CN102071401A - Planar magnetic-control sputtering target improving utilization efficiency - Google Patents
Planar magnetic-control sputtering target improving utilization efficiency Download PDFInfo
- Publication number
- CN102071401A CN102071401A CN2009101549392A CN200910154939A CN102071401A CN 102071401 A CN102071401 A CN 102071401A CN 2009101549392 A CN2009101549392 A CN 2009101549392A CN 200910154939 A CN200910154939 A CN 200910154939A CN 102071401 A CN102071401 A CN 102071401A
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- Prior art keywords
- target
- magnetron
- overcoat
- magnetic
- bar
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005477 sputtering target Methods 0.000 title claims abstract description 19
- 229910000838 Al alloy Inorganic materials 0.000 claims description 7
- 239000002826 coolant Substances 0.000 claims description 7
- 229920002050 silicone resin Polymers 0.000 claims description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 7
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 210000001061 forehead Anatomy 0.000 abstract 3
- NRTLIYOWLVMQBO-UHFFFAOYSA-N 5-chloro-1,3-dimethyl-N-(1,1,3-trimethyl-1,3-dihydro-2-benzofuran-4-yl)pyrazole-4-carboxamide Chemical compound C=12C(C)OC(C)(C)C2=CC=CC=1NC(=O)C=1C(C)=NN(C)C=1Cl NRTLIYOWLVMQBO-UHFFFAOYSA-N 0.000 abstract 1
- 239000000498 cooling water Substances 0.000 abstract 1
- 238000012216 screening Methods 0.000 abstract 1
- 239000000463 material Substances 0.000 description 12
- 239000013077 target material Substances 0.000 description 11
- 238000010586 diagram Methods 0.000 description 9
- 238000001755 magnetron sputter deposition Methods 0.000 description 7
- 238000001816 cooling Methods 0.000 description 6
- 238000004544 sputter deposition Methods 0.000 description 6
- 238000007747 plating Methods 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 230000007797 corrosion Effects 0.000 description 4
- 238000005260 corrosion Methods 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910000510 noble metal Inorganic materials 0.000 description 3
- 229910052726 zirconium Inorganic materials 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 230000005347 demagnetization Effects 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 229910001172 neodymium magnet Inorganic materials 0.000 description 2
- 238000005240 physical vapour deposition Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 238000001771 vacuum deposition Methods 0.000 description 2
- 241001280173 Crassula muscosa Species 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 239000007888 film coating Substances 0.000 description 1
- 238000009501 film coating Methods 0.000 description 1
- 239000010985 leather Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
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Abstract
The invention discloses a planar magnetic-control sputtering target improving utilization efficiency. The planar magnetic-control sputtering target is characterized by comprising a target magnetron jacket; the bottom surface of the target magnetron jacket is connected with a cover plate; cooling water is filled between the cover plate and the target magnetron jacket; a magnetic forehead is arranged in the target magnetron jacket; limber holes are formed on the magnetic forehead which is provided with permanent magnets; target strips are arranged on the target magnetron jacket and a target fixed block is arranged outside the target strips; the target strips are arranged in parallel at intervals and are overlapped; the surfaces of the target strips are flat; target screening cases are arranged outside the target magnetron jacket and the target fixed block; and the magnetic poles of permanent magnets which are arranged in the target magnetron jacket and connected with the magnetic forehead are arranged in parallel in a sequence of NSN or SNS and are perpendicular to the surfaces of the target strips.
Description
Technical field
The plane sputtering target of using when the present invention relates to a kind of magnetron sputtering plating is applicable to physical vapor deposition magnetic control sputtering vacuum coating technical field.
Background technology
In the vacuum plating industry, the sputter coating technology has can realize the big area fast deposition, and film and basal body binding force are good, and film densification, pin hole are few, advantages such as rete controllability and good reproducibility, thereby development in recent years is rapid, is widely used.Magnetron sputtering occupies important position in the plated film industry, because its significant advantage is used extensive day by day, target is except that cylinder target and moving field target in magnetron sputtering equipment, use rectangle magnetron sputtering planar targets, and target mostly is precious metal material, as metal targets such as plating Ti, Zr, Au more, widespread usage is at decoration film coating, as phone housing, watch chain, spectacle-frame or the like, these films not only increase the aesthetic of material, and have improved the wear resisting property of material.Also have some functional membranes in addition, as ITO film, polysilicon membrane, superhard film, electrode film etc., in these films, are no lack of some expensive targets of use, noble metal target material such as gold target, silver-colored target, yet in common magnetron sputtering equipment, the Magnetic Field Design of planar target is the closed annular setting substantially, magnetron uses NSN or SNS closo magnetic circuit, cause target material surface an endless track type etched area partly to be occurred by sputter, this etched area only is the sub-fraction of overall target, and most materials can not be reused.Cause the waste of target material like this, made the manufacturing cost of film can not be in any more.Therefore, if can design a kind of scheme, the target part of changing in magnetron sputtering that is sputtered away can rationally utilize target not increase the cost of target again fully at every turn, will bring good profit to enterprise.
Summary of the invention
The objective of the invention is in order to overcome the shortcoming of prior art, a kind of physical vapor deposition planar target magnetic control sputtering vacuum coating that is applicable to is provided, each target part of in magnetron sputtering, changing that is sputtered away, can improve target utilization, less wastage, and planar magnetic control sputtering simple in structure leather crust.
The technical scheme of a kind of plane magnetic controlled sputtering target of increasing operation rate of the present invention is: it is characterized in that comprising target magnetron overcoat, the bottom surface of target magnetron overcoat connects cover plate, between cover plate and the target magnetron overcoat water coolant is arranged, the inner magnetic volume of placing of target magnetron overcoat, be shaped on the limbers in the magnetic volume, mounting permanent magnet on the magnetic volume, the target magnetron has target bar fixed block outside putting target bar and target bar being installed outward, the target bar becomes alternately parallel, overlap mutually between the target bar, the surface of target bar is a burnishing surface, outside target magnetron overcoat and target bar fixed block, the target shielding case is arranged, the magnetic pole of the permanent magnet that links to each other with the magnetic volume in the target magnetron overcoat is that NSN or SNS are arranged in parallel, and perpendicular to the surface of target bar.
The invention discloses a kind of plane magnetic controlled sputtering target of increasing operation rate, the target magnetron has target bar fixed block outside putting target bar and target bar being installed outward, the target bar becomes alternately parallel, overlap mutually between the target bar, target is divided into polylith target bar, and arrangement parallel to each other, and main etched area target bar is replaceable, all the other target bars are reusable, to reach the purpose of saving target; Target magnetron overcoat inside is full of the abundant cooling that water coolant can guarantee target and permanent magnet, avoids overheated demagnetization and the overheated sputtering yield that causes of target of causing of permanent magnet to reduce; Target material surface is the spark phenomenon of burnishing surface can as far as possible avoid sputter the time; The magnetic pole of interior permanent magnet is that NSN or SNS are arranged in parallel, and not closed (Magnetic Field Design that has overcome the prior art planar target is the closed annular setting substantially, magnetron uses NSN or SNS closo magnetic circuit, cause target material surface an endless track type etched area partly to be occurred) by sputter, make that sputter area is parallel etched area, help by the replacing of sputter part target bar, to reach the purpose of saving target, particularly improve the utilization ratio of noble metal target material such as metals such as gold and silver, zirconium, reduce cost and increase economic efficiency.
A kind of plane magnetic controlled sputtering target of increasing operation rate of the present invention, insulating mat is installed in the junction of described target shielding case and target magnetron overcoat.Insulating mat has been installed in the junction of target shielding case and target magnetron overcoat, has guaranteed vacuum chamber and the insulation between the target and the sealing effectiveness of vacuum plating.Described target magnetron overcoat is connected by fastening piece with target bar fixed block, and is more firm each other.Described target magnetron overcoat is the aluminum alloy sleeve of U type.U type aluminium alloy overcoat can guarantee that the water coolant volume is big, and cooling area is big, the relative and stainless material good cooling results of aluminum alloy materials.The magnetic conduction pad is arranged at the bottom of described target bar.Used the magnetic conduction pad can effectively retrain and transmit magnetic field in the bottom of target bar.Described target magnetron overcoat and cover plate are fixed by screw.The magnetic volume is fixed on the expansion link in the described target magnetron, and expansion link and cover plate are by fixed by nut.The magnetic volume is fixed on the expansion link, and expansion link can move can regulate target material surface magnetic field, and is convenient for changing permanent magnet and target bar.Described magnetic volume and permanent magnet surface are coated with diamond-film-like, diamond-film-like outside coating silicone resin.Because of permanent magnet is a NdFeB material, the magnetic volume is an iron, and two kinds of materials all easily are corroded, and diamond like carbon film and silicone resin film are corrosion resistant material, and the multilayer protection can improve its corrosion resistant ability.The specific product of diamond-film-like and silicone resin is a prior art.
Description of drawings
Fig. 1 is a kind of plane magnetic controlled sputtering target synoptic diagram of increasing operation rate of the present invention;
Fig. 2 is that target magnetron overcoat is a U type synoptic diagram;
Fig. 3 is that the parallel overlapping of polylith Splittable target is placed synoptic diagram;
Fig. 4 is that the B of Fig. 3 is to synoptic diagram;
Fig. 5 is that the magnetic pole of permanent magnet is the synoptic diagram of SNS arrangement mode;
Fig. 6 is that the magnetic pole of permanent magnet is the synoptic diagram of NSN arrangement mode;
Fig. 7 installs magnetic volume and permanent magnet synoptic diagram in the target magnetron overcoat;
Fig. 8 is this plane magnetic controlled sputtering target Surface field and electronics e running orbit synoptic diagram;
Fig. 9 forms the etched area synoptic diagram shown in the target bar side.
Embodiment
The present invention relates to a kind of plane magnetic controlled sputtering target of increasing operation rate, as Fig. 1-shown in Figure 9, it is characterized in that comprising target magnetron overcoat 4, the bottom surface of target magnetron overcoat 4 connects cover plate 15, between cover plate 15 and the target magnetron overcoat 4 water coolant is arranged, the target magnetron overcoat 4 inner magnetic volumes 7 of placing, be shaped on limbers 8 in the magnetic volume 7, mounting permanent magnet 6 on the magnetic volume 7, outside target bar 1 and target bar are installed on the target magnetron overcoat 4 target bar fixed block 11 is arranged, 1 one-tenth of target bar is alternately parallel, overlap mutually between the target bar, the surface of target bar 1 is a burnishing surface, outside target magnetron overcoat 4 and target bar fixed block 11 target shielding case 10 is arranged, the magnetic pole of the permanent magnets 6 that link to each other with magnetic volume 7 in the target magnetron overcoat 4 is that NSN or SNS are arranged in parallel, and perpendicular to the surface of target bar 1.Outside target bar 1 and target bar are installed on this product target magnetron overcoat 4 target bar fixed block 11 is arranged, 1 one-tenth of target bar is alternately parallel, overlap mutually between the target bar 1, target is divided into polylith target bar, and arrangement parallel to each other, main etched area target bar is replaceable, and all the other target bars 1 are reusable, to reach the purpose of saving target; Target magnetron overcoat 4 inside are full of the abundant cooling that water coolant can guarantee target and permanent magnet 6, avoid permanent magnet 6 overheated demagnetization and the overheated sputtering yields that cause of target of causing to reduce; Target material surface is the spark phenomenon of burnishing surface can as far as possible avoid sputter the time; The magnetic pole of interior permanent magnet 6 is that NSN or SNS are arranged in parallel, and not closed (Magnetic Field Design that has overcome the prior art planar target is the closed annular setting substantially, magnetron uses NSN or SNS closo magnetic circuit, cause target material surface by sputter partly occur an endless track type etched area 1 '), make that sputter area is parallel etched area, help by the replacing of sputter part target bar, to reach the purpose of saving target, particularly improve the utilization ratio of noble metal target material such as metals such as gold and silver, zirconium, reduce cost and increase economic efficiency.Described target shielding case 10 is installed insulating mat 12 with the junction of target magnetron overcoat 4.Target shielding case 10 has been installed insulating mat 12 with the junction of target magnetron overcoat 4, has guaranteed vacuum chamber and the insulation between the target and the sealing effectiveness of vacuum plating.Described target magnetron overcoat 4 is connected by fastening piece 41 with target bar fixed block 11, and is more firm each other.Described target magnetron overcoat 4 is the aluminum alloy sleeve of U type.U type aluminium alloy overcoat can guarantee that the water coolant volume is big, and cooling area is big, the relative and stainless material good cooling results of aluminum alloy materials.Magnetic conduction pad 5 is arranged at the bottom of described target bar 1.Used magnetic conduction pad 5 can effectively retrain and transmit magnetic field in the bottom of target bar 1.Described target magnetron overcoat 4 and cover plate 15 are fixed by screw.The magnetic volume is fixed on the expansion link 17 in the described target magnetron, and expansion link 17 is fixing by nut 9 with cover plate 15.The magnetic volume is fixed on the expansion link 17, and expansion link 17 can move can regulate target material surface magnetic field, and is convenient for changing permanent magnet 6 and target bar 1.Described magnetic volume 7 and permanent magnet 6 surfaces are coated with diamond-film-like, diamond-film-like outside coating silicone resin.Because of permanent magnet 6 is a NdFeB material, the magnetic volume is an iron, and two kinds of materials all easily are corroded, and diamond like carbon film and silicone resin film are corrosion resistant material, and the multilayer protection can improve its corrosion resistant ability.The specific product of diamond-film-like and silicone resin is a prior art.
Claims (8)
1. plane magnetic controlled sputtering target of increasing operation rate, it is characterized in that comprising target magnetron overcoat (4), the bottom surface of target magnetron overcoat (4) connects cover plate (15), between cover plate (15) and the target magnetron overcoat (4) water coolant is arranged, the inner magnetic volume (7) of placing of target magnetron overcoat (4), be shaped on limbers (8) in the magnetic volume (7), magnetic volume (7) is gone up mounting permanent magnet (6), target magnetron overcoat (4) has target bar fixed block (11) outside going up target bar (1) and target bar being installed, it is alternately parallel that target bar (1) becomes, overlap mutually between the target bar, the surface of target bar (1) is a burnishing surface, outside target magnetron overcoat (4) and target bar fixed block (11), target shielding case (10) is arranged, the magnetic pole of the permanent magnet (6) that links to each other with magnetic volume (7) in the target magnetron overcoat (4) is that NSN or SNS are arranged in parallel, and perpendicular to the surface of target bar (1).
2. a kind of plane magnetic controlled sputtering target of increasing operation rate as claimed in claim 1 is characterized in that insulating mat (12) is installed in the junction of described target shielding case (10) and target magnetron overcoat (4).
3. a kind of plane magnetic controlled sputtering target of increasing operation rate as claimed in claim 1 is characterized in that described target magnetron overcoat (4) is connected by fastening piece (41) with target bar fixed block (11).
4. a kind of plane magnetic controlled sputtering target of increasing operation rate as claimed in claim 1 is characterized in that described target magnetron overcoat (4) is the aluminum alloy sleeve of U type.
5. a kind of plane magnetic controlled sputtering target of increasing operation rate as claimed in claim 1 is characterized in that magnetic conduction pad (5) is arranged at the bottom of described target bar (1).
6. a kind of plane magnetic controlled sputtering target of increasing operation rate as claimed in claim 1 is characterized in that described target magnetron overcoat (4) and cover plate (15) are fixed by screw (13).
7. a kind of plane magnetic controlled sputtering target of increasing operation rate as claimed in claim 1 is characterized in that the volume ferropexy is on expansion link (17) in the described target magnetron, and expansion link (17) is fixing by nut (9) with cover plate (15).
8. a kind of plane magnetic controlled sputtering target of increasing operation rate as claimed in claim 1 is characterized in that described magnetic volume (7) and permanent magnet (6) surface are coated with diamond-film-like, diamond-film-like outside coating silicone resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200910154939 CN102071401B (en) | 2009-11-25 | 2009-11-25 | Planar magnetic-control sputtering target improving utilization efficiency |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200910154939 CN102071401B (en) | 2009-11-25 | 2009-11-25 | Planar magnetic-control sputtering target improving utilization efficiency |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102071401A true CN102071401A (en) | 2011-05-25 |
| CN102071401B CN102071401B (en) | 2013-03-06 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200910154939 Active CN102071401B (en) | 2009-11-25 | 2009-11-25 | Planar magnetic-control sputtering target improving utilization efficiency |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102296274A (en) * | 2011-08-18 | 2011-12-28 | 北京镨玛泰克真空科技有限公司 | Shielding device for cathode arc metal ion source |
| CN104404463A (en) * | 2014-11-14 | 2015-03-11 | 河海大学 | Planar magnetron sputtering target |
| CN105154839A (en) * | 2015-09-22 | 2015-12-16 | 上海晓睿真空科技有限公司 | Planar cathode |
| CN109706428A (en) * | 2019-02-25 | 2019-05-03 | 常州星宇车灯股份有限公司 | A kind of sputtering target assembly |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5279724A (en) * | 1991-12-26 | 1994-01-18 | Xerox Corporation | Dual sputtering source |
| CN2615146Y (en) * | 2003-03-18 | 2004-05-12 | 沈阳金昌普新材料股份有限公司 | Sputtering cathode target material structure for producing foam nickel metallization |
| CN2688722Y (en) * | 2004-03-30 | 2005-03-30 | 王有德 | Scanning focusing magnetic controlling sputtering target |
| CN2828061Y (en) * | 2005-07-15 | 2006-10-18 | 中国人民解放军国防科学技术大学 | Target material structure of magnetic sputtering ferromagnetic material |
-
2009
- 2009-11-25 CN CN 200910154939 patent/CN102071401B/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102296274A (en) * | 2011-08-18 | 2011-12-28 | 北京镨玛泰克真空科技有限公司 | Shielding device for cathode arc metal ion source |
| CN102296274B (en) * | 2011-08-18 | 2013-11-27 | 北京镨玛泰克真空科技有限公司 | Shielding device for cathode arc metal ion source |
| CN104404463A (en) * | 2014-11-14 | 2015-03-11 | 河海大学 | Planar magnetron sputtering target |
| CN105154839A (en) * | 2015-09-22 | 2015-12-16 | 上海晓睿真空科技有限公司 | Planar cathode |
| CN109706428A (en) * | 2019-02-25 | 2019-05-03 | 常州星宇车灯股份有限公司 | A kind of sputtering target assembly |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102071401B (en) | 2013-03-06 |
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| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: ZHEJIANG TIANCHONG VEHICLE LAMP GROUP CO., LTD. Free format text: FORMER OWNER: FAN JIAQIU Effective date: 20130711 |
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| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20130711 Address after: 318020 No. 68, Lantau Road, West Industrial Park, Taizhou, Zhejiang, Huangyan Patentee after: Zhejiang Tianchong Vehicle Lamp Group Co., Ltd. Address before: Huangyan West Industrial Park, new Island Road Taizhou City, Zhejiang province 318020 No. 68 Zhejiang Tianchong vehide Co. Ltd. Patentee before: Fan Jiaqiu |