CN102069453A - Sharpener trimmer with protection film and forming method of protection film - Google Patents
Sharpener trimmer with protection film and forming method of protection film Download PDFInfo
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- CN102069453A CN102069453A CN2009102248316A CN200910224831A CN102069453A CN 102069453 A CN102069453 A CN 102069453A CN 2009102248316 A CN2009102248316 A CN 2009102248316A CN 200910224831 A CN200910224831 A CN 200910224831A CN 102069453 A CN102069453 A CN 102069453A
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- trimmer
- diaphragm
- milling tool
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- tool trimmer
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Abstract
The invention relates to a sharpener trimmer with a protection film and a forming method of the protection film. The sharpener trimmer with the protection film comprises a substrate and at least one amorphous oxide film, wherein the substrate is provided with a body, multiple grinding granules and at least one combination layer which is absorbed to the body surface, the multiple grinding granules are provided with a first part and a second part, the first part is exposed outside the surface of the combination layer, the second part is embedded in the combination layer, the amorphous oxide film covers the surfaces of the substrate, the multiple grinding granules and the combination layer, is coated, deposited and plated on the surface of the sharpener trimmer by using a sol-gel method, and forms the protection film on the surface of the sharpener trimmer so that the sharpener trimmer can resist acid-base corrosion to further prolong the service life.
Description
Technical field
A kind of milling tool trimmer of tool diaphragm and diaphragm manufacturing process thereof refer to a kind ofly batch cover the erosion-resisting diaphragm of one deck in milling tool trimmer surface and batch cover the method that this diaphragm is shaped in the diaphragm of milling tool trimmer especially.
Background technology
Press the existing all kinds of different acid-base solutions that in the every processing procedure of semiconductor, use; especially to grind the wafer such as the pottery of all kinds of materials in the middle of cmp (CMP) processing procedure; silicon; glass; material such as quartz and metal must add the operation that chemical grinding slurry collocation grinding pad grinds; described grinding pad is in the middle of grinding operation carries out process; interior polishing particles and the aforementioned wafer of slurry that described grinding pad surface can fix aforementioned collocation grinding operation use grinds the material particle that is cut; so needing to use trimmer clears up described grinding pad; when described trimmer and grinding pad interact; the material or the solution that still have acid or alkali in the described grinding pad; the material of described acid or alkali and solution will corrode this trimmer; make significantly reduce its service life; so the personage of this technology is with chemical vapour deposition (CVD) (Chemical Vapor Deposition; CVD) cover one deck hydrophobicity diaphragm in surperficial batch of this trimmer; this diaphragm mainly avoids suffering acidity and alkaline matter to corrode in order to the surface of protecting this trimmer; (Chemical Vapor Deposition CVD) is a kind of purity height that is used for producing in described chemical vapour deposition (CVD); the chemical technology of the solid-state material that performance is good.
Semiconductor industry is used aforementioned chemical vapour deposition (CVD) (Chemical Vapor Deposition, CVD) the technology film of growing up; Typical C VD processing procedure is that wafer (substrate) is exposed under one or more different predecessors, produces the film that desire deposits at substrate surface generation chemical reaction or chemical breakdown; Usually also can produce different byproducts concomitantly in the course of reaction, but mostly can be along with air-flow is being with, and can not stay in the reaction chamber.
Little processing procedure mostly uses chemical vapour deposition (CVD) (Chemical Vapor Deposition, CVD) technology deposits multi-form material, comprise monocrystalline, polycrystalline, amorphous and brilliant material of heap of stone, these materials have materials such as silicon, carbon fiber, carbon nano-fiber, nano wire, CNT, SiO2, SiGe, tungsten, silicon-carbon, silicon nitride, silicon oxynitride and various high-k medium, (Chemical Vapor Deposition, CVD) processing procedure also is commonly used to generate synthesizing diamond in chemical vapour deposition (CVD).
Aforesaid chemical vapour deposition (CVD) (Chemical Vapor Deposition, CVD) processing procedure is not a zero defect, needs to reach a high temperature in chamber when carrying out chemical vapor deposition process and the atmosphere of high pressure, and need will vacuumize in the chamber; So improve cost and the operating efficiency of making relatively, and chemical vapour deposition (CVD) only can be plated the thing surface in desire and be carried out coating and criticize and cover, also can't criticize between hole and cover, cavity size and deposit film time length that working substance is subject to the chemical vapour deposition (CVD) facility are the shortcoming of chemical vapour deposition (CVD) too; So known technology has following shortcoming:
1. cost is too high;
2. inefficiency;
3. can't produce in a large number;
4. only can be in the working substance surface coating;
5. apparatus expensive.
Summary of the invention
Of the present inventionly provide a kind of and have the milling tool trimmer of diaphragm and a kind of manufacture method of draping over one's shoulders attached diaphragm in milling tool trimmer surface is provided, to solve the technical problem that exists in the above-mentioned background technology.
For reaching the milling tool trimmer that above-mentioned purpose the invention provides a kind of tool diaphragm, described milling tool trimmer structure, comprise: a base material and at least one noncrystalline sull, this base material has a body and an a plurality of abrasive grains and a binder course, described binder course drapes over one's shoulders and invests this body surface, these abrasive grains have a first and a second portion, and described first exposes to aforementioned binder course surface, and described second portion embeds in the aforementioned binder course; Described noncrystalline sull covers aforementioned substrates and these abrasive grains and binder course surface.
For reaching the diaphragm manufacturing process that another above-mentioned purpose the invention provides a kind of milling tool trimmer of tool diaphragm; comprise the following step: prepare a milling tool trimmer; again with sol-gal process described milling tool trimmer surface be coated with at least one noncrystalline sull thereafter; moreover; described milling tool trimmer integral body is carried out drying to be handled; at last aforementioned milling tool trimmer is coated with noncrystalline sull part and carries out sintering, can firmly be attached to the surface of this milling tool trimmer to guarantee aforementioned noncrystalline sull.
But to make this milling tool trimmer acid-alkali-corrosive-resisting, the person of advancing improves the service life of milling tool trimmer, has reached beneficial technical effects by technique scheme in the present invention.
Description of drawings
Fig. 1 is the generalized section of the milling tool trimmer of embodiments of the invention;
Fig. 1 a is the local enlarged diagram of section of the milling tool trimmer of embodiments of the invention;
Fig. 1 b is the structural representation of another milling tool trimmer of embodiments of the invention;
Fig. 2 is the flow chart of diaphragm manufacturing process of the milling tool trimmer of embodiments of the invention;
Fig. 3 covers the film schematic diagram for criticizing of embodiments of the invention;
Fig. 4 is the flow chart of diaphragm manufacturing process of the milling tool trimmer of another embodiment of the present invention;
Fig. 5 is the milling tool trimmer structural representation of embodiments of the invention.
Description of reference numerals:
The specific embodiment
Characteristic on above-mentioned purpose of the present invention and structure thereof and the function will be according to appended graphic preferred embodiment with explanation.
See also Fig. 1,1a, 1b, be the generalized section and the partial enlarged drawing of the milling tool trimmer of embodiments of the invention, milling tool trimmer 1 structure of the present invention comprises: a base material 11, a noncrystalline sull 12.
This base material 11 has a body 111 and an a plurality of abrasive grains 112 and a binder course 113, described binder course 113 drapes over one's shoulders and invests this body 111 surfaces, these abrasive grains 112 have a first 1121 and a second portion 1122, described first 1121 exposes to aforementioned binder course 113 surfaces, and described second portion 1122 embeds in the aforementioned binder course 113.
Aforementioned abrasive grains 112 is selected from the group that diamond, polycrystalline diamond, cubic boron nitride, polycrystal cubic boron nitride and combination thereof are formed.
It is wherein arbitrary that described body 111 may be selected to be metal and plastic cement and pottery and glass and graphite.
It is wherein arbitrary that described binder course 113 may be selected to be metal and plastic cement and pottery and glass and graphite.
Described noncrystalline sull 12 covers aforementioned substrates 11 and these abrasive grains 112 and binder course 113 surfaces;
Described noncrystalline sull 12 comprises a plurality of particles 121, and these particles 121 are selected from the group that Al2O3 (aluminium oxide) and SiO2 (silica) and ZrO2 (zirconia) and CaO (calcium oxide) and K2O (potassium oxide) and TiO2 (titanium oxide) are formed.
Described noncrystalline sull 12 can be single or multiple lift, and can drape over one's shoulders attached institute and form (shown in Fig. 1 b) by single material or by many materials are overlapped.The milling tool trimmer of described tool diaphragm is in order to the grinding pad in the chemical mechanical polishing device of finishing semiconductor crystal wafer.
See also Fig. 2,3, for the flow chart of the diaphragm manufacturing process of the milling tool trimmer of tool diaphragm of the present invention and drape over one's shoulders attached film schematic diagram, the diaphragm manufacturing process of described milling tool trimmer comprises the following step:
Step S1: a milling tool trimmer is provided;
Prepare a milling tool trimmer 1, can earlier cleaning be done on the surface, for example can the unclean thing on surface be removed placing ultrasonic cleaning machine (not shown) to shake again in this milling tool trimmer 1 placement pure water.
Step S2: described milling tool trimmer surface is coated with at least one noncrystalline sull with sol-gal process;
The particle 121 that described sol-gal process is selected from the group that aforementioned Al2O3 (aluminium oxide) and SiO2 (silica) and ZrO2 (zirconia) and CaO (calcium oxide) and K2O (potassium oxide) and TiO2 (titanium oxide) particle form is soaked in the aqueous solution 2, and make the described aqueous solution 2 and aforementioned arbitrary material particle inject evenly mixing in the cell body 3, aforementioned milling tool trimmer 1 be soaked in the aqueous solution of aforementioned cell body 3 thereafter, and this milling tool trimmer 1 left standstill, again this milling tool trimmer 1 is pulled out from the aqueous solution 2 at last or the aqueous solution 2 is removed by leaking in the cell body 3 totally, make aforementioned particles 121 be attached to this milling tool trimmer 1 surface.
The sol-gal process of present embodiment more comprises the following step:
When milling tool trimmer 1 immerses in the aqueous solution 2 with 100-200mm/min speed, when milling tool trimmer 1 lower edge contact liquid level, suspend 2-5 second.
Behind the milling tool trimmer 1 complete immersed in liquid level, suspend 10-30 second.
When milling tool trimmer 1 was pulled out liquid level, the speed of drawing high was 40-120mm/min, after base material 11 is pulled out liquid level fully, suspend 30-60 second.
The mode of described sol-gal process can be selected from immersion type and spoon drench formula and retouch the formula of being coated with and atomizing and rotation cloth of coating-type wherein arbitrary.
Step S3: described milling tool trimmer integral body is carried out drying handle;
Drying is carried out on aforementioned milling tool trimmer 1 surface of finishing deposited amorphous matter sull 12 to be handled, carry out when carrying out milling tool trimmer 1 to be placed under the room temperature when drying is handled, or milling tool trimmer 1 is placed in carries out drying in the high temperature baking box (not shown) and handle, and the temperature of high temperature baking box set the boundary in the 50-200 degree, the high more time that can shorten drying operation of baking temperature.
Need wait for when the drying of present embodiment is handled taking off again after milling tool trimmer 1 surperficial water wave disappears and do baking, its preferable baking temperature 70 ℃/1 hour or 120 ℃/20 minutes.
Step S4: aforementioned milling tool trimmer is coated with the amorphous film part carries out sintering.
For the noncrystalline sull 12 that makes milling tool trimmer 1 surface can firmly be attached to this milling tool trimmer 1 surface, so need carry out sintering work, described milling tool trimmer 1 is placed in the sintering furnace (not shown), and sintering temperature is set in the 200-800 degree and continues for some time, at last with milling tool trimmer 1 by taking out in the sintering furnace, this step can make the noncrystalline sull 12 on this milling tool trimmer 1 surface fit tightly in this surface.
Described preferable sintering condition is 550 ℃/20 minutes or 750 ℃/5 minutes.
Consult Fig. 4 clearly, as shown in the figure, aforementioned milling tool trimmer 1 is coated with before noncrystalline (amorphous) sull 12 parts carry out sintering in carrying out step S4, more can comprises a step S5 noncrystalline sulls 12 at the abrasive grains 112 most advanced and sophisticated places on this milling tool trimmer 1 surface are removed (as shown in Figure 5).
In the embodiment of the invention in each manufacture method step employed material be the Nano sol surface pretreatment agent that faithful and honest technology advisory firm (Taiwan) is provided, production code member A-100, its main component is the aluminium oxide nano particle, particle diameter≤10nm, content 1.0%;
Product performance: proportion 1.01 ± 0.03, flashing point＞100 ℃, appearance colorless is transparent, pH value 7.0 ± 0.5.
In the embodiment of the invention in each manufacture method step employed another material be the Nano sol surface pretreatment agent that faithful and honest technology advisory firm (Taiwan) is provided, production code member T-80, its main component is titanium dioxide nano-particle and interfacial agent, particle diameter≤10nm, content 0.8%; Product performance:
Proportion 1.01 ± 0.03, flashing point＞100 ℃, golden appearance transparency liquid, pH value 7.0 ± 0.5; Dry 30 ± 5 ℃ of the temperature of doing.
The above description of this invention is illustrative, and nonrestrictive, and those skilled in the art is understood, and can carry out many modifications, variation or equivalence to it within spirit that claim limits and scope, but they will fall within the scope of protection of the present invention all.
Claims (13)
1. the milling tool trimmer of a tool diaphragm is characterized in that, comprises:
One base material, have a body and a plurality of abrasive grains and a binder course, described binder course drapes over one's shoulders and invests this body surface, and these abrasive grains have a first and a second portion, described first exposes to described binder course surface, and described second portion embeds in the described binder course;
At least one noncrystalline sull is covered in described base material and these abrasive grains and binder course surface.
2. the milling tool trimmer of tool diaphragm as claimed in claim 1; it is characterized in that; described noncrystalline sull comprises a plurality of particles, and these particles are selected from the group that aluminium oxide and silica and zirconia and calcium oxide and potassium oxide and titanium oxide are formed.
3. the milling tool trimmer of tool diaphragm as claimed in claim 1 is characterized in that, described abrasive grains is selected from the group that diamond and polycrystalline diamond and cubic boron nitride and polycrystal cubic boron nitride are formed.
4. the milling tool trimmer of tool diaphragm as claimed in claim 1 is characterized in that, it is wherein arbitrary that described base material is chosen as metal and plastic cement and pottery and glass and graphite.
5. the milling tool trimmer of tool diaphragm as claimed in claim 1 is characterized in that, it is wherein arbitrary that described binder course is chosen as metal and plastic cement and pottery and glass and graphite.
6. the milling tool trimmer of tool diaphragm as claimed in claim 1 is characterized in that, the milling tool trimmer of described tool diaphragm is in order to the grinding pad in the chemical mechanical polishing device of finishing semiconductor crystal wafer.
7. the diaphragm manufacturing process of the milling tool trimmer of a tool diaphragm is characterized in that, comprises the following step:
One milling tool trimmer is provided;
With sol-gal process described milling tool trimmer surface is coated with at least one noncrystalline sull;
Described milling tool trimmer integral body is carried out drying to be handled; And
The described milling tool trimmer that is coated with the noncrystalline sull is carried out sintering.
8. the diaphragm manufacturing process of the milling tool trimmer of tool diaphragm as claimed in claim 7; it is characterized in that; described noncrystalline sull comprises a plurality of particles, and these particles are selected from the group that aluminium oxide and silica and zirconia and calcium oxide and potassium oxide and titanium oxide are formed.
9. the diaphragm manufacturing process of the milling tool trimmer of tool diaphragm as claimed in claim 7 is characterized in that, the described dry temperature of handling is the 50-200 degree.
10. the diaphragm manufacturing process of the milling tool trimmer of tool diaphragm as claimed in claim 7 is characterized in that, described sintering temperature is the 200-800 degree.
11. the diaphragm manufacturing process of the milling tool trimmer of tool diaphragm as claimed in claim 7 is characterized in that, dry processing places under the room temperature to be handled.
12. the diaphragm manufacturing process of the milling tool trimmer of tool diaphragm as claimed in claim 7 is characterized in that, the sol-gal process coating method be selected from immersion type and spoon drench formula and retouch the formula of being coated with and atomizing and rotation cloth of coating-type wherein arbitrary.
13. the diaphragm manufacturing process of the milling tool trimmer of tool diaphragm as claimed in claim 7; it is characterized in that; before the described milling tool trimmer that is coated with the noncrystalline sull carried out the step of sintering, the noncrystalline sull that more comprises the most advanced and sophisticated place of this milling tool trimmer surface grinding particle removed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009102248316A CN102069453A (en) | 2009-11-24 | 2009-11-24 | Sharpener trimmer with protection film and forming method of protection film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009102248316A CN102069453A (en) | 2009-11-24 | 2009-11-24 | Sharpener trimmer with protection film and forming method of protection film |
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| Publication Number | Publication Date |
|---|---|
| CN102069453A true CN102069453A (en) | 2011-05-25 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009102248316A Pending CN102069453A (en) | 2009-11-24 | 2009-11-24 | Sharpener trimmer with protection film and forming method of protection film |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103317157A (en) * | 2012-03-21 | 2013-09-25 | 三菱综合材料株式会社 | Surface coating cutting tool |
| CN104097146A (en) * | 2013-04-08 | 2014-10-15 | 鑫晶鑽科技股份有限公司 | Polishing pad dresser structure and manufacturing method thereof |
| CN108237467A (en) * | 2016-12-23 | 2018-07-03 | 中芯国际集成电路制造(上海)有限公司 | A kind of processing method of grinding pad |
-
2009
- 2009-11-24 CN CN2009102248316A patent/CN102069453A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103317157A (en) * | 2012-03-21 | 2013-09-25 | 三菱综合材料株式会社 | Surface coating cutting tool |
| CN103317157B (en) * | 2012-03-21 | 2016-08-03 | 三菱综合材料株式会社 | Surface-coated cutting tool |
| CN104097146A (en) * | 2013-04-08 | 2014-10-15 | 鑫晶鑽科技股份有限公司 | Polishing pad dresser structure and manufacturing method thereof |
| CN104097146B (en) * | 2013-04-08 | 2017-06-09 | 鑫晶鑽科技股份有限公司 | Polishing pad dresser structure and manufacturing method thereof |
| CN108237467A (en) * | 2016-12-23 | 2018-07-03 | 中芯国际集成电路制造(上海)有限公司 | A kind of processing method of grinding pad |
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Application publication date: 20110525 |