CN102065626A - Atmospheric pressure non-thermal plasma brush generator and array combination thereof - Google Patents
Atmospheric pressure non-thermal plasma brush generator and array combination thereof Download PDFInfo
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- CN102065626A CN102065626A CN 201110024536 CN201110024536A CN102065626A CN 102065626 A CN102065626 A CN 102065626A CN 201110024536 CN201110024536 CN 201110024536 CN 201110024536 A CN201110024536 A CN 201110024536A CN 102065626 A CN102065626 A CN 102065626A
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Abstract
The invention discloses an atmospheric pressure non-thermal plasma brush generator and array combination thereof in order to solve the following problem in the prior art: cooling systems need to be additionally configured because the gas flow temperature of the plasmas generated when the atmospheric pressure plasma generators work is higher, thus the generators are hard to be applied in the practical industry. The brush generator comprises a main chamber and two electrodes, wherein the main chamber is provided with an air inlet and an air outlet in a shape of narrow gap; a narrow gap chamber is naturally formed on the part close to the air outlet, in the main chamber; and the discharge ends of the two electrodes are arranged in the narrow gap chamber. The brush generator has the following advantages: the brush generator can generate plasmas at atmospheric pressure; and the structural design is diversified, the cost is low, the brush generator is safe and convenient to operate, and the objects with large areas or complex contour structures are easier to treat by the brush generator compared with the traditional low pressure plasma generators.
Description
Technical field
The present invention relates to a kind of atmos low-temperature plasma brush generating means and array combination thereof, often be applied to the material surface cleaning, material character improvement, the equipment in fields such as the sterilization and the depollution of environment.
Background technology
In recent years, plasma technique (plasma-treating technology) is widely used in semiconductor manufacturing, material removing surface and improvement, industrial circles such as sterilization.Plasma technique is in the successful Application of the above-mentioned numerous industrial circles nonequilibrium behavior because of plasma.In the non-equilibrium plasma system, exist a large amount of cryochemistry active species, when these active species contact with other material surface, can be under the situation that does not influence these material bulk properties, the upgrade materials surface characteristic.
In traditional industrial circle, mainly rely on the low pressure glow discharge nonequilibrium plasma to carry out material processed, and this plasma production process need expensive vacuum equipment, also there is the unfavorable factor of the compatible difficulty of substance to be processed and vacuum plant.The investment of huge amount of money vacuum equipment, the effects limit such as complexity of higher facility maintenance and repair expense and operation control the use on a large scale of low pressure glow discharge nonequilibrium plasma treatment process.
The low pressure glow plasma generating means that has vacuum equipment relatively, atmos low-temperature plasma brush generating means want cheap many, also do not need substance to be processed to be in the vacuum environment.In recent decades, people are devoted to the research and development of atmospheric pressure non-equilibrium plasma equipment, yet report only is several atmospheric pressure plasma generators few in number.Wherein, the using value maximum that atmospheric pressure plasma jet (APPJ) is potential, it is to use resonant cavity to carry out radio frequency discharge to produce plasma, the radio-frequency (RF) energy of input is greatly about 300～500 watts, annular region between two cylindrical electrodes produces plasma, and dependence is kept to central electrode input radio frequency energy.In order to prevent the generation of electric spark, plasma is kept gas must select helium.In the material surface processing procedure, need keep to plasma and add 0.5～1% active gases in the gas, such as oxygen, fluorocarbon (carbon tetrafluoride etc.), carbon oxyfluoride and halogen etc., produce chemically active species.Yet, atmospheric pressure plasma jet (APPJ), the higher energy of needs causes and keeps.Wherein, most of energy is absorbed by plasma gas and produces temperature rise.Thereby also need cooling system to guarantee atmospheric pressure plasma jet (APPJ) operate as normal under low-temperature atmosphere-pressure.Other atmospheric pressure plasma also has some characteristics of low pressure plasma concurrently, but the plasma temperature of its generation is higher, in practical application in industry, such as being subjected to very big restriction in the middle of the material processed.At present, plasma producing apparatus is difficult to obtain the plasma of large volume, and in addition, it is also quite high that the article on plasma body is kept the purity requirement of gas, and also very little to the selectivity of active gases, these unfavorable factors are all limiting atmospheric pressure plasma techniques and are further developing and use.
Summary of the invention
The present invention aims to provide a kind of atmos low-temperature plasma brush generating means, the plasma flow temperature that produces when solving atmospheric pressure plasma generator work in the prior art is higher, needs the additional configuration cooling system and causes being difficult to problem in practical application in industry.
Technical scheme of the present invention is as follows:
A kind of atmos low-temperature plasma brush generating means, comprise main body chamber and two electrodes, the main body chamber has the air inlet port and the port of giving vent to anger, the described port of giving vent to anger is the narrow slit shape, the indoor part near this port of giving vent to anger of main cavity forms narrow slit cavity (outlet of this narrow slit cavity is the port of giving vent to anger of narrow slit shape), the discharge end of described two electrodes is positioned at described narrow slit cavity place, and promptly the discharge end of two electrodes partly discharges at the narrow slit cavity of main body chamber.
Shrink gradually or be tending towards flat (smooth linear changes, phase step type change all can) from air inlet port to the port of giving vent to anger in the aforementioned body chamber, perhaps the indoor integral body of main cavity is the narrow slit cavity.
Also be in series with steady resistance on the loop of above-mentioned two electrodes.
Above-mentioned atmos low-temperature plasma brush generating means also comprises the charge flow rate control unit, and described air inlet port is provided with flowmeter; The described port of giving vent to anger also is provided with temperature sensor, specifically selects thermocouple sensor.
The width of the above-mentioned port of giving vent to anger is 5～100 with the ratio of thickness, is good with 10～100.
The gas that enters the aforementioned body chamber is that plasma is kept gas and/or active gases, wherein plasma is kept the mixture that gas comprises any two or more formation in a kind of and above-mentioned gas in inert gas, nitrogen, air, the oxygen, and active gases comprises the mixture of any two or more formation in a kind of and above-mentioned gas in fluorocarbon, carbon oxyfluoride, the halogen gas.
For above-mentioned two electrodes provide the power supply of discharge voltage is DC power supply or AC power, wherein, adjustable in the radio-frequency region of the frequency of AC power from power frequency to 13.56MHz; Electric source modes is continuous or impulse form.
The aforementioned body chamber is made by polytetrafluoroethylene, insulating ceramics or both composite materials.
Above-mentioned electrode is the electrode that tungsten, nickel, tantalum, platinum or its alloy are made, two electrodes mutually over against the discharge end face be plane or tip-like.
The present invention also provides a kind of plasma brush generating means that is applied to the large tracts of land object handles, and its core is the array combination that is formed by above-mentioned atmos low-temperature plasma brush generating means.
Atmos low-temperature plasma brush generating means provided by the invention and array combination thereof have realized producing under normal pressure near room temperature, and shape is as the low-temperature plasma jet of brush shape.In the work, allow plasma keep gas and active gases passes through chamber, on two electrodes, add certain voltage and come activated plasma to keep gas and active gases, make the plasma jet of its discharge generation brush shape, from the port ejection of giving vent to anger near the port of giving vent to anger.Utilize steady resistance, select suitable plasma to keep gas and active gases, and reasonably design the narrow slit cavity and can avoid glow discharge to be transformed into arc discharge.Brush shape plasma jet is from the outlet ejection of chamber, this jet has the living features of non-equilibrium plasma, thereby this plasma generating equipment can be used for carrying out the eliminating of plasma surface treatment and cleaning, plasma-deposited, plasma sterilization and plasma for purification and chemical and biological weapons.
The present invention has the following advantages:
1. atmos low-temperature plasma brush generating means of the present invention can produce plasma under normal pressure.The plasma jet of flat brush shape makes the larger area plasma exposure in atmosphere, the heat that carries from discharge range can promptly be dispersed into the air and go, this structure is except helping eliminating the thermally labile factor, prevent that glow discharge is transformed into beyond the arc discharge, also played good natural cooling effect.Thereby in some special application facet, this device can produce the plasma jet near room temperature, the highlyest is no more than 200 ℃.Be fit to be used for handling thermo-sensitive material, it is not caused any damage.Adopt steady resistance, and select suitable plasma to keep gas and active gases can prevent that glow discharge is transformed into arc discharge.
2. the structural design of this device has diversity, and with low cost, need not expensive vacuum system and just can produce low-temperature plasma jet; Easy-to-operate does not have strict restriction to the size and dimension of processed article, adopts plasma brush generating means of the present invention when the article of processing large tracts of land or complex appearance structure, and is simply more than traditional low pressure plasma generation equipment.
3. the plasma jet of brush shape formula can utilize plasma to keep gas and active gases is saved energy efficiently.
4. plasma brush generating means is low in energy consumption, may diminish to several watts, therefore can adopt automobile batteries, even dry cell is powered.Under special circumstances, plasma brush generating means also can be worked under the power of several hectowatt.The plasma producing apparatus of array can be handled large-area object with higher efficient.Can hand with the plasma brush array device of dry cell power supply and to use.
5. characteristics simple in structure and low in energy consumption can guarantee that this device develops into portable set.
Description of drawings
Fig. 1 is an agent structure schematic diagram of the present invention, and wherein a is static schematic diagram, the schematic diagram that the plasma electrically scopiform became when b was work;
The work schematic diagram of Fig. 2 atmos low-temperature plasma brush generating means;
Fig. 3 array atmos low-temperature plasma brush generating means substrate material is handled schematic diagram.
Embodiment
Atmos low-temperature plasma brush generating means provided by the invention, by a main body chamber, two electrodes, a steady resistance, a mass flowmenter and a power-supply device are formed.The main body chamber comprises two ports, and a port is the air inlet port, and another port is the port of giving vent to anger, and the indoor part near this port of giving vent to anger of main cavity forms the narrow slit cavity naturally.In the main cavity chamber interior, two electrodes against the port arrangements of giving vent to anger, two electrodes face on the wall that is fixed on main body chamber both sides.One of them electrode is connected with steady resistance.The main body chamber is to be made by polymer or insulating ceramic materials as polytetrafluoroethylene one class; Electrode is heat-resisting metal material, and these metals comprise the alloy of tungsten, nickel, tantalum, platinum and these metals, but is not restricted to above-mentioned material.In the chamber two electrodes over against end face both can be that the plane also can be a tip-like.Mass flowmenter in this device is used for the plasma flow of control flows through chamber.Power-supply device provides direct current or alternating voltage.Wherein, the frequency of AC power can change to the radio frequency of 13.56MHz from power frequency, and electric source modes both can be also can be pulse continuously.The steady resistance of connecting in the circuit can suppress the electric field fluctuation of cathode zone, and the size of discharging current prevents that glow discharge is transformed into arc discharge between restriction the two poles of the earth, thereby makes can produce stable glow discharge in gas chamber.
During work, add certain voltage between two electrodes, plasma is kept gas and active gases from air inlet port inflow chamber chamber, when flowing through regional between two electrodes, will stable plasma gas discharge take place.The gas that can be used for producing plasma has helium, argon gas, nitrogen, air and their mist, but is not limited only to these gas.Flow out at the narrow slit of the interval plasma flow that forms of two electrode discharges from chamber, narrow slit can guarantee that plasma gas has higher speed in the moment of ejection chamber.The plasma gas that flows out fast from the slit cavity is carrying the heat of part, is just eliminating the thermally labile factor of glow discharge with this.Plasma flow sprays from chamber with very fast speed, stretches out into the stable low-temperature plasma jet of brush shape, forms the atmos low-temperature plasma brush.This plasma jet has the feature of low pressure non-equilibrium plasma, thereby this plasma brush generating means can be used for carrying out the eliminating of plasma surface treatment and cleaning, plasma-deposited, plasma sterilization and plasma for purification and chemical and biological weapons.
The shape of plasma brush and volume are subjected to gas flow rate, discharge energy, the width of the structure of chamber and narrow slit cavity and the influence of thickness.Plasma flow may diminish to 0.01L/min or littler, also can be up to several liters of per minute or higher.The ratio of the wide height of design chamber is generally speaking greater than 5, and is more suitable greater than 10, and when contacting with the object being treated surface with convenient plasma electrically brush, plasma jet can be evenly distributed on body surface.The voltage that is used to produce the plasma brush can be the hundreds of volt, also can be elevated to several kilovolts, and is perhaps higher, and discharging current is perhaps higher in milliampere to tens milliampere magnitude.Generation is kept the energy of steady glow discharge usually between several watts to tens watts.When power supply was worked with pulse mode, the energy of discharge can further reduce.Low energy consumption can guarantee to form the plasma jet of low temperature.Under the situation of not losing plasma stability, plasma brush generating means can be operated in (a few hectowatt) under the higher discharge energy state.At this moment, the plasma brush will have the temperature of bigger volume and Geng Gao.
Below in conjunction with accompanying drawing to involved in the present invention to concrete link elaborate.
In different accompanying drawings, provided similar or identical apparatus structure schematic diagram.Fig. 1 a is agent structure 10 schematic diagrames of atmos low-temperature plasma brush generating means of the present invention.Atmos low-temperature plasma brush generating means comprises main body chamber 12, and main body chamber 12 has two ports, an air inlet port 14 and the port 16 of giving vent to anger.Plasma keeps gas and active gases flows into chamber from air inlet port 14, the flat narrow slit cavity of the main body of flowing through chamber 12 inside (whole in the main body chamber 12 in the present embodiment is the narrow slit cavity).Plasma brush generating means also comprises two electrodes, an electrode 20 and another electrode 22.Electrode 20 and electrode 22 face mutually all in the inside of main body chamber 12, and near giving vent to anger port 16.When the voltage that is applied to the electrode two ends is enough high, will discharge in the inside of chamber 12, produce plasma.Plasma jet formed schematic diagram when Fig. 1 b had showed the discharge of plasma brush generating means.Plasma keeps gas and active gases flows into main body chamber 12 from air inlet port 14 constantly, and the plasma flow that produces in chamber interior sprays from the port 16 of giving vent to anger through the narrow slit cavity, forms the jet 24 of brush shape.
Fig. 2 is the work schematic diagram of atmos low-temperature plasma brush generating means 26 of the present invention.Atmospheric pressure plasma brush generating means 26 also comprises steady resistance 28 and power-supply device 30 except containing a main body chamber 12.In addition, control the mass flowmenter 34 and 32 that plasma is kept gas and active gases flow velocity in addition respectively.
During work, plasma is kept gas and is controlled by way of pipeline 38 again by air inlet port inflow chamber chamber by flowmeter 34; Active gases is controlled by way of pipeline 38 again by air inlet port inflow chamber chamber by flowmeter 32.When the voltage that is added in electrode 20 and 22 two ends was enough high, the gas in the zone of flowing through between two electrodes was just breakdown, and electric discharge phenomena take place, and forms plasma flow.The steady resistance 28 that is connected in the circuit can limit the size of discharging current between the two poles of the earth and the electric field fluctuation of inhibition cathode zone, prevents that the glow discharge between the electrode is transformed into arc discharge.Plasma flow just can spray via the narrow slit cavity with the form of stable brush shape low-temperature plasma jet 24 because of the influence of flow velocity own.The low-temperature plasma jet 24 that low temperature plasma brush generating means 26 is produced touches the surface of processed object 36, and suitably contacts with it and moving back and forth, just can handle the whole surface or the pretreating surface of object 36.
What deserves to be explained is, Fig. 2 has only shown that the assembling of two kinds of gases (plasma is kept gas and active gases) feeding mechanism is fused into single gas gas handling system, and low temperature plasma brush generating means of the present invention also can comprise a plurality of (〉=3) gas supply devices and extra gas gas handling system.
The volume of plasma brush and shape mainly are subjected to gas flow rate, discharge energy, the ratio that the narrow slit cavity is wide and high and the influence of chamber structure.For a specific plasma brush generating means, the chamber structure feature depends on, but be not restricted to following numerous factor, such as the energy size that power supply provided, the flow velocity of plasma gas, the size and shape of electrode, the spacing between two electrodes, the width of cavity narrow slit and the length of plasma brush etc.Atmospheric pressure plasma brush generating means, the width and the thickness of the port 16 of giving vent to anger (also can be considered the narrow slit cavity) of its main body chamber 12 are respectively 10mm and 1mm usually, the width and the thickness that also are main body chamber 12 integral body in the present embodiment are respectively 10mm and 1mm, be spaced apart 15mm between two electrodes, the diameter of each electrode is 0.75mm.What deserves to be explained is that above-mentioned size only is a sample of plasma brush generating means of the present invention, this device size is not restricted to above-mentioned scope.
The design of narrow slit cavity can guarantee that the plasma jet that sprays cavity is utilized efficiently.Pass through the plasma flow of cavity rapidly and can take away the part heat that produces at discharge range, eliminate the thermally labile factor, thereby keep stable glow discharge.As seen, the air-flow of very fast flow velocity helps generating means to produce stable atmos low-temperature plasma brush.
Again as shown in Figure 3, the present invention can also be combined by a plurality of plasma brush generating meanss except can being made of single plasma brush generating means.Combination back forms plasma brush array, and each brush is responsible for the part on handled object surface, when plasma brush array with the form of integral body when body surface moves around, handled object surface quickly and efficiently just.Certainly, the single narrow slit cavity plasma brush of widening also has identical effect.
Claims (10)
1. atmos low-temperature plasma brush generating means, comprise main body chamber and two electrodes, the main body chamber has the air inlet port and the port of giving vent to anger, it is characterized in that: the described port of giving vent to anger is the narrow slit shape, the indoor part near this port of giving vent to anger of main cavity forms the narrow slit cavity, and the discharge end of described two electrodes is positioned at described narrow slit cavity place.
2. atmos low-temperature plasma brush generating means according to claim 1 is characterized in that: main cavity is indoor to be shunk gradually or is tending towards flat from air inlet port to the port of giving vent to anger, and perhaps the indoor integral body of main cavity is the narrow slit cavity.
3. atmos low-temperature plasma brush generating means according to claim 2 is characterized in that: also be in series with steady resistance on the loop of described two electrodes.
4. atmos low-temperature plasma brush generating means according to claim 3 is characterized in that: this atmos low-temperature plasma brush generating means also comprises the charge flow rate control unit, and described air inlet port is provided with flowmeter; The described port of giving vent to anger also is provided with temperature sensor.
5. atmos low-temperature plasma brush generating means according to claim 4 is characterized in that: the width of the described port of giving vent to anger is 5～100 with the ratio of thickness.
6. atmos low-temperature plasma brush generating means according to claim 4, it is characterized in that: the gas that enters described main body chamber is that plasma is kept gas and/or active gases, wherein plasma is kept the mixture that gas comprises any two or more formation in a kind of and above-mentioned gas in inert gas, nitrogen, air, the oxygen, and active gases comprises the mixture of any two or more formation in a kind of and above-mentioned gas in fluorocarbon, carbon oxyfluoride, the halogen gas.
7. atmos low-temperature plasma brush generating means according to claim 4, it is characterized in that: for two electrodes provide the power supply of discharge voltage is DC power supply or AC power, wherein, adjustable in the radio-frequency region of the frequency of AC power from power frequency to 13.56MHz; Electric source modes is continuous or impulse form.
8. atmos low-temperature plasma brush generating means according to claim 4 is characterized in that: described main body chamber is made by polytetrafluoroethylene, insulating ceramics or both composite materials.
9. atmos low-temperature plasma brush generating means according to claim 8 is characterized in that: described electrode is the electrode that tungsten, nickel, tantalum, platinum or its alloy are made, two electrodes mutually over against the discharge end face be plane or tip-like.
10. be applied to the plasma brush generating means of large tracts of land object handles, it is characterized in that: its core is the array combination that is formed by the described atmos low-temperature plasma brush of claim 1 generating means.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103140011A (en) * | 2011-11-30 | 2013-06-05 | 亚树科技股份有限公司 | Vertical type plasma producing device |
| CN103760147A (en) * | 2014-01-20 | 2014-04-30 | 段忆翔 | Microplasma-based portable chemical volatile matter detector |
| CN104066264A (en) * | 2014-06-18 | 2014-09-24 | 大连理工大学 | Direct-current self-excited pulse large-area high-air-pressure creepage discharge generation device |
| CN104994673A (en) * | 2015-06-29 | 2015-10-21 | 河北大学 | Device and method for generating uniform plasma brush under atmospheric pressure in air environment |
| CN105578699A (en) * | 2015-12-30 | 2016-05-11 | 河北大学 | Device and method for generating cold plasma brush |
| CN110916294A (en) * | 2018-09-19 | 2020-03-27 | 钜翁企业有限公司 | Plasma generator for processing shoe material and processing method thereof |
| CN111246651A (en) * | 2020-04-08 | 2020-06-05 | 河北大学 | Device and method for generating large-scale plasma plume by utilizing spray gun array |
| CN115351273A (en) * | 2022-08-22 | 2022-11-18 | 广东电网有限责任公司 | Powder filler surface treatment device |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1525803A (en) * | 2003-02-27 | 2004-09-01 | 王守国 | Normal pressure radio frequency and DC mixed type cold plasma system and spray gun thereof |
| CN1812687A (en) * | 2006-02-24 | 2006-08-02 | 清华大学 | Atmospheric radio-frequency discharging high-speed cold plasma array generator |
| JP2008091176A (en) * | 2006-09-29 | 2008-04-17 | Tokyo Electron Ltd | Microwave plasma treatment apparatus, one-body type slot forming member, manufacturing method and method of use for microwave plasma treatment device |
| CN101252805A (en) * | 2008-03-31 | 2008-08-27 | 大连理工大学 | Simple atmosphere pressure suspending electrode cold plasma fluid generator |
| CN101426327A (en) * | 2008-12-02 | 2009-05-06 | 华中科技大学 | Plasma jet device |
| CN101437352A (en) * | 2008-12-19 | 2009-05-20 | 华中科技大学 | Plasma relay apparatus |
| US20090317566A1 (en) * | 2008-06-18 | 2009-12-24 | Tokyo Electron Limited | Microwave plasma processing apparatus and method of supplying microwaves using the apparatus |
| CN201986252U (en) * | 2011-01-21 | 2011-09-21 | 中国科学院西安光学精密机械研究所 | Atmosphere low-temperature plasma electric brush generating device and array combination thereof |
-
2011
- 2011-01-21 CN CN 201110024536 patent/CN102065626B/en not_active Expired - Fee Related
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1525803A (en) * | 2003-02-27 | 2004-09-01 | 王守国 | Normal pressure radio frequency and DC mixed type cold plasma system and spray gun thereof |
| CN1812687A (en) * | 2006-02-24 | 2006-08-02 | 清华大学 | Atmospheric radio-frequency discharging high-speed cold plasma array generator |
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