CN102064156B - Poly-crystal type LED (light emitting diode) package structure for generating quasi-circular light-emitting effect - Google Patents
Poly-crystal type LED (light emitting diode) package structure for generating quasi-circular light-emitting effect Download PDFInfo
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- CN102064156B CN102064156B CN 200910180189 CN200910180189A CN102064156B CN 102064156 B CN102064156 B CN 102064156B CN 200910180189 CN200910180189 CN 200910180189 CN 200910180189 A CN200910180189 A CN 200910180189A CN 102064156 B CN102064156 B CN 102064156B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Abstract
The invention claims a poly-crystal type LED (light emitting diode) package structure for generating quasi-circular light-emitting effect, comprising a substrate unit, a light-emitting unit and a package unit, wherein the substrate unit is provided with a substrate body and a plurality of conductive circuits which are separated from each other in a predetermined distance and disposed on the substrate body; each conductive circuit is provided with a plurality of extending portions, and the extending portions of every two conductive circuits are adjacent to each other and are alternatively arranged with each other; the light-emitting unit is provided with a plurality of LED crystal grains which are selectively and electrically disposed on the substrate unit, and the LED crystal grains are arranged into a quasi-circular shape; and the package unit is provided with a light-transmitting package resin body which is formed on the upper surface of the substrate unit so as to cover the LED crystal grains. The structure is capable of achieving the purposes of stable current and long service life.
Description
Technical field
The present invention relates to a kind of multi-chip light emitting diode encapsulating structure, refer to a kind of multi-chip light emitting diode encapsulating structure that is used to produce circular illumination effect especially.
Background technology
The invention of electric light can be described as the life style that has changed the whole mankind up hill and dale, if our life does not have electric light, when night or weather conditions are not good, the work of all will be stopped; If be subject to illumination, building construction mode or human life style are thoroughly changed, therefore the whole mankind will can't improve, the age that stays on and fall behind.
So, today employed on the market lighting apparatus, for example: fluorescent lamp, tungsten lamp even the more popular till now Electricity-saving lamp bulb of being accepted are widely used in the middle of the daily life all.Yet this type of electric light has fast, the high power consumption of optical attenuation mostly, be easy to generate high heat, the life-span is short, frangible or shortcoming such as difficult recovery.Moreover the color rendering of traditional fluorescent lamp is relatively poor, so produce pale light and be out of favour; In addition because principle of luminosity is the flowing of second of fluorescent tube two utmost point electronics 120 times fast, just to open and electric current causes flicker when unstable easily, this phenomenon is considered to cause the arch-criminal of domestic high rate of myopia usually; But this problem can solve through the fluorescent tube of repacking with " high-frequency electrical minor stabilizer "; Its high-frequency electrical minor stabilizer not only can fall 20% to the power consumption of traditional fluorescent lamp again, and when lighting a lamp because of high frequency moment again, the light wave of output is highly stable; Therefore almost flicker free takes place; And when power supply voltage variation or fluorescent tube are in low temperature, be not easy to produce flicker, this helps the protection of eyesight.Yet the stabilizer of general Electricity-saving lamp bulb and power-saving lighting tube all is fixed, if eliminate the words of trade-in; Must connect stabilizer abandons together; Moreover no matter fluorescent tube how power saving again,, still inevitably environment is caused serious pollution after discarded because of it contains the coating of mercury.Therefore, in order to solve the above problems, light emitting diode bulb or light-emitting diode lamp tube in response to and give birth to.
Summary of the invention
Technical problem to be solved by this invention is to provide a kind of multi-chip light emitting diode encapsulating structure that is used to produce circular illumination effect, and it can reach the purpose of current stabilization (voltage is stable) and long service life.
In order to solve the problems of the technologies described above, according to wherein a kind of scheme of the present invention, a kind of multi-chip light emitting diode encapsulating structure that is used to produce circular illumination effect is provided, it comprises: a base board unit, a luminescence unit and an encapsulation unit.Wherein, This base board unit has a substrate body, one first conducting wire, one second conducting wire and one the 3rd conducting wire; And this first conducting wire, this second conducting wire and the 3rd conducting wire preset distance separated from one another and be arranged on this substrate body; Wherein this first conducting wire have one first base portion and a plurality of from this first base portion extend first on extension; This second conducting wire have one second base portion, a plurality of from this second base portion extend second on extension, a plurality of from this second base portion extend and with those on first extension located adjacent one another and alternately arrange each other second extension, and at least one second lower extension of extending from this second base portion, the 3rd conducting wire have one the 3rd base portion, a plurality of from the 3rd base portion extend and with those on second extension located adjacent one another and alternately arrange each other the 3rd on extension, and at least one from the 3rd base portion extend and with above-mentioned at least one second lower extension the 3rd lower extension located adjacent one another.This luminescence unit has many selectivity and electrically is arranged at the LED crystal particle on this base board unit.This encapsulation unit has one and forms in this base board unit upper surface to cover the printing opacity packing colloid of those LED crystal particles.
In order to solve the problems of the technologies described above, according to wherein a kind of scheme of the present invention, a kind of multi-chip light emitting diode encapsulating structure that is used to produce circular illumination effect is provided, it comprises: a base board unit, a luminescence unit and an encapsulation unit.This base board unit has a substrate body and an a plurality of preset distance separated from one another and is arranged at the conducting wire on this substrate body; Wherein each conducting wire has a plurality of extensions, and those extension selectivity of per two conducting wires are located adjacent one another and alternately arrangement each other.This luminescence unit has many selectivity and electrically is arranged at the LED crystal particle on this base board unit, and those LED crystal particles are arranged in a toroidal.This encapsulation unit has one and forms in this base board unit upper surface to cover the printing opacity packing colloid of those LED crystal particles.
Beneficial effect of the present invention is:
1, those LED crystal particles of the present invention come electrically to be arranged on this base board unit with the mode of even number series connection and most parallel connections.Certainly, those LED crystal particles can also radix the mode of series connection and most parallel connections come electrically to be arranged on this base board unit.Therefore, the present invention has the advantage of current stabilization (voltage is stable) and long service life.
2, therein among the embodiment; The positive pole of each LED crystal particle of the present invention and negative pole corresponding at least two the anodal weld pads of difference and at least two negative pole weld pads; Therefore the positive pole and the negative pole of each LED crystal particle have at least one subsequent use anodal weld pad and at least one subsequent use negative pole weld pad respectively, with time (promoting the efficient of routing) that is used to save routing and the qualification rate that increases routing.
3, the mode of the present invention through coating be shaped one can be arbitrary shape the reflective colloid of circulating type (circulating type white colloid); Therefore and with position of limiting to a printing opacity packing colloid (fluorescent colloid) and the surface configuration of adjusting this printing opacity packing colloid, package structure for LED of the present invention can " improve the luminous efficiency of LED crystal particle " and reach " rising angle of controlling LED crystal particle " through the reflective colloid of this circulating type.
Reach technology, means and the effect that predetermined purpose is taked in order further to understand the present invention; See also following about detailed description of the present invention and accompanying drawing; Believe the object of the invention, characteristic and characteristics; Go deep into and concrete understanding when getting one thus, yet appended accompanying drawing only provides reference and explanation usefulness, is not to be used for the present invention is limited.
Description of drawings
Figure 1A to Fig. 1 D is respectively the making schematic flow sheet of first embodiment that the present invention is used to produce the multi-chip light emitting diode encapsulating structure of circular illumination effect;
Fig. 2 A to Fig. 2 C is respectively the making schematic flow sheet of second embodiment that the present invention is used to produce the multi-chip light emitting diode encapsulating structure of circular illumination effect;
Fig. 3 A is used to produce the decomposing schematic representation of first kind of base board unit of the multi-chip light emitting diode encapsulating structure of circular illumination effect for the present invention;
Fig. 3 B is used to produce the combination sketch map of first kind of base board unit of the multi-chip light emitting diode encapsulating structure of circular illumination effect for the present invention;
Fig. 4 A is used to produce the combination sketch map of second kind of base board unit of the multi-chip light emitting diode encapsulating structure of circular illumination effect for the present invention; And the schematic side view that cooperates with second kind of base board unit for LED crystal particle of the present invention of Fig. 4 B.
[main element description of reference numerals]
Multi-chip light emitting diode encapsulating structure P
Conducting wire C
First conducting wire 11
The first base portion 11A
The first lower extension 11B
Second conducting wire 12
The second base portion 12A
The second lower extension 12B
The 3rd conducting wire 13
The 3rd base portion 13A
The 3rd lower extension 13B
The 4th conducting wire 14
The 4th base portion 14A
The 4th lower extension 14B
The 5th conducting wire 15
The 5th base portion 15A
The 5th lower extension 15B
Heat dissipating layer 17
The reflective colloid 30 of reflecting unit 3 circulating types
The spacing space 300 of colloid
Circular arc tangential line T
Angle θ
Height H
Encapsulation unit 4 printing opacity packing colloids 40
Blue light beam L 1
White light beam L 2
Embodiment
See also shown in Figure 1A to Fig. 1 D, below the manufacture method of " being used to produce the multi-chip light emitting diode encapsulating structure P of circular illumination effect " of giving an example with first embodiment of the invention, carry out the description (step S100 to S108) of details:
Please refer to shown in Figure 1A; At first; One base board unit 1 is provided, and it has a substrate body 10, a plurality ofly is arranged at the insulating barrier 18 (step S100) of conducting wire C to expose conductive welding pads 16 that heat dissipating layer 17, that the conducting wire C of these substrate body 10 upper surfaces, a plurality of conductive welding pad 16, that is arranged at those conducting wires C upper surface be arranged at these substrate body 10 bottoms is arranged at these substrate body 10 upper surfaces and is used for the cover part.Therefore, this heat dissipating layer 17 can be used for increasing the heat dissipation of this base board unit 1, and those insulating barriers 18 can be used for only letting conductive welding pads 16 and led chip put the welding resisting layer that the zone exposes out and reach the limitation welding region for a kind of.Yet above-mentioned is not that the substrate of any pattern is all the applicable category of the present invention such as in order to qualification the present invention for defining of base board unit 1.For example: this base board unit 1 can be a printed circuit board (PCB), a soft base plate, an aluminium base, a ceramic substrate or a copper base.
Please refer to shown in Figure 1B; Many LED crystal particles 20 selectivity electrically are arranged at the 0 white light beam L1 that produces project the inwall of the reflective colloid 30 of this circulating type and produce reflection, and then can increase the luminous efficiency that the present invention is used to produce the multi-chip light emitting diode encapsulating structure P of circular illumination effect.
Please refer to shown in Fig. 1 C; At first; Be coated with liquid glue material (figure does not show) in this base board unit 1 upper surface (step S104) around ground; Wherein should liquid state glue material can optionally be surrounded into a predetermined shape (for example circular), the thixotropic index of this liquid state glue material (thixotropic index) between 4-6, be coated with this liquid state glue material in the pressure of this base board unit 1 upper surface between 350-450kpa; Be coated with this liquid state glue material in the speed of this base board unit 1 upper surface between 5-15mm/s, and be identical position in the starting point of this base board unit 1 upper surface with terminating point around ground this liquid state glue material of coating; Then; Solidify again should liquid state glue material to form the reflective colloid 30 of a circulating type; And the reflective colloid of this circulating type 30 is arranged at the LED crystal particle 20 on this base board unit 1 around those, with form one be positioned at this base board unit 1 top the spacing space 300 of colloid (step S106), wherein should harden through the mode of baking by liquid state glue material; The temperature of baking is between the 120-140 degree, and the time of baking is between 20-40 minute.
Moreover; The upper surface of the reflective colloid 30 of this circulating type can be a circular arc; The reflective colloid 30 of this circulating type with respect to the angle θ of the circular arc tangential line T of this base board unit 1 upper surface between 40～50 degree; The end face of the reflective colloid 30 of this circulating type with respect to the height H of this base board unit 1 upper surface between 0.3～0.7mm; The width of the reflective colloid of this circulating type 30 bottoms is between 1.5～3mm, and the thixotropic index of the reflective colloid 30 of this circulating type (thixotropic index) is between 4-6.
Please refer to shown in Fig. 1 D; Be shaped a printing opacity packing colloid 40 in the upper surface of this base board unit 1; To cover those LED crystal particles 20; Wherein this printing opacity packing colloid 40 is limited in the spacing space of this colloid 300 (step S108), the reflective colloid 30 of this circulating type can be one be mixed with inorganic additive the white hot reflective colloid (light tight colloid) that hardens, and the upper surface of this printing opacity packing colloid 40 is a convex surface.
The example of being takeed with first embodiment of the invention; Each LED crystal particle 20 can be a blue LED crystal grain; And this printing opacity packing colloid 40 can be a fluorescent colloid; Therefore the blue light beam L1 that cast out of those LED crystal particles 20 (those blue LED crystal grain) can pass this printing opacity packing colloid 40 (this fluorescent colloid), to produce the white light beam L2 in similar fluorescent lamp source.
In other words, through the use of the reflective colloid 30 of this circulating type, so that this printing opacity packing colloid 40 is limited in the spacing space 300 of this colloid, and then may command " use amount of this printing opacity packing colloid 40 "; Moreover through controlling the use amount of this printing opacity packing colloid 40, with surface configuration and the height of adjusting this printing opacity packing colloid 40, and then control " rising angle of the white light beam L2 that those LED crystal particles 20 are produced "; In addition; The present invention also can be through the use of the reflective colloid 30 of this circulating type; So that the white light beam L1 that those LED crystal particles 20 produced projects the inwall of the reflective colloid 30 of this circulating type and produces reflection, and then can increase the luminous efficiency that the present invention is used to produce the polycrystalline formula package structure for LED P of similar round illumination effect.
See also shown in Fig. 2 A to Fig. 2 C, below the manufacture method of " being used to produce the multi-chip light emitting diode encapsulating structure P of circular illumination effect " of giving an example with second embodiment of the invention, carry out the description (step S200 to S208) of thin portion:
Please refer to shown in Fig. 2 A; At first; One base board unit 1 is provided, and it has a substrate body 10, a plurality ofly is arranged at the insulating barrier 18 (step S200) of conducting wire C to expose conductive welding pads 16 that heat dissipating layer 17, that the conducting wire C of these substrate body 10 upper surfaces, a plurality of conductive welding pad 16, that is arranged at those conducting wires C upper surface be arranged at these substrate body 10 bottoms is arranged at these substrate body 10 upper surfaces and is used for the cover part.Therefore, this heat dissipating layer 17 can be used for increasing the heat dissipation of this base board unit 1, and those insulating barriers 18 can be used for only letting conductive welding pads 16 and led chip put the welding resisting layer that the zone exposes out and reach the limitation welding region for a kind of.Yet above-mentioned is not that the substrate of any pattern is all the applicable category of the present invention such as in order to qualification the present invention for defining of base board unit 1.For example: this base board unit 1 can be a printed circuit board (PCB), a soft base plate, an aluminium base, a ceramic substrate or a copper base.
Please refer to shown in Fig. 2 A; At first; Be coated with liquid glue material (figure does not show) in this base board unit 1 upper surface (step S202) around ground; Wherein should liquid state glue material can optionally be surrounded into a predetermined shape (for example circular), the thixotropic index of this liquid state glue material (thixotropic index) between 4-6, be coated with this liquid state glue material in the pressure of this base board unit 1 upper surface between 350-450kpa; Be coated with this liquid state glue material in the speed of this base board unit 1 upper surface between 5-15mm/s, and be identical position in the starting point of this base board unit 1 upper surface with terminating point around ground this liquid state glue material of coating; Then, solidify again should liquid state glue material to form the reflective colloid 30 of a circulating type (step S204), wherein should harden through the mode of baking by liquid state glue material, the temperature of baking is between the 120-140 degree, and the time of baking is between 20-40 minute.
Moreover; The upper surface of the reflective colloid 30 of this circulating type can be a circular arc; The reflective colloid 30 of this circulating type with respect to the angle θ of the circular arc tangential line T of this base board unit 1 upper surface between 40～50 degree; The end face of the reflective colloid 30 of this circulating type with respect to the height H of this base board unit 1 upper surface between 0.3～0.7mm; The width of the reflective colloid of this circulating type 30 bottoms is between 1.5～3mm, and the thixotropic index of the reflective colloid 30 of this circulating type (thixotropic index) is between 4-6.
Please refer to shown in Fig. 2 B, those conducting wires C that many LED crystal particles 20 selectivity electrically is arranged at this base board unit 1 goes up (step S206).With the example that first embodiment of the invention is takeed, each LED crystal particle 20 is through the mode of routing (wire-bonding), between two conductive welding pad 16 that are electrically connected at per two conducting wire C.Moreover the reflective colloid of this circulating type 30 is arranged at the LED crystal particle 20 on this base board unit 1 around those, with form one be positioned at this base board unit 1 top the spacing space 300 of colloid.
Please refer to shown in Fig. 2 C; Be shaped a printing opacity packing colloid 40 in the upper surface of this base board unit 1; To cover those LED crystal particles 20; Wherein this printing opacity packing colloid 40 is limited in the spacing space of this colloid 300 (step S208), the reflective colloid 30 of this circulating type can be one be mixed with inorganic additive the white hot reflective colloid (light tight colloid) that hardens, and the upper surface of this printing opacity packing colloid 40 is a convex surface.
With the example that first embodiment of the invention is takeed, each LED crystal particle 2
0 can be a blue LED crystal grain; And this printing opacity packing colloid 40 can be a fluorescent colloid; Therefore the blue light beam L1 that cast out of those LED crystal particles 20 (those blue LED crystal grain) can pass this printing opacity packing colloid 40 (this fluorescent colloid), to produce the white light beam L2 in similar fluorescent lamp source.
In other words, through the use of the reflective colloid 30 of this circulating type, so that this printing opacity packing colloid 40 is limited in the spacing space 300 of this colloid, and then may command " use amount of this printing opacity packing colloid 40 "; Moreover through controlling the use amount of this printing opacity packing colloid 40, with surface configuration and the height of adjusting this printing opacity packing colloid 40, and then control " rising angle of the white light beam L 2 that those LED crystal particles 20 are produced "; In addition; The present invention also can be through the use of the reflective colloid 30 of this circulating type; So that the white light beam L1 that those LED crystal particles 20 produced projects the inwall of the reflective colloid 30 of this circulating type and produces reflection, and then can increase the luminous efficiency that the present invention is used to produce the multi-chip light emitting diode encapsulating structure P of circular illumination effect.
Therefore; Through above-mentioned manufacture method; See also Fig. 1 D and Fig. 2 C can know, the present invention provides a kind of multi-chip light emitting diode encapsulating structure P that is used to produce circular illumination effect, and it comprises: a base board unit 1, a luminescence unit 2, reflecting unit 3 and an encapsulation unit 4.
Wherein, This base board unit 1 (please cooperate shown in Fig. 3 A and Fig. 3 B) has a substrate body 10, one first conducting wire 11, one second conducting wire 12, one the 3rd conducting wire 13, one the 4th conducting wire 14 and one the 5th conducting wire 15, and this first conducting wire 11, this second conducting wire 12 and the 3rd conducting wire 13, the 4th conducting wire 14 and the 5th conducting wire 15 preset distances separated from one another and be arranged on this substrate body 10.
Moreover, this first conducting wire 11 have one first base portion 11A, at least one from this first base portion prolong that 11A stretches first extension 11M, and at least one from this extension 11M extend downwards and away from the first lower extension 11B of this first base portion 11A.In addition, those on first extension 11T and above-mentioned at least one in extension 11M all extend out in the same direction from this first base portion 11A, and above-mentioned at least one lower extension 11B from above-mentioned at least one the turning of extension 11M to extending below and bending.
In addition, this second conducting wire 12 have one second base portion 12A, a plurality of from this second base portion 12A extend second on extension 12T, a plurality of from this second base portion 12A extend and with those on first extension 11T located adjacent one another and alternately arrange each other second extension 12M, and at least one second lower extension 12B that extends from this second base portion 12A.In addition, those extension 12T on second, those in second extension 12M and above-mentioned at least one second lower extension 12B all extend out in the same direction from this second base portion 12A.
In addition, the 3rd conducting wire 13 have one the 3rd base portion 13A, a plurality of from the 3rd base portion 13A extend and with those on second extension 12T located adjacent one another and alternately arrange each other the 3rd on extension 13T, and at least one from the 3rd base portion 13A extend and with above-mentioned at least one second lower extension 12B the 3rd lower extension 13B located adjacent one another.In addition, those on the 3rd extension 13T extend from the inboard of the 3rd base portion 13A, and above-mentioned at least one the 3rd lower extension 13B extends from the end of the 3rd base portion 13A.
Moreover, the 4th conducting wire 14 have one the 4th base portion 14A, at least one from the 4th base portion 14A extend and with above-mentioned at least one first extension 11M located adjacent one another the 4th on extension 14T, a plurality of from the 4th base portion 14A extend the 4th extension 14M, and at least one the 4th lower extension 14B that extends from the 4th base portion 14A.In addition, extension 14T on the above-mentioned at least one the 4th, those in the 4th extension 14M and above-mentioned at least one the 4th lower extension 14B all extend out in the same direction from the 4th base portion 14A.
In addition, the 5th conducting wire 15 have one the 5th base portion 15A, a plurality of from the 5th base portion 15A extend and with those the 4th extension 14M located adjacent one another and alternately arrange each other the 5th on extension 15T, and at least one from the 5th base portion 15A extend and with above-mentioned at least one the 4th lower extension 14B the 5th lower extension 15B located adjacent one another.In addition; Those on the 5th extension 15T and above-mentioned at least one the 5th lower extension 15B all extend from the inboard of the 5th base portion 15A, and the end of above-mentioned at least one first lower extension 11B is contiguous and be arranged between above-mentioned at least one the 4th lower extension 14B and above-mentioned at least one the 5th lower extension 15B.
Moreover shown in Fig. 3 B, conductive welding pads 16 optionally is arranged on this first conducting wire 11, this second conducting wire 12, the 3rd conducting wire 13, the 4th conducting wire 14 and the 5th conducting wire 15.In other words; This base board unit 1 has a substrate body 10 and an a plurality of preset distance separated from one another and is arranged at the conducting wire C (as five above-mentioned conducting wires) on this substrate body 10; Wherein each conducting wire C has a plurality of extensions (as above-mentioned a plurality of extensions), and those extension selectivity of per two conducting wire C are located adjacent one another and alternately arrangement each other.
In addition, this second conducting wire 12 has one second base portion 12A, a plurality ofly optionally is electrically connected at through the mode of routing wherein between two conductive welding pad 16 from the 0th), and those LED crystal particles 20 are arranged in a toroidal.Moreover; Each LED crystal particle 20 has an anodal and negative pole (for instance; This positive pole and this negative pole all are arranged at the upper surface of each LED crystal particle 20); And anodal corresponding at least two conductive welding pad 16 of each LED crystal particle 20, corresponding at least two conductive welding pad 16 of the negative pole of each LED crystal particle 20.
In addition; Those LED crystal particles 20 are arranged in the parallel LED crystal particle group of many rows; Those LED crystal particle groups identical distance separated from one another; Those LED crystal particle 20 identical distances separated from one another of each group LED crystal particle group, and those LED crystal particles 20 are arranged on this base board unit 1 interlaced with each otherly.Can know that by Fig. 3 B those LED crystal particles 20 come electrically to be arranged on this base board unit 1 with the mode of even number series connection and most parallel connections.Certainly, those LED crystal particles 20 can also radix the mode of series connection and most parallel connections come electrically to be arranged on this base board unit 1.
In addition; This reflecting unit 3 have one form in this base board unit 1 upper surface around ground through the mode of coating the reflective colloid 30 of circulating type; Wherein the reflective colloid of this circulating type 30 is arranged at the LED crystal particle 20 on this base board unit 1 around those, with form one be positioned at this base board unit 1 top the spacing space 300 of colloid.
In addition, this encapsulation unit 4 has one and forms in this base board unit 1 upper surface to cover the printing opacity packing colloid 40 of those LED crystal particles 20, wherein this printing opacity packing colloid 4
0 is limited in the spacing space 300 of this colloid.
Certainly, the present invention also can omit the use of this reflecting unit 3, that is the present invention can be with these printing opacity packing colloid 40 direct forming in this base board unit 1 upper surface to cover those LED crystal particles 20.
See also shown in Fig. 4 A and Fig. 4 B; The present invention further comprises: one have many lead W lead unit and have the conductive unit of a plurality of electric conductor B; Wherein two electrodes of each LED crystal particle 20 (20a, 20b) are arranged at the upper surface and the lower surface of each LED crystal particle 20 respectively, and two electrodes of each LED crystal particle 20 (20a, 20b) are respectively through each bar lead W and each electric conductor B and be electrically connected at wherein two conductive welding pad 16 respectively.
In sum, the present invention's multi-chip light emitting diode encapsulating structure of being used to produce circular illumination effect has following advantage:
1, those LED crystal particles of the present invention come electrically to be arranged on this base board unit with the mode of even number series connection and most parallel connections.Certainly, those LED crystal particles can also radix the mode of series connection and most parallel connections come electrically to be arranged on this base board unit.Therefore, the present invention has the advantage of current stabilization (voltage is stable) and long service life.
2, therein among the embodiment; The positive pole of each LED crystal particle of the present invention and negative pole corresponding at least two the anodal weld pads of difference and at least two negative pole weld pads; Therefore the positive pole and the negative pole of each LED crystal particle have at least one subsequent use anodal weld pad and at least one subsequent use negative pole weld pad respectively, with time (promoting the efficient of routing) that is used to save routing and the qualification rate that increases routing.Because the positive pole of each LED crystal particle and negative pole have at least one subsequent use anodal weld pad and at least one subsequent use negative pole weld pad respectively; So (cause floating the weldering during failure when terminal beat on (being welded on) one of them anodal weld pad or negative pole weld pad of this lead; That is generation electric connection between this lead and " this positive pole weld pad or this negative pole weld pad "); The producer need not remove the welding slag (or the welding slag on negative pole weld pad surface) on the anodal weld pad surface that is positioned at the routing failure; One end of this lead can be beaten on the anodal weld pad of another one (or another one negative pole weld pad), with the time (promoting the efficient of routing) of saving routing and the qualification rate that increases routing.
3, the mode of the present invention through coating be shaped one can be arbitrary shape the reflective colloid of circulating type (circulating type white colloid); And through the surface configuration of the reflective colloid of this circulating type with the position of limiting to a printing opacity packing colloid (fluorescent colloid) and this printing opacity packing colloid of dawn adjustment, therefore package structure for LED of the present invention can " improve the luminous efficiency of LED crystal particle " and reach " rising angle of controlling LED crystal particle ".In other words, through the use of the reflective colloid of this circulating type, so that this printing opacity packing colloid is limited in the spacing space of this colloid, and then may command " use amount of this printing opacity packing colloid and position "; Moreover through controlling the use amount and the position of this printing opacity packing colloid, with surface configuration and the height of adjusting this printing opacity packing colloid, and then control " rising angle of the white light beam that those LED crystal particles produced "; In addition; The present invention also can be through the use of the reflective colloid of this circulating type; So that the light beam that those LED crystal particles produced projects the inwall of the reflective colloid of this circulating type and produces reflection, and then can increase " luminous efficiency of package structure for LED of the present invention ".
But; All scopes of the present invention should be as the criterion with claim; All embodiment that accords with the spirit variation similar of claim of the present invention with it; All should be contained in the category of the present invention, any those skilled in the art can think easily and variation or revise all can be encompassed in the scope of claim of the present invention.
Claims (10)
1. a multi-chip light emitting diode encapsulating structure that is used to produce circular illumination effect is characterized in that, comprising:
One base board unit; It has a substrate body, one first conducting wire, one second conducting wire and one the 3rd conducting wire; And this first conducting wire, this second conducting wire and the 3rd conducting wire preset distance separated from one another and be arranged on this substrate body; Wherein this first conducting wire have one first base portion and a plurality of from this first base portion extend first on extension; This second conducting wire have one second base portion, a plurality of from this second base portion extend second on extension, a plurality of from this second base portion extend and with those on first extension located adjacent one another and alternately arrange each other second extension, and at least one second lower extension of extending from this second base portion, the 3rd conducting wire have one the 3rd base portion, a plurality of from the 3rd base portion extend and with those on second extension located adjacent one another and alternately arrange each other the 3rd on extension, and at least one from the 3rd base portion extend and with above-mentioned at least one second lower extension the 3rd lower extension located adjacent one another;
One luminescence unit, it has many selectivity and electrically is arranged at the LED crystal particle on this base board unit; And
One encapsulation unit, it has one and forms in this base board unit upper surface to cover the printing opacity packing colloid of those LED crystal particles.
2. the multi-chip light emitting diode encapsulating structure that is used to produce circular illumination effect as claimed in claim 1; It is characterized in that: this base board unit has one the 4th conducting wire and one the 5th conducting wire; The 4th conducting wire and the 5th a conducting wire preset distance separated from one another and being arranged on this substrate body, this first conducting wire have at least one from this first base portion extend first extension and at least one from this extension extend downwards and away from first lower extension of this first base portion; The 4th conducting wire have one the 4th base portion, at least one from the 4th base portion extend and with above-mentioned at least one first extension located adjacent one another the 4th on extension, a plurality of from the 4th base portion extend the 4th extension, and at least one the 4th lower extension of extending from the 4th base portion; The 5th conducting wire have one the 5th base portion, a plurality of from the 5th base portion extend and with those the 4th extension located adjacent one another and alternately arrange each other the 5th on extension, and at least one from the 5th base portion extend and with above-mentioned at least one the 4th lower extension the 5th lower extension located adjacent one another, and the end of above-mentioned at least one first lower extension is contiguous and be arranged between above-mentioned at least one the 4th lower extension and above-mentioned at least one the 5th lower extension.
3. the multi-chip light emitting diode encapsulating structure that is used to produce circular illumination effect as claimed in claim 2; It is characterized in that: this base board unit has a plurality of conductive welding pad; Conductive welding pads optionally is arranged on this first conducting wire, this second conducting wire, the 3rd conducting wire, the 4th conducting wire and the 5th conducting wire; Each LED crystal particle has an anodal and negative pole; And anodal corresponding at least two conductive welding pad of each LED crystal particle, corresponding at least two conductive welding pad of the negative pole of each LED crystal particle.
4. the multi-chip light emitting diode encapsulating structure that is used to produce circular illumination effect as claimed in claim 3; It is characterized in that; Further comprise: a lead unit; It has many leads, and wherein the positive pole of each LED crystal particle and negative pole are electrically connected at wherein two conductive welding pad respectively through two leads respectively.
5. the multi-chip light emitting diode encapsulating structure that is used to produce circular illumination effect as claimed in claim 3; It is characterized in that; Further comprise: one have many leads lead unit and have the conductive unit of a plurality of electric conductors, wherein two electrodes of each LED crystal particle are respectively through each bar lead and each electric conductor and be electrically connected at wherein two conductive welding pad respectively.
6. the multi-chip light emitting diode encapsulating structure that is used to produce circular illumination effect as claimed in claim 5 is characterized in that: two electrodes of each LED crystal particle are arranged at the upper surface and the lower surface of each LED crystal particle respectively.
7. the multi-chip light emitting diode encapsulating structure that is used to produce circular illumination effect as claimed in claim 1; It is characterized in that: those LED crystal particles are arranged in a toroidal; Those LED crystal particles are arranged in the parallel LED crystal particle group of many rows; Those LED crystal particle groups identical distance separated from one another; Those LED crystal particles identical distance separated from one another of each group LED crystal particle group, and those LED crystal particles are arranged on this base board unit interlaced with each otherly.
8. the multi-chip light emitting diode encapsulating structure that is used to produce circular illumination effect as claimed in claim 1; It is characterized in that; Further comprise: a reflecting unit; It has one form in this base board unit upper surface around ground through the mode of coating the reflective colloid of circulating type; Wherein the reflective colloid of this circulating type is arranged at the LED crystal particle on this base board unit around those, with form one be positioned at this base board unit top the spacing space of colloid, and this printing opacity packing colloid is limited in the spacing space of this colloid.
9. the multi-chip light emitting diode encapsulating structure that is used to produce circular illumination effect as claimed in claim 8; It is characterized in that: the upper surface of the reflective colloid of this circulating type is a circular arc; The reflective gel phase of this circulating type for the angle of the circular arc tangential line of this substrate body upper surface between 40～50 degree; The end face of the reflective colloid of this circulating type with respect to the height of this substrate body upper surface between 0.3～0.7mm; The width of the reflective colloid of this circulating type bottom between 1.5～3mm, the thixotropic index of the reflective colloid of this circulating type between 4-6, and the reflective colloid of this circulating type be one be mixed with inorganic additive the white hot reflective colloid that hardens.
10. a multi-chip light emitting diode encapsulating structure that is used to produce circular illumination effect is characterized in that, comprising:
One base board unit; It has a substrate body and an a plurality of preset distance separated from one another and is arranged at the conducting wire on this substrate body; Wherein each conducting wire has a plurality of extensions, and those extension selectivity of per two conducting wires are located adjacent one another and alternately arrangement each other;
One luminescence unit, it has many selectivity and electrically is arranged at the LED crystal particle on this base board unit; And
One encapsulation unit, it has one and forms in this base board unit upper surface to cover the printing opacity packing colloid of those LED crystal particles.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200910180189 CN102064156B (en) | 2009-11-16 | 2009-11-16 | Poly-crystal type LED (light emitting diode) package structure for generating quasi-circular light-emitting effect |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200910180189 CN102064156B (en) | 2009-11-16 | 2009-11-16 | Poly-crystal type LED (light emitting diode) package structure for generating quasi-circular light-emitting effect |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102064156A CN102064156A (en) | 2011-05-18 |
| CN102064156B true CN102064156B (en) | 2012-12-05 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200910180189 Expired - Fee Related CN102064156B (en) | 2009-11-16 | 2009-11-16 | Poly-crystal type LED (light emitting diode) package structure for generating quasi-circular light-emitting effect |
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| CN (1) | CN102064156B (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103000852A (en) * | 2011-09-14 | 2013-03-27 | 原瑞电池科技股份有限公司 | Reworkable flexible package battery cell and circuit board structure and manufacturing method thereof |
| TWI484882B (en) * | 2011-12-30 | 2015-05-11 | Uer Technology Corp | Welding structure and welding method for connecting lithium battery to electric circuit board |
| CN103899966B (en) * | 2012-06-01 | 2016-03-02 | 明基电通有限公司 | Light-emitting device |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6812498B1 (en) * | 2003-06-26 | 2004-11-02 | Samsung Electro-Mechanics Co., Ltd. | Multi-color light emitting diode package |
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Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6812498B1 (en) * | 2003-06-26 | 2004-11-02 | Samsung Electro-Mechanics Co., Ltd. | Multi-color light emitting diode package |
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| CN102064156A (en) | 2011-05-18 |
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