CN102071401B - Planar magnetic-control sputtering target improving utilization efficiency - Google Patents
Planar magnetic-control sputtering target improving utilization efficiency Download PDFInfo
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- CN102071401B CN102071401B CN 200910154939 CN200910154939A CN102071401B CN 102071401 B CN102071401 B CN 102071401B CN 200910154939 CN200910154939 CN 200910154939 CN 200910154939 A CN200910154939 A CN 200910154939A CN 102071401 B CN102071401 B CN 102071401B
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- target
- magnetron
- overcoat
- bar
- yoke
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- 238000005477 sputtering target Methods 0.000 title claims abstract description 12
- 229910000838 Al alloy Inorganic materials 0.000 claims description 8
- 229920002050 silicone resin Polymers 0.000 claims description 8
- 239000002826 coolant Substances 0.000 claims description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 7
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 238000009434 installation Methods 0.000 claims 1
- 210000001061 forehead Anatomy 0.000 abstract 3
- NRTLIYOWLVMQBO-UHFFFAOYSA-N 5-chloro-1,3-dimethyl-N-(1,1,3-trimethyl-1,3-dihydro-2-benzofuran-4-yl)pyrazole-4-carboxamide Chemical compound C=12C(C)OC(C)(C)C2=CC=CC=1NC(=O)C=1C(C)=NN(C)C=1Cl NRTLIYOWLVMQBO-UHFFFAOYSA-N 0.000 abstract 1
- 239000000498 cooling water Substances 0.000 abstract 1
- 238000012216 screening Methods 0.000 abstract 1
- 239000000463 material Substances 0.000 description 12
- 239000013077 target material Substances 0.000 description 11
- 238000010586 diagram Methods 0.000 description 9
- 238000001755 magnetron sputter deposition Methods 0.000 description 7
- 238000001816 cooling Methods 0.000 description 6
- 238000007747 plating Methods 0.000 description 5
- 238000004544 sputter deposition Methods 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical group [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 230000007797 corrosion Effects 0.000 description 4
- 238000005260 corrosion Methods 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910000510 noble metal Inorganic materials 0.000 description 3
- 229910052726 zirconium Inorganic materials 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 230000005347 demagnetization Effects 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 229910001172 neodymium magnet Inorganic materials 0.000 description 2
- 238000005240 physical vapour deposition Methods 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 238000001771 vacuum deposition Methods 0.000 description 2
- 241001280173 Crassula muscosa Species 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 239000007888 film coating Substances 0.000 description 1
- 238000009501 film coating Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
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Abstract
The invention discloses a planar magnetic-control sputtering target improving utilization efficiency. The planar magnetic-control sputtering target is characterized by comprising a target magnetron jacket; the bottom surface of the target magnetron jacket is connected with a cover plate; cooling water is filled between the cover plate and the target magnetron jacket; a magnetic forehead is arranged in the target magnetron jacket; limber holes are formed on the magnetic forehead which is provided with permanent magnets; target strips are arranged on the target magnetron jacket and a target fixed block is arranged outside the target strips; the target strips are arranged in parallel at intervals and are overlapped; the surfaces of the target strips are flat; target screening cases are arranged outside the target magnetron jacket and the target fixed block; and the magnetic poles of permanent magnets which are arranged in the target magnetron jacket and connected with the magnetic forehead are arranged in parallel in a sequence of NSN or SNS and are perpendicular to the surfaces of the target strips.
Description
Technical field
The plane sputtering target of using when the present invention relates to a kind of magnetron sputtering plating is applicable to physical vapor deposition magnetic control sputtering vacuum coating technical field.
Background technology
In the vacuum plating industry, the sputter coating technology has can realize the big area fast deposition, and film and basal body binding force are good, and film is fine and close, pin hole is few, the advantages such as rete controllability and good reproducibility, thereby development in recent years is rapid, is widely used.Magnetron sputtering occupies important position in the plated film industry, because its significant advantage is used increasingly extensive, target is except cylinder target and moving field target in magnetron sputtering equipment, use rectangle magnetron sputtering planar targets, and target mostly is precious metal material, such as metal targets such as plating Ti, Zr, Au more, generally be applied in decoration film coating, such as phone housing, watch chain, spectacle-frame etc., these films not only increase the aesthetic of material, and have improved the wear resisting property of material.Also have in addition some functional membranes, such as ITO film, polysilicon membrane, superhard film, electrode film etc., in these films, are no lack of some expensive targets of use, the noble metal target material such as gold target, silver-colored target, yet in common magnetron sputtering equipment, the Magnetic Field Design of planar target is the closed annular setting substantially, magnetron uses NSN or SNS closo magnetic circuit, cause target material surface an endless track type etched area partly to be occurred by sputter, this etched area only is the sub-fraction of overall target, and most materials can not be reused.Caused like this waste of target material, so that the manufacturing cost of film can be in any more.Therefore, if can design a kind of scheme, the target part that is sputtered away of at every turn changing in magnetron sputtering can rationally utilize target not increase again the cost of target fully, will bring good profit to enterprise.
Summary of the invention
The objective of the invention is in order to overcome the shortcoming of prior art, a kind of physical vapor deposition planar target magnetic control sputtering vacuum coating that is applicable to is provided, each target part that is sputtered away of in magnetron sputtering, changing, can improve target utilization, less wastage, and plane magnetic controlled sputtering target simple in structure.
The technical scheme of a kind of plane magnetic controlled sputtering target of increasing operation rate of the present invention is: it is characterized in that comprising target magnetron overcoat, the bottom surface of target magnetron overcoat connects cover plate, between cover plate and the target magnetron overcoat water coolant is arranged, the inner yoke of placing of target magnetron overcoat, be shaped with the limbers in the yoke, mounting permanent magnet on the yoke, the target magnetron has target bar fixed block outside putting target bar and target bar being installed outward, the target bar becomes alternately parallel, overlapping mutually between the target bar, the surface of target bar is burnishing surface, outside target magnetron overcoat and target bar fixed block, the target shielding case is arranged, the magnetic pole of the permanent magnet that links to each other with yoke in the target magnetron overcoat is that NSN or SNS are arranged in parallel, and perpendicular to the surface of target bar, the junction installing insulating pad of described target shielding case and target magnetron overcoat, described target magnetron overcoat is connected by fastening piece with target bar fixed block, described target magnetron overcoat is U-shaped aluminum alloy sleeve, the magnetic conduction pad is arranged at the bottom of described target bar, described target magnetron overcoat and cover plate are fixed by screw, described target magnetron inner yoke is fixed on the expansion link, expansion link and cover plate are fixed by nut, described yoke and permanent magnet surface are coated with diamond-film-like, diamond-film-like outside coating silicone resin.
The invention discloses a kind of plane magnetic controlled sputtering target of increasing operation rate, the target magnetron has target bar fixed block outside putting target bar and target bar being installed outward, the target bar becomes alternately parallel, overlapping mutually between the target bar, target is divided into polylith target bar, and arrangement parallel to each other, and main etched area target bar is replaceable, all the other target bars are reusable, to reach the purpose of saving target; Target magnetron overcoat inside is full of the abundant cooling that water coolant can guarantee target and permanent magnet, avoids that permanent magnet is overheated to cause demagnetization, and the overheated sputtering yield that causes of target reduces; Target material surface is the spark phenomenon of burnishing surface can as far as possible avoid sputter the time; The magnetic pole of interior permanent magnet is that NSN or SNS are arranged in parallel, and not closed (Magnetic Field Design that has overcome the prior art planar target is the closed annular setting substantially, magnetron uses NSN or SNS closo magnetic circuit, cause target material surface an endless track type etched area partly to be occurred by sputter), so that sputter area is parallel etched area, be conducive to by the replacing of sputter part target bar, to reach the purpose of saving target, particularly improve the utilization ratio of noble metal target material such as the metals such as gold and silver, zirconium, reduce cost and increase economic efficiency.The junction installing insulating pad of described target shielding case and target magnetron overcoat.Insulating mat has been installed in the junction of target shielding case and target magnetron overcoat, has guaranteed vacuum chamber and the insulation between the target and the sealing effectiveness of vacuum plating.Described target magnetron overcoat is connected by fastening piece with target bar fixed block, and is more firm each other.Described target magnetron overcoat is U-shaped aluminum alloy sleeve.U-shaped aluminium alloy overcoat can guarantee that the water coolant volume is large, and cooling area is large, the relative and stainless material good cooling results of aluminum alloy materials.The magnetic conduction pad is arranged at the bottom of described target bar.Used the magnetic conduction pad can effectively retrain and transmit magnetic field in the bottom of target bar.Described target magnetron overcoat and cover plate are fixed by screw.Described target magnetron inner yoke is fixed on the expansion link, and expansion link and cover plate are fixed by nut.Yoke is fixed on the expansion link, and expansion link can movement can be regulated target material surface magnetic field, and is convenient for changing permanent magnet and target bar.Described yoke and permanent magnet surface are coated with diamond-film-like, diamond-film-like outside coating silicone resin.Because permanent magnet is NdFeB material, yoke is iron, and bi-material all easily is corroded, and diamond like carbon film and silicone resin film are corrosion resistant material, and the multilayer protection can improve its corrosion resistant ability.The specific product of diamond-film-like and silicone resin is prior art.
Description of drawings
Fig. 1 is a kind of plane magnetic controlled sputtering target synoptic diagram of increasing operation rate of the present invention;
Fig. 2 is that target magnetron overcoat is U-shaped synoptic diagram;
Fig. 3 is the parallel overlapping placement synoptic diagram of polylith Splittable target;
Fig. 4 is that the B of Fig. 3 is to synoptic diagram;
Fig. 5 is that the magnetic pole of permanent magnet is the synoptic diagram of SNS arrangement mode;
Fig. 6 is that the magnetic pole of permanent magnet is the synoptic diagram of NSN arrangement mode;
Fig. 7 installs yoke and permanent magnet synoptic diagram in the target magnetron overcoat;
Fig. 8 is this plane magnetic controlled sputtering target Surface field and electronics e running orbit synoptic diagram;
Fig. 9 forms the etched area synoptic diagram shown in the target bar side.
Embodiment
The present invention relates to a kind of plane magnetic controlled sputtering target of increasing operation rate, such as Fig. 1-shown in Figure 9, it is characterized in that comprising target magnetron overcoat 4, the bottom surface of target magnetron overcoat 4 connects cover plate 15, between cover plate 15 and the target magnetron overcoat 4 water coolant is arranged, the target magnetron overcoat 4 inner yokes 7 of placing, be shaped with limbers 8 in the yoke 7, mounting permanent magnet 6 on the yoke 7, outside target bar 1 and target bar are installed on the target magnetron overcoat 4 target bar fixed block 11 is arranged, 1 one-tenth of target bar is alternately parallel, overlapping mutually between the target bar, the surface of target bar 1 is burnishing surface, outside target magnetron overcoat 4 and target bar fixed block 11 target shielding case 10 is arranged, the magnetic pole of the permanent magnets 6 that link to each other with yoke 7 in the target magnetron overcoat 4 is that NSN or SNS are arranged in parallel, and perpendicular to the surface of target bar 1.Outside target bar 1 and target bar are installed on this product target magnetron overcoat 4 target bar fixed block 11 is arranged, 1 one-tenth of target bar is alternately parallel, overlapping mutually between the target bar 1, target is divided into polylith target bar, and arrangement parallel to each other, main etched area target bar is replaceable, and all the other target bars 1 are reusable, to reach the purpose of saving target; Target magnetron overcoat 4 inside are full of the abundant cooling that water coolant can guarantee target and permanent magnet 6, avoid that permanent magnet 6 is overheated to cause demagnetization, and the overheated sputtering yield that causes of target reduces; Target material surface is the spark phenomenon of burnishing surface can as far as possible avoid sputter the time; The magnetic pole of interior permanent magnet 6 is that NSN or SNS are arranged in parallel, and not closed (Magnetic Field Design that has overcome the prior art planar target is the closed annular setting substantially, magnetron uses NSN or SNS closo magnetic circuit, cause target material surface by sputter partly occur an endless track type etched area 1 '), so that sputter area is parallel etched area, be conducive to by the replacing of sputter part target bar, to reach the purpose of saving target, particularly improve the utilization ratio of noble metal target material such as the metals such as gold and silver, zirconium, reduce cost and increase economic efficiency.The junction installing insulating pad 12 of described target shielding case 10 and target magnetron overcoat 4.Target shielding case 10 has been installed insulating mat 12 with the junction of target magnetron overcoat 4, has guaranteed vacuum chamber and the insulation between the target and the sealing effectiveness of vacuum plating.Described target magnetron overcoat 4 is connected by fastening piece 41 with target bar fixed block 11, and is more firm each other.Described target magnetron overcoat 4 is U-shaped aluminum alloy sleeve.U-shaped aluminium alloy overcoat can guarantee that the water coolant volume is large, and cooling area is large, the relative and stainless material good cooling results of aluminum alloy materials.Magnetic conduction pad 5 is arranged at the bottom of described target bar 1.Used magnetic conduction pad 5 can effectively retrain and transmit magnetic field in the bottom of target bar 1.Described target magnetron overcoat 4 and cover plate 15 are fixed by screw.Described target magnetron inner yoke is fixed on the expansion link 17, and expansion link 17 is fixing by nut 9 with cover plate 15.Yoke is fixed on the expansion link 17, and expansion link 17 can movement can be regulated target material surface magnetic field, and is convenient for changing permanent magnet 6 and target bar 1.Described yoke 7 and permanent magnet 6 surfaces are coated with diamond-film-like, diamond-film-like outside coating silicone resin.Because permanent magnet 6 is NdFeB material, yoke is iron, and bi-material all easily is corroded, and diamond like carbon film and silicone resin film are corrosion resistant material, and the multilayer protection can improve its corrosion resistant ability.The specific product of diamond-film-like and silicone resin is prior art.
Claims (1)
1. plane magnetic controlled sputtering target of increasing operation rate, it is characterized in that comprising target magnetron overcoat (4), the bottom surface of target magnetron overcoat (4) connects cover plate (15), between cover plate (15) and the target magnetron overcoat (4) water coolant is arranged, the inner yoke (7) of placing of target magnetron overcoat (4), be shaped with limbers (8) in the yoke (7), the upper mounting permanent magnet (6) of yoke (7), there is target bar fixed block (11) in target magnetron overcoat (4) upper installation target bar (1) and the target bar outside, it is alternately parallel that target bar (1) becomes, overlapping mutually between the target bar, the surface of target bar (1) is burnishing surface, outside target magnetron overcoat (4) and target bar fixed block (11), target shielding case (10) is arranged, the magnetic pole of the permanent magnet (6) that links to each other with yoke (7) in the target magnetron overcoat (4) is that NSN or SNS are arranged in parallel, and perpendicular to the surface of target bar (1), the junction installing insulating pad (12) of described target shielding case (10) and target magnetron overcoat (4), described target magnetron overcoat (4) is connected by fastening piece (41) with target bar fixed block (11), described target magnetron overcoat (4) is U-shaped aluminum alloy sleeve, magnetic conduction pad (5) is arranged at the bottom of described target bar (1), described target magnetron overcoat (4) is fixed by screw (13) with cover plate (15), described target magnetron inner yoke is fixed on the expansion link (17), expansion link (17) is fixing by nut (9) with cover plate (15), described yoke (7) and permanent magnet (6) surface are coated with diamond-film-like, diamond-film-like outside coating silicone resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200910154939 CN102071401B (en) | 2009-11-25 | 2009-11-25 | Planar magnetic-control sputtering target improving utilization efficiency |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200910154939 CN102071401B (en) | 2009-11-25 | 2009-11-25 | Planar magnetic-control sputtering target improving utilization efficiency |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102071401A CN102071401A (en) | 2011-05-25 |
| CN102071401B true CN102071401B (en) | 2013-03-06 |
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| CN 200910154939 Active CN102071401B (en) | 2009-11-25 | 2009-11-25 | Planar magnetic-control sputtering target improving utilization efficiency |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102296274B (en) * | 2011-08-18 | 2013-11-27 | 北京镨玛泰克真空科技有限公司 | Shielding device for cathode arc metal ion source |
| CN104404463B (en) * | 2014-11-14 | 2017-02-22 | 河海大学 | Planar magnetron sputtering target |
| CN105154839B (en) * | 2015-09-22 | 2018-03-09 | 上海晓睿真空科技有限公司 | A kind of planar cathode |
| CN109706428A (en) * | 2019-02-25 | 2019-05-03 | 常州星宇车灯股份有限公司 | A kind of sputtering target assembly |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5279724A (en) * | 1991-12-26 | 1994-01-18 | Xerox Corporation | Dual sputtering source |
| CN2615146Y (en) * | 2003-03-18 | 2004-05-12 | 沈阳金昌普新材料股份有限公司 | Sputtering cathode target material structure for producing foam nickel metallization |
| CN2688722Y (en) * | 2004-03-30 | 2005-03-30 | 王有德 | Scanning focusing magnetic controlling sputtering target |
| CN2828061Y (en) * | 2005-07-15 | 2006-10-18 | 中国人民解放军国防科学技术大学 | Target material structure of magnetic sputtering ferromagnetic material |
-
2009
- 2009-11-25 CN CN 200910154939 patent/CN102071401B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5279724A (en) * | 1991-12-26 | 1994-01-18 | Xerox Corporation | Dual sputtering source |
| CN2615146Y (en) * | 2003-03-18 | 2004-05-12 | 沈阳金昌普新材料股份有限公司 | Sputtering cathode target material structure for producing foam nickel metallization |
| CN2688722Y (en) * | 2004-03-30 | 2005-03-30 | 王有德 | Scanning focusing magnetic controlling sputtering target |
| CN2828061Y (en) * | 2005-07-15 | 2006-10-18 | 中国人民解放军国防科学技术大学 | Target material structure of magnetic sputtering ferromagnetic material |
Non-Patent Citations (1)
| Title |
|---|
| JP昭63-38576A 1988.02.19 |
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| CN102071401A (en) | 2011-05-25 |
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Owner name: ZHEJIANG TIANCHONG VEHICLE LAMP GROUP CO., LTD. Free format text: FORMER OWNER: FAN JIAQIU Effective date: 20130711 |
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| C41 | Transfer of patent application or patent right or utility model | ||
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Effective date of registration: 20130711 Address after: 318020 No. 68, Lantau Road, West Industrial Park, Taizhou, Zhejiang, Huangyan Patentee after: Zhejiang Tianchong Vehicle Lamp Group Co., Ltd. Address before: Huangyan West Industrial Park, new Island Road Taizhou City, Zhejiang province 318020 No. 68 Zhejiang Tianchong vehide Co. Ltd. Patentee before: Fan Jiaqiu |