CN102056452A - Heat radiator device and module using same - Google Patents
Heat radiator device and module using same Download PDFInfo
- Publication number
- CN102056452A CN102056452A CN2009102090340A CN200910209034A CN102056452A CN 102056452 A CN102056452 A CN 102056452A CN 2009102090340 A CN2009102090340 A CN 2009102090340A CN 200910209034 A CN200910209034 A CN 200910209034A CN 102056452 A CN102056452 A CN 102056452A
- Authority
- CN
- China
- Prior art keywords
- heat
- module
- heat sink
- group
- end portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000012530 fluid Substances 0.000 claims abstract description 56
- 239000012809 cooling fluid Substances 0.000 claims abstract description 48
- 238000009434 installation Methods 0.000 claims description 119
- 230000017525 heat dissipation Effects 0.000 claims description 29
- 239000004020 conductor Substances 0.000 claims description 26
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 20
- 239000011889 copper foil Substances 0.000 claims description 19
- 230000005540 biological transmission Effects 0.000 claims description 18
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 18
- 238000001514 detection method Methods 0.000 claims description 8
- 230000000694 effects Effects 0.000 claims description 7
- 238000001816 cooling Methods 0.000 claims description 5
- 239000007788 liquid Substances 0.000 claims description 5
- 239000011148 porous material Substances 0.000 claims description 4
- 238000009833 condensation Methods 0.000 claims description 3
- 230000005494 condensation Effects 0.000 claims description 3
- 238000000034 method Methods 0.000 claims description 3
- 230000006837 decompression Effects 0.000 claims description 2
- 238000005245 sintering Methods 0.000 claims description 2
- 238000009423 ventilation Methods 0.000 claims description 2
- 239000002184 metal Substances 0.000 abstract 2
- 238000010586 diagram Methods 0.000 description 7
- 239000000463 material Substances 0.000 description 4
- 239000007769 metal material Substances 0.000 description 4
- 238000005538 encapsulation Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 238000002309 gasification Methods 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 235000019628 coolness Nutrition 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000009775 high-speed stirring Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000009183 running Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention relates to a heat radiator device and a module using the same. The heat radiator device is provided and is suitably used together with the module. The module comprises an installing plate. The heat radiator device comprises a metal heat radiating element, a pump unit, a fluid conduit and a fan unit, wherein the metal heat radiating element is provided with a body and a plurality of heat radiating fins; a through hole is formed in the central part of the body; the pump unit comprises a containing shell filled with cooling fluid, a pump blade group and a passive magnet; the fluid conduit is filled with cooling fluid and is communicated with the containing shell; and the fan unit is arranged on the heat radiating fins and comprises a driving shaft and an active magnet. When the fan unit is actuated, the active magnet and the driving shaft rotate together so that the passive magnet rotates along with the active magnet to rotate pump blades for driving the cooling fluid in the fluid conduit to flow circularly at high speed.
Description
Technical field
The present invention relates to a kind of heat sink arrangement and a kind of module of using this heat sink arrangement.
Background technology
Using light-emitting diode in lighting apparatus is the trend in the whole world as light source.Yet up to the present the operational temperature that can effectively reduce light-emitting diode does not have anyone to propose to suppress light decay and then to promote the method for brightness or install as yet, to such an extent as to light-emitting diode still can't be popularized in the application of lighting apparatus at present comprehensively.
Summary of the invention
One object of the present invention is for providing a kind of heat sink arrangement and a kind of module of using it.
According to feature of the present invention, a kind of heat sink arrangement is provided, this heat sink arrangement is suitable for using with a module, this module comprises a mounting panel, this heat sink arrangement comprises: a metallic heat-radiating element, this metallic heat-radiating element has a body and a plurality of upwardly extending separate radiating fin of upper surface from this body, one of middle body formation at this body connects its upper surface and the through hole of lower surface, and this through hole is suitable for embedding for the projection at the opposite back side of the installation surface with electronic component is installed of the mounting panel of this module; Unit, a gang of Pu, this unit, group Pu comprise one be arranged at the installation region, group Pu of upper surface of body of this heat dissipation element and the ccontaining housing, that is filled with cooling fluid be arranged within this ccontaining housing and also be installed on the end portion of a rotating shaft that extends downwards from the roof of this ccontaining housing group's Pu vane group, and one be installed on this rotating shaft the upper part by moving magnet; One fluid conduit systems can flow at this fluid conduit systems and this putting part body-internal-circulation to such an extent as to this fluid conduit systems is filled with the identical cooling fluid of cooling fluid in the ccontaining housing with this unit, group Pu and is communicated with cooling fluid with this ccontaining housing; An and fan unit, this fan unit is arranged on the radiating fin of this metallic heat-radiating element and comprises that one has one and extends and be installed on the active magnet of the end portion of this driving shaft by the driving shaft of the end portion of moving magnet and near this, when this fan unit start, rotated together along with active magnet by moving magnet and make group's Pu vane group rotate to circulate at a high speed with the cooling fluid of reaching in this fluid conduit systems to such an extent as to this active magnet rotates with this driving shaft.
According to another characteristic of the invention, a kind of heat sink arrangement is provided, this heat sink arrangement is suitable for using with a module, this module comprises a mounting panel, this heat sink arrangement comprises: one first metallic heat-radiating element, this first metallic heat-radiating element has a body and a plurality of upwardly extending separate radiating fin of upper surface from this body, is formed with a group unit, Pu on the upper surface of this body alcove is installed; Unit, a gang of Pu, this unit, group Pu comprise ccontaining housing, that a unit, group Pu that is arranged at the body of this first metallic heat-radiating element is installed alcove and is filled with cooling fluid be arranged within this ccontaining housing and also be installed on the end portion of a rotating shaft that extends downwards from the roof of this ccontaining housing group's Pu vane group, and one be installed on this rotating shaft the upper part by moving magnet; One fan unit, this fan unit is arranged on the radiating fin of this first metallic heat-radiating element and comprises that one has one and extends and be installed on the active magnet of the end portion of this driving shaft by the driving shaft of the end portion of moving magnet and near this, when this fan unit start, to such an extent as to this active magnet rotates by moving magnet along with active magnet rotates together with this driving shaft; Second metallic heat-radiating element that places this first metallic heat-radiating element next door, this second metallic heat-radiating element has a lip-deep body that is arranged at this module, and the body of this second metallic heat-radiating element has a plurality of upwardly extending radiating fins and its lower surface is formed with a ccontaining alcove in the position corresponding to this module; And the fluid conduit systems of the identical cooling fluid of the cooling fluid in ccontaining housing that is filled with this unit, group Pu, to such an extent as to be communicated with this ccontaining housing and have a middle interconnecting piece cooling fluid that passes the body of this second metallic heat-radiating element can be mobile at this fluid conduit systems and this putting part body-internal-circulation for this fluid conduit systems.
According to a feature more of the present invention, a kind of heat sink arrangement is provided, this heat sink arrangement is suitable for using with a module, this module comprises a mounting panel, this heat sink arrangement comprises: a metallic heat-radiating element, this metallic heat-radiating element is arranged on the back side of mounting panel of this module and comprises a roughly body of circular shape, a plurality of radiating fins, an and ring-type collector pipe, this body has a lower surface that contacts with the back side of the mounting panel of this module and this body is formed with a water leg along its periphery extension in inside, the ccontaining alcove in unit, a gang of Pu is formed on the upper surface of this body, these a plurality of radiating fins extend upward and radially separate one another along the periphery of this body from the upper surface of this body, each radiating fin is formed with at least one passage that runs through its upper and lower end parts and be communicated with this water leg, this ring-type collector pipe be arranged at this radiating fin the upper part and also with the channel connection of this radiating fin; One fan unit, this fan unit comprises a driving shaft, a sets of fan blades, reaches an active magnet, the end portion of this driving shaft extends near this body, to such an extent as to this sets of fan blades is installed on the upper part of this driving shaft when this driving shaft is rotated, this sets of fan blades is rotated with this driving shaft, and this active magnet is installed on the end portion of this driving shaft rotating with this driving shaft; Unit, a gang of Pu, this unit, group Pu comprises a ccontaining housing, a gang of Pu vane group, reaches one by moving magnet, to such an extent as to this ccontaining housing is arranged at the roof of this ccontaining housing in the ccontaining alcove in unit, group Pu of this body near this active magnet, this group's Pu vane group is installed on an end portion from the downward installation shaft of extending of roof of this ccontaining housing, this is arranged at the roof of the upper part of this installation shaft near this ccontaining housing by moving magnet, and connects helping the Pu vane group to rotate with this with this group's Pu vane group; One output duct, this output duct have one and are arranged at this body interior and output that the input and that is communicated with the fluid output port of this ccontaining housing extends upward and is communicated with this collector pipe; And an input pipe, this input pipe is arranged at this body interior and has an output that is communicated with the fluid input port of this ccontaining housing and an input that is communicated with this water leg.
According to another feature again more of the present invention, a kind of heat sink arrangement is provided, this heat sink arrangement is suitable for using with a module, this module comprises a transparent mounting panel and a plurality of light-emitting diode that is installed on the installation surface of this mounting panel, this heat sink arrangement comprises: a heat transmission unit, this heat transmission unit comprises an installation base plate and a plurality of conductor that is installed on this installation base plate, it is identical with this first installation surface with one and be laid with second installation surface of predetermined circuit trace that this installation base plate has one first installation surface, each conductor has first terminal and second end portion that is electrically connected with the light-emitting diode of this module of circuit trace of the correspondence of second installation surface that is electrically connected to this installation base plate, when this conductor is provided with electric power, to such an extent as to the temperature of second end portion is lowered than the operational temperature of low this light-emitting diode of temperature of first end portion; And a fan unit, this fan unit is installed on first installation surface of this installation base plate.
According to another feature again of the present invention, a kind of light-emitting diode (LED) module is provided, and this light-emitting diode (LED) module comprises: a transparent mounting panel; A plurality of light-emitting diodes that are installed on the installation surface of this mounting panel; On a plurality of that be installed on this mounting panel and the installation surface opposing backside surface, be positioned at the lens of the correspondence position of this light-emitting diode; One heat transmission unit, this heat transmission unit comprises an installation base plate and a plurality of conductor that is installed on this installation base plate, it is identical with this first installation surface with one and be laid with second installation surface of predetermined circuit trace that this installation base plate has one first installation surface, each conductor has first terminal and second end portion that is electrically connected with the light-emitting diode of this module of circuit trace of the correspondence of second installation surface that is electrically connected to this installation base plate, when this conductor is provided with electric power, to such an extent as to the temperature of second end portion is lowered than the operational temperature of low this light-emitting diode of temperature of first end portion; And a fan unit, this fan unit is installed on first installation surface of this installation base plate.
According to another feature more again of the present invention, a kind of solar module is provided, and comprising: a transparent mounting panel; One is installed on the transparency conducting layer of the installation surface of this mounting panel; This transparency conducting layer of a plurality of mats is installed on the solar cell of the installation surface of this mounting panel; On a plurality of that be installed on this mounting panel and the installation surface opposing backside surface, be positioned at the lens of the correspondence position of this solar cell; One heat transmission unit, this heat transmission unit comprises an installation base plate and a plurality of conductor that is installed on this installation base plate, it is identical with this first installation surface with one and be laid with second installation surface of predetermined circuit trace that this installation base plate has one first installation surface, each conductor has first terminal and second end portion that is electrically connected with the solar cell of this module of circuit trace of the correspondence of second installation surface that is electrically connected to this installation base plate, when this conductor is provided with electric power, to such an extent as to the temperature of second end portion is lowered than the operational temperature of low this solar cell of temperature of first end portion; And a fan unit, this fan unit is installed on first installation surface of this installation base plate.
Description of drawings
Fig. 1 to 3 is the schematic diagram of the heat sink arrangement of the demonstration first embodiment of the present invention;
Fig. 4 to 5 is for showing the schematic diagram of the variation of employed electronic component in the module of using heat sink arrangement of the present invention;
Fig. 6 to 8 is the schematic diagram of the heat sink arrangement of the demonstration second embodiment of the present invention;
Fig. 9 is an illustrative circuitry calcspar that is presented at employed safety device in the heat sink arrangement of the present invention;
Figure 10 and 11 is the schematic diagram that shows the heat sink arrangement of the third embodiment of the present invention;
Figure 12 to 14 for show can be in heat sink arrangement of the present invention the schematic plan view of employed auxiliary heat dissipation element;
Figure 15 to 19 is the schematic diagram of the heat sink arrangement of the demonstration fourth embodiment of the present invention;
Figure 20 is a schematic sectional view that shows the heat sink arrangement of the fifth embodiment of the present invention;
Figure 21 is a schematic sectional view that shows the heat sink arrangement of the sixth embodiment of the present invention;
Figure 22 is the schematic sectional view of the variation of a heat sink arrangement that shows the first embodiment of the present invention;
Figure 23 is the schematic sectional view of the variation of a heat sink arrangement that shows the sixth embodiment of the present invention;
Figure 24 is the schematic sectional view of the variation of a heat sink arrangement that shows the sixth embodiment of the present invention;
Figure 25 is the schematic sectional view of the variation of a heat sink arrangement that shows the sixth embodiment of the present invention;
Figure 26 is the schematic sectional view of another variation of a heat sink arrangement that shows the sixth embodiment of the present invention;
Figure 27 is a schematic sectional view that shows the aspect when heat sink arrangement of the present invention uses with the memory body module; And
Figure 28 is the schematic sectional view of the variation of a heat sink arrangement that shows the first embodiment of the present invention.
Embodiment
In the detailed description of the preferred embodiments of the present invention of back, identical or similar elements is indicated by identical label, and their detailed description will be omitted.In addition, for clear announcement feature of the present invention, the element in graphic is not to describe by actual ratio.
Fig. 1 to 3 is the schematic diagram of the heat sink arrangement of demonstration first preferred embodiment of the invention.In Fig. 3, the sets of fan blades 32 of fan unit 3 removes from installing rack 30.
See also shown in Fig. 1 to 3, the heat sink arrangement of first preferred embodiment of the invention comprises a metallic heat-radiating element 1, unit, a gang of Pu 2, a fluid conduit systems 4 substantially, reaches a fan unit 3.
This metallic heat-radiating element 1 comprises a body roughly in a rectangular shape 10 and a plurality of upper surface 102 upwardly extending separate radiating fins 11 from this body 10.Middle body at this body 10 forms a through hole 12 that connects its upper surface 102 and lower surface 101.In the present embodiment, this through hole 12 is to be suitable for being embedded as example for the projection 91 at the opposite back side of the installation surface with light-emitting diode 92 is installed of the mounting panel 90 of a light-emitting diode (LED) module 9.That is, in the present embodiment, this heat sink arrangement is used to reduce the operational temperature of light-emitting diode (LED) module 9.
In the present embodiment, this heat dissipation element 1 is made of aluminum.Yet this heat dissipation element 1 can also be made by any other material that is fit to.In addition, the middle body of the upper surface 102 of this body 10 is a group installation region, Pu, and therefore, this radiating fin 11 is not formed within this installation region, group Pu, as shown in Fig. 1 and 2.
This unit, group Pu 2 comprises that a ccontaining housing 20, a gang of Pu vane group 21 and are by moving magnet 22.
To such an extent as to this ccontaining housing 20 is arranged at the inside of this ccontaining housing 20 of installation region, group Pu of upper surface 102 of the body 10 of this heat dissipation element 1 and can enters via the through hole 12 of this body 10.This ccontaining housing 20 also has a fluid input port 200 and a fluid output port 201.The inner filling of this ccontaining housing 20 has cooling fluid.In the present embodiment, this ccontaining housing 20 is made for the best by metal material.Yet this ccontaining housing 20 can also be made by any other material that is fit to.
This group's Pu vane group 21 is arranged within this ccontaining housing 20 and is installed on an end portion from the downward rotating shaft 23 that extends of roof of this ccontaining housing 20.In the present embodiment, this group's Pu vane group 21 is made for the best by metal material.Yet this group's Pu vane group 21 also can be made by any suitable material as plastic cement.
This is installed on the roof of the upper part of this rotating shaft 23 near this ccontaining housing 20 by moving magnet 22.
This fluid conduit systems 4 is filled with the cooling fluid 29 identical with the cooling fluid 29 of filling in the ccontaining housing 20 of this unit, group Pu 2 and has middle interconnecting piece 42 (see figure 2)s that a fluid outlet that is communicated with the fluid input port 200 of this ccontaining housing 20 40, a fluid input port 41 that is communicated with the fluid output port 201 of this ccontaining housing 20 and a form with cranky that is communicated with this fluid output 40 and this fluid input port 41 are passed this radiating fin 11.Therefore, when group's Pu vane group 21 of this group unit, Pu 2 was rotated, cooling fluid 29 circulated in this fluid conduit systems 4 and this ccontaining housing 20.
This fan unit 3 comprises an installing rack 30, a driving shaft 31 vertical with this body 10, a sets of fan blades 32, an and magnet 33 initiatively.
This installing rack 30 is set on the radiating fin 11 of this metallic heat-radiating element 1 with any suitable known manner.
This driving shaft 31 is rotatably installed on this installing rack 30 in known manner and known is driven by a motor sub-assembly (not shown).This driving shaft 31 is aimed at the installation shaft 23 of this unit, group Pu 2 and its end portion extends downwardly near the roof near the ccontaining housing 20 of this unit, group Pu 2.
To such an extent as to the upper part that this sets of fan blades 32 is installed on this driving shaft 31 is when this driving shaft 31 is driven when rotating, this sets of fan blades 32 is rotated with this driving shaft 31.Should be noted that in the present embodiment this sets of fan blades 32 can be rotated with the speed of the thousands of commentaries on classics of per minute.
This active magnet 33 is installed in the end portion of this driving shaft 31 rotating with this driving shaft 31.Since the effect of magnetic attraction, the rotation of this active magnet 33 cause this unit, group Pu 2 by the rotation of moving magnet 23, cause the rotation of this group's Pu vane group 21 thus.
By structure as above, because fluid conduit systems 4 contacts with radiating fin 11 with the body 10 of this heat dissipation element 1, when the sets of fan blades 32 of this fan unit 3 during with the high speed rotating of the thousands of commentaries on classics of per minute, this active magnet 33 with this by moving magnet 22 along with these sets of fan blades 32 high speed rotating circulate to reach the hot-swap feature of cooling fluid 29 and this body 10 and radiating fin 11 in this fluid conduit systems 4 to reach cooling fluid 29 in this fluid conduit systems 4 at high speed can make these group's Pu vane group 21 high speed rotating, reduce the temperature of this light-emitting diode (LED) module 9 thus.
Because this sets of fan blades 32 is with high speed rotating, to such an extent as to this group Pu vane group 21 thus also with the flowing velocity of high speed rotating fluid in fluid conduit systems 4 very soon can reach high efficiency heat exchange.Moreover, because the middle interconnecting piece 42 of this fluid conduit systems 4 passes the body 10 and the radiating fin 11 of this heat dissipation element 1 in cranky mode, this fluid conduit systems 4 increases with the area that the body 10 of heat dissipation element 1 contacts with radiating fin 11, strengthens radiating efficiency thus.In addition, the cooling fluid 29 of group's Pu vane group 21 high speed stirrings in ccontaining housing 20 also produces the effect of cooling fluid 29 coolings.
On the other hand, the cooling air that blows from lower to upper or blow from top to bottom that produced of sets of fan blades 32 causes the effect of cross-ventilation with further lifting cooling.
In addition, the cooling fluid in fluid conduit systems 4 29 can for water, be added with cooling fluid water, be added with the water of low ignition point liquid and similar.For example, this cooling fluid 29 can comprise 50% alcohol and 50% water.Be added with the cooling fluid 29 of low ignition point liquid owing to have the characteristic that is easy to gasify, therefore when gasification, can make the further lifting of flow velocity and the heat exchanger effectiveness of cooling fluid 29 higher.On the other hand, owing to mix, therefore aspect fail safe, there is not doubt with water.Certainly, this cooling fluid 29 also can be a gas.
Moreover, by the driving shaft 31 of fan unit 3 aims at the installation shaft 23 of group unit, Pu 2 and by contactless active magnet 32 with by the design of moving magnet 22, to such an extent as to the inside of the ccontaining housing 20 of this fluid conduit systems 4 and this unit, group Pu 2 cooling fluid 29 of one-tenth vacuum state in the ccontaining housing 20 of this fluid conduit systems 4 and this unit, group Pu 2 can not leak.
In Fig. 1, the LED encapsulation body 92 of this light-emitting diode (LED) module 9 is installed in the routing mode, yet, this LED encapsulation body 92 can also be installed to cover crystalline substance (Flip-Chip) mode, as shown in FIG. 4, perhaps this LED encapsulation body 92 is commercially available emitter, as shown in FIG. 5.
Fig. 6 to 8 is the schematic plan view of the heat sink arrangement of demonstration second preferred embodiment of the invention, wherein, Fig. 6 is the diagrammatic side view of the heat sink arrangement of this second preferred embodiment of demonstration, the top schematic view of Fig. 7 for fan unit is removed, and the top schematic view of Fig. 8 for fan unit and radiating fin are removed.
See also shown in Fig. 6 to 8, in the present embodiment, the ccontaining housing 20 of this unit, group Pu 2 is arranged within this perforation 12.Because the structure of this group unit, Pu 2 is identical with first preferred embodiment, does not repeat them here.On the other hand, the middle interconnecting piece 42 of fluid conduit systems 4 also passes this body 10 except passing this radiating fin 11.
Fig. 9 is an illustrative circuitry calcspar that is presented at employed safety device in the heat sink arrangement of the present invention.
See also shown in Figure 9ly, this safety device comprises that substantially one in series is connected control circuit 39, and the detector 38 of rotating speed that is used to detect this fan motor 34 that is electrically connected to this control circuit 39 that the fan motor 34 of this fan unit 3 and vacuum decompression circuit breaker 37, that the PTR variable resistance between the fan power supply 36 35, is electrically connected to this fan power supply are electrically connected to this circuit breaker 37.
This variable resistance 35 is the variable resistance that a kind of its resistance value and temperature are inversely proportional to and change.Therefore this variable resistance 35 is located on the body 10 of this heat dissipation element 1, and the temperature of the body 10 of its resistance value and this heat dissipation element 1 is inversely proportional to.That is, when the temperature of the body 10 of this heat dissipation element 1 rises,, the resistance value of variable resistance 35 drives this sets of fan blades 32 with high rotational speed to such an extent as to reducing this fan motor 34.Otherwise when the temperature of the body 10 of this heat dissipation element 1 descended, this fan motor 34 drove this sets of fan blades 32 with lower rotating speed to such an extent as to the resistance value of variable resistance 35 rises.
This circuit breaker 37 can operate and cut off this fan power supply 36.
This detector 38 is used to detect the rotating speed of this fan motor 34, and produces the detection signal of the rotating speed of this motor 34 of expression.This control circuit 39 receives this detection signal and the reference signal of the rated speed of this detection signal and this motor of expression is made comparisons.When this detection signal is bigger than this reference signal, the normal rotating speed height of rotating ratio of representing this motor 34, representative has drainage, so this control circuit 39 outputs one start signal interrupts this fan power supply 36 to guarantee safety to this circuit breaker 37 with this circuit breaker 37 of start.
Figure 10 and 11 is the schematic plan view that shows the heat sink arrangement of third preferred embodiment of the invention.
See also shown in Figure 10 and 11, the heat sink arrangement of the 3rd preferred embodiment comprises one first metallic heat-radiating element 1, unit, a gang of Pu 2, a fan unit 3, a fluid conduit systems 4 substantially, reaches one second metallic heat-radiating element 7.
This second metallic heat-radiating element 7 has a lip-deep body 70 that is arranged at this light-emitting diode (LED) module 9.This body 70 has a plurality of upwardly extending radiating fins 71 and its lower surface 701 is formed with a ccontaining alcove 703 in the position corresponding to this light-emitting diode (LED) module 9.
One auxiliary heat dissipation sheet 5 by, for example, copper becomes and is installed in the ccontaining alcove 703 of this body 70 contact with the back side of the mounting panel 90 of this light-emitting diode (LED) module 9, promotes the heat exchanger effectiveness of this heat dissipation element 7 and this light-emitting diode (LED) module 9 thus.
This first metallic heat-radiating element 1 has a body 10 and an a plurality of upwardly extending radiating fin 11 that is arranged at a side of this second metallic heat-radiating element 7.This body 10 surface thereon is formed with unit, a group Pu installation alcove 104 that is used for the ccontaining housing 20 of ccontaining this unit, group Pu 2 on 102.Because other structures of this group unit, Pu 2 identical with shown in Fig. 1 and 6 do not repeat them here.
The structure of this fan unit 3 identical with shown in Fig. 1 and 6, therefore, its detailed description does not repeat them here.
Figure 12 to 14 for show can be in heat sink arrangement of the present invention the schematic plan view of employed auxiliary heat dissipation element.
See also shown in Figure 12 to 14, each auxiliary heat dissipation element 13 is attached at the surface of the radiating fin 11 of metallic heat-radiating element 1.
This auxiliary heat dissipation element 13 can be called as so-called heat pipe (heat pipe) and respectively have a bottom 130, an intermediate layer 131, first and second copper foil 132 and 133, an and top layer 134.
This bottom 130 is one to have a flexible film by what PI and BS formed.This bottom 130 has one near the first surface 1300 on the surface of the radiating fin 11 of a correspondence and one and these first surface 1300 opposing second surface 1301.This first copper foil 132 with, for example, mode of printing is set on this second surface 1301 and its two end portions 1320 convexedly stretches in outside this bottom 130.Should be noted that this first copper foil 132 also can replace with any other tinsel that is fit to.
This intermediate layer 131 is formed on this first copper foil 132.In the present embodiment, this intermediate layer 131 is formed by photoresist.This intermediate layer 131 is formed with and a plurality ofly extends to other end part and run through the perforate 1310 on its two surfaces from the one end parts.A plurality of pores 1311 are come to form via sintering processes in this intermediate layer 131 on the hole wall that forms each perforate 1310.
This second copper foil 133 is arranged on this intermediate layer 131 in the mode identical with first copper foil 132.Identical with this first copper foil 132, two end portion 1330 of this second copper foil 133 protrude out outside this intermediate layer 131.
This top layer 134 is to form and to be arranged on this second copper foil 133 with these bottom 130 identical materials.
First and second copper foils 132 of each auxiliary heat dissipation element 13 and 133 end portion 1320 contact with this body 10 with corresponding radiating fin 11 respectively with 1330.
By structure as above, first and second copper foils 132 and 133 can carry out heat exchange with body 10 and radiating fin 11, promote heat radiation function thus.To such an extent as to should be noted that in the perforate 1310 in this intermediate layer 131, can add the low ignition point fluid when first and second copper foils 132 and 133 and body 10 and radiating fin 132 and 133 carry out heat exchange and can gasify rapidly.Low ignition point fluid through gasification transforms back into liquid state via this pore 1311 by capillary condensation principle (capillary condensation).
Figure 15 to 19 is the schematic diagram of the heat sink arrangement of demonstration fourth embodiment of the invention.
See also shown in Figure 15 to 19, the heat sink arrangement of present embodiment comprises a metallic heat-radiating element 1 ', a fan unit 3, unit, a gang of Pu 2, one L shaped output duct 106, an input pipe 107 substantially, reaches a plurality of auxiliary heat dissipation elements 13.
This metallic heat-radiating element 1 ' is arranged on the back side of mounting panel 90 of this light-emitting diode (LED) module 9 and comprises roughly body 10 ', a plurality of radiating fin 11 ', and the ring-type collector pipe 14 of circular shape.
This body 10 ' has a lower surface 101 ' that contacts with the back side of the mounting panel 90 of this light-emitting diode (LED) module 9, and as shown in Figure 19, this body 10 ' is formed with a water leg 105 along its periphery extension in inside.The ccontaining alcove 104 in unit, a gang of Pu is formed on the upper surface 102 ' of this body 10 '.
These a plurality of radiating fins 11 ' extend upward and radially separate one another along the periphery of this body 10 ' from the upper surface 102 ' of this body 10 '.Each radiating fin 11 ' is formed with at least one passage 110 that runs through its upper and lower end parts and be communicated with this water leg 105.
This ring-type collector pipe 14 is arranged at the upper part of this radiating fin 11 ' and is communicated with the passage 110 of this fin 11 '.
This fan unit 3 comprises an installing rack 30, a driving shaft 31 vertical with this body 10, a sets of fan blades 32, an and magnet 33 initiatively.
This installing rack 30 is surrounded by this radiating fin 11 ' and is connected can be fixed on one and these collector pipe 14 much the same levels with this radiating fin 11 '.
This driving shaft 31 is rotatably installed on this installing rack 30 in the mode identical with aforesaid embodiment.The end portion of this driving shaft 31 extends near this body 10 ' downwards.
To such an extent as to the upper part that this sets of fan blades 32 is installed on this driving shaft 31 is when this driving shaft 31 is driven when rotating, this sets of fan blades 32 is rotated with this driving shaft 31.
This active magnet 33 is installed in the end portion of this driving shaft 31 rotating with this driving shaft 31.
This unit, group Pu 2 comprises a ccontaining housing 20, a gang of Pu vane group 21, reaches one by moving magnet 22.
To such an extent as to this ccontaining housing 20 is arranged at the roof of this ccontaining housing 20 in the ccontaining alcove 104 in the unit, group Pu of this body 10 ' near this active magnet 33.This ccontaining housing 20 has a fluid input port 200 and a fluid output port 201.In the present embodiment, this ccontaining housing 20 is made by metal material.
This group's Pu vane group 21 is rotatably installed on an end portion from the downward installation shaft 23 of extending of roof of this ccontaining housing 20.In the present embodiment, this group's Pu vane group 21 is made by metal material.
This is arranged at the roof of the upper part of this installation shaft 23 near this ccontaining housing 20 rotationally by moving magnet 22, and connects helping Pu vane group 21 to rotate with this with this group's Pu vane group 21.
This output duct 106 has one and is arranged at the output 1061 that this body 10 ' is inner and input 1060 and that be communicated with the fluid output port 201 of this ccontaining housing 20 extends upward and is communicated with this collector pipe 14.
This input pipe 107 is arranged at this body 10 ' inside and has an output 1070 that is communicated with the fluid input port 200 of this ccontaining housing 20 and an input 1071 that is communicated with this water leg 105.
This auxiliary heat dissipation element 13 with at identical described in Figure 12 to 14 and the outer surface that is attached at the lower surface 101 ' of this body 10 ' and extends to corresponding one in this radiating fin 11 ' carrying out heat exchange with the cooling fluid 29 in this corresponding radiating fin 11 ', further promote radiating effect thus.
By as above constructing, when this group's Pu vane group 21 is rotated owing to the rotation of this sets of fan blades 32, cooling fluid 29 will be transferred to this collector pipe 14 from this ccontaining housing 20 via this output duct 106, then be transferred to this water leg 105, enter this ccontaining housing 20 via this input pipe 107 more at last via passage 110.
Figure 20 is a schematic sectional view that shows the heat sink arrangement of fifth embodiment of the invention.
See also shown in Figure 20ly, the heat sink arrangement of present embodiment comprises a fan unit 3 and a heat transmission unit 6.
This heat transmission unit 6 comprises an installation base plate 60 and a plurality of conductor of being made by semi-conducting material 61 that is installed on this installation base plate 60.
In the present embodiment, this installation base plate 60 is a ceramic substrate and to have one first installation surface relative with this first installation surface with and be laid with second installation surface of predetermined circuit trace 600.This fan unit 3 is installed on first installation surface of this installation base plate 60.
Each conductor 61 have first electrode 610 of circuit trace of correspondence that is electrically connected to second installation surface of this installation base plate 60.Each conductor 61 has second electrode 611 that is electrically connected with the light-emitting diode 92 of a light-emitting diode (LED) module 9.In the present embodiment, first electrode 610 of this conductor 61 is N type zone for p type island region territory second electrode 611, therefore, when this conductor 61 was provided with electric power via sort circuit track 600, this conductor 61 had heat is transferred to thermal conduction effect near an end parts of this installation base plate 60 from the end parts away from this installation base plate 60.
This light-emitting diode (LED) module 9 has a transparent mounting panel 90 and a plurality of light-emitting diode 92 that is installed on the installation surface of this mounting panel 90 operationally.This light-emitting diode has second electrode 921 that first electrode 920 that connects with second electrode 611 of the corresponding conductor 61 of this conduction unit 6 and are electrically connected with corresponding circuit trace 98 on this mounting panel 90, thus, this conductor 61 can reduce the operational temperature of this light-emitting diode 92.
Should be noted that, in the present embodiment, this light-emitting diode (LED) module 9 also comprises on a plurality of back sides opposite with installation surface that are installed on this mounting panel 90, is positioned at the lens 93 of the correspondence position of this light-emitting diode 92, and a reflecting plate 94 that surrounds this lens 93.In Figure 20, each lens 93 is shown as has a circular arc external surface, yet each lens 93 can also be formed has a plurality of flat outer surfaces.
Figure 21 is the schematic sectional view of the variation of a heat sink arrangement that shows the fifth embodiment of the present invention.Different with the 5th embodiment, this variation is used with solar module.This solar module comprise solar cell 95 on a mounting panel 90 ', a plurality of installation surface that is installed on this mounting panel 90 ' by a transparency conducting layer 96 operationally, and a plurality of back side opposite that is installed on this mounting panel 90 ' with installation surface on, be positioned at the lens 93 of the correspondence position of this solar cell 95.
Should be noted that can be more concentrated for light, can comprise also that in this variation one is installed in this mounting panel 90 ' and goes up can cover the snoot 900 that uses light to concentrate of being used to of this lens 93.
Figure 22 is the schematic sectional view of the variation of a heat sink arrangement that shows the first embodiment of the present invention.
As shown in Figure 22, the place different with first embodiment is that the mounting panel 90 of this light-emitting diode (LED) module 9 is a transparent mounting panel, and this light-emitting diode 92 is installed on the surface of projection 91 at the back side of this mounting panel 90 operationally, and mobile cooling fluid 29 is nonconducting in ccontaining housing 20 and fluid conduit systems 4.
Figure 23 A and 23B are respectively the schematic sectional view and the signal part stereogram of the heat sink arrangement that shows the sixth embodiment of the present invention.
As shown in Figure 23 A and the 23B, the heat sink arrangement of present embodiment comprises a heat transmission unit 6.This heat transmission unit 6 has a microscler heat conduction installation base plate 60.This heat conduction installation base plate 60 has an installation surface and is laid on this installation surface, is arranged near a terminal predetermined circuit trace 62 (only Bu Fen circuit trace 62 is presented at Figure 23 B).
To such an extent as to the light-emitting diode 92 of this light-emitting diode (LED) module 9 is installed on the electrode (not shown) of this light-emitting diode 92 on the installation surface of this installation base plate 60 operationally with matrix form and corresponding circuit trace 62 is electrically connected.In addition, on the installation surface that light-emitting diode 92 is installed of this installation base plate 60, more be coated with the phosphor powder layer 97 of this light-emitting diode 92 of a covering.
Figure 24 is the schematic sectional view of the variation of a heat sink arrangement that shows the sixth embodiment of the present invention.
As shown in Figure 24, the difference of the embodiment shown in this variation and Figure 23 A and the 23B only is that the installation of light-emitting diode 92 on the installation surface of installation base plate 60 finish with lead 98.
Figure 25 A and 25B are respectively the schematic sectional view and the signal part stereogram of another variation of the heat sink arrangement that shows the sixth embodiment of the present invention.
As shown in Figure 25 A and the 25B, this variation only is the emitter star of this light-emitting diode 92 for getting on the market with the difference of the embodiment shown in Figure 23 A and the 23B, therefore, can be omitted at the phosphor powder layer shown in Figure 23 A and the 23B.
Figure 26 is the schematic isometric of another variation of a heat sink arrangement that shows the sixth embodiment of the present invention.
As shown in Figure 26, be provided with one in another terminal relative end portion of this heat conduction installation base plate 60 this another end portion is placed in cooling fluid bag 63 in it with being laid with circuit trace 62.To such an extent as to being installed in cooling fluid 29, this cooling fluid bag 63 in it, can promote the effect that this heat conduction installation base plate 60 reduces the operational temperature of light-emitting diode 92.
Figure 27 is a schematic sectional view that shows the aspect when heat sink arrangement of the present invention uses with the memory body module.
As shown in Figure 27, this memory body module 9 comprises a mounting panel 90 and a plurality of memory body 92 that is installed on operationally on this mounting panel 90.To such an extent as to this memory body module 9 places the non-electrode installation surface of this memory body 92 under this body 10 to contact with the lower surface of this body 10, the heat that produces when 9 runnings of memory body module can dissipate via this body 10 thus.
Figure 28 is the schematic sectional view of the variation of a heat sink arrangement that shows the first embodiment of the present invention.
As shown in Figure 28, different with first embodiment places are that this module 9 is semiconductor integrated circuit module.The mounting panel 90 of this module 9 has one and is used to the lower surface of conduction connector 93 is installed and a plurality of semiconductor integrated circuit 92 is installed on the surface of the projection 91 of this mounting panel 90 operationally.
Claims (17)
1. heat sink arrangement, described heat sink arrangement is suitable for using with a module, and described module comprises a mounting panel, and described heat sink arrangement is characterised in that and comprises:
A metallic heat-radiating element, described metallic heat-radiating element has a body and a plurality of upwardly extending separate radiating fin of upper surface from described body, middle body at described body forms a through hole that connects its upper surface and lower surface, and described through hole is suitable for embedding for the projection at the opposite back side of the installation surface with electronic component is installed of the mounting panel of described module;
A group unit, Pu, unit, described group Pu comprise one be arranged at the installation region, group Pu of upper surface of body of described heat dissipation element and the ccontaining housing, that is filled with cooling fluid be arranged within the described ccontaining housing and also be installed on the end portion of a rotating shaft that extends downwards from the roof of described ccontaining housing group's Pu vane group, and one be installed on described rotating shaft the upper part by moving magnet;
A fluid conduit systems can flow at described fluid conduit systems and described putting part body-internal-circulation to such an extent as to described fluid conduit systems is filled with the identical cooling fluid of cooling fluid in the ccontaining housing with unit, described group Pu and is communicated with cooling fluid with described ccontaining housing; And
A fan unit, described fan unit is arranged on the radiating fin of described metallic heat-radiating element and comprises that one has one and extends near the described active magnet that is installed on the end portion of described driving shaft by the driving shaft of the end portion of moving magnet and, when described fan unit start, rotated together along with active magnet by moving magnet and make group's Pu vane group rotate to circulate at a high speed with the cooling fluid of reaching in described fluid conduit systems to such an extent as to described active magnet rotates with described driving shaft.
2. heat sink arrangement as claimed in claim 1, it is characterized in that, described fan unit also comprises the sets of fan blades of a upper part that is installed on described driving shaft rotating with described driving shaft, produce from lower to upper or the cooling air that blows from top to bottom the effect that therefore cross-ventilation makes further lifting cooling by described sets of fan blades.
3. heat sink arrangement as claimed in claim 1, it is characterized in that, described fluid conduit systems has one and passes the body of described heat dissipation element and the middle interconnecting piece of radiating fin in cranky mode, and described cooling fluid can for water, be added with cooling fluid water, be added with low ignition point liquid water and similar in any one.
4. heat sink arrangement as claimed in claim 1 is characterized in that, also comprises a safety device, and described safety device comprises:
One is connected in series at the fan motor of described fan unit and the PTR variable resistance between the fan power supply, and described variable resistance changes its resistance value according to the temperature of the body of described metallic heat-radiating element;
A vacuum decompression circuit breaker that is electrically connected to described fan power supply, described circuit breaker can operate and cut off described fan power supply;
A control circuit that is electrically connected to described circuit breaker; And
The detector of rotating speed that is used to detect described fan motor that is electrically connected to described control circuit, described detector detects the rotating speed of described fan motor, and produce the detection signal of the rotating speed of a described motor of expression, described control circuit receives described detection signal and the reference signal of the rated speed of a described detection signal and a described motor of expression is made comparisons, when described detection signal is bigger than described reference signal, the normal rotating speed height of rotating ratio of representing described motor, representative has a drainage, and therefore described control circuit is exported a start signal and interrupted described fan power supply to guarantee safety to described circuit breaker with the described circuit breaker of start.
5. heat sink arrangement, described heat sink arrangement is suitable for using with a module, and described module comprises a mounting panel, and described heat sink arrangement is characterised in that and comprises:
One first metallic heat-radiating element, described first metallic heat-radiating element have a body and a plurality of upwardly extending separate radiating fin of upper surface from described body, be formed with a group unit, Pu on the upper surface of described body alcove is installed;
A group unit, Pu, unit, described group Pu comprise ccontaining housing, that a unit, group Pu that is arranged at the body of described first metallic heat-radiating element is installed alcove and is filled with cooling fluid be arranged within the described ccontaining housing and also be installed on the end portion of a rotating shaft that extends downwards from the roof of described ccontaining housing group's Pu vane group, and one be installed on described rotating shaft the upper part by moving magnet;
A fan unit, described fan unit is arranged on the radiating fin of described first metallic heat-radiating element and comprises that one has one and extends near the described active magnet that is installed on the end portion of described driving shaft by the driving shaft of the end portion of moving magnet and, when described fan unit start, to such an extent as to described active magnet rotates by moving magnet along with active magnet rotates together with described driving shaft;
Second metallic heat-radiating element that places described first metallic heat-radiating element next door, described second metallic heat-radiating element has a lip-deep body that is arranged at the mounting panel of described module, and the body of described second metallic heat-radiating element has a plurality of upwardly extending radiating fins and its lower surface is formed with a ccontaining alcove in the position corresponding to described module; And
The fluid conduit systems of the cooling fluid that the cooling fluid in ccontaining housing that is filled with unit, described group Pu is identical can flow at described fluid conduit systems and described putting part body-internal-circulation to such an extent as to described fluid conduit systems is communicated with described ccontaining housing and has a middle interconnecting piece cooling fluid that passes the body of described second metallic heat-radiating element.
6. heat sink arrangement as claimed in claim 5, it is characterized in that, can carry out heat exchange with described auxiliary heat dissipation sheet to such an extent as to also comprise in the ccontaining alcove of a body that is installed in described second metallic heat-radiating element cooling fluid, thus the further operational temperature of the described module of reduction corresponding in the described storehouse of catchmenting, the storehouse of catchmenting of the section of described auxiliary heat dissipation sheet with the auxiliary heat dissipation sheet that can contact and a middle interconnecting piece that is arranged at described fluid conduit systems with the back side of the mounting panel of described module.
7. heat sink arrangement, described heat sink arrangement is suitable for using with a module, and described module comprises a mounting panel, and described heat sink arrangement is characterised in that and comprises:
A metallic heat-radiating element, described metallic heat-radiating element is arranged on the back side of mounting panel of described module and comprises a roughly body of circular shape, a plurality of radiating fins, an and ring-type collector pipe, described body has a lower surface that contacts with the back side of the mounting panel of described module and described body is formed with a water leg along its periphery extension in inside, the ccontaining alcove in unit, a gang of Pu is formed on the upper surface of described body, described a plurality of radiating fin extends upward and radially separates one another along the periphery of described body from the upper surface of described body, each radiating fin is formed with at least one passage that runs through its upper and lower end parts and be communicated with described water leg, described ring-type collector pipe be arranged at described a plurality of radiating fins the upper part and also with the channel connection of described a plurality of radiating fins;
A fan unit, described fan unit comprises a driving shaft, a sets of fan blades, reaches an active magnet, the end portion of described driving shaft extends near described body, to such an extent as to described sets of fan blades is installed on the upper part of described driving shaft when described driving shaft is rotated, described sets of fan blades is rotated with described driving shaft, and described active magnet is installed on the end portion of described driving shaft rotating with described driving shaft;
A group unit, Pu, unit, described group Pu comprises a ccontaining housing, a gang of Pu vane group, reaches one by moving magnet, to such an extent as to described ccontaining housing is arranged at the approaching described active magnet of roof of the interior described ccontaining housing of the ccontaining alcove in unit, group Pu of described body, described group Pu vane group is installed on an end portion from the downward installation shaft of extending of roof of described ccontaining housing, the described upper part that is arranged at described installation shaft by moving magnet is near the roof of described ccontaining housing, and connects rotating with described group Pu vane group with described group Pu vane group;
An output duct, described output duct have one and are arranged at described body interior and output that the input and that is communicated with the fluid output port of described ccontaining housing extends upward and is communicated with described collector pipe; And
An input pipe, described input pipe are arranged at described body interior and have an output that is communicated with the fluid input port of described ccontaining housing and an input that is communicated with described water leg.
8. as each the described heat sink arrangement in the claim 1,5 or 7, it is characterized in that also comprise the auxiliary heat dissipation element on the surface of a plurality of radiating fins that respectively are attached at metallic heat-radiating element, each auxiliary heat dissipation element comprises:
A bottom, described bottom are one to have flexible film, and have one near the first surface on the surface of the radiating fin of a correspondence and one and described first surface opposing second surface;
One first copper foil, described first copper foil are arranged on the second surface of described bottom and its two end portions convexedly stretches in outside the described bottom and contact with the corresponding radiating fin and the body of metallic heat-radiating element respectively;
An intermediate layer, described intermediate layer is formed on described first copper foil and is formed with and a plurality ofly extends to other end part and run through the perforate on its two surface from the one end parts, and a plurality of pores are come to form via sintering processes in described intermediate layer on the hole wall that forms each perforate;
One second copper foil, described second copper foil are arranged on the described intermediate layer and its two end portion protrudes out outside described intermediate layer and contact with the corresponding radiating fin and the body of metallic heat-radiating element respectively; And
A top layer that is arranged on described second copper foil.
9. heat sink arrangement as claimed in claim 8, it is characterized in that, described bottom is formed by PI and BS, to such an extent as to and in the perforate in described intermediate layer, can add the low ignition point fluid and carry out heat exchange and can gasify rapidly when the body of first and second copper foils and metallic heat-radiating element and radiating fin, the low ignition point fluid through gasifying transforms back into liquid state via described a plurality of pores by the capillary condensation principle.
10. heat sink arrangement, described heat sink arrangement is suitable for using with a module, and described module comprises a transparent mounting panel and a plurality of light-emitting diode that is installed on the installation surface of described mounting panel, and described heat sink arrangement is characterised in that and comprises:
A heat transmission unit, described heat transmission unit comprises an installation base plate and a plurality of conductor that is installed on the described installation base plate, it is identical with described first installation surface with one and be laid with second installation surface of predetermined circuit trace that described installation base plate has one first installation surface, each conductor has first terminal and second end portion that is electrically connected with the light-emitting diode of described module of circuit trace of the correspondence of second installation surface that is electrically connected to described installation base plate, when described a plurality of conductors are provided with electric power, to such an extent as to the temperature of second end portion is lowered than the operational temperature of the low described light-emitting diode of temperature of first end portion; And
A fan unit, described fan unit are installed on first installation surface of described installation base plate.
11. a light-emitting diode (LED) module is characterized in that comprising:
A transparent mounting panel;
A plurality of light-emitting diodes that are installed on the installation surface of described mounting panel;
On a plurality of that be installed on described mounting panel and the installation surface opposing backside surface, be positioned at the lens of the correspondence position of described a plurality of light-emitting diodes;
One heat transmission unit, described heat transmission unit comprises an installation base plate and a plurality of conductor that is installed on the described installation base plate, it is identical with described first installation surface with one and be laid with second installation surface of predetermined circuit trace that described installation base plate has one first installation surface, each conductor has first terminal and second end portion that is electrically connected with the light-emitting diode of described module of circuit trace of the correspondence of second installation surface that is electrically connected to described installation base plate, when described a plurality of conductors are provided with electric power, to such an extent as to the temperature of second end portion is lowered than the operational temperature of the low described light-emitting diode of temperature of first end portion; And
One fan unit, described fan unit are installed on first installation surface of described installation base plate.
12. heat sink arrangement as claimed in claim 11 is characterized in that, also comprises a reflecting plate light emitting diode illuminating apparatus that surrounds described a plurality of lens.
13. heat sink arrangement as claimed in claim 11 is characterized in that, each lens can be formed has a plurality of flat outer surfaces.
14. a solar module is characterized in that comprising:
A transparent mounting panel;
A transparency conducting layer that is installed on the installation surface of described mounting panel;
A plurality of solar cells that are installed on the installation surface of described mounting panel by described transparency conducting layer;
On a plurality of that be installed on described mounting panel and the installation surface opposing backside surface, be positioned at the lens of the correspondence position of described a plurality of solar cells;
A heat transmission unit, described heat transmission unit comprises an installation base plate and a plurality of conductor that is installed on the described installation base plate, it is identical with described first installation surface with one and be laid with second installation surface of predetermined circuit trace that described installation base plate has one first installation surface, each conductor has first terminal and second end portion that is electrically connected with the solar cell of described module of circuit trace of the correspondence of second installation surface that is electrically connected to described installation base plate, when described a plurality of conductors are provided with electric power, to such an extent as to the temperature of second end portion is lowered than the operational temperature of the low described solar cell of temperature of first end portion; And
A fan unit, described fan unit are installed on first installation surface of described installation base plate.
15. solar module as claimed in claim 14 also comprises a condenser that is covered on the described transparent mounting panel.
16. a heat sink arrangement, described heat sink arrangement are suitable for using with a module, described module comprises a mounting panel, and described heat sink arrangement is characterised in that and comprises:
A heat transmission unit, described heat transmission unit has a microscler heat-conducting plate, the mounting panel of described module is suitable for being installed on the surface of an end portion of described heat-conducting plate, and described heat-conducting plate can be being transmitted to another end portion by the heat that element produced on the mounting panel of described module from described end portion.
17. heat sink arrangement as claimed in claim 16 is characterized in that, also comprises a cooling fluid storage tank that is installed in cooling fluid that coats described another end portion of described heat-conducting plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009102090340A CN102056452B (en) | 2009-10-30 | 2009-10-30 | Heat radiator device and module using same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009102090340A CN102056452B (en) | 2009-10-30 | 2009-10-30 | Heat radiator device and module using same |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210263893XA Division CN102802382A (en) | 2009-10-30 | 2009-10-30 | Radiator device and module using same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102056452A true CN102056452A (en) | 2011-05-11 |
| CN102056452B CN102056452B (en) | 2013-06-19 |
Family
ID=43960195
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009102090340A Expired - Fee Related CN102056452B (en) | 2009-10-30 | 2009-10-30 | Heat radiator device and module using same |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102056452B (en) |
Cited By (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102446997A (en) * | 2011-12-20 | 2012-05-09 | 上海电力学院 | Heat dissipation system applied to light-concentrating solar panel |
| CN102809139A (en) * | 2011-05-31 | 2012-12-05 | 上海微电子装备有限公司 | Mercury lamp room with cooling system |
| WO2013082803A1 (en) * | 2011-12-09 | 2013-06-13 | GE Lighting Solutions, LLC | Led lamp having magnetic thermal management |
| CN103807712A (en) * | 2012-11-09 | 2014-05-21 | 广州市雷腾照明科技有限公司 | Motorcycle LED (Light Emitting Diode) lamp cap with good heat dissipation performance |
| CN104023502A (en) * | 2013-03-01 | 2014-09-03 | 鸿富锦精密工业（深圳）有限公司 | Heat radiation device and electronic device |
| CN104180352A (en) * | 2013-05-24 | 2014-12-03 | 深圳市海洋王照明工程有限公司 | High-power lamp |
| CN105570692A (en) * | 2015-10-16 | 2016-05-11 | 马根昌 | Wind wheel type heat dissipation LED lamp |
| CN106159358A (en) * | 2016-07-19 | 2016-11-23 | 超威电源有限公司 | Heat management device of power battery and thermal management algorithm |
| CN106352249A (en) * | 2016-08-18 | 2017-01-25 | 东莞市闻誉实业有限公司 | Efficient heat-dissipation LED lamp |
| CN106402743A (en) * | 2016-10-24 | 2017-02-15 | 东莞市闻誉实业有限公司 | LED lighting device |
| US9730358B2 (en) | 2013-03-01 | 2017-08-08 | Hon Hai Precision Industry Co., Ltd. | Unpowered auxiliary heat dissipation apparatus and device using the same |
| TWI604626B (en) * | 2016-11-16 | 2017-11-01 | Solar heat sink fin module and solar energy device | |
| CN108533973A (en) * | 2018-04-11 | 2018-09-14 | 宁波蒙曼生物科技有限公司 | A kind of energy-saving radiating LED lamp device |
| CN108954120A (en) * | 2018-10-10 | 2018-12-07 | 贵州大学 | A kind of tunnel LED explosion-proof lamp with warning function |
| CN111520691A (en) * | 2020-04-20 | 2020-08-11 | 绍兴市上虞区友友照明电器有限公司 | Heat dissipation device of LED lamp |
| CN112161216A (en) * | 2020-10-12 | 2021-01-01 | 福建中科锐创光电科技有限公司 | Electric intelligent control high-lighting-effect track lamp |
| CN113170600A (en) * | 2018-12-13 | 2021-07-23 | 通用电气公司 | Liquid driven thermal module and thermal management system |
| CN115046173A (en) * | 2022-08-15 | 2022-09-13 | 江苏兆铝金属制品有限公司 | Radiator for automobile LED lamp |
| CN115100916A (en) * | 2022-08-29 | 2022-09-23 | 珠海翔翼航空技术有限公司 | Embedded controller for airplane flight training simulator |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101256992A (en) * | 2007-02-28 | 2008-09-03 | 长春藤控股有限公司 | Heat radiating device |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101266512A (en) * | 2007-03-14 | 2008-09-17 | 富钧科技股份有限公司 | Integral type recirculated water cooling and radiation device suitable for computer interface card chip |
| CN201187695Y (en) * | 2008-05-08 | 2009-01-28 | 鑫源盛科技股份有限公司 | Concatenation type light fitting heat radiating device |
-
2009
- 2009-10-30 CN CN2009102090340A patent/CN102056452B/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101256992A (en) * | 2007-02-28 | 2008-09-03 | 长春藤控股有限公司 | Heat radiating device |
Cited By (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102809139A (en) * | 2011-05-31 | 2012-12-05 | 上海微电子装备有限公司 | Mercury lamp room with cooling system |
| WO2013082803A1 (en) * | 2011-12-09 | 2013-06-13 | GE Lighting Solutions, LLC | Led lamp having magnetic thermal management |
| CN102446997B (en) * | 2011-12-20 | 2013-11-06 | 上海电力学院 | Heat dissipation system applied to light-concentrating solar panel |
| CN102446997A (en) * | 2011-12-20 | 2012-05-09 | 上海电力学院 | Heat dissipation system applied to light-concentrating solar panel |
| CN103807712A (en) * | 2012-11-09 | 2014-05-21 | 广州市雷腾照明科技有限公司 | Motorcycle LED (Light Emitting Diode) lamp cap with good heat dissipation performance |
| CN104023502B (en) * | 2013-03-01 | 2016-12-28 | 鸿富锦精密工业（深圳）有限公司 | Heat abstractor and electronic installation |
| CN104023502A (en) * | 2013-03-01 | 2014-09-03 | 鸿富锦精密工业（深圳）有限公司 | Heat radiation device and electronic device |
| US9730358B2 (en) | 2013-03-01 | 2017-08-08 | Hon Hai Precision Industry Co., Ltd. | Unpowered auxiliary heat dissipation apparatus and device using the same |
| CN104180352A (en) * | 2013-05-24 | 2014-12-03 | 深圳市海洋王照明工程有限公司 | High-power lamp |
| CN105570692A (en) * | 2015-10-16 | 2016-05-11 | 马根昌 | Wind wheel type heat dissipation LED lamp |
| CN105570692B (en) * | 2015-10-16 | 2018-07-27 | 沈阳北方防爆股份有限公司 | Wind wheel type heat radiating LED lamp |
| CN106159358B (en) * | 2016-07-19 | 2018-10-09 | 超威电源有限公司 | Heat management device of power battery and thermal management algorithm |
| CN106159358A (en) * | 2016-07-19 | 2016-11-23 | 超威电源有限公司 | Heat management device of power battery and thermal management algorithm |
| CN106352249A (en) * | 2016-08-18 | 2017-01-25 | 东莞市闻誉实业有限公司 | Efficient heat-dissipation LED lamp |
| CN106402743A (en) * | 2016-10-24 | 2017-02-15 | 东莞市闻誉实业有限公司 | LED lighting device |
| CN106402743B (en) * | 2016-10-24 | 2019-04-02 | 东莞市闻誉实业有限公司 | LED light device |
| TWI604626B (en) * | 2016-11-16 | 2017-11-01 | Solar heat sink fin module and solar energy device | |
| CN108533973B (en) * | 2018-04-11 | 2020-05-12 | 桐乡市倍特科技有限公司 | Energy-saving heat-dissipation LED lamp device |
| CN108533973A (en) * | 2018-04-11 | 2018-09-14 | 宁波蒙曼生物科技有限公司 | A kind of energy-saving radiating LED lamp device |
| CN108954120A (en) * | 2018-10-10 | 2018-12-07 | 贵州大学 | A kind of tunnel LED explosion-proof lamp with warning function |
| CN113170600A (en) * | 2018-12-13 | 2021-07-23 | 通用电气公司 | Liquid driven thermal module and thermal management system |
| CN111520691A (en) * | 2020-04-20 | 2020-08-11 | 绍兴市上虞区友友照明电器有限公司 | Heat dissipation device of LED lamp |
| CN112161216A (en) * | 2020-10-12 | 2021-01-01 | 福建中科锐创光电科技有限公司 | Electric intelligent control high-lighting-effect track lamp |
| CN115046173A (en) * | 2022-08-15 | 2022-09-13 | 江苏兆铝金属制品有限公司 | Radiator for automobile LED lamp |
| CN115100916A (en) * | 2022-08-29 | 2022-09-23 | 珠海翔翼航空技术有限公司 | Embedded controller for airplane flight training simulator |
| CN115100916B (en) * | 2022-08-29 | 2022-11-15 | 珠海翔翼航空技术有限公司 | Embedded controller for airplane flight training simulator |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102056452B (en) | 2013-06-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102056452B (en) | Heat radiator device and module using same | |
| US20110073159A1 (en) | Heat Dissipating Device and Module Using Same | |
| CN100570865C (en) | Heat abstractor | |
| CN109524373A (en) | The three-dimensional active heat removal encapsulating structure and its manufacture craft of embedded fluid channel | |
| JP7218917B2 (en) | Heat dissipation device | |
| CN104582357B (en) | Electronic installation with water-protected enclosure | |
| CN202132770U (en) | Light-emitting diode (LED) explosion-proof lamp | |
| JP2009088000A (en) | Circuit module | |
| CN102802382A (en) | Radiator device and module using same | |
| EP3157055B1 (en) | Heat dissipating module, heat dissipating system and circuit device | |
| KR20100133877A (en) | Semiconductor application installation adapted with a temperature equalization system | |
| CN101170087A (en) | Power module having self-contained cooling system | |
| CN104183690A (en) | Heat radiation plate | |
| CN102509520B (en) | Ventilating and heat-radiating structure and heat-radiating method of LED (light-emitting diode) display screen | |
| WO2005071747A1 (en) | Heat pipe radiator of heat-generating electronic component | |
| CN106684076B (en) | Encapsulating structure and its manufacturing method | |
| US20170367216A1 (en) | Water cooling device | |
| CN103400835B (en) | The integrated encapsulation method of LED module | |
| CN105390585A (en) | Chip packaging module and packaging substrate | |
| CN101389202B (en) | Cooling device for electronic element | |
| CN110783290A (en) | Radiating assembly and radiator | |
| US20040196632A1 (en) | Heat dissipation module | |
| CN201218482Y (en) | Angle-fixing high-brightness polycrystal packaging LED heat radiating device | |
| KR101233644B1 (en) | Heat emittion device of large lamp having laminated heat emitting conductor | |
| CN102401293A (en) | Micro air duct radiating light emitting diode (LED) street lamp |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| ASS | Succession or assignment of patent right |
Owner name: CHANGCHUNTENG HOLDING CO., LTD. Free format text: FORMER OWNER: SHEN YUNONG Effective date: 20130204 Free format text: FORMER OWNER: WANG CONGQI Effective date: 20130204 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20130204 Address after: Virgin Islands (British) Applicant after: CHANGCHUNTENG HOLDING Co.,Ltd. Address before: Taipei City, Taiwan, China Applicant before: Shen Yunong Applicant before: Wang Congqi |
|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: SHEN MINGDONG Free format text: FORMER OWNER: CHANGCHUNTENG HOLDING CO., LTD. Effective date: 20141029 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; TO: TAIWAN, CHINA |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20141029 Address after: Taipei City, Taiwan, China Patentee after: Shen Mingdong Address before: Virgin Islands (British) Patentee before: CHANGCHUNTENG HOLDING Co.,Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130619 Termination date: 20161030 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |