CN102065633A - Microwave high-frequency ultralong circuit board - Google Patents
Microwave high-frequency ultralong circuit board Download PDFInfo
- Publication number
- CN102065633A CN102065633A CN 201110002274 CN201110002274A CN102065633A CN 102065633 A CN102065633 A CN 102065633A CN 201110002274 CN201110002274 CN 201110002274 CN 201110002274 A CN201110002274 A CN 201110002274A CN 102065633 A CN102065633 A CN 102065633A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- frequency
- metal substrate
- microwave high
- ultralong
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
The invention discloses a microwave high-frequency ultralong circuit board comprising a metal substrate (1). A circuit layer (4) is arranged at one end of the metal substrate (1), and a tin layer (5) is arranged at the other end of the metal substrate (1). The invention provides a microwave high-frequency ultralong circuit board for a mobile communication base station antenna, which has an effective length up to 1520 mm, can avoid bending and deforming in baking and cooling without influencing the stripping strength of the circuit board, and stabilizes the dielectric constant, and a circuit board circuit part and a signal circuit part of the antenna have better insulation performance.
Description
Technical field
The present invention relates to a kind of antenna of mobile communication base station microwave high-frequency overlength circuit board.
Background technology
In microwave high-frequency circuit board (HFPCB) industry, the circuit board that length surpasses 800mm is called ultra-long microwave high-frequency circuit board, the maximum working ability of manufacturer is 1100mm in the industry at present, surpass this length generally in the problem that cools and occur bending and deformation often, the out-of-flatness of plate face, reduce the circuit board peel strength, can not satisfy the high-transmission function of antenna of mobile communication base station microwave high-frequency overlength circuit board microwave signal.
Summary of the invention
The invention provides a kind of antenna of mobile communication base station microwave high-frequency overlength circuit board, its effective length reaches 1520mm, can be not crooked when baking cools, indeformable, do not influence the wiring board peel strength, make dielectric constant stable, and antenna circuit board circuit part and signal circuit section insulation property are better.
The present invention has adopted following technical scheme: a kind of microwave high-frequency overlength circuit board, and it comprises metal substrate, is provided with line layer in the one side of metal substrate, another side is provided with the tin layer.
Described tin layer is provided with dielectric substrate; Described metal substrate is provided with location hole; Described location hole is positioned on the diagonal of metal substrate, and cornerwise two ends are respectively equipped with a location hole; Described metal substrate is provided with the metallization square groove; Described metallization square groove is positioned on another diagonal of metal substrate, and cornerwise two ends are respectively equipped with a metallization square groove; Described metal substrate is the microwave high-frequency copper clad foil substrate.
The present invention has following beneficial effect: the present invention is after increasing tin coating on the whole plate copper layer of the one side of metal substrate, on the tin layer, print insulating glass sealant, form dielectric substrate, can gain in strength and the toughness of circuit board, make circuit board like this when production length is increased to 1520mm, baking cools not crooked, indeformable, do not influence the peel strength of line layer, dielectric constant is stable, is provided with location hole on the plate body diagonal angle, can guarantee accurate positioning, be provided with the metallization square groove at another diagonal angle, make circuit board line part and the signal circuit section performance that is electrically insulated stronger.
Description of drawings
Fig. 1 is a structural representation of the present invention.
Embodiment
In Fig. 1, the present invention is a kind of microwave high-frequency overlength circuit board, and it comprises metal substrate 1, and this metal substrate 1 is the microwave high-frequency copper clad foil substrate.One side at metal substrate 1 is provided with line layer 4, and another side is provided with tin layer 5.Described tin layer 5 is provided with dielectric substrate 6.Described metal substrate 1 is provided with location hole 2, and described location hole 2 is positioned on the diagonal of metal substrate 1, and cornerwise two ends are respectively equipped with a location hole 2.Described metal substrate 1 is provided with metallization square groove 3, and described metallization square groove 3 is positioned on another diagonal of metal substrate 1, and cornerwise two ends are respectively equipped with a metallization square groove 3.
Claims (7)
1. a microwave high-frequency overlength circuit board is characterized in that it comprises metal substrate (1), is provided with line layer (4) in the one side of metal substrate (1), and another side is provided with tin layer (5).
2. a kind of microwave high-frequency overlength circuit board according to claim 1 is characterized in that described tin layer (5) is provided with dielectric substrate (6).
3. a kind of microwave high-frequency overlength circuit board according to claim 1 is characterized in that described metal substrate (1) is provided with location hole (2).
4. a kind of microwave high-frequency overlength circuit board according to claim 3 is characterized in that described location hole (2) is positioned on the diagonal of metal substrate (1), and cornerwise two ends are respectively equipped with a location hole (2).
5. a kind of microwave high-frequency overlength circuit board according to claim 1 is characterized in that described metal substrate (1) is provided with metallization square groove (3).
6. a kind of microwave high-frequency overlength circuit board according to claim 5 is characterized in that described metallization square groove (3) is positioned on another diagonal of metal substrate (1), and cornerwise two ends are respectively equipped with a metallization square groove (3).
7. according to claim 1 or 3 or 4 or 5 or 6 described a kind of microwave high-frequency overlength circuit boards, it is characterized in that described metal substrate (1) is the microwave high-frequency copper clad foil substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110002274 CN102065633A (en) | 2011-01-05 | 2011-01-05 | Microwave high-frequency ultralong circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110002274 CN102065633A (en) | 2011-01-05 | 2011-01-05 | Microwave high-frequency ultralong circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102065633A true CN102065633A (en) | 2011-05-18 |
Family
ID=44000649
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201110002274 Pending CN102065633A (en) | 2011-01-05 | 2011-01-05 | Microwave high-frequency ultralong circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102065633A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1989650A (en) * | 2004-07-23 | 2007-06-27 | 日本电气株式会社 | Composite via structures and filters in multilayer printed circuit boards |
| JP2010010277A (en) * | 2008-06-25 | 2010-01-14 | Nippon Mektron Ltd | Flexible circuit board and method of manufacturing the same |
| CN101784165A (en) * | 2010-03-19 | 2010-07-21 | 中兴通讯股份有限公司 | Treatment method of corrosion-resistant weldable coating layer of printed circuit board |
| CN101808464A (en) * | 2010-03-09 | 2010-08-18 | 施吉连 | Method for manufacturing ultra-long microwave high-frequency circuit board |
| CN201919239U (en) * | 2011-01-05 | 2011-08-03 | 倪新军 | Microwave high-frequency ultra-long circuit board |
-
2011
- 2011-01-05 CN CN 201110002274 patent/CN102065633A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1989650A (en) * | 2004-07-23 | 2007-06-27 | 日本电气株式会社 | Composite via structures and filters in multilayer printed circuit boards |
| JP2010010277A (en) * | 2008-06-25 | 2010-01-14 | Nippon Mektron Ltd | Flexible circuit board and method of manufacturing the same |
| CN101808464A (en) * | 2010-03-09 | 2010-08-18 | 施吉连 | Method for manufacturing ultra-long microwave high-frequency circuit board |
| CN101784165A (en) * | 2010-03-19 | 2010-07-21 | 中兴通讯股份有限公司 | Treatment method of corrosion-resistant weldable coating layer of printed circuit board |
| CN201919239U (en) * | 2011-01-05 | 2011-08-03 | 倪新军 | Microwave high-frequency ultra-long circuit board |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TW200721927A (en) | Method for making a circuit board, and circuit board | |
| TW200744256A (en) | Radio frequency identification tag and antenna for radio frequency identification tag | |
| US20220336948A1 (en) | Antenna structure | |
| JP2013223000A (en) | Antenna device | |
| KR20170094702A (en) | Flexible printed circuit board | |
| CN201947528U (en) | Multilayer printed circuit board | |
| WO2009037145A3 (en) | Method for the production of an electronic assembly, and electronic assembly | |
| CN205255668U (en) | Low dielectricity glued membrane | |
| CN201919239U (en) | Microwave high-frequency ultra-long circuit board | |
| WO2012085472A3 (en) | Printed circuit board with an insulated metal substrate | |
| CN203151860U (en) | Bendable metal-base printed circuit board | |
| CN102480840B (en) | Method for manufacturing circuit boards | |
| CN102065633A (en) | Microwave high-frequency ultralong circuit board | |
| CN202121866U (en) | Copper foil substrate of flexible circuit board | |
| CN101145635B (en) | Dual-frequency printing antenna | |
| CN203181416U (en) | Jumper wire for printed circuit board and printed circuit board thereof | |
| US20130321105A1 (en) | Stripline connection apparatus | |
| KR102088323B1 (en) | Connection Structure of the Printed Circuit Board | |
| CN103379748B (en) | High-frequency mixed-compression board and preparation method thereof | |
| CN102036472A (en) | Microwave high-frequency metal base circuit board | |
| EP1937040A3 (en) | Conductor board with a high frequency component | |
| CN203219609U (en) | Novel metal core printed circuit board | |
| CN205793641U (en) | A kind of FPC golden finger connecting ZIF stand | |
| CN212211492U (en) | Novel metal-based copper-clad plate | |
| CN203901854U (en) | 3D metal-based copper clad laminate |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20110518 |