CN111741657B - Electronic equipment - Google Patents
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- CN111741657B CN111741657B CN202010630483.9A CN202010630483A CN111741657B CN 111741657 B CN111741657 B CN 111741657B CN 202010630483 A CN202010630483 A CN 202010630483A CN 111741657 B CN111741657 B CN 111741657B
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- heat dissipation
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/203—Cooling means for portable computers, e.g. for laptops
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0213—Venting apertures; Constructional details thereof
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Computer Hardware Design (AREA)
- Human Computer Interaction (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The embodiment of the invention discloses electronic equipment, which comprises a first body and a second body which are connected, wherein the second body comprises: a ventilation channel; at least one heat generating component; the heat dissipation part is arranged in the ventilation channel and used for absorbing heat generated by the heat generating part; the ventilation channel includes: the air inlet is arranged on the lower surface of the second body; the lower surface is a surface of the second body, which is far away from the first body when the second body is attached to the first body; the air outlet is used for forming airflow from the outside of the electronic equipment, inputting the airflow into the electronic equipment through the air inlet, flowing through the heat dissipation component and discharging the airflow through the air outlet; no aerodynamic components are included within the electronic device that form an airflow within the ventilation channel.
Description
Technical Field
The invention relates to the technical field of heat dissipation, in particular to electronic equipment.
Background
With the development of electronic products in the light and thin direction, many electronic products without a fan heat dissipation system are available; in the related art, electronic products of a fanless heat dissipation system generate lower heat by sacrificing the working performance of the electronic products, and heat dissipation of the electronic products is achieved by using contact type heat dissipation with slower heat dissipation. However, this leads to the problems of low performance and slow heat dissipation of the electronic product of the fanless heat dissipation system in the related art.
Disclosure of Invention
In order to solve the above technical problems, embodiments of the present invention are directed to providing an electronic device, which improves the heat dissipation capability of an electronic product without a fan heat dissipation system while ensuring the working performance of the electronic product.
The technical scheme of the invention is realized as follows:
an electronic device comprising a first body and a second body connected, wherein the second body comprises:
a ventilation channel;
at least one heat generating component;
the heat dissipation part is arranged in the ventilation channel and used for absorbing heat generated by the heat generating part;
the ventilation channel includes: the air inlet is arranged on the lower surface of the second body; the lower surface is a surface of the second body, which is far away from the first body when the second body is attached to the first body;
the air outlet is used for forming airflow from the outside of the electronic equipment, inputting the airflow into the electronic equipment through the air inlet, flowing through the heat dissipation component and discharging the airflow through the air outlet;
no aerodynamic components are included within the electronic device that form an airflow within the ventilation channel.
Optionally, a through hole is provided at a position corresponding to the air inlet on the heat dissipation member.
Optionally, a through hole is provided at a position corresponding to a target device of the electronic device on the heat dissipation component; wherein the target device characterizes a device that generates heat when the electronic device is in an operational state.
Optionally, the external air is input into the electronic equipment through the air inlet and is input to the surface of the target device through the through hole; wherein the target device characterizes a device that generates heat when the electronic device is in an operational state.
Optionally, when the electronic device uses a heat dissipation bracket, the heat dissipation bracket is disposed on the lower surface of the second body, and the fan of the heat dissipation bracket is disposed at a position corresponding to the air inlet.
Optionally, the electronic device controls the fan of the heat dissipation bracket to input the airflow into the electronic device through the air inlet.
Optionally, if the electronic device is in a first working scene, heat generated by the heat generating component is exhausted through the air outlet of the ventilation channel under the action of the heat dissipating component;
if the electronic equipment is in a second working scene, the heat generated by the heating component is exhausted through the air outlet of the ventilation channel under the combined action of the heat radiating component and the fan of the heat radiating bracket; and the energy consumption of the electronic equipment in the first working scene is less than that in the second working scene.
Optionally, the electronic device further comprises:
and the induction component is used for inducing the wind pressure value and/or the temperature value of the wind inlet.
Optionally, if the electronic device is in the second working scenario, the electronic device generates a speed regulation instruction based on the wind pressure value and/or the temperature value, and controls the fan of the heat dissipation bracket to flow into the electronic device through the air inlet by an airflow corresponding to the wind pressure value and/or the temperature value.
Optionally, the electronic device controls the heat dissipating component and/or the fan of the heat dissipating bracket based on the wind pressure value and/or the temperature value, so that the heat generated by the heat generating component is exhausted through the air outlet of the ventilation channel.
The electronic device provided by the embodiment of the invention comprises a first body and a second body which are connected, wherein the second body comprises: a ventilation channel; at least one heat generating component; the heat dissipation part is arranged in the ventilation channel and used for absorbing heat generated by the heating part; the ventilation channel includes: the air inlet is arranged on the lower surface of the second body; the lower surface is a surface of the second body, which is far away from the first body when the second body is attached to the first body; the air from the outside of the electronic equipment can form airflow, is input into the electronic equipment through the air inlet, flows through the heat dissipation component and is exhausted through the air outlet; no aerodynamic components are included within the electronic device that form an airflow within the ventilation channel. Therefore, air flow is formed by air from the outside of the electronic equipment and is input into the electronic equipment through the air inlet of the ventilation channel, flows through the heat dissipation part and is discharged through the air outlet, the working performance of the electronic product is ensured, and meanwhile, the heat dissipation capacity of the electronic product of the fanless heat dissipation system is improved.
Drawings
Fig. 1 is a schematic cross-sectional structural diagram of an electronic device according to an embodiment of the present invention;
fig. 2 is a schematic cross-sectional structural diagram of another electronic device according to an embodiment of the present invention;
fig. 3 is a schematic cross-sectional structural diagram of another electronic device according to an embodiment of the present invention;
1-first body, 2-second body, 21-ventilation channel, 211-air inlet, 212-air outlet, 22-heating component, 23-heat dissipation component, 231-through hole, 24-induction component, 3-heat dissipation bracket and 31-fan.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.
An embodiment of the present invention provides an electronic device, which includes, as shown in fig. 1, a first body 1 and a second body 2 connected, where the second body 2 includes:
a ventilation passage 21;
at least one heat-generating component 22;
a heat dissipation member 23 disposed in the ventilation duct 21 and absorbing heat generated by the heat generating member 22;
the ventilation passage 21 includes: an air inlet 211 provided at a lower surface of the second body 2;
the lower surface is a surface of the second body 2, which is far away from the first body 1 when being attached to the first body 1;
an air outlet 212, through which air from outside the electronic device can be input into the electronic device through the air inlet 211, flow through the heat dissipation member 23, and be discharged through the air outlet 212;
no aerodynamic components are included in the electronic device that form an airflow within the ventilation channel 21.
It should be noted that the electronic device may be any electronic device having the first body 1 and the second body 2 connected to each other.
When taking an electronic device as a notebook computer for example, the electronic device includes a first body 1 and a second body 2 connected to each other, where the first body 1 may be a display device of the notebook computer, and the second body 2 may be a keyboard of the notebook computer; taking an example of an electronic product in which the electronic device is a combination of a notebook computer and a tablet computer as an example, the first body 1 may be the tablet computer, and the second body 2 may be the notebook computer. In the following other embodiments of the present invention, a notebook computer is taken as an example of the electronic device, that is, the first body 1 is a display device of the notebook computer, and the second body 2 is a keyboard of the notebook computer.
The ventilation channel 21 may be disposed at any position of the second body 2 of the electronic device, that is, the ventilation channel 21 of the electronic device may be disposed as a front and rear ventilation channel 21, a left and right ventilation channel 21, and an upper and lower ventilation channel 21 according to the wind direction; it should be noted that the shape or cross-sectional area of the ventilation channel 21 inside the second body 2 may be determined according to the requirements of the electronic device in actual production, i.e. the shape of the ventilation channel 21 in the second body 2 is not limited in this embodiment of the present invention.
The heat generating component 22 may be a processor inside the electronic device, such as a Central Processing Unit (CPU) of the electronic device, a Graphic Processing Unit (GPU) of the electronic device, and the like. But also can be some power devices inside the electronic equipment, such as a Metal Oxide Semiconductor (MOS) tube, a power supply device, and the like. It should be noted that, in the embodiment of the present invention, the number of the heat generating components is not limited in any number.
The heat dissipation component 23 may be a heat dissipation fin, specifically, a heat dissipation fin, located in the ventilation channel 21, and performs heat dissipation inside the electronic device based on a passive heat dissipation principle. The thickness and shape of the heat dissipation member 23 are not limited in the embodiment of the present invention, and the thermal conductivity of the heat dissipation member is not limited herein.
The heat dissipation member 23 and the heat generating member 22 may be connected in contact in any manner, and the manner of contact between the heat dissipation member 23 and the heat generating member 22 is not limited in this embodiment of the present invention.
In the embodiment of the present invention, the heat dissipation member 23 may be formed by combining at least two heat dissipation materials having different thermal conductivities, or may be formed by combining heat dissipation materials in order of their thermal conductivities to form a heat conductive sheet.
In a possible implementation, the heat dissipation member 23 may also be a heat pipe located inside the ventilation channel 21.
The air inlet 211 of the ventilation channel 21 may be disposed at any position of the lower surface of the second body 2, wherein when the first body 1 and the second body 2 of the electronic device are attached, the surface of the second body 2 away from the first body 1 is the lower surface. The shape and position of the air inlet 211 of the ventilation channel 21 are not limited in any way in the embodiment of the present invention.
In a possible implementation manner, the ventilation channel 21 may include one, two or even more air inlets 211, and the relative positions of at least two air inlets 211 are not limited in any way in the embodiment of the present invention.
The air outlet 212 of the ventilation channel 21 is disposed corresponding to the air inlet 211 of the ventilation channel 21, and in the embodiment of the present invention, the position of the air outlet 212 of the ventilation channel 21 may be disposed at any position of the second body 2. It should be noted that the number of the air outlets 212 and the shape of the air outlets 212 are not limited in any way in the embodiment of the present invention.
In a possible implementation manner, the air from the outside of the electronic device may be natural wind, and more specifically, the external aerodynamic component may form an airflow by the external natural wind through the air inlet 211 to be input into the ventilation channel 21, that is, into the inside of the electronic device, and the airflow may pass through at least one heat dissipation component 23, such as a heat dissipation fin or a heat conduction pipe, and then be exhausted through the air outlet 212.
In one possible implementation, the aerodynamic component may be a fan.
It should be noted that the electronic device may include at least one ventilation channel 21, the first body 1 of the electronic device may also include the ventilation channel 21, and the ventilation channel 21 inside the first body 1 may include a heat dissipation device, and the heat dissipation device may be any heat dissipation component 23, that is, may be an aerodynamic component such as a fan, and may further be a heat dissipation fin or a heat conduction pipe.
The electronic device provided by the embodiment of the invention comprises a first body and a second body which are connected, wherein the second body comprises: a ventilation channel having an air inlet and an air outlet; at least one heat generating component; and a heat dissipation member disposed in the ventilation channel. Therefore, through the heat dissipation part arranged in the ventilation channel and the air inlet and the air outlet on the ventilation channel, air from the outside of the electronic equipment forms airflow and is input into the electronic equipment through the air inlet, so that heat generated by the heating part is driven to flow through the heat dissipation part and is discharged through the air outlet, the working performance of the electronic product is ensured, and meanwhile, the heat dissipation capacity of the electronic product of the fanless heat dissipation system is improved.
Based on the foregoing embodiment, in another embodiment of the present invention, an electronic device may further be provided, and as shown in fig. 1, the electronic device includes a first body 1 and a second body 2 connected to each other, where the second body 2 includes: a ventilation passage 21; at least one heat-generating component 22; the heat dissipation member 23.
In one possible implementation, the heat dissipation member 23 is provided with a through hole 231 (not shown in fig. 1) at a position corresponding to the air inlet 211.
It should be noted that the through hole 231 provided in the heat dissipation member 23 may be a cylindrical through hole, and in the embodiment of the present invention, the shape of the through hole 231 is not limited at all. And the through holes 231 are additionally arranged on the heat dissipation part 23, so that the area and the volume of the heat dissipation part can be increased, and the heat dissipation capability is further accelerated.
The number of the through holes 231 provided at the position of the heat dissipation member 23 corresponding to the air inlet 211 is not limited in the embodiment of the present invention. In the case where the heat dissipation member 23 is provided with at least two through holes 231, the positions and shapes of the at least two through holes 231 are not limited in any way in the embodiment of the present invention.
Based on the foregoing embodiment, in the electronic apparatus provided in the other embodiment of the present invention, the heat dissipation member 23 is provided with the through hole 231 at a position corresponding to the target device of the electronic apparatus.
Wherein the target device represents a device that generates heat when the electronic device is in an operational state.
It should be noted that the through holes 231 on the heat dissipation component 23 may correspond to target devices one to one, where the target devices are not shown in fig. 1, and the target devices may be MOS transistors, power supply devices, power devices, and the like inside the electronic device, or may be processors such as CPUs, GPUs, and the like inside the electronic device.
The device for generating heat when the electronic equipment is in the working state can be a device or a processor for generating certain heat after the electronic equipment works for a certain time.
Based on the foregoing embodiment, in the electronic device provided in the other embodiments of the present invention, the electronic device itself or other devices input the external air into the electronic device through the air inlet 211 in a certain manner.
In one possible implementation, the external air is input into the electronic device through the air inlet 211 and is input to the surface of the target device through the through hole 231.
It should be noted that, the external air may be formed into an airflow by an external aerodynamic component such as a fan, and the airflow is input into the electronic device through the air inlet 211 of the ventilation channel 21, and then input to the surface of the target device through the through hole 231 on the heat dissipation component 23, so that the heat generated by the target device in the operating state flows through the airflow and is exhausted through the air outlet 212.
According to the electronic equipment provided by the embodiment of the invention, air from the outside of the electronic equipment forms airflow and is input into the electronic equipment through the air inlet of the ventilation channel, and simultaneously is input to the surface of the target device through the through hole arranged on the heat dissipation part, so that heat generated by the heating part is driven to flow through the heat dissipation part and is exhausted through the air outlet of the ventilation channel, the working performance of an electronic product is ensured, and meanwhile, the heat dissipation capability of the electronic product of the fanless heat dissipation system is improved.
Based on the foregoing embodiments, embodiments of the present invention may also provide an electronic device, as shown in fig. 2, in which the electronic device may include a first body 1 and a second body 2 connected, wherein,
the second body 2 includes: a ventilation passage 21; at least one heat-generating component 22; the heat dissipation member 23.
In a possible implementation, the electronic device can also work synchronously with the heat dissipation bracket 3.
When the electronic device uses the heat dissipation bracket 3, the heat dissipation bracket 3 is disposed on the lower surface of the second body 2, and the fan 31 of the heat dissipation bracket 3 is disposed at a position corresponding to the air inlet 211.
It should be noted that the heat dissipation bracket 3 is detachably connected with the second body 2.
In the embodiment of the present invention, the heat dissipation support 3 may be the heat dissipation support 3 only provided with the fan 31, or the heat dissipation support 3 formed by combining the fan 31 and the heat conductive material. In the embodiment of the present invention, the heat dissipation bracket 3 is formed by combining the heat conductive material and the fan 31 without any limitation.
Wherein, the fan 31 of the heat dissipation bracket 3 is arranged at a position right below the air inlet 211 of the second body 2, so as to better improve the heat dissipation capability of the electronic device.
Based on the foregoing embodiment, in the electronic device provided in the other embodiments of the present invention, the electronic device may further control the fan 31 of the heat dissipation bracket 3.
In a possible implementation, the fan 31 of the electronic device control heat dissipation bracket 3 inputs air flow to the inside of the electronic device through the air inlet 211.
It should be noted that, the electronic device may convert the external air into a corresponding air flow by controlling the operation of the fan 31 of the heat dissipation bracket 3, and input the air flow into the electronic device through the air inlet 211. The rotation speed of the fan 31 may be adjusted by a preset control strategy inside the electronic device, in other words, the rotation speed of the fan 31 of the heat dissipation bracket 3 may be controlled by the electronic device and is not unique.
It should be noted that, when the heat dissipation bracket 3 is disposed on the lower surface of the second body 2 of the electronic device, the heat dissipation bracket 3 includes a first working mode and a second working mode, where the heat dissipation bracket 3 supports the electronic device in the first working mode; in the second operation mode, the heat dissipation bracket 3 supports the electronic device and inputs a corresponding airflow into the electronic device through the air inlet 211.
Based on the foregoing embodiment, in the electronic device provided in other embodiments of the present invention, under the condition that the heat dissipation bracket 3 supports the electronic device, the electronic device includes at least two working scenarios, that is, a working scenario corresponding to the electronic device when the heat dissipation bracket 3 supports the electronic device and the fan 31 of the heat dissipation bracket 3 does not operate, and a working scenario corresponding to the electronic device when the heat dissipation bracket 3 supports the electronic device and the fan 31 of the heat dissipation bracket 3 operates.
In a possible implementation manner, if the electronic device is in the first working scenario, the heat generated by the heat-generating component 22 is dissipated through the air outlet 212 of the air duct 21 by the heat-dissipating component 23;
if the electronic device is in the second working scenario, the heat generated by the heat generating component 22 is discharged through the air outlet 212 of the air duct 21 under the combined action of the heat dissipating component 23 and the fan 31 of the heat dissipating bracket 3;
and the energy consumption of the electronic equipment in the first working scene is less than that in the second working scene.
It should be noted that the electronic device may include, but is not limited to, the above two working scenarios.
When the electronic device is in the first working scenario, the heat dissipation bracket 3 supports the electronic device, the fan 31 inside the heat dissipation bracket 3 does not work, and heat generated by the heat generating component 22 inside the electronic device is dissipated passively by the heat dissipating component 23 and then exhausted through the air outlet 212 of the air duct 21.
When the electronic device is in the second working scenario, the heat dissipation bracket 3 not only supports the electronic device, but also the fan 31 of the heat dissipation bracket 3 works simultaneously, wherein the fan 31 of the heat dissipation bracket 3 can work under the control of the electronic device to dissipate heat generated by the heat generating component 22 inside the electronic device, and meanwhile, the heat is dissipated passively through the heat dissipating component 23, and the fan 31 of the heat dissipation bracket 3 forms airflow with outside air and inputs the airflow into the inside of the electronic device to drive the heat generated by the heat generating component 22, and then the airflow is discharged through the air outlet 212 of the air duct 21.
The heat generated by the heat-generating component 22 in the second working scenario of the electronic device is greater than the heat generated by the heat-generating component 22 in the first working scenario of the electronic device.
In a possible implementation manner, the electronic device is in the second working scenario, and the electronic device can obtain the heat generated by the heat generating component 22 to control the rotation speed of the fan 31 of the heat dissipating bracket 3.
It should be noted that, when the electronic device is in the second working scenario, the electronic device may have at least two working states, and the rotation speeds of the fans 31 of the heat dissipation brackets 3 in each working state of the electronic device are different.
The electronic equipment provided by the embodiment of the invention forms air flow from the outside of the electronic equipment to be input into the electronic equipment through the air inlet of the ventilation channel under the action of the external heat dissipation bracket so as to drive heat generated by the heating component to flow through the heat dissipation component and be discharged through the air outlet of the ventilation channel, thereby ensuring the working performance of the electronic product and improving the heat dissipation capability of the electronic product of the fanless heat dissipation system.
Based on the foregoing embodiment, as shown in fig. 3, an electronic device further provided in the embodiment of the present invention includes a first body 1 and a second body 2 connected to each other, where the second body 2 further includes: a ventilation passage 21; at least one heat-generating component 22; a heat-dissipating member 23; and the induction part 24, wherein the induction part 24 is used for inducing the wind pressure value and/or the temperature value of the wind inlet 211.
In one possible implementation, the electronic device may operate based on the inductive component 24.
If the electronic device is in the second working scene, the electronic device generates a speed regulation instruction based on the wind pressure value and/or the temperature value, and the fan 31 of the heat dissipation bracket 3 is controlled by the speed regulation instruction to input air flow corresponding to the wind pressure value and/or the temperature value into the electronic device through the air inlet 211.
The electronic device controls the sensing component 24 to sense a wind pressure value and/or a temperature value of the air inlet 211, and the electronic device generates a speed regulation instruction based on the sensed wind pressure value and/or temperature value, wherein the speed regulation instruction represents a rotating speed of the fan. The electronic device controls the rotation speed of the fan 31 of the heat dissipation bracket 3 according to the speed regulation instruction, and forms an air flow corresponding to the air pressure value and/or the temperature value from the outside according to the corresponding rotation speed, and inputs the air flow into the electronic device through the air inlet 211.
It should be noted that the electronic device may generate the speed regulation instruction only according to the temperature value sensed by the sensing component 24, or may generate the speed regulation instruction only according to the wind pressure value sensed by the sensing component 24, or may generate the speed regulation instruction according to the wind pressure value and the temperature value sensed by the sensing component 24; when the wind pressure value and the temperature value are simultaneously sensed, corresponding weight coefficients can be set for the wind pressure value and the temperature value according to preset rules, and meanwhile, the electronic equipment generates a speed regulation instruction based on the wind pressure value, the temperature value, the weight coefficients of the wind pressure value and the weight coefficients of the temperature value. In addition, the sensing component 24 can sense the wind pressure value and then the temperature value according to a preset rule. In the embodiment of the present invention, how to generate the speed regulation command based on the wind pressure value and/or the temperature value is not limited at all.
Based on the foregoing embodiment, in the electronic device provided in other embodiments of the present invention, the electronic device may further control the specific operation manner of the heat dissipation component 23 and the fan 31 of the heat dissipation bracket 3 according to the wind pressure value and/or the temperature value generated by the sensing component 24.
In a possible implementation, the electronic device controls the heat dissipating component 23 and/or the fan 31 of the heat dissipating bracket 3 based on the wind pressure value and/or the temperature value, so that the heat generated by the heat generating component 22 is exhausted through the air outlet 212 of the air passage 21.
It should be noted that, the electronic device controls the operation of the heat dissipation member 23 and/or the fan 31 of the heat dissipation bracket 3 based on the obtained wind pressure value and/or temperature value, wherein the electronic device can control the operation of the fan 31 of the heat dissipation member 23 and/or the heat dissipation bracket 3 based on the wind pressure value only, can control the operation of the fan 31 of the heat dissipation member 23 and/or the heat dissipation bracket 3 based on the temperature value only, and can further control the operation of the fan 31 of the heat dissipation member 23 and/or the heat dissipation bracket 3 based on the wind pressure value and the temperature value together, wherein when the wind pressure value and the temperature value are sensed at the same time, corresponding weight coefficients can be set for the wind pressure value and the temperature value according to preset rules, and at the same time, the electronic device controls the operation of the fan 31 of the heat dissipation member 23 and/or the heat dissipation bracket 3 based on the wind pressure value, the temperature value, the weight coefficient for the wind pressure value, and the weight coefficient for the temperature value, this is not intended to be limiting in the examples of the present invention.
The electronic device can correspondingly control the heat dissipation component 23 and/or the fan 31 of the heat dissipation bracket 3 to work according to the wind pressure value and/or the temperature value, for example, when the wind pressure value and/or the temperature value is lower than a first preset value, the electronic device controls the heat dissipation component 23 to work, and the fan 31 of the heat dissipation bracket 3 does not work; when the wind pressure value and/or the temperature value is higher than the first preset value, the electronic device controls the heat dissipation component 23 and the fan 31 of the heat dissipation bracket 3 to work simultaneously, and controls the rotation speed of the fan 31 of the heat dissipation bracket 3 correspondingly according to the wind pressure value and/or the temperature value, so that the heat generated by the heat generation component 22 is discharged through the air outlet 212 of the air passage 21.
In addition, it should be noted that fig. 1 to 3 are only schematic structural diagrams illustrating partial positions of the cross-sectional structure of the electronic device, and do not illustrate the entire structural schematic diagram of the electronic device.
According to the electronic equipment provided by the embodiment of the invention, the fan of the external radiating support and the internal radiating part are controlled to work based on the induced wind pressure value and/or temperature value, so that the working performance of an electronic product is ensured, and the radiating capacity of the electronic product of a fanless radiating system is improved.
In the description of the present invention, reference to the terms "some embodiments," "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," "some examples," or "other examples of the invention" or the like, means that a particular feature, structure, material, or characteristic described in connection with the embodiments or examples is included in at least one embodiment or example of the invention. In the present invention, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "connected" or "connected" and the like are to be interpreted broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; may be mechanically connected, may be electrically connected or may be in communication with each other; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
Further, in the description of the present invention, it is to be understood that the terms "width", "upper", "inner", "outer", etc. indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience in describing the present invention and simplifying the description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. The terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
The above description is only for the preferred embodiment of the present invention and is not intended to limit the scope of the present invention, and all equivalent structural changes made by using the contents of the present specification and the drawings, or any other related technical fields, are included in the scope of the present invention.
Claims (8)
1. An electronic device comprising a first body and a second body connected, wherein the second body comprises:
a ventilation channel;
at least one heat generating component;
the heat dissipation part is arranged in the ventilation channel and used for absorbing heat generated by the heat generating part;
the ventilation channel includes: the air inlet is arranged on the lower surface of the second body; the lower surface is a surface of the second body, which is far away from the first body when the second body is attached to the first body;
the air outlet is used for forming airflow from the outside of the electronic equipment, inputting the airflow into the electronic equipment through the air inlet, flowing through the heat dissipation component and discharging the airflow through the air outlet;
the induction component is used for inducing the wind pressure value and/or the temperature value of the wind inlet; enabling the electronic equipment to control the heat dissipation component based on the wind pressure value and/or the temperature value, so that the heat generated by the heat generation component is exhausted through an air outlet of the ventilation channel;
no aerodynamic components are included within the electronic device that form an airflow within the ventilation channel.
2. The electronic device of claim 1,
and a through hole is formed in the position, corresponding to the air inlet, of the heat dissipation component.
3. The electronic device of claim 1,
a through hole is formed in the radiating part at a position corresponding to a target device of the electronic equipment; wherein the target device characterizes a device that generates heat when the electronic device is in an operational state.
4. The electronic device of claim 2 or 3,
the external air is input into the electronic equipment through the air inlet and is input to the surface of the target device through the through hole; wherein the target device characterizes a device that generates heat when the electronic device is in an operational state.
5. The electronic device according to any one of claims 1 to 3,
when the electronic equipment uses the heat dissipation support, the heat dissipation support is arranged on the lower surface of the second body, and the fan of the heat dissipation support is arranged at the position corresponding to the air inlet.
6. The electronic device of claim 5,
and the electronic equipment controls the fan of the heat dissipation bracket to input the airflow into the electronic equipment through the air inlet.
7. The electronic device of claim 6,
if the electronic equipment is in a first working scene, the heat generated by the heating component is exhausted through the air outlet of the ventilation channel under the action of the heat radiating component;
if the electronic equipment is in a second working scene, the heat generated by the heating component is exhausted through the air outlet of the ventilation channel under the combined action of the heat radiating component and the fan of the heat radiating bracket; and the energy consumption of the electronic equipment in the first working scene is less than that in the second working scene.
8. The electronic device of claim 7,
if the electronic equipment is in the second working scene, the electronic equipment generates a speed regulation instruction based on the wind pressure value and/or the temperature value, and the speed regulation instruction controls the fan of the heat dissipation support to pass through the wind inlet to be input so as to enable the air flow corresponding to the wind pressure value and/or the temperature value to flow into the electronic equipment.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010630483.9A CN111741657B (en) | 2020-06-30 | 2020-06-30 | Electronic equipment |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010630483.9A CN111741657B (en) | 2020-06-30 | 2020-06-30 | Electronic equipment |
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| Publication Number | Publication Date |
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| CN111741657A CN111741657A (en) | 2020-10-02 |
| CN111741657B true CN111741657B (en) | 2022-03-25 |
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| Application Number | Title | Priority Date | Filing Date |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112788920A (en) * | 2020-12-31 | 2021-05-11 | 联想(北京)有限公司 | Electronic equipment, heat dissipation equipment and heat dissipation system |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101742878A (en) * | 2008-11-26 | 2010-06-16 | 英业达股份有限公司 | Heat dispersion structure of electronic device |
| CN210835965U (en) * | 2019-12-24 | 2020-06-23 | 深圳市集力成科技有限公司 | Intelligent heat dissipation support structure for notebook computer |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105939594B (en) * | 2016-06-30 | 2018-12-14 | 海信集团有限公司 | The radiator and electronic equipment of electronic equipment |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101742878A (en) * | 2008-11-26 | 2010-06-16 | 英业达股份有限公司 | Heat dispersion structure of electronic device |
| CN210835965U (en) * | 2019-12-24 | 2020-06-23 | 深圳市集力成科技有限公司 | Intelligent heat dissipation support structure for notebook computer |
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| CN111741657A (en) | 2020-10-02 |
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