the above-mentioned gas jet tray along the edge of above-mentioned gas jet tray, and the other end is supported by above-mentioned supporting bracket, so that move along with the thermal deformation of above-mentioned gas jet tray; And
Barrier film is formed between the above-mentioned connecting block along the edge of above-mentioned gas jet tray, is used to seal the space between above-mentioned supporting bracket and the above-mentioned gas jet tray.
2. gas injection apparatus according to claim 1 is characterized in that,
In the side of above-mentioned supporting bracket, be formed with the slot part of depression to the inside;
In the other end of above-mentioned connecting block, be formed with the insertion section of inserting above-mentioned slot part, described insertion section is supported by above-mentioned supporting bracket and is removable.
3. gas injection apparatus according to claim 2 is characterized in that,
Above-mentioned connecting block comprises engagement groove, described engagement groove be formed on the side of lateral vertical that is formed with above-mentioned insertion section on, and the end that can insert above-mentioned barrier film.
4. gas injection apparatus according to claim 2 is characterized in that,
On in above-mentioned connecting block and above-mentioned supporting bracket any, the part that supports above-mentioned insertion section in above-mentioned supporting bracket is formed with the direction restriction projection of the thermal expansion direction that is used to limit the above-mentioned gas jet tray, on in above-mentioned connecting block and above-mentioned supporting bracket another, be formed with the direction limiting groove that inserts above-mentioned direction restriction projection.
5. gas injection apparatus according to claim 4 is characterized in that,
Above-mentioned direction restriction projection is outstanding to an above-mentioned end direction from the above-mentioned insertion section of above-mentioned connecting block.
6. gas injection apparatus according to claim 5 is characterized in that,
On four limits of above-mentioned supporting bracket, an above-mentioned connecting block that is formed with above-mentioned direction restriction projection is set at least respectively.
7. gas injection apparatus according to claim 2 is characterized in that,
Between the slot part of the insertion section of above-mentioned connecting block and above-mentioned supporting bracket, be formed with the sliding mats that reduces to rub.
8. gas injection apparatus according to claim 1 is characterized in that,
Also comprise conductive member, its above-mentioned supporting bracket and above-mentioned connecting block that will be applied with high frequency electric source is electrically connected.
9. process chamber comprises:
Chamber body;
Base plate supports portion is arranged on the inside of chamber body, supports processed substrate; And
Gas injection apparatus in the inside of above-mentioned chamber body, is provided with vis-a-vis with the aforesaid substrate support portion, to above-mentioned processed orientation substrate gas jet;
The above-mentioned gas injection apparatus comprises:
Supporting bracket;
The gas blowing plate, with above-mentioned supporting bracket across the spacing setting, be formed with a plurality of gas jetting holes that are used for to processed orientation substrate gas jet;
A plurality of connecting blocks, along the edge of above-mentioned gas jet tray mutually across the spacing setting, one end of each connecting block is fixed on the above-mentioned gas jet tray, it is also supported that the other end is inserted into the slot part that forms in the side of above-mentioned supporting bracket, so that move along with the thermal deformation of above-mentioned gas jet tray; And
Barrier film is formed between the above-mentioned connecting block along the edge of above-mentioned gas jet tray, is used to seal the space between above-mentioned supporting bracket and the above-mentioned gas jet tray.
10. process chamber according to claim 9 is characterized in that,
On in above-mentioned connecting block and above-mentioned supporting bracket any, the part that supports above-mentioned connecting block in above-mentioned supporting bracket is formed with the direction restriction projection of the thermal expansion direction that is used to limit the above-mentioned gas jet tray, on in above-mentioned connecting block and above-mentioned supporting bracket another, be formed with the direction limiting groove that inserts above-mentioned direction restriction projection.
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