CN201614403U - Gold plated ceramic - Google Patents

Gold plated ceramic Download PDF

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Publication number
CN201614403U
CN201614403U CN2010200043822U CN201020004382U CN201614403U CN 201614403 U CN201614403 U CN 201614403U CN 2010200043822 U CN2010200043822 U CN 2010200043822U CN 201020004382 U CN201020004382 U CN 201020004382U CN 201614403 U CN201614403 U CN 201614403U
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CN
China
Prior art keywords
gold
layer
plated
ceramic
ceramic matrix
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CN2010200043822U
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Chinese (zh)
Inventor
汪友林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tritree Metal (Shenzhen) Co.,Ltd.
Original Assignee
TRITREE METAL (SHENZHEN) CO Ltd
SENFUNG VACUUM PLATING CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TRITREE METAL (SHENZHEN) CO Ltd, SENFUNG VACUUM PLATING CO Ltd filed Critical TRITREE METAL (SHENZHEN) CO Ltd
Priority to CN2010200043822U priority Critical patent/CN201614403U/en
Application granted granted Critical
Publication of CN201614403U publication Critical patent/CN201614403U/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Abstract

The utility model provides gold plated ceramic which comprises a ceramic matrix and a gold plating layer. The gold plating layer is a gold layer which is plated through physical vapor deposition in a vacuum film coating chamber, and a transition layer which is plated through physical vapor deposition is also arranged between the ceramic matrix and the gold plating layer. The gold plated ceramic has the advantages that the gold plated ceramic is convenient to manufacture, no environmental pollutant, such as waste gas and waste liquor, are produced, the gold layer is firmly combined with the ceramic matrix, and the gold plated ceramic is uneasy to be worn or fall off, and simultaneously has the excellent performances, such as good electric conductivity, abrasion resistance, constant color and the like.

Description

A kind of gold-plated pottery
Technical field
The utility model relates to a kind of pottery, relates in particular to the pottery that a kind of surface coverage has the gold layer.
Background technology
Along with developing by leaps and bounds of top science technology such as industry such as modern electrical equipment, wireless, aviation, nuclear power, metallurgy, machinery, chemistry and robot calculator, space technology, new energy development, be the pottery made of the sintered material of main component with the oxide compound since its superior performance in the application of modern society more and more widely, for example, aluminum oxide or zirconia ceramics.Alumina-ceramic is a kind of with aluminum oxide (Al 2O 3) be the material of main body, be usually used in thick film integrated circuit.Alumina-ceramic has erosion resistance preferably, physical strength and high thermal resistance, use very extensive, for example, be widely used in medicine equipment, the pyroceramic circuit card of industry-by-industry such as printer and computer, the pottery wiring board, pottery rigidity wiring board, various Ceramic fittings, ceramic heater, ceramic laser printer heating piece and heater strip etc. are as body material mostly with alumina-ceramic, and then be coated with one deck gold on above-mentioned ceramic matrix surface, can further process as required at last, for example, carry out surface etch and form circuit card with specific circuit etc.
Have now in the gold-plated technology of ceramic surface and usually adopt plating mode, but because pottery itself is non-conductive, so can not Direct Electroplating on its surface, need at first to put it into nickel plating in the nickel plating aqueous solution again behind ceramic surface deposition one deck conducting material, the electrogilding aqueous solution with configuration carries out electrogilding at last.But because above-mentioned a plurality of plating step need finish, be easy to introduce impurity element in different electrolyzers, and gold-plated process often needs highly toxic substance as complexing agent, the liquid waste disposal difficulty, very important to the harm of environment.
The utility model content
The utility model purpose is to provide a kind of gold-plated pottery, through unique design, can reduce the consumption of gold copper-base alloy, and the gold layer combines firmly with ceramic matrix, not easy to wear coming off, and do not have environmental pollutions such as waste liquid, waste gas.
For achieving the above object, the utility model provides a kind of gold-plated pottery, comprises ceramic matrix and Gold plated Layer, and this Gold plated Layer is a kind of gold layer that is coated with physical gas-phase deposite method in vacuum film coating chamber; Between this ceramic matrix and Gold plated Layer, also be provided with the transition layer that is coated with physical gas-phase deposite method.
Described transition layer is chromium layer that is coated with on the ceramic matrix surface earlier and the nickel dam that is coated with at this chromium laminar surface.
Described transition layer is the wipla layer.
Described transition layer is titanium layer or titanium alloy layer.
Described physical gas-phase deposite method comprises magnetically controlled sputter method, multi-arc ion coating method and electron gun evaporation.
The utlity model has following advantage:
1. product surface is the proof gold look, and quality is moist;
2. transition layer and gold layer are to deposit film forming with physical gas-phase deposite method on ceramic matrix, and it is in aggregates but also high especially with the bonding force of ceramic matrix not only itself to mutually combine, difficult drop-off;
3. good conductivity is wear-resistant, and is fast in colour constant;
4. production process does not have waste liquid, does not have atmospheric pollution yet;
5. make simply, only need ceramic matrix is positioned in the vacuum film coating chamber, change cathode targets then and just can be coated with transition layer and gold layer successively continuously.
Description of drawings
Fig. 1 is the utility model structure cross-sectional schematic.
Embodiment
See also shown in Figure 1ly, the utility model comprises ceramic matrix 1 and gold layer 3.Ceramic matrix 1 can be to be the matrix that the sintered material of main component is made with oxide compound.This ceramic matrix 1 can be made into the pyroceramic circuit card of industry-by-industries such as being widely used in medicine equipment, printer and computer, ceramic wiring board, ceramic rigidity wiring board, various Ceramic fitting, ceramic heater, ceramic laser printer heating piece and heater strip etc. behind surface gold-plating layer 3.
Ceramic matrix 1 is put into vacuum film coating chamber be coated with a transition layer 2, change the cathode targets made from proof gold then, again at these transition layer 2 surface gold-plating layers 3 with the physical vapor deposition (PVD) method.This transition layer 2 both can increase the bonding force of gold layer 3 and ceramic matrix 1, simultaneously by selecting suitable transition layer 2 also can make gold-plated pottery have wear resistance, erosion resistance and certain rigidity requirement.
This transition layer 2 can be to plate the chromium layer on ceramic matrix 1 surface earlier, changes the cathode targets made from nickel then, plates nickel dam on the surface of this chromium layer again.Chromium layer and ceramic matrix 1 have good bonding force, and nickel dam is good diffusion impervious layer, stop the diffusion of chromium layer.Simultaneously, thus nickel dam and chromium layer and gold layer 3 also all have the uniformity consistency that the good binding ability has guaranteed whole rete.
This transition layer 2 can be a wipla.
This transition layer 2 can be titanium layer or titanium alloy layer.
For reducing the consumption of gold copper-base alloy, in the process of gold-plated film 3, rotate by the electric machine control gold target, plated the ceramic matrix 1 of transition layer 2 over against gold target one suitable fixed distance, such structure design carries out gold-platedly both can improving the waste that the gold target utilization ratio reduces the Precious Metals-Gold material simultaneously, and it is very fast to deposit film forming speed, and rete is more even.
All the transition layer 2 that is coated with physical gas-phase deposite method can be determined according to the service requirements of concrete ceramic substrate with the thickness of gold layer 3.
Described physical gas-phase deposite method comprises magnetically controlled sputter method, multi-arc ion coating method and electron gun evaporation etc.
The utility model in vacuum coating equipment through repeatedly once finishing behind the plated film, so easily manufactured, and do not have the environmental pollutions such as waste gas, waste liquid, also have simultaneously corrosion-resistant, good conductivity, the premium properties such as constant fast in colour.

Claims (5)

1. a gold-plated pottery comprises ceramic matrix and Gold plated Layer, it is characterized in that, this Gold plated Layer is a kind of gold layer that is coated with physical gas-phase deposite method in vacuum film coating chamber; Between this ceramic matrix and Gold plated Layer, also be provided with the transition layer that is coated with physical gas-phase deposite method.
2. a kind of gold-plated pottery according to claim 1 is characterized in that, described transition layer is chromium layer that is coated with on the ceramic matrix surface earlier and the nickel dam that is coated with at this chromium laminar surface.
3. a kind of gold-plated pottery according to claim 1 is characterized in that described transition layer is the wipla layer.
4. a kind of gold-plated pottery according to claim 1 is characterized in that described transition layer is titanium layer or titanium alloy layer.
5. a kind of gold-plated pottery according to claim 1 is characterized in that described physical gas-phase deposite method comprises magnetically controlled sputter method, multi-arc ion coating method and electron gun evaporation.
CN2010200043822U 2010-01-12 2010-01-12 Gold plated ceramic Expired - Lifetime CN201614403U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2010200043822U CN201614403U (en) 2010-01-12 2010-01-12 Gold plated ceramic

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2010200043822U CN201614403U (en) 2010-01-12 2010-01-12 Gold plated ceramic

Publications (1)

Publication Number Publication Date
CN201614403U true CN201614403U (en) 2010-10-27

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN2010200043822U Expired - Lifetime CN201614403U (en) 2010-01-12 2010-01-12 Gold plated ceramic

Country Status (1)

Country Link
CN (1) CN201614403U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102776511A (en) * 2012-08-10 2012-11-14 昆山乔锐金属制品有限公司 Preparation method for metal composite coating using ceramic as base body
CN104294222A (en) * 2014-10-17 2015-01-21 汕头市鸿志电子有限公司 Manufacturing technology of inner electrode of electronic ceramic element
CN107742779A (en) * 2017-08-30 2018-02-27 瑞声精密制造科技(常州)有限公司 The preparation method and mobile device of a kind of antenna

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102776511A (en) * 2012-08-10 2012-11-14 昆山乔锐金属制品有限公司 Preparation method for metal composite coating using ceramic as base body
CN104294222A (en) * 2014-10-17 2015-01-21 汕头市鸿志电子有限公司 Manufacturing technology of inner electrode of electronic ceramic element
CN104294222B (en) * 2014-10-17 2016-06-29 汕头市鸿志电子有限公司 The manufacturing process of electrode in a kind of electronic ceramic component
CN107742779A (en) * 2017-08-30 2018-02-27 瑞声精密制造科技(常州)有限公司 The preparation method and mobile device of a kind of antenna

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Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
ASS Succession or assignment of patent right

Owner name: TRITREE METAL (SHENZHEN) CO., LTD.

Free format text: FORMER OWNER: SHENZHEN SENFUNG VACUUM PLATING CO., LTD.

Effective date: 20110302

Free format text: FORMER OWNER: TRITREE METAL (SHENZHEN) CO., LTD.

C41 Transfer of patent application or patent right or utility model
COR Change of bibliographic data

Free format text: CORRECT: ADDRESS; FROM: 518101 8/F, YINJIN INDUSTRIAL BUILDING, LIUXIAN ROAD 1, AREA 71, BAOAN DISTRICT, SHENZHEN CITY, GUANGDONG PROVINCE TO: 518106 BUILDING 7, BANSHIGUAN INDUSTRIAL PARK, GONGMING SUBDISTRICT, GUANGMING NEW DISTRICT, SHENZHEN CITY, GUANGDONG PROVINCE

TR01 Transfer of patent right

Effective date of registration: 20110302

Address after: 518106, Shenzhen, Guangming District, Guangdong province Gongming Street Stone Industry Park seventh

Patentee after: Tritree Metal (Shenzhen) Co.,Ltd.

Address before: Shenzhen City, Guangdong province Baoan District 518101 District 71 Liuxian road Arts crafts emporium eighth introduction

Co-patentee before: Tritree Metal (Shenzhen) Co.,Ltd.

Patentee before: SenFung Vacuum Plating Co., Ltd.

CX01 Expiry of patent term
CX01 Expiry of patent term

Granted publication date: 20101027