CN101256992A

CN101256992A - Heat radiating device

Info

Publication number: CN101256992A
Application number: CNA2007100843731A
Authority: CN
Inventors: 沈育浓
Original assignee: CHANGCHUNTENG HOLDING Co Ltd
Current assignee: CHANGCHUNTENG HOLDING Co Ltd
Priority date: 2007-02-28
Filing date: 2007-02-28
Publication date: 2008-09-03
Anticipated expiration: 2027-02-28
Also published as: CN100570865C

Abstract

A heat radiating device for a computer system includes a semiconductor chip installed in the computer system with a heat radiation element of a main body and a several radiating rib, a pump unit installed at the main body of the heat radiation element with the cooling fluid, a fan unit installed at the radiating rib of the heat radiation element, and a fluid conduit tube filled with the cooling fluid communicated with the pump unit, and the fluid conduit tube crosses the main body and the radiating rib, the operation of the fan unit can operate the pump unit for making the cooling fluid flowing rapidity in the fluid conduit tube. The present invention can reduce the operation temperature of the computer element in the computer system effectively.

Description

Heat abstractor

[technical field]

The invention relates to a kind of heat abstractor, particularly the heat abstractor of using relevant for a kind of computer system.

[background technology]

Along with semiconductor technology be showing improvement or progress day by day and the function of computer beneficial more powerful, the picture central processing unit of computer system, the wafer of VGA card, motherboard control IC, wafer set, or the like as the running speed of semiconductor wafer be more and more faster, yet, running speed is fast more, the temperature of semiconductor wafer is high more, causes the problem of " working as machine " easily.

At present, see also shown in Figure 1ly, the known heat abstractor that computer system is used comprises that haply one is installed on as the metallic heat-radiating element with radiating fin 90 and on the semiconductor wafer 9 as the central processing unit and is installed on radiator fan 91 on this metallic heat-radiating element 90.Yet so heat abstractor is in the real temperature of this semiconductor wafer 9 when operating that can't effectively reduce under the more and more faster situation of the running speed of semiconductor wafer 9.

[summary of the invention]

Heat abstractor for providing a kind of computer system that can effectively reduce the operational temperature of computer components in the computer system to use is provided.

In order to achieve the above object, the invention provides the heat abstractor that a kind of computer system is used, this computer system comprises semiconductor wafer, and this heat abstractor comprises:

One metallic heat-radiating element, this metallic heat-radiating element is to be suitable for being arranged on this semiconductor wafer and to comprise a body roughly in a rectangular shape and the upwardly extending separate radiating fin of several upper surfaces from this body, and the lower surface of this body is to contact with the surface of this semiconductor wafer;

Unit, a gang of Pu, this unit, group Pu comprises a ccontaining housing, a gang of Pu vane group, reach one by moving magnet, this ccontaining housing be arranged at this heat dissipation element body upper surface and have a fluid input port and a fluid output port, the inside of this ccontaining housing is to be filled with cooling fluid, this group's Pu vane group is arranged within this ccontaining housing and is to be rotatably installed on a lower end part from the downward installation shaft of extending of roof of this ccontaining housing, this is the roof that is rotatably installed on partly approaching this ccontaining housing in upper end of this installation shaft by moving magnet, and is to connect helping the Pu vane group to rotate with this with this group's Pu vane group;

One fluid conduit systems, this fluid conduit systems is to be filled with the cooling fluid identical with the cooling fluid of filling in the ccontaining housing of this unit, group Pu and to have the middle interconnecting piece that fluid outlet, a fluid input port that is communicated with the fluid output port of this ccontaining housing and the form with cranky that is communicated with this fluid outlet and this fluid input port that is communicated with the fluid input port of this ccontaining housing passed this body and these radiating fins, when group's Pu vane group of this group unit, Pu was rotated, cooling fluid was to circulate in this fluid conduit systems; And

One fan unit, this fan unit comprises an installing rack, one driving shaft vertical with this body, one sets of fan blades, reach an active magnet, this installing rack is to be set on the radiating fin of this metallic heat-radiating element, this driving shaft is to be rotatably installed on this installing rack and is to be driven by a motor sub-assembly, this driving shaft be aim at the installation shaft of this unit, group Pu and also under it end part be the roof that extends downwardly near the ccontaining housing of this unit, group Pu, this sets of fan blades be installed on this driving shaft the upper end partly so that be driven when rotating when this driving shaft, this sets of fan blades is to rotate with this driving shaft, this active magnet is to be installed in the lower end of this driving shaft partly rotating with this driving shaft, because the effect of magnetic attraction, the rotation of this active magnet be cause this unit, group Pu by the rotation of moving magnet, cause the rotation of this group's Pu vane group whereby.

The heat abstractor that the present invention also provides a kind of computer system to use, this computer system comprises semiconductor wafer, this heat abstractor comprises:

One metallic heat-radiating element, this metallic heat-radiating element is to be suitable for being arranged on this semiconductor wafer and to comprise a body roughly in a rectangular shape and the upwardly extending separate radiating fin of several upper surfaces from this body, the lower surface of this body is to contact with the surface of this semiconductor wafer, on the upper surface of this body is to be formed with unit, a gang of Pu alcove is installed;

Unit, a gang of Pu, this unit, group Pu comprises a ccontaining housing, a gang of Pu vane group, reach one by moving magnet, this ccontaining housing is that the unit, group Pu that is arranged at the body of this heat dissipation element is installed alcove and had a fluid input port and a fluid output port, the inside of this ccontaining housing is to be filled with cooling fluid, this group's Pu vane group is arranged within this ccontaining housing and is to be rotatably installed on a lower end part from the downward installation shaft of extending of roof of this ccontaining housing, this is the roof that is rotatably installed on partly approaching this ccontaining housing in upper end of this installation shaft by moving magnet, and is to connect helping the Pu vane group to rotate with this with this group's Pu vane group;

One fan unit, this fan unit comprises an installing rack, one driving shaft vertical with this body, one sets of fan blades, reach an active magnet, this installing rack is the radiating fin support by this heat dissipation element, this driving shaft is to be rotatably installed on this installing rack so that the upper end of this driving shaft partly is to extend up to a degree, this sets of fan blades be installed on this driving shaft the lower end partly so that be driven when rotating when this driving shaft, this sets of fan blades is to rotate with this driving shaft, and this active magnet is to be installed in the upper end of this driving shaft partly rotating with this driving shaft;

One metal mounting base, this metal mounting base has several and extends downwards from surface under it and be arranged at the upwardly extending radiating fin of going up of following radiating fin and several surfaces on it on the installing rack of this fan unit, and the active magnet of this fan unit is the lower surface near this mounting base;

Unit, a gang of Pu, this unit, group Pu comprises a ccontaining housing, a gang of Pu vane group, reaches one by moving magnet, this ccontaining housing is to be arranged on the upper surface that is provided with radiating fin of this mounting base, this group's Pu vane group is arranged within this ccontaining housing and is to be rotatably installed on a upper end part from the downward installation shaft of extending of roof of this ccontaining housing, and this is to be arranged at partly close this active magnet in lower end of this installation shaft rotationally by moving magnet and is helping the Pu vane group to rotate with this with this group's Pu vane group connection;

One fluid conduit systems, this fluid conduit systems have a fluid outlet that is communicated with the fluid input port of the ccontaining housing of this unit, group Pu, a fluid input port that is communicated with the fluid output port of the ccontaining housing of this unit, group Pu, reach a body that passes this heat dissipation element, this heat dissipation element radiating fin, reach the middle interconnecting piece of the upper and lower radiating fin of this mounting base.

One fan unit, this fan unit comprises an installing rack, a driving shaft vertical with this body, an and sets of fan blades, this installing rack is to be set on the radiating fin of this metallic heat-radiating element, this driving shaft is to be rotatably installed on this installing rack and is to be driven by a motor sub-assembly, this driving shaft is to have an open lower of extending downwards partly for a hollow sleeve and its, this sets of fan blades is that the upper end with this driving shaft partly forms

Unit, a gang of Pu, this unit, group Pu comprises a ccontaining housing and a gang of Pu vane group, this ccontaining housing be arranged at this heat dissipation element body upper surface and have a fluid input port and a fluid output port, the inside of this ccontaining housing is to be filled with cooling fluid, this group's Pu vane group is arranged within this ccontaining housing and is to be rotatably installed on a lower end part from the downward installation shaft of extending of roof of this ccontaining housing, this is the roof that is rotatably installed on partly approaching this ccontaining housing in upper end of this installation shaft by moving magnet, and is to connect helping the Pu vane group to rotate with this with this group's Pu vane group;

One fluid conduit systems, this fluid conduit systems is to be filled with the cooling fluid identical with the cooling fluid of filling in the ccontaining housing of this unit, group Pu and to have a fluid outlet that is communicated with the fluid input port of this ccontaining housing, an one fluid input port that is communicated with the fluid output port of this ccontaining housing and a form with cranky that is communicated with this fluid outlet and this fluid input port are passed the middle interconnecting piece of this body and these radiating fins, when group's Pu vane group of this group unit, Pu is rotated, cooling fluid is to circulate in this fluid conduit systems, and the middle interconnecting piece of this fluid conduit systems is corresponding to this ccontaining housing storehouse of catchmenting; And

The heat pipe of one hollow, this heat pipe are to be installed on this body and to have one to extend up to the open lower part that the interior open upper end part and of this driving shaft extends downwardly into this storehouse of catchmenting.

One fan unit, this fan unit comprises an installing rack, a driving shaft vertical with this body, an and sets of fan blades, this installing rack is to be set on the radiating fin of this metallic heat-radiating element, this driving shaft is to be rotatably installed on this installing rack and is to be driven by a motor sub-assembly, the lower end of this driving shaft partly is to extend downwardly into this unit, group Pu to install in the alcove, this sets of fan blades be installed on this driving shaft the upper end partly so that be driven when rotating when this driving shaft, this sets of fan blades is to rotate with this driving shaft;

Unit, a gang of Pu, this unit, group Pu comprises a ccontaining housing and a gang of Pu vane group, this ccontaining housing is that alcove is installed so that the driving shaft of this fan unit is to extend in this ccontaining housing in the unit, group Pu that is arranged at the body of this heat dissipation element, this ccontaining housing has a fluid input port and a fluid output port, the inside of this ccontaining housing is to be filled with cooling fluid, and this group's Pu vane group is arranged within this ccontaining housing and is the lower end part that is installed on the driving shaft of this fan unit; And

One fluid conduit systems, this fluid conduit systems is to be filled with the cooling fluid identical with the cooling fluid of filling in the ccontaining housing of this unit, group Pu and to have the middle interconnecting piece that fluid outlet, a fluid input port that is communicated with the fluid output port of this ccontaining housing and the form with cranky that is communicated with this fluid outlet and this fluid input port that is communicated with the fluid input port of this ccontaining housing passed this body and these radiating fins, when group's Pu vane group of this group unit, Pu was rotated, cooling fluid was to circulate in this fluid conduit systems.

One fan unit, this fan unit comprises an installing rack, a driving shaft vertical with this body, an and sets of fan blades, this installing rack is to be set on the radiating fin of this metallic heat-radiating element, this driving shaft is to be rotatably installed on this installing rack and is to be driven by a motor sub-assembly, the lower end of this driving shaft partly is the upper surface that extends downwards near this body, this sets of fan blades be installed on this driving shaft the upper end partly so that be driven when rotating when this driving shaft, this sets of fan blades is to rotate with this driving shaft;

Unit, a gang of Pu, this unit, group Pu comprises a ccontaining housing and a gang of Pu vane group, this ccontaining housing is to be arranged on the upper surface of body of this heat dissipation element so that the lower end of the driving shaft of this fan unit partly is to extend in this ccontaining housing, this ccontaining housing has a fluid input port and a fluid output port, the inside of this ccontaining housing is to be filled with cooling fluid, and this group's Pu vane group is arranged within this ccontaining housing and is to be installed on the lower end of this driving shaft partly helping the Pu vane group to rotate with this; And

One fan unit, this fan unit comprises an installing rack, a driving shaft vertical with this body, an and sets of fan blades, this installing rack is the radiating fin support by this heat dissipation element, this driving shaft is to be rotatably installed on this installing rack so that the upper end of this driving shaft partly is to extend up to a degree, this sets of fan blades be installed on this driving shaft the lower end partly so that be driven when rotating when this driving shaft, this sets of fan blades is to rotate with this driving shaft;

Unit, a gang of Pu, this unit, group Pu comprises a ccontaining housing and a gang of Pu vane group, this ccontaining housing is to be arranged on the upper surface that is provided with radiating fin of this mounting base, the upper end of the driving shaft of this fan unit partly is to extend in this ccontaining housing, and this group's Pu vane group is arranged within this ccontaining housing and is to be installed on the upper end of driving shaft of this fan unit partly rotating with this sets of fan blades; And

One first metallic heat-radiating element, this first metallic heat-radiating element is to be suitable for being arranged on this semiconductor wafer and to comprise a body roughly in a rectangular shape and the upwardly extending separate radiating fin of several upper surfaces from this body, the lower surface of this body is to contact with the surface of this semiconductor wafer, on the upper surface of this body is to be formed with unit, a gang of Pu alcove is installed;

One second metallic heat-radiating element, this second metallic heat-radiating element has the body on the radiating fin that is arranged at this first metallic heat-radiating element, from the upwardly extending radiating fin of this body, run through this body and the driven spindle of aiming at the installation shaft of this unit, group Pu, and two upper ends that are installed on this driven spindle respectively partly and lower end relaying magnet partly, the lower end of this driven spindle relaying magnet partly be near this unit, group Pu by moving magnet;

One fan unit, this fan unit has an installing rack, one driving shaft, one sets of fan blades, reach an active magnet, this installing rack is to be arranged on the radiating fin of this second heat dissipation element, this driving shaft is to aim at this driven spindle and is to be rotatably installed on this installing rack, the lower end of this driving shaft partly is to extend downwardly near the relaying magnet partly of the upper end of the driven spindle of this second heat dissipation element, this sets of fan blades be installed in this driving shaft the upper end partly so that be driven when rotating when this driving shaft, this sets of fan blades is to rotate with this driving shaft, this active magnet is to be installed in the lower end of this driving shaft partly rotating with this driving shaft, the rotation of this active magnet makes the upper end relaying magnet partly of driven spindle of this second heat dissipation element rotate and then cause this driven spindle and rotates at the lower end of this driven spindle relaying magnet partly, and what make this unit, group Pu whereby is rotated group's Pu vane group with this unit, group Pu of start by moving magnet.

One fan unit, this fan unit comprises an installing rack, one driving shaft vertical with this body, one sets of fan blades, reach an active magnet, this installing rack is to be set on the radiating fin of this metallic heat-radiating element, this driving shaft is to be rotatably installed on this installing rack and is to be driven by a motor sub-assembly, this driving shaft be aim at the installation shaft of this unit, group Pu and also under it end part be the roof that extends downwardly near the ccontaining housing of this unit, group Pu, this sets of fan blades be installed on this driving shaft the upper end partly so that be driven when rotating when this driving shaft, this sets of fan blades is to rotate with this driving shaft, this active magnet is to be installed in the lower end of this driving shaft partly rotating with this driving shaft, because the effect of magnetic attraction, the rotation of this active magnet be cause this unit, group Pu by the rotation of moving magnet, cause the rotation of this group's Pu vane group whereby;

One second metallic heat-radiating element, this second metallic heat-radiating element have lip-deep body and several the surperficial upwardly extending radiating fins from this body that is arranged at this semiconductor wafer; And

One fluid conduit systems, this fluid conduit systems have a fluid outlet that is communicated with the fluid input port of the ccontaining housing of this unit, group Pu, a fluid input port that is communicated with the fluid output port of the ccontaining housing of this unit, group Pu, reach a middle interconnecting piece that passes the body of the body of this first heat dissipation element and this second heat dissipation element.

One metallic heat-radiating element, this metallic heat-radiating element is arranged on the semiconductor wafer of this computer system and comprises a roughly body of circular shape, several radiating fins, an and ring-type collector pipe, this body has a lower surface that contacts with the surface of this semiconductor wafer, this body is to be formed with a water leg that extends along its periphery in inside, the ccontaining alcove in unit, a gang of Pu is to be formed on the upper surface of this body, these several radiating fins are that the upper surface from this body extends upward and is radially to separate along the periphery of this body each other, each radiating fin be formed with at least one run through on it and the lower end partly and the passage that is communicated with this water leg, this ring-type collector pipe is to be arranged at the upper end part of these radiating fins and is channel connection with these radiating fins;

One fan unit, this fan unit comprises an installing rack, one driving shaft vertical with this body, one sets of fan blades, reach an active magnet, this installing rack is to be connected can be fixed on one and the much the same level of this collector pipe by these radiating fins encirclements and with these radiating fins, this driving shaft is to be rotatably installed on this installing rack in the mode identical with aforesaid embodiment, the lower end of this driving shaft partly is to extend downwards near this body, this sets of fan blades be installed on this driving shaft the upper end partly so that be driven when rotating when this driving shaft, this sets of fan blades is to rotate with this driving shaft, and this active magnet is to be installed in the lower end of this driving shaft partly rotating with this driving shaft;

Unit, a gang of Pu, this unit, group Pu comprises a ccontaining housing, a gang of Pu vane group, reach one by moving magnet, this ccontaining housing is to be arranged in the ccontaining alcove in unit, group Pu of this body so that the roof of this ccontaining housing is near this active magnet, this ccontaining housing has a fluid input port and a fluid output port, this group's Pu vane group is to be rotatably installed on a lower end part from the downward installation shaft of extending of roof of this ccontaining housing, this is the roof that is arranged at partly approaching this ccontaining housing in upper end of this installation shaft rotationally by moving magnet, and is to connect helping the Pu vane group to rotate with this with this group's Pu vane group;

One output duct, this output duct have one and are arranged at this body interior and output that the input and that is communicated with the fluid output port of this ccontaining housing extends upward and is communicated with this collector pipe;

One input pipe, this input pipe are to be arranged at this body interior and to have an output and an input that is communicated with this water leg that is communicated with the fluid input port of this ccontaining housing.

According to a feature of the present invention, the heat abstractor that a kind of computer system is used is to be provided, this computer system comprises semiconductor wafer, this heat abstractor comprises: a metallic heat-radiating element, this metallic heat-radiating element is to be suitable for being arranged on this semiconductor wafer and to comprise a body roughly in a rectangular shape and the upwardly extending separate radiating fin of several upper surfaces from this body, and the lower surface of this body is to contact with the surface of this semiconductor wafer; Unit, a gang of Pu, this unit, group Pu comprises a ccontaining housing, a gang of Pu vane group, reach one by moving magnet, this ccontaining housing be arranged at this heat dissipation element body upper surface and have a fluid input port and a fluid output port, the inside of this ccontaining housing is to be filled with cooling fluid, this group's Pu vane group is arranged within this ccontaining housing and is to be rotatably installed on a lower end part from the downward installation shaft of extending of roof of this ccontaining housing, this is the roof that is rotatably installed on partly approaching this ccontaining housing in upper end of this installation shaft by moving magnet, and is to connect helping the Pu vane group to rotate with this with this group's Pu vane group; One fluid conduit systems, this fluid conduit systems is to be filled with the cooling fluid identical with the cooling fluid of filling in the ccontaining housing of this unit, group Pu and to have the middle interconnecting piece that fluid outlet, a fluid input port that is communicated with the fluid output port of this ccontaining housing and the form with cranky that is communicated with this fluid outlet and this fluid input port that is communicated with the fluid input port of this ccontaining housing passed this body and these radiating fins, when group's Pu vane group of this group unit, Pu was rotated, cooling fluid was to circulate in this fluid conduit systems; An and fan unit, this fan unit comprises an installing rack, one driving shaft vertical with this body, one sets of fan blades, reach an active magnet, this installing rack is to be set on the radiating fin of this metallic heat-radiating element, this driving shaft is to be rotatably installed on this installing rack and is to be driven by a motor sub-assembly, this driving shaft be aim at the installation shaft of this unit, group Pu and also under it end part be the roof that extends downwardly near the ccontaining housing of this unit, group Pu, this sets of fan blades be installed on this driving shaft the upper end partly so that be driven when rotating when this driving shaft, this sets of fan blades is to rotate with this driving shaft, this active magnet is to be installed in the lower end of this driving shaft partly rotating with this driving shaft, because the effect of magnetic attraction, the rotation of this active magnet be cause this unit, group Pu by the rotation of moving magnet, cause the rotation of this group's Pu vane group whereby.

According to another characteristic of the invention, the heat abstractor that a kind of computer system is used is to be provided, this computer system comprises semiconductor wafer, this heat abstractor comprises: a metallic heat-radiating element, this metallic heat-radiating element is to be suitable for being arranged on this semiconductor wafer and to comprise a body roughly in a rectangular shape and the upwardly extending separate radiating fin of several upper surfaces from this body, the lower surface of this body is to contact with the surface of this semiconductor wafer, on the upper surface of this body is to be formed with unit, a gang of Pu alcove is installed; Unit, a gang of Pu, this unit, group Pu comprises a ccontaining housing, a gang of Pu vane group, reach one by moving magnet, this ccontaining housing is that the unit, group Pu that is arranged at the body of this heat dissipation element is installed alcove and had a fluid input port and a fluid output port, the inside of this ccontaining housing is to be filled with cooling fluid, this group's Pu vane group is arranged on the interior of this ccontaining housing and is to be rotatably installed on a lower end part from the downward installation shaft of extending of roof of this ccontaining housing, this is the roof that is rotatably installed on partly approaching this ccontaining housing in upper end of this installation shaft by moving magnet, and is to connect helping the Pu vane group to rotate with this with this group's Pu vane group; One fluid conduit systems, this fluid conduit systems is to be filled with the cooling fluid identical with the cooling fluid of filling in the ccontaining housing of this unit, group Pu and to have the middle interconnecting piece that fluid outlet, a fluid input port that is communicated with the fluid output port of this ccontaining housing and the form with cranky that is communicated with this fluid outlet and this fluid input port that is communicated with the fluid input port of this ccontaining housing passed this body and these radiating fins, when group's Pu vane group of this group unit, Pu was rotated, cooling fluid was to circulate in this fluid conduit systems; An and fan unit, this fan unit comprises an installing rack, one driving shaft vertical with this body, one sets of fan blades, reach an active magnet, this installing rack is to be set on the radiating fin of this metallic heat-radiating element, this driving shaft is to be rotatably installed on this installing rack and is to be driven by a motor sub-assembly, this driving shaft is to aim at the installation shaft of this unit, group Pu and its lower end partly is the roof that extends downwardly near the ccontaining housing of this unit, group Pu, this sets of fan blades be installed on this driving shaft the upper end partly so that be driven when rotating when this driving shaft, this sets of fan blades is to rotate with this driving shaft, this active magnet is to be installed in the lower end of this driving shaft partly rotating with this driving shaft, because the effect of magnetic attraction, the rotation of this active magnet be cause this unit, group Pu by the rotation of moving magnet, cause the rotation of this group's Pu vane group whereby.

According to another feature again of the present invention, the heat abstractor that a kind of computer system is used is to be provided, this computer system comprises semiconductor wafer, this heat abstractor comprises: a metallic heat-radiating element, this metallic heat-radiating element is to be suitable for being arranged on this semiconductor wafer and to comprise a body roughly in a rectangular shape and the upwardly extending separate radiating fin of several upper surfaces from this body, and the lower surface of this body is to contact with the surface of this semiconductor wafer; One fan unit, this fan unit comprises an installing rack, one driving shaft vertical with this body, one sets of fan blades, reach an active magnet, this installing rack is the radiating fin support by this heat dissipation element, this driving shaft is to be rotatably installed on this installing rack so that the upper end of this driving shaft partly is to extend up to a degree, this sets of fan blades be installed on this driving shaft the lower end partly so that be driven when rotating when this driving shaft, this sets of fan blades is to rotate with this driving shaft, and this active magnet is to be installed in the upper end of this driving shaft partly rotating with this driving shaft; One metal mounting base, this metal mounting base has several and extends downwards from surface under it and be arranged at the upwardly extending radiating fin of going up of following radiating fin and several surfaces on it on the installing rack of this fan unit, and the active magnet of this fan unit is the lower surface near this mounting base; Unit, a gang of Pu, this unit, group Pu comprises a ccontaining housing, a gang of Pu vane group, reaches one by moving magnet, this ccontaining housing is to be arranged on the upper surface that is provided with radiating fin of this mounting base, this group's Pu vane group is arranged within this ccontaining housing and is to be rotatably installed on a upper end part from the downward installation shaft of extending of roof of this ccontaining housing, and this is to be arranged at partly close this active magnet in lower end of this installation shaft rotationally by moving magnet and is helping the Pu vane group to rotate with this with this group's Pu vane group connection; One fluid conduit systems, this fluid conduit systems have a fluid outlet that is communicated with the fluid input port of the ccontaining housing of this unit, group Pu, a fluid input port that is communicated with the fluid output port of the ccontaining housing of this unit, group Pu, reach a body that passes this heat dissipation element, this heat dissipation element radiating fin, reach the middle interconnecting piece of the upper and lower radiating fin of this mounting base.

According to a feature more of the present invention, the heat abstractor that a kind of computer system is used is to be provided, this computer system comprises semiconductor wafer, this heat abstractor comprises: a metallic heat-radiating element, this metallic heat-radiating element is to be suitable for being arranged on this semiconductor wafer and to comprise a body roughly in a rectangular shape and the upwardly extending separate radiating fin of several upper surfaces from this body, and the lower surface of this body is to contact with the surface of this semiconductor wafer; One fan unit, this fan unit comprises an installing rack, a driving shaft vertical with this body, an and sets of fan blades, this installing rack is to be set on the radiating fin of this metallic heat-radiating element, this driving shaft is to be rotatably installed on this installing rack and is to be driven by a motor sub-assembly, this driving shaft is for a hollow sleeve and its have an open lower of extending downwards partly, and this sets of fan blades is that the upper end with this driving shaft partly forms; Unit, a gang of Pu, this unit, group Pu comprises a ccontaining housing and a gang of Pu vane group, this ccontaining housing be arranged at this heat dissipation element body upper surface and have a fluid input port and a fluid output port, the inside of this ccontaining housing is to be filled with cooling fluid, this group's Pu vane group is arranged within this ccontaining housing and is to be rotatably installed on a lower end part from the downward installation shaft of extending of roof of this ccontaining housing, this is the roof that is rotatably installed on partly approaching this ccontaining housing in upper end of this installation shaft by moving magnet, and is to connect helping the Pu vane group to rotate with this with this group's Pu vane group; One fluid conduit systems, this fluid conduit systems is to be filled with the cooling fluid identical with the cooling fluid of filling in the ccontaining housing of this unit, group Pu and to have a fluid outlet that is communicated with the fluid input port of this ccontaining housing, an one fluid input port that is communicated with the fluid output port of this ccontaining housing and a form with cranky that is communicated with this fluid outlet and this fluid input port are passed the middle interconnecting piece of this body and these radiating fins, when group's Pu vane group of this group unit, Pu is rotated, cooling fluid is to circulate in this fluid conduit systems, and the middle interconnecting piece of this fluid conduit systems is corresponding to this ccontaining housing storehouse of catchmenting; And the heat pipe of a hollow, this heat pipe is to be installed on this body and to have one to extend up to the open lower part that the interior open upper end part and of this driving shaft extends downwardly into this storehouse of catchmenting.

According to a feature more again of the present invention, the heat abstractor that a kind of computer system is used is to be provided, this computer system comprises semiconductor wafer, this heat abstractor comprises: a metallic heat-radiating element, this metallic heat-radiating element is to be suitable for being arranged on this semiconductor wafer and to comprise a body roughly in a rectangular shape and the upwardly extending separate radiating fin of several upper surfaces from this body, the lower surface of this body is to contact with the surface of this semiconductor wafer, on the upper surface of this body is to be formed with unit, a gang of Pu alcove is installed; One fan unit, this fan unit comprises an installing rack, a driving shaft vertical with this body, an and sets of fan blades, this installing rack is to be set on the radiating fin of this metallic heat-radiating element, this driving shaft is to be rotatably installed on this installing rack and is to be driven by a motor sub-assembly, the lower end of this driving shaft partly is to extend downwardly into this unit, group Pu to install in the alcove, this sets of fan blades be installed on this driving shaft the upper end partly so that be driven when rotating when this driving shaft, this sets of fan blades is to rotate with this driving shaft; Unit, a gang of Pu, this unit, group Pu comprises a ccontaining housing and a gang of Pu vane group, this ccontaining housing is that alcove is installed so that the driving shaft of this fan unit is to extend in this ccontaining housing in the unit, group Pu that is arranged at the body of this heat dissipation element, this ccontaining housing has a fluid input port and a fluid output port, the inside of this ccontaining housing is to be filled with cooling fluid, and this group's Pu vane group is arranged within this ccontaining housing and is the lower end part that is installed on the driving shaft of this fan unit; An and fluid conduit systems, this fluid conduit systems is to be filled with the cooling fluid identical with the cooling fluid of filling in the ccontaining housing of this unit, group Pu and to have the middle interconnecting piece that fluid outlet, a fluid input port that is communicated with the fluid output port of this ccontaining housing and the form with cranky that is communicated with this fluid outlet and this fluid input port that is communicated with the fluid input port of this ccontaining housing passed this body and these radiating fins, when group's Pu vane group of this group unit, Pu was rotated, cooling fluid was to circulate in this fluid conduit systems.

According to a feature more again of the present invention, the heat abstractor that a kind of computer system is used is to be provided, this computer system comprises semiconductor wafer, this heat abstractor comprises: a metallic heat-radiating element, this metallic heat-radiating element is to be suitable for being arranged on this semiconductor wafer and to comprise a body roughly in a rectangular shape and the upwardly extending separate radiating fin of several upper surfaces from this body, and the lower surface of this body is to contact with the surface of this semiconductor wafer; One fan unit, this fan unit comprises an installing rack, a driving shaft vertical with this body, an and sets of fan blades, this installing rack is to be set on the radiating fin of this metallic heat-radiating element, this driving shaft is to be rotatably installed on this installing rack and is to be driven by a motor sub-assembly, the lower end of this driving shaft partly is the upper surface that extends downwards near this body, this sets of fan blades be installed on this driving shaft the upper end partly so that be driven when rotating when this driving shaft, this sets of fan blades is to rotate with this driving shaft; Unit, a gang of Pu, this unit, group Pu comprises a ccontaining housing and a gang of Pu vane group, this ccontaining housing is to be arranged on the upper surface of body of this heat dissipation element so that the lower end of the driving shaft of this fan unit partly is to extend in this ccontaining housing, this ccontaining housing has a fluid input port and a fluid output port, the inside of this ccontaining housing is to be filled with cooling fluid, and this group's Pu vane group is arranged within this ccontaining housing and is to be installed on the lower end of this driving shaft partly helping the Pu vane group to rotate with this; An and fluid conduit systems, this fluid conduit systems is to be filled with the cooling fluid identical with the cooling fluid of filling in the ccontaining housing of this unit, group Pu and to have the middle interconnecting piece that fluid outlet, a fluid input port that is communicated with the fluid output port of this ccontaining housing and the form with cranky that is communicated with this fluid outlet and this fluid input port that is communicated with the fluid input port of this ccontaining housing passed this body and these radiating fins, when group's Pu vane group of this group unit, Pu was rotated, cooling fluid was to circulate in this fluid conduit systems.

According to another characteristic of the invention, the heat abstractor that a kind of computer system is used is to be provided, this computer system comprises semiconductor wafer, this heat abstractor comprises: a metallic heat-radiating element, this metallic heat-radiating element is to be suitable for being arranged on this semiconductor wafer and to comprise a body roughly in a rectangular shape and the upwardly extending separate radiating fin of several upper surfaces from this body, and the lower surface of this body is to contact with the surface of this semiconductor wafer; One fan unit, this fan unit comprises an installing rack, a driving shaft vertical with this body, an and sets of fan blades, this installing rack is the radiating fin support by this heat dissipation element, this driving shaft is to be rotatably installed on this installing rack so that the upper end of this driving shaft partly is to extend up to a degree, this sets of fan blades be installed on this driving shaft the lower end partly so that be driven when rotating when this driving shaft, this sets of fan blades is to rotate with this driving shaft; One metal mounting base, this metal mounting base has several and extends downwards from surface under it and be arranged at following radiating fin and the upwardly extending radiating fin of going up of several upper surfaces from it on the installing rack of this fan unit, and the active magnet of this fan unit is the lower surface near this mounting base; Unit, a gang of Pu, this unit, group Pu comprises a ccontaining housing and a gang of Pu vane group, this ccontaining housing is to be arranged on the upper surface that is provided with radiating fin of this mounting base, the upper end of the driving shaft of this fan unit partly is to extend in this ccontaining housing, and this group's Pu vane group is arranged within this ccontaining housing and is to be installed on the upper end of driving shaft of this fan unit partly rotating with this sets of fan blades; And a fluid conduit systems, this fluid conduit systems has a fluid outlet that is communicated with the fluid input port of the ccontaining housing of this unit, group Pu, a fluid input port that is communicated with the fluid output port of the ccontaining housing of this unit, group Pu, reach a body that passes this heat dissipation element, this heat dissipation element radiating fin, reach the middle interconnecting piece of the upper and lower radiating fin of this mounting base.

According to another feature of the present invention, the heat abstractor that a kind of computer system is used is to be provided, this computer system comprises semiconductor wafer, this heat abstractor comprises: one first metallic heat-radiating element, this first metallic heat-radiating element is to be suitable for being arranged on this semiconductor wafer and to comprise a body roughly in a rectangular shape and the upwardly extending separate radiating fin of several upper surfaces from this body, the lower surface of this body is to contact with the surface of this semiconductor wafer, on the upper surface of this body is to be formed with unit, a gang of Pu alcove is installed; Unit, a gang of Pu, this unit, group Pu comprises a ccontaining housing, a gang of Pu vane group, reach one by moving magnet, this ccontaining housing is that the unit, group Pu that is arranged at the body of this heat dissipation element is installed alcove and had a fluid input port and a fluid output port, the inside of this ccontaining housing is to be filled with cooling fluid, this group's Pu vane group is arranged within this ccontaining housing and is to be rotatably installed on a lower end part from the downward installation shaft of extending of roof of this ccontaining housing, this is the roof that is rotatably installed on partly approaching this ccontaining housing in upper end of this installation shaft by moving magnet, and is to connect helping the Pu vane group to rotate with this with this group's Pu vane group; One second metallic heat-radiating element, this second metallic heat-radiating element has the body on the radiating fin that is arranged at this first metallic heat-radiating element, from the upwardly extending radiating fin of this body, run through this body and the driven spindle of aiming at the installation shaft of this unit, group Pu, and two upper ends that are installed on this driven spindle respectively partly and lower end relaying magnet partly, the lower end of this driven spindle relaying magnet partly be near this unit, group Pu by moving magnet; One fan unit, this fan unit has an installing rack, one driving shaft, one sets of fan blades, reach an active magnet, this installing rack is to be arranged on the radiating fin of this second heat dissipation element, this driving shaft is to aim at this driven spindle and is to be rotatably installed on this installing rack, the lower end of this driving shaft partly is to extend downwardly near the relaying magnet partly of the upper end of the driven spindle of this second heat dissipation element, this sets of fan blades be installed in this driving shaft the upper end partly so that be driven when rotating when this driving shaft, this sets of fan blades is to rotate with this driving shaft, this active magnet is to be installed in the lower end of this driving shaft partly rotating with this driving shaft, the rotation of this active magnet makes the upper end relaying magnet partly of driven spindle of this second heat dissipation element rotate and then cause this driven spindle and rotates at the lower end of this driven spindle relaying magnet partly, and what make this unit, group Pu whereby is rotated group's Pu vane group with this unit, group Pu of start by moving magnet.

According to a feature more of the present invention, the heat abstractor that a kind of computer system is used is to be provided, this computer system comprises semiconductor wafer, this heat abstractor comprises: one first metallic heat-radiating element, this first metallic heat-radiating element is to be suitable for being arranged on this semiconductor wafer and to comprise a body roughly in a rectangular shape and the upwardly extending separate radiating fin of several upper surfaces from this body, the lower surface of this body is to contact with the surface of this semiconductor wafer, on the upper surface of this body is to be formed with unit, a gang of Pu alcove is installed; Unit, a gang of Pu, this unit, group Pu comprises a ccontaining housing, a gang of Pu vane group, reach one by moving magnet, this ccontaining housing is that the unit, group Pu that is arranged at the body of this heat dissipation element is installed alcove and had a fluid input port and a fluid output port, the inside of this ccontaining housing is to be filled with cooling fluid, this group's Pu vane group is arranged within this ccontaining housing and is to be rotatably installed on a lower end part from the downward installation shaft of extending of roof of this ccontaining housing, this is the roof that is rotatably installed on partly approaching this ccontaining housing in upper end of this installation shaft by moving magnet, and is to connect helping the Pu vane group to rotate with this with this group's Pu vane group; One fan unit, this fan unit comprises an installing rack, one driving shaft vertical with this body, one sets of fan blades, reach an active magnet, this installing rack is to be set on the radiating fin of this metallic heat-radiating element, this driving shaft is to be rotatably installed on this installing rack and is to be driven by a motor sub-assembly, this driving shaft be aim at the installation shaft of this unit, group Pu and also under it end part be the roof that extends downwardly near the ccontaining housing of this unit, group Pu, this sets of fan blades be installed on this driving shaft the upper end partly so that be driven when rotating when this driving shaft, this sets of fan blades is to rotate with this driving shaft, this active magnet is to be installed in the lower end of this driving shaft partly rotating with this driving shaft, because the effect of magnetic attraction, the rotation of this active magnet be cause this unit, group Pu by the rotation of moving magnet, cause the rotation of this group's Pu vane group whereby; One second metallic heat-radiating element, this second metallic heat-radiating element have lip-deep body and several the surperficial upwardly extending radiating fins from this body that is arranged at this semiconductor wafer; And a fluid conduit systems, this fluid conduit systems has one to be imported fluid outlet that the port is communicated with, a fluid input port that is communicated with the fluid output port of the ccontaining housing of this unit, group Pu with the fluid of the ccontaining housing of this unit, group Pu, reaches a middle interconnecting piece that passes the body of the body of this first heat dissipation element and this second heat dissipation element.

According to another feature more of the present invention, the heat abstractor that a kind of computer system is used is to be provided, this computer system comprises semiconductor wafer, this heat abstractor comprises: a metallic heat-radiating element, this metallic heat-radiating element is arranged on the semiconductor wafer of this computer system and comprises a roughly body of circular shape, several radiating fins, an and ring-type collector pipe, this body has a lower surface that contacts with the surface of this semiconductor wafer, this body is to be formed with a water leg that extends along its periphery in inside, the ccontaining alcove in unit, a gang of Pu is to be formed on the upper surface of this body, these several radiating fins are that the upper surface from this body extends upward and is radially to separate along the periphery of this body each other, each radiating fin be formed with at least one run through on it and the lower end partly and the passage that is communicated with this water leg, this ring-type collector pipe is to be arranged at the upper end part of these radiating fins and is channel connection with these radiating fins; One fan unit, this fan unit comprises an installing rack, one driving shaft vertical with this body, one sets of fan blades, reach an active magnet, this installing rack is to be connected can be fixed on one and the much the same level of this collector pipe by these radiating fins encirclements and with these radiating fins, this driving shaft is to be rotatably installed on this installing rack in the mode identical with aforesaid embodiment, the lower end of this driving shaft partly is to extend downwards near this body, this sets of fan blades be installed on this driving shaft the upper end partly so that be driven when rotating when this driving shaft, this sets of fan blades is to rotate with this driving shaft, and this active magnet is to be installed in the lower end of this driving shaft partly rotating with this driving shaft; Unit, a gang of Pu, this unit, group Pu comprises a ccontaining housing, a gang of Pu vane group, reach one by moving magnet, this ccontaining housing is to be arranged in the ccontaining alcove in unit, group Pu of this body so that the roof of this ccontaining housing is near this active magnet, this ccontaining housing has a fluid input port and a fluid output port, this group's Pu vane group is to be rotatably installed on a lower end part from the downward installation shaft of extending of roof of this ccontaining housing, this is the roof that is arranged at partly approaching this ccontaining housing in upper end of this installation shaft rotationally by moving magnet, and is to connect helping the Pu vane group to rotate with this with this group's Pu vane group; One output duct, this output duct have one and are arranged at this body interior and output that the input and that is communicated with the fluid output port of this ccontaining housing extends upward and is communicated with this collector pipe; One input pipe, this input pipe are to be arranged at this body interior and to have an output and an input that is communicated with this water leg that is communicated with the fluid input port of this ccontaining housing.

In sum, the heat abstractor that computer system of the present invention is used comprises that mainly one is installed on the heat dissipation element with a body and several radiating fins on the semiconductor wafer of this computer system, one is installed on the body of this heat dissipation element and is filled with the unit, group Pu of cooling fluid, one is installed on the fan unit on the radiating fin of this heat dissipation element, and one be communicated with and be filled with the fluid conduit systems of cooling fluid with this unit, group Pu, this fluid conduit systems is to pass this body and these radiating fins, the running of this fan unit causes the running of this unit, group Pu so that the cooling fluid in this fluid conduit systems is mobile rapidly, thereby effectively reduces the operational temperature of computer components in the computer system.

[description of drawings]

Fig. 1 is for showing the schematic isometric of a known heat abstractor;

Fig. 2 to Fig. 4 is the schematic plan view of the heat abstractor used for the computer system that shows the present invention's first preferred embodiment;

Fig. 5 to Fig. 6 is the schematic plan view of the heat abstractor used for the computer system that shows the present invention's second preferred embodiment;

Fig. 7 to Fig. 9 is the schematic plan view of the heat abstractor used for the computer system that shows the present invention's the 3rd preferred embodiment;

Figure 10 to Figure 12 is the schematic plan view of the heat abstractor used for the computer system that shows the present invention's the 4th preferred embodiment;

Figure 13 is the schematic plan view of the heat abstractor used for the computer system that shows the present invention's the 5th preferred embodiment;

Figure 14 is the schematic plan view of the heat abstractor used for the computer system that shows the present invention's the 6th preferred embodiment;

Figure 15 is the schematic plan view of the heat abstractor used for the computer system that shows the present invention's the 7th preferred embodiment;

Figure 16 is the schematic plan view of the heat abstractor used for the computer system that shows the present invention's the 8th preferred embodiment;

Figure 17 is the schematic plan view of the heat abstractor used for the computer system that shows the present invention's the 9th preferred embodiment;

Figure 18 is the schematic plan view of the heat abstractor used for the computer system that shows the present invention's the tenth preferred embodiment;

Figure 19 is for being presented at the block schematic diagram of employed safety device in the preferred embodiment of the present invention;

Figure 20 to Figure 21 is the schematic plan view of the heat abstractor used for the computer system that shows the present invention's the 11 preferred embodiment;

Figure 22 is the schematic plan view of the heat abstractor used for the computer system that shows the present invention's the 12 preferred embodiment;

Figure 23 is the schematic plan view of the heat abstractor used for the computer system that shows the present invention's the 13 preferred embodiment;

Figure 24 to Figure 26 is for being presented at the schematic plan view of employed auxiliary heat dissipation element in the preferred embodiment of the present invention;

Figure 27 to Figure 28 is for being presented at the schematic plan view of another aspect of employed auxiliary heat dissipation element in the preferred embodiment of the present invention;

Figure 29 to Figure 33 is the schematic plan view of the heat abstractor used for the computer system that shows the present invention's the 14 preferred embodiment;

Figure 34 is for being presented at employed block schematic diagram in order to the circuit arrangement of eliminating noise in the preferred embodiment of the present invention; And

Figure 35 is the schematic plan view for the relation between display driver axle and the ccontaining housing.

Figure 36 is for showing that preferred embodiment of the present invention is used in the schematic plan view of computer components;

[embodiment]

Preferred embodiment of the present invention be described in detail before, should be noted that similar element is to be indicated by identical label in whole specification.On the other hand, in order to clearly reveal structure of the present invention, the element in graphic is not to describe in the actual size ratio.

Fig. 2 to Fig. 4 is the schematic plan view of the heat abstractor used for the computer system that shows the present invention's first preferred embodiment, wherein, Fig. 2 is the diagrammatic side view of the heat abstractor used for the computer system that shows first preferred embodiment, Fig. 3 is the top schematic view that fan unit is removed, and Fig. 4 is the top schematic view of removing for fan unit and radiating fin.

See also Fig. 2 to shown in Figure 4, the heat abstractor that the computer system of the present invention's first preferred embodiment is used comprises a metallic heat-radiating element 1, unit, a gang of Pu 2, a fluid conduit systems 4 substantially, reaches a fan unit 3.

This metallic heat-radiating element 1 is to be suitable for being arranged on the semiconductor wafer 9 of this computer system and to comprise a body roughly in a rectangular shape 10 and several upper surface 102 upwardly extending separate radiating fins 11 from this body 10.The lower surface 101 of this body 10 is to contact with the surface of this semiconductor wafer 9.

Should be noted that, in all embodiment of the present invention, this semiconductor wafer 9 is with the central processing unit of computer system as an example, and the heat abstractor that computer system of the present invention is used not only can use on the central processing unit of computer system, also can be used on the high pyrotoxin element of memory body module (memory module), LED lighting apparatus or the like of computer system, thereby effectively reduce the operational temperature of computer components in the computer system.

In the present embodiment, this heat dissipation element 1 is made of aluminum.Yet this heat dissipation element 1 can also be made by any other material that is fit to.In addition, the central part of the upper surface 102 of this body 10 is to be a group installation region, Pu, and therefore, these radiating fins 11 are not formed within this installation region, group Pu, as shown in FIG. 3.

This unit, group Pu 2 comprises a ccontaining housing 20, a gang of Pu vane group 21, reaches one by moving magnet 22.

This ccontaining housing 20 be arranged at this heat dissipation element 1 body 10 upper surface 102 installation region, group Pu and have a fluid input port 200 and a fluid output port 201.The inside of this ccontaining housing 20 is to be filled with cooling fluid.In the present embodiment, this ccontaining housing 20 is to be made for the best by metal material.Yet this ccontaining housing 20 can also be made by any other material that is fit to.

This group's Pu vane group 21 is arranged within this ccontaining housing 20 and is to be rotatably installed on a lower end part from the downward installation shaft 23 of extending of roof of this ccontaining housing 20.In the present embodiment, this group's Pu vane group 21 is to be made for the best by metal material.Yet this group's Pu vane group 21 can also be made by any suitable material as plastic cement.

This is the roofs that are rotatably installed on partly approaching this ccontaining housing 20 in upper end of this installation shaft 23 by moving magnet 22, and is to connect helping Pu vane group 21 to rotate with this with this group's Pu vane group 21.

This fluid conduit systems 4 is to be filled with the cooling fluid identical with the cooling fluid of filling in the ccontaining housing 20 of this unit, group Pu 2 and to have the middle interconnecting piece 42 that fluid outlet 40, a fluid input port 41 that is communicated with the fluid output port 201 of this ccontaining housing 20 and the form with cranky that is communicated with this fluid outlet 40 and this fluid input port 41 that is communicated with the fluid input port 200 of this ccontaining housing 20 passed this body 10 and these radiating fins 11.Therefore, when group's Pu vane group 21 of this group unit, Pu 2 was rotated, cooling fluid was to circulate in this fluid conduit systems 4.

This fan unit 3 comprises an installing rack 30, a driving shaft 31 vertical with this body 10, a sets of fan blades 32, an and magnet 33 initiatively.

This installing rack 30 is to be set on the radiating fin 11 of this metallic heat-radiating element 1 with any suitable conventional approaches.

This driving shaft 31 is to be rotatably installed on this installing rack 30 and to be to be driven by a motor sub-assembly (not shown) knownly in known mode.This driving shaft 31 be aim at the installation shaft 23 of this unit, group Pu 2 and also under it end part be near the roof that extends downwardly near the ccontaining housing 20 of this unit, group Pu 2.

This sets of fan blades 32 be installed on this driving shaft 31 the upper end partly so that be driven when rotating when this driving shaft 31, this sets of fan blades 32 is with these driving shaft 31 rotations.Should be noted that in the present embodiment this sets of fan blades 32 is to rotate with the speed of the thousands of commentaries on classics of per minute.

This active magnet 33 is to be installed in the lower end of this driving shaft 31 partly rotating with this driving shaft 31.Since the effect of magnetic attraction, the rotation of this active magnet 33 be cause this unit, group Pu 2 by the rotation of moving magnet 23, cause the rotation of this group's Pu vane group 21 whereby.

By structure as above, because fluid conduit systems 4 is to contact with radiating fin 11 with the body 10 of this heat dissipation element 1, when the sets of fan blades 32 of this fan unit 3 during with the high speed rotating of the thousands of commentaries on classics of per minute, this active magnet 33 is along with these sets of fan blades 32 high speed rotating circulate to reach the cooling fluid in this fluid conduit systems 4 and the hot-swap feature of this body 10 and radiating fin 11 to reach cooling fluid in fluid conduit systems 4 at high speed can make these group's Pu vane group 21 high speed rotating with this by moving magnet 22, reduces the temperature of this semiconductor wafer 9 whereby.

Because this sets of fan blades 32 is with high speed rotating, this group's Pu vane group 21 be so also with high speed rotating so that the flowing velocity of fluid in fluid conduit systems 4 is very soon can reach high efficiency heat exchange.Moreover, because the middle interconnecting piece 42 of this fluid conduit systems 4 is body 10 and the radiating fins 11 that pass this heat dissipation element 1 in cranky mode, this fluid conduit systems 4 is to increase with the area that the body 10 of heat dissipation element 1 contacts with radiating fin 11, strengthens radiating efficiency whereby.In addition, the cooling fluid of group's Pu vane group 21 high speed stirrings in ccontaining housing 20 also produces the effect of cooling fluid cooling.

On the other hand, the cooling air that blows from lower to upper or blow from top to bottom that produced of sets of fan blades 32 is to cause the effect of cross-ventilation with further lifting cooling.

In addition, the cooling fluid in fluid conduit systems 4 can be for water, be added with cooling fluid water, be added with the water of low ignition point liquid and similar.For example, this cooling fluid can comprise 50% alcohol and 50% water.Be added with the cooling fluid of low ignition point liquid owing to have the characteristic that is easy to gasify, therefore when gasification, can make the further lifting of flow velocity and the heat exchanger effectiveness of cooling fluid higher.On the other hand, owing to be to mix, therefore aspect fail safe, there is not doubt with water.

Moreover, driving shaft 31 by fan unit 3 is to aim to reach by contactless active magnet 32 and by the design of moving magnet 22 with the installation shaft 23 of helping unit, Pu 2, and the inside of the ccontaining housing 20 of this fluid conduit systems 4 and this unit, group Pu 2 is into vacuum state so that the cooling fluid in the ccontaining housing 20 of this fluid conduit systems 4 and this unit, group Pu 2 can not leak.

See also shown in Figure 35ly, this driving shaft 31 more can have most advanced and sophisticated partly 310 the situations can avoid this driving shaft 31 to shake that protrude out to this pit 202 when rotating in more being formed with a pit 202 on its roof at the ccontaining housing 20 described in this first preferred embodiment.

Fig. 5, the 6th, the schematic plan view of the heat abstractor of using for the computer system that shows the present invention's second preferred embodiment, wherein, Fig. 5 is the diagrammatic side view of the heat abstractor used for the computer system of second preferred embodiment, and Fig. 6 is the top schematic view of removing for fan unit and radiating fin.The heat abstractor of this second preferred embodiment has a structure identical with this first preferred embodiment substantially, catchments the storehouse 43 except the central connecting portion 42 that more comprises an auxiliary heat dissipation sheet 5 and this fluid conduit systems 4 has more one.

See also shown in Fig. 5,6, the lower surface 101 of the body 10 of the heat dissipation element 1 of this second preferred embodiment is that the position corresponding to the IC wafer 92 of this semiconductor wafer 9 is formed with a ccontaining alcove 103.

This auxiliary heat dissipation sheet 5 be by, for example, copper becomes and is to be installed in the ccontaining alcove 103 of this body 10 contact with the surface corresponding to the position of this IC wafer 92 of this semiconductor wafer 9, promotes the heat exchanger effectiveness of this heat dissipation element 1 and this semiconductor wafer 9 whereby.Should be noted that this auxiliary heat dissipation sheet 5 can also be made by any other material that is fit to.

This storehouse 43 of catchmenting be arranged at this fluid conduit systems 4 middle interconnecting piece 42 corresponding to the section of this auxiliary heat dissipation sheet 5 and be to be in close proximity to this auxiliary heat dissipation sheet 5 cooling fluids in the storehouse 43 can carry out heat exchange with this auxiliary heat dissipation sheet 5 so that this catchments, further promote the heat exchanger effectiveness of entire heat dissipation device whereby.

Fig. 7 to Fig. 9 is the schematic plan view for the heat abstractor that shows the present invention's the 3rd preferred embodiment, wherein, Fig. 7 is the diagrammatic side view of the heat abstractor used for the computer system that shows the 3rd preferred embodiment, Fig. 8 is the top schematic view that fan unit is removed, and Fig. 9 is the top schematic view of removing for fan unit and radiating fin.The heat abstractor of the 3rd preferred embodiment has a structure identical with this second preferred embodiment substantially, except the middle interconnecting piece 42 of the position at the fluid input port 200 of the ccontaining housing 20 of this unit, group Pu 2 and this fluid conduit systems 4 around shape be different with this second preferred embodiment.

See also Fig. 7 to shown in Figure 9, in this preferred embodiment, the fluid input port 200 of the ccontaining housing 20 of this unit, group Pu 2 that is communicated with the fluid outlet 40 of this fluid conduit systems 4 is arranged on this group Pu vane group 21 belows, strengthens the efficient of drawing water of this group's Pu vane group 21 whereby.

Figure 10 to Figure 12 is the schematic plan view of the heat abstractor used for the computer system that shows the present invention's the 4th preferred embodiment, wherein, Figure 10 is the diagrammatic side view of the heat abstractor used for the computer system that shows the 4th preferred embodiment, Figure 11 is the top schematic view that fan unit is removed, and Figure 12 is the top schematic view of removing for fan unit and radiating fin.The heat abstractor of the 4th preferred embodiment has a structure identical with this second preferred embodiment substantially, except being provided with the saving of position and this storehouse of catchmenting of this unit, group Pu 2.

Seeing also Figure 10 to shown in Figure 12, in the present embodiment, is to be formed with unit, a group Pu installation alcove 104 that is communicated with this ccontaining alcove 103 on the upper surface 102 of the body 10 of this heat dissipation element 1.The ccontaining housing 20 of this unit, group Pu 2 is to be arranged within this installation alcove 104 so that this unit, group Pu 2 to have more function as the storehouse of catchmenting of this second preferred embodiment except the function as the group Pu.

Figure 13 is the schematic plan view of the heat abstractor used for the computer system that shows the present invention's the 5th preferred embodiment.

See also shown in Figure 13ly, the heat abstractor of the 5th embodiment comprises a metallic heat-radiating element 1, unit, a gang of Pu 2, a fluid conduit systems 4, a fan unit 3 and a metal mounting base 12 substantially.

The structure of this metallic heat-radiating element 1 is with identical in second preferred embodiment shown in Fig. 5, thus its to be described in more detail in this be to be omitted.

This installing rack 30 is to be supported by the radiating fin 11 of this heat dissipation element 1.

This driving shaft 31 is to be rotatably installed on this installing rack 30 so that the upper end of this driving shaft 31 partly is to extend up to a degree.

This sets of fan blades 32 be installed on this driving shaft 31 the lower end partly so that be driven when rotating when this driving shaft 31, this sets of fan blades 32 is with these driving shaft 31 rotations.

This active magnet 33 is to be installed in the upper end of this driving shaft 31 partly rotating with this driving shaft 31.

This metal mounting base 12 has several and extends downwards from surface under it and be arranged at the upwardly extending radiating fin 121 of going up of following radiating fin 120 and several surfaces on it on the installing rack 30 of this fan unit 3.The active magnet 33 of this fan unit 3 is the lower surfaces near this mounting base 12.

This ccontaining housing 20 is to be arranged on the upper surface that is provided with radiating fin 121 of this mounting base 12.

This group's Pu vane group 21 is arranged within this ccontaining housing 20 and is to be rotatably installed on a upper end part from the downward installation shaft 23 of extending of roof of this ccontaining housing 20.

This is to be arranged at partly close this active magnet 33 in lower end of this installation shaft 23 rotationally by moving magnet 22 and is to connect helping Pu vane group 21 to rotate with this with this group's Pu vane group 21.Therefore, when this active magnet 33 rotated, this was along with this active magnet 33 rotates so that this group's Pu vane group 21 is rotated by moving magnet 23.

This fluid conduit systems 4 has a fluid outlet that is communicated with the fluid input port 200 of the ccontaining housing 20 of this unit, group Pu 2 40, a fluid that is communicated with the fluid output port 201 of the ccontaining housing 20 of this unit, group Pu 2 and imports 41, reaches one and pass the body 10 of this heat dissipation element 1, the radiating fin 11 of this heat dissipation element 1, the upper and lower radiating fin 120 that reaches this mounting

base

12 and 121 middle interconnecting piece 42.

Because the running of this preferred embodiment is identical with above-described preferred embodiment with resulting effect, repeats no more for this reason in this.

Figure 14 is the schematic plan view of the heat abstractor used for the computer system that shows the present invention's the 6th preferred embodiment.

See also shown in Figure 14, different with above-described second preferred embodiment, the driving shaft 31 ' of the fan unit 3 of this preferred embodiment is to have an open lower in the ccontaining housing 20 that extends downwardly into this unit, group Pu 2 partly for a hollow sleeve and its.The sets of fan blades 32 of this fan unit 3 is that the upper end with this driving shaft 31 ' partly forms and group's Pu vane group 21 of this unit, group Pu 2 is lower ends with this driving shaft 31 ' partly forms.

The heat abstractor of present embodiment more comprises the heat pipe 6 of a hollow.This heat pipe 6 is to be installed on this body 10 and to have one to extend up to the open lower part 61 that this driving shaft 31 ' interior open upper end part 60 and extends downwardly into this storehouse 43 of catchmenting.

By structure so, the some of the cooling fluid in this catchments storehouse 43 is can come partly 61 upwards to be transferred to this upper end part 60 from the lower end of this heat pipe 6 by capillary theory owing to have temperature.The cooling fluid that is transferred to this upper end part 60 is to enter in this driving shaft 31 '.Because this driving shaft 31 ' is with high speed rotating, the cooling fluid in this driving shaft 31 ' is and the air high speed convection, reaches cooling effect.Cooling fluid through supercooling is to get back in the ccontaining housing 20 of this unit, group Pu 2 along this driving shaft 31 '.

Figure 15 is the schematic plan view of the heat abstractor used for the computer system that shows the present invention's the 7th preferred embodiment.

See also shown in Figure 15, with different in second preferred embodiment shown in Fig. 5, the lower end of the driving shaft 31 of this fan unit 3 partly is to extend in the ccontaining housing 20 of this unit, group Pu 2 and this group Pu vane group 21 is lower end parts of being installed on this driving shaft 31 with can be with these driving shaft 31 rotations.

Figure 16 is the schematic plan view of the heat abstractor used for the computer system that shows the present invention's the 8th preferred embodiment.

See also shown in Figure 16, with different in the 4th preferred embodiment shown in Figure 10, the lower end of the driving shaft 31 of this fan unit 3 partly is to extend in the ccontaining housing 20 of this unit, group Pu 2 and this group Pu vane group 21 is lower end parts of being installed on this driving shaft 31 with can be with these driving shaft 31 rotations.

Figure 17 is the schematic plan view of the heat abstractor used for the computer system that shows the present invention's the 9th preferred embodiment.

See also shown in Figure 17, with different in the 5th preferred embodiment shown in Figure 13, the upper end of the driving shaft 31 of this fan unit 3 partly is to extend in the ccontaining housing 20 of this unit, group Pu 2 and this group Pu vane group 21 is lower end parts of being installed on this driving shaft 31 ' with can be with this driving shaft 31 ' rotation.

Figure 18 is the schematic plan view of the heat abstractor used for the computer system that shows the present invention's the tenth preferred embodiment.

See also shown in Figure 180ly, the heat abstractor of the tenth embodiment comprises one first metallic heat-radiating element 1, unit, a gang of Pu 2, a fluid conduit systems 4, a fan unit 3, and one second metallic heat-radiating element 7 substantially.

This first metallic heat-radiating element 1 is identical with the 4th preferred embodiment shown in Figure 10 with the structure of this unit, group Pu 2, thus its to be described in more detail in this be to be omitted.

This second metallic heat-radiating element 7 has the body 70 on the radiating fin 11 that is arranged at this first metallic heat-radiating element 1.This second metallic heat-radiating element 7 have from this body 70 upwardly extending radiating fins 71, run through this body 70 and the driven spindle of aiming at the installation shaft 23 of this unit, group Pu 2 72, and two upper ends that are installed on this driven spindle 72 respectively partly and lower end relaying magnet 73 partly.In the lower end of this driven spindle 72 partly relaying magnet 73 be near this unit, group Pu 2 by moving magnet 22.

The installing rack 30 of this fan unit 3 is to be arranged on the radiating fin 71 of this second heat dissipation element 7.

This driving shaft 31 is to aim at this driven spindle 72 and is to be rotatably installed on this installing rack 30.The lower end of this driving shaft 31 partly is to extend downwardly near the relaying magnet 73 partly of the upper end of the driven spindle 72 of this second heat dissipation element 7.

This sets of fan blades 32 be installed in this driving shaft 31 the upper end partly so that be driven when rotating when this driving shaft 31, this sets of fan blades 32 is with these driving shaft 31 rotations.

This active magnet 33 is to be installed in the lower end of this driving shaft 31 partly rotating with this driving shaft 31.The rotation of this active magnet 33 makes the upper end relaying magnet 73 partly of driven spindle 72 of this second heat dissipation element 7 rotate and then cause this driven spindle 72 and rotates at the lower end of this driven spindle 72 relaying magnet 73 partly, make whereby this unit, group Pu 2 by the group Pu vane group 21 of moving magnet 23 rotations with this unit, group Pu 2 of start.

Figure 19 is for being presented at the illustrative circuitry calcspar of employed safety device in the heat abstractor of the present invention.

See also shown in Figure 19ly, this safety device comprises that substantially one in series is connected control circuit 39, and the detector 38 of rotating speed that is used to detect this fan motor 34 that electrically is connected to this control circuit 39 that the fan motor 34 of this fan unit 3 and road device 37, that the PTR variable resistance between the fan power supply 36 35, electrically is connected to this fan power supply electrically are connected to this circuit breaker 37.

This variable resistance 35 be for a kind of its resistance value be the variable resistance that is inversely proportional to and changes with temperature.This variable resistance 35 is that to be located on the body 10 of this heat dissipation element 1 therefore its resistance value be that temperature with the body 10 of this heat dissipation element 1 is inversely proportional to.That is, when the temperature of the body 10 of this heat dissipation element 1 rose, the resistance value of variable resistance 35 reduced so that this fan motor 34 drives this sets of fan blades 32 with high rotational speed.Otherwise when the temperature of the body 10 of this heat dissipation element 1 descended, the resistance value of variable resistance 35 rose so that this fan motor 34 drives this sets of fan blades 32 with lower rotating speed.

This circuit breaker 37 is can operate to cut off this fan power supply 36.

This detector 38 is the rotating speeds that are used to detect this fan motor 34, and produces the detection signal of the rotating speed of this motor 34 of expression.This control circuit 39 receives this detection signal and the reference signal of the rated speed of this detection signal and this motor of expression is made comparisons.When this detection signal is bigger than this reference signal, the normal rotating speed height of rotating ratio of representing this motor 34, representative has drainage, so this control circuit 39 outputs one start signal interrupts this fan power supply 36 to guarantee safety to this circuit breaker 37 with this circuit breaker 37 of start.

Figure 20, the 21st, the schematic plan view of the heat abstractor of using for the computer system that shows the present invention's the 11 preferred embodiment.

See also shown in Figure 20,21, the heat abstractor of the 11 preferred embodiment comprises one first metallic heat-radiating element 1, unit, a gang of Pu 2, a fan unit 3, a fluid conduit systems 4 substantially, reaches one second metallic heat-radiating element 7.

This second metallic heat-radiating element 7 has a lip-deep body 70 that is arranged at this semiconductor wafer 9.This body 10 have several upwardly extending radiating fins 71 and also under it surface 701 be to be formed with a ccontaining alcove 703 in position corresponding to the IC wafer 92 of this semiconductor wafer 9.

One auxiliary heat dissipation sheet 5 be by, for example, copper becomes and is to be installed in the ccontaining alcove 703 of this body 70 contact with the surface corresponding to the position of this IC wafer 92 of this semiconductor wafer 9, promotes the heat exchanger effectiveness of this heat dissipation element 7 and this semiconductor wafer 9 whereby.

One catchment storehouse 43 be arranged at this fluid conduit systems 4 middle interconnecting piece 42 the cooling fluids in the storehouse 43 can carry out heat exchange with this auxiliary heat dissipation sheet 5 so that this catchments corresponding to the section of this auxiliary heat dissipation sheet 5, further reduce the temperature of this semiconductor wafer 9 whereby.

This first metallic heat-radiating element 1 has body 10 and several the upwardly extending radiating fins 11 that is arranged at these semiconductor wafer 9 one sides.This body 10 is to be formed with a unit, group Pu that is used for the ccontaining housing 20 of ccontaining this unit, group Pu 2 alcove 104 is installed on surface 102 on it.Because other structures of this unit, group Pu 2 are with identical in the 4th preferred embodiment shown in Figure 10, repeat no more for this reason in this.

The structure of this fan unit 3 is with identical in the 4th preferred embodiment shown in Figure 10 and be to be installed on the radiating fin 11 of this heat dissipation element 1 in the mode identical with the 4th preferred embodiment, therefore, and its be described in more detail in this and repeat no more for this reason.

Because the whole height of present embodiment and the whole height of aforesaid embodiment are for lower by comparison, so present embodiment is to be suitable for being applied to notebook computer.

Figure 22 is the schematic plan view for the heat abstractor of the computer system that shows the present invention's the 12 preferred embodiment.

See also shown in Figure 22ly, with different in the 4th preferred embodiment shown in Figure 10, this preferred embodiment more comprises a heat radiation conduit group 8.

This heat radiation conduit group 8 has radiating fin 80 and several heat radiation conduits (heat pipe) 81 on several installing racks that are arranged at this fan unit 3 30.

Each heat radiation conduit 81 has one and extends to the middle interconnecting piece 42 of this fluid conduit systems 4 and the first end and that contacts with this middle interconnecting piece 42 passes the second end of these radiating fins 80.Therefore, these heat radiation conduits 81 can carry out heat exchange with the cooling fluid in this fluid conduit systems 4 can further reduce the temperature of the cooling fluid in this fluid conduit systems 4.

Figure 23 is the schematic plan view for the heat abstractor of the computer system that shows the present invention's the 13 preferred embodiment.

See also shown in Figure 23, with different in the 12 preferred embodiment shown in Figure 22, the heat radiation conduit 81 of the heat radiation conduit group 8 of this preferred embodiment is the second end that the first end and that respectively has a radiating fin 11 that passes this heat dissipation element 1 passes these radiating fins 80.Therefore, these heat radiation conduits 81 can carry out heat exchange can further quicken radiating effect with the radiating fin 11 of this heat dissipation element 1.

Figure 24 to Figure 26 is the schematic plan view for employed auxiliary heat dissipation element in the heat abstractor that is presented at computer system of the present invention.

See also Figure 24 to shown in Figure 26, this metallic heat-radiating element 1 has a body 10, several vertical parallel and is arranged at radiating fin 11 on the upper surface of this body 10, and several each auxiliary heat dissipation elements 13 near the surface of the radiating fin 11 of correspondence separatedly.

These auxiliary heat dissipation elements 13 can be called as so-called heat pipe (heat pipe) and respectively have a bottom 130, an intermediate layer 131, first and

second copper foil

132 and 133, an and top layer 134.

This bottom 130 is to have flexible film for one by what PI and BS formed, and this bottom 130 has one near the first surface 1300 on the surface of the radiating fin 11 of a correspondence and one and these first surface 1300 opposing second surface 1301.This first copper foil 132 be with, for example, mode of printing is set on this second surface 1301 and its two ends 1320 are to convexedly stretch in outside this bottom 130 partly.Should be noted that this first copper foil 132 also can replace with any other tinsel that is fit to.

This intermediate layer 131 is to be formed on this first copper foil 132.In the present embodiment, this intermediate layer 131 is to be formed by photoresist.This intermediate layer 131 be formed with several from its one of end part extend to the other end partly and run through the perforate 1310 on its two surfaces.This intermediate layer 131 is to form several pores 1311 via sintering processes on the hole wall that forms each perforate 1310.

This second copper foil 133 is to be arranged on this intermediate layer 131 in the mode identical with first copper foil 132.Identical with this first copper foil 132, two terminal parts 1330 of this second copper foil 133 are to protrude out outside this intermediate layer 131.

This top layer 134 is to form with these bottom 130 identical materials and to be to be arranged on this second copper foil 133.

First and second copper foils 132 of each auxiliary heat dissipation element 13 with 133 terminal 1320 and 1330 be to contact with this body 10 with corresponding radiating fin 11 respectively partly.

By structure as above, first and second copper foils 132 and 133 can carry out heat exchange with body 10 and radiating fin 11, promote heat radiation function whereby.Should be noted that, be to add the low ignition point fluid in the perforate 1310 in this intermediate layer 131 so that when first and second copper foils 132 and 133 and body 10 and radiating fin 11 when carrying out heat exchange, the low ignition point fluid can gasify rapidly because of carrying out heat exchange with this first and second copper foil 132 and 133.Low ignition point fluid through gasification is to transform back into liquid state via these pores 1311 by capillary condensation principle (capillary condensation).

Figure 27, the 28th is the schematic plan view of another feasible configurations of being presented at the auxiliary heat dissipation element 13 among Figure 24 to Figure 26.

See also shown in Figure 27,28, different with Figure 24 to Figure 26, the bottom 130 of each auxiliary heat dissipation element 13 be formed into frame shape and also under it surface 1300 be to have stickiness so that this auxiliary heat dissipation element 13 is to be attached on the corresponding radiating fin 11 under its surperficial state of contact of first copper foil 132 and radiating fin 11.

Figure 36 is for showing that preferred embodiment of the present invention is used in the schematic plan view of computer components; See also shown in Figure 36, what Figure 36 was different with Figure 26 is, be arranged in Figure 26 below the body 10 is CPU, yet in Figure 36, being arranged on below the body 10 is a memory body module 9 ', and this memory body module 9 ' comprises that a circuit board 92 and several are installed on the memory chip 93 on this circuit board 92 operationally.

Figure 29 to Figure 33 is the schematic diagram of the heat abstractor used for the computer system that shows fourteenth embodiment of the invention.

See also Figure 29 to shown in Figure 33, the heat abstractor that the computer system of present embodiment is used comprises a metallic heat-radiating element 1 ', a fan unit 3, unit, a gang of Pu 2, one L shaped output duct 106, an input pipe 107 substantially, reaches several auxiliary heat dissipation elements 13.

This metallic heat-radiating element 1 ' is arranged on the semiconductor wafer 9 of this computer system and comprises roughly body 10 ', several radiating fins 11 ', and the ring-type collector pipe 14 of circular shape.

This body 10 ' have a lower surface 101 ' that contacts with the surface of this semiconductor wafer 9 and, as shown in Figure 33, this body 10 ' is to be formed with a water leg 105 that extends along its periphery in inside.The ccontaining alcove 104 in unit, a gang of Pu is to be formed on the upper surface 102 ' of this body 10 '.

These several radiating fins 11 are that upper surface 102 ' from this body 10 ' extends upward and is radially to separate along the periphery of this body 10 ' each other.Each radiating fin 11 ' be formed with at least one run through on it and the lower end partly and the passage 110 that is communicated with this water leg 105.

This ring-type collector pipe 14 is to be arranged at the upper end part of these radiating fins 11 ' and is to be communicated with the passage 110 of these radiating fins 11 '.

This installing rack 30 is to be connected can be fixed on one and these collector pipe 14 much the same levels by these radiating fins 11 ' encirclements and with these radiating fins 11 '.

This driving shaft 31 is to be rotatably installed on this installing rack 30 in the mode identical with aforesaid embodiment.The lower end of this driving shaft 31 partly is to extend near this body 10 ' downwards.

This sets of fan blades 32 be installed on this driving shaft 31 the upper end partly so that be driven when rotating when this driving shaft 31, this sets of fan blades 32 is with these driving shaft 31 rotations.

This active magnet 33 is to be installed in the lower end of this driving shaft 31 partly rotating with this driving shaft 31.

This ccontaining housing 20 is to be arranged in the ccontaining alcove 104 in the unit, group Pu of this body 10 ' so that the roof of this ccontaining housing 20 is near this active magnet 33.This ccontaining housing 20 has a fluid input port 200 and a fluid output port 201.In the present embodiment, this ccontaining housing 20 is to be made by metal material.

This group's Pu vane group 21 is to be rotatably installed on a lower end part from the downward installation shaft 23 of extending of roof of this ccontaining housing 20.In the present embodiment, this group's Pu vane group 21 is to be made by metal material.

This is the roofs that are arranged at partly approaching this ccontaining housing 20 in upper end of this installation shaft 23 rotationally by moving magnet 22, and is to connect helping Pu vane group 21 to rotate with this with this group's Pu vane group 21.

This output duct 106 has one and is arranged at the output 1061 that this body 10 ' is inner and input 1060 and that be communicated with the fluid output port 201 of this ccontaining housing 20 extends upward and is communicated with this collector pipe 14.

This input pipe 107 is to be arranged at this body 10 ' inside and to have an output 1070 and an input 1071 that is communicated with this water leg 105 that is communicated with the fluid input port 200 of this ccontaining housing 20.

These auxiliary heat dissipation elements 13 are that each paste to pay in the lower surface 101 ' of this body 10 ' and to be the outer surface that extends to one of correspondence in these radiating fins 11 ' person carry out heat exchange with the cooling fluid in can the radiating fin 11 ' corresponding with this, further promote radiating effect whereby.

By structure as above, when this group's Pu vane group 21 is rotated owing to the rotation of this sets of fan blades 32, cooling fluid will be transferred to this collector pipe 14 from this ccontaining housing 20 via this output duct 106, then be transferred to this water leg 105 via passage 110, Hou enters this ccontaining housing 20 via this input pipe 107 again.

Figure 34 is for showing that employed in the present invention elimination is by the block schematic diagram of fan unit 3 with the circuit arrangement of the noise of helping unit, Pu 2 to be produced.

See also shown in Figure 34ly, this circuit arrangement comprises a microphone M, an inverting amplifier A, an and loud speaker S.

This microphone M is arranged near this heat dissipation element 1 can receive the noise warning signal of the noise that is produced by this fan unit 3 and this unit, group Pu 2.

This inverting amplifier A electrically is connected to this microphone M can receive this noise warning signal and the anti-phase and amplification this noise warning signal.

This loud speaker S electrically is connected to this inverting amplifier A can receive and export this through anti-phase noise warning signal.Because the noise warning signal of input is opposite with the phase place of the anti-phase noise warning signal of output, should be eliminated by this fan unit 3 and the noise that this unit, group Pu 2 is produced.

In sum, the heat abstractor that computer system of the present invention is used really can be borrowed above-mentioned disclosed structure, device, reaches its intended purposes and effect, and does not see the also unexposed use of publication before the application, meets the important documents such as novelty, progress of patent.

Above-mentioned graphic and explanation of taking off only is embodiments of the invention, and is non-for limiting embodiments of the invention, generally be familiar with people's bodyguard of this skill, it complies with feature category of the present invention, and other equivalences of being done change or modify, and all should be encompassed in the claim of the present invention.

(graphic main element conventional letter table)

9 semiconductor wafers, 90 metallic heat-radiating elements

91 heat radiation fans, 1 metallic heat-radiating element

2 help unit, Pu 3 fan units

4 fluid conduit systems, 10 bodies

Surperficial 11 heat radiating fin sheets on 102

101 times surface 20 accommodating housings

21 help Pu vane group 22 by moving magnet

200 fluid input ports, 201 fluid output ports

23 installation shaft, 40 fluid outlets

41 fluids input mouthful 42 middle interconnecting pieces

30 installing racks, 31 driving shafts

32 sets of fan blades 33 are magnet initiatively

5 auxiliary heat dissipation sheets 43 storehouse of catchmenting

103 accommodating alcoves 104 are helped Pu cellular installation alcove

120 times heat radiating fin sheets of 12 metal mounting bases

Heat radiating fin sheet 31 ' driving shaft on 121

6 thermal conductance pipes, 60 open upper end partly

61 open lower are 7 second metallic heat-radiating elements partly

70 bodies, 71 heat radiating fin sheets

The 73 relaying rotating shafts of 72 driven spindles

701 times surfaces of 703 accommodating alcoves

8 heat radiation conduit groups, 80 radiating fins

81 heat radiation conduits, 13 auxiliary heat dissipation elements

130 bottoms, 131 intermediate layers

132 first copper foils, 133 second copper foils

134 top layers, 1300 first surfaces

1310 perforates of 1301 second surfaces

1311 pores 1320 are partly terminal

1330 terminal partly 1 ' metallic heat-radiating elements

11 ' the heat radiation of 10 ' body

101 ' lower surface, 102 ' upper surface

110 path 10s, 5 water legs

14 collector pipes, 106 output ducts

107 input pipes, 1060 inputs

1061 outputs, 1070 inputs

1071 outputs, 200 pits

310 is partly most advanced and sophisticated

Claims

1. heat abstractor that computer system is used, this computer system comprises semiconductor wafer, this heat abstractor is characterized in that: comprise:

2. heat abstractor as claimed in claim 1 is characterized in that: this ccontaining housing on its roof, more can be formed with a pit and this driving shaft more can have one protrude out to this pit most advanced and sophisticated partly.

3. heat abstractor as claimed in claim 1 is characterized in that: this cooling fluid can be for water, be added with cooling fluid water, be added with the water of low ignition point liquid and similar.

4. heat abstractor as claimed in claim 1, it is characterized in that: this semiconductor wafer has an IC wafer, the lower surface of the body of this heat dissipation element is that the position corresponding to the IC wafer of this semiconductor wafer is formed with a ccontaining alcove, this heat abstractor more comprises an auxiliary heat dissipation sheet, and this auxiliary heat dissipation sheet is to be made of copper and is to be installed in the ccontaining alcove of this body contacting with the surface corresponding to the position of this IC wafer of this semiconductor wafer.

5. heat abstractor as claimed in claim 4, it is characterized in that: the middle interconnecting piece of this fluid conduit systems is to be formed with the storehouse of catchmenting corresponding to the section of this auxiliary heat dissipation sheet, and this storehouse of catchmenting is to be in close proximity to this auxiliary heat dissipation sheet the cooling fluid in the storehouse can carry out heat exchange with this auxiliary heat dissipation sheet so that this catchments.

6. heat abstractor that computer system is used, this computer system comprises semiconductor wafer, this heat abstractor is characterized in that: comprise:

7. heat abstractor as claimed in claim 6 is characterized in that: this ccontaining housing on its roof, more can be formed with a pit and this driving shaft more can have one protrude out to this pit most advanced and sophisticated partly.

8. heat abstractor as claimed in claim 6 is characterized in that: this cooling fluid can be for water, be added with cooling fluid water, be added with the water of low ignition point liquid and similar.

9. heat abstractor as claimed in claim 6, it is characterized in that: this semiconductor wafer has an IC wafer, the lower surface of the body of this heat dissipation element is that the position corresponding to the IC wafer of this semiconductor wafer is formed with a ccontaining alcove that is communicated with this ccontaining alcove in unit, group Pu, this heat abstractor more comprises an auxiliary heat dissipation sheet, and this auxiliary heat dissipation sheet is to be made of copper and is to be installed in the ccontaining alcove of this body contact with the surface corresponding to the position of this IC wafer of this semiconductor wafer to reach carrying out heat exchange with the cooling fluid in this ccontaining housing.

10. heat abstractor that computer system is used, this computer system comprises semiconductor wafer, this heat abstractor is characterized in that: comprise:

11. heat abstractor as claimed in claim 10 is characterized in that: this cooling fluid can be for water, be added with cooling fluid water, be added with the water of low ignition point liquid and similar.

12. heat abstractor as claimed in claim 10, it is characterized in that: this semiconductor wafer has an IC wafer, the lower surface of the body of this heat dissipation element is that the position corresponding to the IC wafer of this semiconductor wafer is formed with a ccontaining alcove, this heat abstractor more comprises an auxiliary heat dissipation sheet, and this auxiliary heat dissipation sheet is to be made of copper and is to be installed in the ccontaining alcove of this body contacting with the surface corresponding to the position of this IC wafer of this semiconductor wafer.

13. heat abstractor as claimed in claim 12, it is characterized in that: the middle interconnecting piece of this fluid conduit systems is to be formed with the storehouse of catchmenting corresponding to the section of this auxiliary heat dissipation sheet, and this storehouse of catchmenting is to be in close proximity to this auxiliary heat dissipation sheet the cooling fluid in the storehouse can carry out heat exchange with this auxiliary heat dissipation sheet so that this catchments.

14. the heat abstractor that computer system is used, this computer system comprises semiconductor wafer, and this heat abstractor is characterized in that: comprise:

15. heat abstractor as claimed in claim 14 is characterized in that: this cooling fluid can be for water, be added with cooling fluid water, be added with the water of low ignition point liquid and similar.

16. heat abstractor as claimed in claim 14, it is characterized in that: this semiconductor wafer has an IC wafer, the lower surface of the body of this heat dissipation element is the ccontaining alcove that is in close proximity to this storehouse of catchmenting corresponding to the position of the IC wafer of this semiconductor wafer, this heat abstractor more comprises an auxiliary heat dissipation sheet, and this auxiliary heat dissipation sheet is to be made of copper and is to be installed in the ccontaining alcove of this body contacting with the surface corresponding to the position of this IC wafer of this semiconductor wafer.

17. the heat abstractor that computer system is used, this computer system comprises semiconductor wafer, and this heat abstractor is characterized in that: comprise:

18. heat abstractor as claimed in claim 17 is characterized in that: this cooling fluid can be for water, be added with cooling fluid water, be added with the water of low ignition point liquid and similar.

19. heat abstractor as claimed in claim 17, it is characterized in that: this semiconductor wafer has an IC wafer, the lower surface of the body of this heat dissipation element is that the position corresponding to the IC wafer of this semiconductor wafer is formed with a ccontaining alcove that is communicated with this ccontaining alcove in unit, group Pu, this heat abstractor more comprises an auxiliary heat dissipation sheet, and this auxiliary heat dissipation sheet is to be made of copper and is to be installed in the ccontaining alcove of this body contact with the surface corresponding to the position of this IC wafer of this semiconductor wafer to reach carrying out heat exchange with the cooling fluid in this ccontaining housing.

20. the heat abstractor that computer system is used, this computer system comprises semiconductor wafer, and this heat abstractor is characterized in that: comprise:

21. heat abstractor as claimed in claim 20 is characterized in that: this cooling fluid can be for water, be added with cooling fluid water, be added with the water of low ignition point liquid and similar.

22. heat abstractor as claimed in claim 20, it is characterized in that: this semiconductor wafer has an IC wafer, the lower surface of the body of this heat dissipation element is that the position corresponding to the IC wafer of this semiconductor wafer is formed with a ccontaining alcove, this heat abstractor more comprises an auxiliary heat dissipation sheet, and this auxiliary heat dissipation sheet is to be made of copper and is to be installed in the ccontaining alcove of this body contacting with the surface corresponding to the position of this IC wafer of this semiconductor wafer.

23. heat abstractor as claimed in claim 22, it is characterized in that: the middle interconnecting piece of this fluid conduit systems is to be formed with the storehouse of catchmenting corresponding to the section of this auxiliary heat dissipation sheet, and this storehouse of catchmenting is to be in close proximity to this auxiliary heat dissipation sheet the cooling fluid in the storehouse can carry out heat exchange with this auxiliary heat dissipation sheet so that this catchments.

24. the heat abstractor that computer system is used, this computer system comprises semiconductor wafer, and this heat abstractor is characterized in that: comprise:

25. heat abstractor as claimed in claim 24 is characterized in that: this cooling fluid can be for water, be added with cooling fluid water, be added with the water of low ignition point liquid and similar.

26. heat abstractor as claimed in claim 24, it is characterized in that: this semiconductor wafer has an IC wafer, the lower surface of the body of this heat dissipation element is that the position corresponding to the IC wafer of this semiconductor wafer is formed with a ccontaining alcove, this heat abstractor more comprises an auxiliary heat dissipation sheet, and this auxiliary heat dissipation sheet is to be made of copper and is to be installed in the ccontaining alcove of this body contacting with the surface corresponding to the position of this IC wafer of this semiconductor wafer.

27. heat abstractor as claimed in claim 26, it is characterized in that: the middle interconnecting piece of this fluid conduit systems is to be formed with the storehouse of catchmenting corresponding to the section of this auxiliary heat dissipation sheet, and this storehouse of catchmenting is to be in close proximity to this auxiliary heat dissipation sheet the cooling fluid in the storehouse can carry out heat exchange with this auxiliary heat dissipation sheet so that this catchments.

28. the heat abstractor that computer system is used, this computer system comprises semiconductor wafer, and this heat abstractor is characterized in that: comprise:

29. heat abstractor as claimed in claim 28 is characterized in that: this cooling fluid can be for water, be added with cooling fluid water, be added with the water of low ignition point liquid and similar.

30. heat abstractor as claimed in claim 28, it is characterized in that: this semiconductor wafer has an IC wafer, the lower surface of the body of this heat dissipation element is that the position corresponding to the IC wafer of this semiconductor wafer is formed with a ccontaining alcove that is communicated with this ccontaining alcove in unit, group Pu, this heat abstractor more comprises an auxiliary heat dissipation sheet, and this auxiliary heat dissipation sheet is to be made of copper and is to be installed in the ccontaining alcove of this body contact with the surface corresponding to the position of this IC wafer of this semiconductor wafer to reach carrying out heat exchange with the cooling fluid in this ccontaining housing.

31. the heat abstractor that computer system is used, this computer system comprises semiconductor wafer, and this heat abstractor is characterized in that: comprise:

32. heat abstractor as claimed in claim 31 is characterized in that: this cooling fluid can be for water, be added with cooling fluid water, be added with the water of low ignition point liquid and similar.

33. heat abstractor as claimed in claim 31, it is characterized in that: this semiconductor wafer has an IC wafer, the lower surface of the body of this second heat dissipation element is that the position corresponding to the IC wafer of this semiconductor wafer is formed with a ccontaining alcove, this heat abstractor more comprises an auxiliary heat dissipation sheet, and this auxiliary heat dissipation sheet is to be made of copper and is to be installed in the ccontaining alcove of body of this second heat dissipation element contact with the surface corresponding to the position of this IC wafer of this semiconductor wafer to reach carrying out heat exchange with the cooling fluid in this ccontaining housing.

34. heat abstractor as claimed in claim 33, it is characterized in that: the middle interconnecting piece of this fluid conduit systems is to be formed with the storehouse of catchmenting corresponding to the section of this auxiliary heat dissipation sheet, and this storehouse of catchmenting is to be in close proximity to this auxiliary heat dissipation sheet the cooling fluid in the storehouse can carry out heat exchange with this auxiliary heat dissipation sheet so that this catchments.

35. the heat abstractor of using as each described computer system in the claim 1,6,10,14,17,20,24,28 or 31, it is characterized in that: more comprise a heat radiation conduit group, this heat radiation conduit group has radiating fin and several heat radiation conduits on several installing racks that are arranged at this fan unit, and each heat radiation conduit has one and extends to the middle interconnecting piece of this fluid conduit systems and the first end and that contacts with this middle interconnecting piece passes the second end of these radiating fins.

36. the heat abstractor of using as each described computer system in the claim 1,6,10,14,17,20,24,28 or 31, it is characterized in that: more comprise a heat radiation conduit group, this heat radiation conduit group has radiating fin and several heat radiation conduits on several installing racks that are arranged at this fan unit, and each heat radiation conduit is the second end that the first end and that respectively has a radiating fin that passes this heat dissipation element passes these radiating fins.

37. as claim 1,6,10,14,17,20,24, the heat abstractor that each described computer system is used in 28 or 31, it is characterized in that: more comprise several each auxiliary heat dissipation elements near the surface of the radiating fin of correspondence, these auxiliary heat dissipation elements respectively have a bottom, one intermediate layer, first and second copper foil, an and top layer, this bottom is to have flexible film for one by what PI and BS formed, this bottom has one near the first surface on the surface of the radiating fin of a correspondence and one and this first surface opposing second surface, this first copper foil is to be set on this second surface and its two ends partly are to convexedly stretch in outside this bottom with mode of printing, this intermediate layer is to be formed on this first copper foil, this intermediate layer be formed with several from its one of end part extend to the other end partly and run through the perforate on its two surfaces, this intermediate layer is to form several pores via sintering processes on the hole wall that forms each perforate, this second copper foil is to be arranged on this intermediate layer in the mode identical with first copper foil, two ends of this second copper foil partly are to protrude out outside this intermediate layer, this top layer is forming with this bottom identical materials and to be to be arranged on this second copper foil, and the end of first and second copper foils of each auxiliary heat dissipation element partly is to contact with this body with corresponding radiating fin respectively.

38. the heat abstractor that computer system as claimed in claim 37 is used is characterized in that: be to add the low ignition point fluid in the perforate in this intermediate layer.

39. the heat abstractor of using as each described computer system in the claim 1,6,10,14,17,20,24,28 or 31, it is characterized in that: more comprise several auxiliary heat dissipation elements, the bottom of each auxiliary heat dissipation element be formed into frame shape and also under it surface be to have stickiness so that this auxiliary heat dissipation element is to be attached on the corresponding radiating fin under its surperficial state of contact of first copper foil and radiating fin.

40. the heat abstractor that computer system as claimed in claim 39 is used is characterized in that: be to add the low ignition point fluid in the perforate in this intermediate layer.

41. the heat abstractor that computer system is used, this computer system comprises semiconductor wafer, and this heat abstractor is characterized in that: comprise:

42. the heat abstractor that computer system as claimed in claim 41 is used, it is characterized in that: more comprise several auxiliary heat dissipation elements, these auxiliary heat dissipation elements are that each paste to be paid in the lower surface of this body and is one the outer surface that extends to correspondence in these radiating fins.

43. the heat abstractor as each described computer system in the claim 1,6,10,14,17,20,24,28,31 or 41 is used is characterized in that: more comprise a safety device, this safety device comprises:

One in series is connected the fan motor of this fan unit and the PTR variable resistance between the fan power supply, and this variable resistance is that to be located on the body of this heat dissipation element therefore its resistance value be that temperature with the body of this heat dissipation element is inversely proportional to;

One electrically is connected to the circuit breaker of this fan power supply;

One electrically is connected to the control circuit of this circuit breaker; And

One electrically is connected to the detector of rotating speed that is used to detect this fan motor of this control circuit;

Wherein, when the temperature of the body of this heat dissipation element rises, the resistance value of variable resistance reduces so that this fan motor drives this sets of fan blades with high rotational speed, when the temperature of the body of this heat dissipation element descends, the resistance value of variable resistance rises so that this fan motor drives this sets of fan blades with lower rotating speed, this detector is the rotating speed that is used to detect this fan motor, and produce the detection signal of the rotating speed of this motor of expression, this control circuit receives this detection signal and the reference signal of the rated speed of this detection signal and this motor of expression is made comparisons, when this detection signal is bigger than this reference signal, the normal rotating speed height of rotating ratio of representing this motor, representative has drainage, so this control circuit is exported a start signal and interrupted this fan power supply to guarantee safety to this circuit breaker with this circuit breaker of start.

44. as claim 1,6,10,14,17,20,24,28, the heat abstractor that each described computer system is used in 31 or 41, it is characterized in that: more comprise one in order to eliminate by the circuit arrangement of fan unit with the noise of helping the unit, Pu to be produced, this circuit arrangement comprises a microphone, one inverting amplifier, an and loud speaker, this microphone is to be arranged near this heat dissipation element can receive the noise warning signal of the noise that is produced by this fan unit and this unit, group Pu, this inverting amplifier is electrically to be connected to this microphone can receive this noise warning signal and the anti-phase and amplification this noise warning signal, this loud speaker is electrically to be connected to this inverting amplifier can receive and export this through anti-phase noise warning signal, because the noise warning signal of input is opposite with the phase place of the anti-phase noise warning signal of output, should be eliminated by the noise that this fan unit and this unit, group Pu are produced.