CN102802382A - Radiator device and module using same - Google Patents
Radiator device and module using same Download PDFInfo
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- CN102802382A CN102802382A CN201210263893XA CN201210263893A CN102802382A CN 102802382 A CN102802382 A CN 102802382A CN 201210263893X A CN201210263893X A CN 201210263893XA CN 201210263893 A CN201210263893 A CN 201210263893A CN 102802382 A CN102802382 A CN 102802382A
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- base plate
- mounting panel
- installation
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- 239000004020 conductor Substances 0.000 claims abstract description 29
- 238000009434 installation Methods 0.000 claims description 115
- 239000012809 cooling fluid Substances 0.000 claims description 33
- 230000005540 biological transmission Effects 0.000 claims description 18
- 239000000758 substrate Substances 0.000 abstract description 6
- 239000012530 fluid Substances 0.000 description 40
- 230000017525 heat dissipation Effects 0.000 description 22
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 13
- 239000011889 copper foil Substances 0.000 description 12
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 12
- 230000000694 effects Effects 0.000 description 6
- 238000001514 detection method Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000007769 metal material Substances 0.000 description 4
- 238000001816 cooling Methods 0.000 description 3
- 238000005538 encapsulation Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- 238000002309 gasification Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 235000019628 coolness Nutrition 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000006837 decompression Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000009775 high-speed stirring Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000009183 running Effects 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
Images
Classifications
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention relates to a radiator device. The radiator device is suitable for being used together with a module; the module comprises a transparent mounting plate and a plurality of light-emitting diodes mounted on the mounting surface of the mounting plate; the radiator device comprises a thermal conduction unit; the thermal conduction unit comprises a mounting substrate and a plurality of conductors mounted on the mounting substrate; the mounting substrate is provided with a first mounting surface and a second mounting surface which is identical to the first mounting surface and is provided with a predetermined circuit track; each conductor is provided with a first end part which is electrically connected to the corresponding circuit track of the second mounting surface of the mounting substrate as well as a second end part which is electrically connected with the light-emitting diodes of the module; when power is supplied to the plurality of conductors, the temperature of the second end part is lower than the temperature of the first end part, so that the operating temperature of each light-emitting diode is lowered; and the radiator device also comprises a fan unit which is mounted on the first mounting surface of the mounting substrate.
Description
The application is that application number is dividing an application of 200910209034.0 one Chinese patent application, and the applying date of this one Chinese patent application is on October 30th, 2009, and denomination of invention is " a kind of heat sink arrangement and a kind of module of using this heat sink arrangement ".
Technical field
The present invention relates to a kind of heat sink arrangement and a kind of module of using this heat sink arrangement.
Background technology
In lighting apparatus, using light-emitting diode is the trend in the whole world as light source.Yet up to the present the operational temperature that can effectively reduce light-emitting diode does not have anyone to propose to suppress light decay and then to promote the method for brightness or install as yet, to such an extent as to light-emitting diode still can't be popularized in the application of lighting apparatus at present comprehensively.
Summary of the invention
One object of the present invention is that a kind of heat sink arrangement and a kind of module of using it are provided.
According to characteristic of the present invention; A kind of heat sink arrangement is provided; This heat sink arrangement is suitable for using with a module; This module comprises a mounting panel, and this heat sink arrangement comprises: a metallic heat-radiating element, this metallic heat-radiating element have a body and a plurality of upwardly extending separate radiating fin of upper surface from this body; Form a upper surface and the through hole of lower surface that connects it at the middle body of this body, this through hole is suitable for supplying the projection embedding at the opposite back side of the installation surface with electronic component is installed of mounting panel of this module; Unit, a gang of Pu, this unit, group Pu comprise one be arranged at the body of this heat dissipation element installation region, group Pu and the ccontaining housing, that is filled with cooling fluid of upper surface be arranged within this ccontaining housing and also be installed on one from the roof of this ccontaining housing to group's Pu vane group of the end portion of the rotating shaft that extends below, and one be installed on this rotating shaft the upper part by moving magnet; One fluid conduit systems can flow at this fluid conduit systems and this putting part body-internal-circulation to such an extent as to this fluid conduit systems is filled with the identical cooling fluid of cooling fluid in the ccontaining housing with this unit, group Pu and is communicated with cooling fluid with this ccontaining housing; An and fan unit; This fan unit is arranged on the radiating fin of this metallic heat-radiating element and comprises that one has one and extends and be installed on the active magnet of the end portion of this driving shaft by the driving shaft of the end portion of moving magnet and near this; When this fan unit start,, this active magnet circulates at a high speed with the cooling fluid of reaching in this fluid conduit systems to such an extent as to rotating to be rotated together along with active magnet and make group's Pu vane group rotate by moving magnet with this driving shaft.
According to another characteristic of the invention; A kind of heat sink arrangement is provided; This heat sink arrangement is suitable for using with a module, and this module comprises a mounting panel, and this heat sink arrangement comprises: one first metallic heat-radiating element; This first metallic heat-radiating element has a body and a plurality of upwardly extending separate radiating fin of upper surface from this body, on the upper surface of this body, is formed with a group unit, Pu alcove is installed; Unit, a gang of Pu, this unit, group Pu comprise one be arranged at the body of this first metallic heat-radiating element unit, the group Pu ccontaining housing, alcove being installed and being filled with cooling fluid be arranged within this ccontaining housing and also be installed on one from the roof of this ccontaining housing to group's Pu vane group of the end portion of the rotating shaft that extends below, and one be installed on this rotating shaft the upper part by moving magnet; One fan unit; This fan unit is arranged on the radiating fin of this first metallic heat-radiating element and comprises that one has one and extends and be installed on the active magnet of the end portion of this driving shaft by the driving shaft of the end portion of moving magnet and near this; When this fan unit start, to such an extent as to this active magnet rotates by moving magnet along with active magnet rotates together with this driving shaft; Second metallic heat-radiating element that places this first metallic heat-radiating element next door; This second metallic heat-radiating element have one be arranged at this module lip-deep body, the body of this second metallic heat-radiating element has a plurality of upwardly extending radiating fins and its lower surface is formed with a ccontaining alcove in the position corresponding to this module; And the fluid conduit systems of the identical cooling fluid of the cooling fluid in ccontaining housing that is filled with this unit, group Pu, to such an extent as to be communicated with this ccontaining housing and have a middle interconnecting piece cooling fluid that passes the body of this second metallic heat-radiating element can be mobile at this fluid conduit systems and this putting part body-internal-circulation for this fluid conduit systems.
According to a characteristic more of the present invention; A kind of heat sink arrangement is provided; This heat sink arrangement is suitable for using with a module; This module comprises a mounting panel; This heat sink arrangement comprises: a metallic heat-radiating element, this metallic heat-radiating element are arranged on the back side of mounting panel of this module and comprise roughly body, a plurality of radiating fin, and the ring-type collector pipe of circular shape, and this body has a lower surface that contacts with the back side of the mounting panel of this module and this body is formed with a water leg along its periphery extension in inside; The ccontaining alcove in unit, a gang of Pu is formed on the upper surface of this body; These a plurality of radiating fins extend upward and radially separate one another along the periphery of this body from the upper surface of this body, and each radiating fin is formed with at least one passage that runs through its upper and lower end parts and be communicated with this water leg, this ring-type collector pipe be arranged at this radiating fin the upper part and also with the channel connection of this radiating fin; One fan unit; This fan unit comprises a driving shaft, a sets of fan blades, reaches an active magnet; The end portion of this driving shaft extends near this body; To such an extent as to this sets of fan blades is installed on the upper part of this driving shaft when this driving shaft is rotated, this sets of fan blades is rotated with this driving shaft, and this active magnet is installed on the end portion of this driving shaft rotating with this driving shaft; Unit, a gang of Pu; This unit, group Pu comprises a ccontaining housing, a gang of Pu vane group, reaches one by moving magnet; To such an extent as to this ccontaining housing is arranged at the roof of this ccontaining housing in the ccontaining alcove in unit, group Pu of this body near this active magnet; This group's Pu vane group is installed on one from the roof of this ccontaining housing end portion to the installation shaft that extends below; This is arranged at the roof of the upper part of this installation shaft near this ccontaining housing by moving magnet, and connects helping the Pu vane group to rotate with this with this group's Pu vane group; One output duct, this output duct have one and are arranged at this body interior and output that the input and that is communicated with the fluid output port of this ccontaining housing extends upward and is communicated with this collector pipe; And an input pipe, this input pipe is arranged at this body interior and has the input that the output and that is communicated with the fluid input port of this ccontaining housing is communicated with this water leg.
According to another feature again more of the present invention; A kind of heat sink arrangement is provided; This heat sink arrangement is suitable for using with a module; This module comprises a transparent mounting panel and a plurality of light-emitting diode that is installed on the installation surface of this mounting panel; This heat sink arrangement comprises: a heat transmission unit; This heat transmission unit comprises an installation base plate and a plurality of conductor that is installed on this installation base plate, and it is identical with this first installation surface with one and be laid with second installation surface of predetermined circuit trace that this installation base plate has one first installation surface, and each conductor has first terminal and second end portion that is electrically connected with the light-emitting diode of this module of the corresponding electrical circuits track of second installation surface that is electrically connected to this installation base plate; When this conductor is provided with electric power, to such an extent as to the temperature of second end portion is able to be lowered than the operational temperature of low this light-emitting diode of temperature of first end portion; And a fan unit, this fan unit is installed on first installation surface of this installation base plate.
According to another feature again of the present invention, a kind of light-emitting diode (LED) module is provided, and this light-emitting diode (LED) module comprises: a transparent mounting panel; A plurality of light-emitting diodes that are installed on the installation surface of this mounting panel; On a plurality of that be installed on this mounting panel and the installation surface opposing backside surface, be positioned at the lens of the correspondence position of this light-emitting diode; One heat transmission unit; This heat transmission unit comprises an installation base plate and a plurality of conductor that is installed on this installation base plate; It is identical with this first installation surface with one and be laid with second installation surface of predetermined circuit trace that this installation base plate has one first installation surface; Each conductor has first terminal and second end portion that is electrically connected with the light-emitting diode of this module of the corresponding electrical circuits track of second installation surface that is electrically connected to this installation base plate; When this conductor is provided with electric power, to such an extent as to the temperature of second end portion is able to be lowered than the operational temperature of low this light-emitting diode of temperature of first end portion; And a fan unit, this fan unit is installed on first installation surface of this installation base plate.
According to another feature more again of the present invention, a kind of solar module is provided, and comprising: a transparent mounting panel; One is installed on the transparency conducting layer of the installation surface of this mounting panel; This transparency conducting layer of a plurality of mats is installed on the solar cell of the installation surface of this mounting panel; On a plurality of that be installed on this mounting panel and the installation surface opposing backside surface, be positioned at the lens of the correspondence position of this solar cell; One heat transmission unit; This heat transmission unit comprises an installation base plate and a plurality of conductor that is installed on this installation base plate; It is identical with this first installation surface with one and be laid with second installation surface of predetermined circuit trace that this installation base plate has one first installation surface; Each conductor has first terminal and second end portion that is electrically connected with the solar cell of this module of the corresponding electrical circuits track of second installation surface that is electrically connected to this installation base plate; When this conductor is provided with electric power, to such an extent as to the temperature of second end portion is able to be lowered than the operational temperature of low this solar cell of temperature of first end portion; And a fan unit, this fan unit is installed on first installation surface of this installation base plate.
Description of drawings
Fig. 1 to 3 is the sketch map of the heat sink arrangement of the demonstration first embodiment of the present invention;
Fig. 4 to 5 is for showing the sketch map of the variation of employed electronic component in the module of using heat sink arrangement of the present invention;
Fig. 6 to 8 is the sketch map of the heat sink arrangement of the demonstration second embodiment of the present invention;
Fig. 9 is an illustrative circuitry calcspar that is presented at employed safety device in the heat sink arrangement of the present invention;
Figure 10 and 11 is the sketch map that shows the heat sink arrangement of the third embodiment of the present invention;
Figure 12 to 14 for show can be in heat sink arrangement of the present invention the schematic plan view of employed auxiliary heat dissipation element;
Figure 15 to 19 is the sketch map of the heat sink arrangement of the demonstration fourth embodiment of the present invention;
Figure 20 is a schematic sectional view that shows the heat sink arrangement of the fifth embodiment of the present invention;
Figure 21 is a schematic sectional view that shows the heat sink arrangement of the sixth embodiment of the present invention;
Figure 22 is the schematic sectional view of the variation of a heat sink arrangement that shows the first embodiment of the present invention;
Figure 23 is the schematic sectional view of the variation of a heat sink arrangement that shows the sixth embodiment of the present invention;
Figure 24 is the schematic sectional view of the variation of a heat sink arrangement that shows the sixth embodiment of the present invention;
Figure 25 is the schematic sectional view of the variation of a heat sink arrangement that shows the sixth embodiment of the present invention;
Figure 26 is the schematic sectional view of another variation of a heat sink arrangement that shows the sixth embodiment of the present invention;
Figure 27 is a schematic sectional view that shows the aspect when heat sink arrangement of the present invention uses with the memory body module; And
Figure 28 is the schematic sectional view of the variation of a heat sink arrangement that shows the first embodiment of the present invention.
Embodiment
In the detailed description of the preferred embodiments of the present invention at the back, identical or similar elements is indicated by identical label, and their detailed description will be omitted.In addition, for clear announcement characteristic of the present invention, the element in graphic is not to describe by actual ratio.
Fig. 1 to 3 is the sketch map of the heat sink arrangement of demonstration first preferred embodiment of the invention.In Fig. 3, the sets of fan blades 32 of fan unit 3 removes from installing rack 30.
See also shown in Fig. 1 to 3, the heat sink arrangement of first preferred embodiment of the invention comprises a metallic heat-radiating element 1, unit, a gang of Pu 2, a fluid conduit systems 4, an and fan unit 3 substantially.
This metallic heat-radiating element 1 comprises a body roughly in a rectangular shape 10 and a plurality of upper surface 102 upwardly extending separate radiating fins 11 from this body 10.Middle body at this body 10 forms a through hole 12 that connects its upper surface 102 and lower surface 101.In the present embodiment, this through hole 12 is embedded as example with the projection 91 at the opposite back side of the installation surface with light-emitting diode 92 is installed of the mounting panel 90 that is suitable for supplying a light-emitting diode (LED) module 9.That is, in the present embodiment, this heat sink arrangement is used to reduce the operational temperature of light-emitting diode (LED) module 9.
In the present embodiment, this heat dissipation element 1 is made of aluminum.Yet this heat dissipation element 1 can also be processed by any other material that is fit to.In addition, the middle body of the upper surface 102 of this body 10 is a group installation region, Pu, and therefore, this radiating fin 11 is not formed within this installation region, group Pu, as shown in Fig. 1 and 2.
This unit, group Pu 2 comprises that a ccontaining housing 20, a gang of Pu vane group 21 and are by moving magnet 22.
To such an extent as to this ccontaining housing 20 is arranged at the inside of this ccontaining housing 20 of installation region, group Pu of upper surface 102 of the body 10 of this heat dissipation element 1 and can gets into via the through hole of this body 10 12.This ccontaining housing 20 also has a fluid input port 200 and a fluid output port 201.The inner filling of this ccontaining housing 20 has cooling fluid.In the present embodiment, this ccontaining housing 20 is made for the best by metal material.Yet this ccontaining housing 20 can also be processed by any other material that is fit to.
This group's Pu vane group 21 is arranged within this ccontaining housing 20 and is installed on one from the roof of this ccontaining housing 20 end portion to the rotating shaft that extends below 23.In the present embodiment, this group's Pu vane group 21 is made for the best by metal material.Yet this group's Pu vane group 21 also can be processed by any suitable material as plastic cement.
This is installed on the roof of the upper part of this rotating shaft 23 near this ccontaining housing 20 by moving magnet 22.
This fluid conduit systems 4 is filled with the cooling fluid 29 identical with the cooling fluid 29 of filling in the ccontaining housing 20 of this unit, group Pu 2 and has middle interconnecting piece 42 (see figure 2)s that the form with cranky that fluid input port 41 and that the fluid outlet 40, that is communicated with the fluid input port 200 of this ccontaining housing 20 is communicated with the fluid output port 201 of this ccontaining housing 20 is communicated with this fluid output 40 and this fluid input port 41 is passed this radiating fin 11.Therefore, when group's Pu vane group 21 of this group unit, Pu 2 was rotated, cooling fluid 29 circulated in this fluid conduit systems 4 and this ccontaining housing 20.
This fan unit 3 comprises an installing rack 30, a driving shaft vertical with this body 10 31, a sets of fan blades 32, an and magnet 33 initiatively.
This installing rack 30 is set on the radiating fin 11 of this metallic heat-radiating element 1 with any suitable known manner.
This driving shaft 31 is rotatably installed on this installing rack 30 and known in known manner and is driven by a motor sub-assembly (not shown).This driving shaft 31 is aimed at the installation shaft 23 of this unit, group Pu 2 and its end portion extends downwardly near the roof near the ccontaining housing 20 of this unit, group Pu 2.
To such an extent as to this sets of fan blades 32 is installed on the upper part of this driving shaft 31 when this driving shaft 31 is rotated by driving, this sets of fan blades 32 is rotated with this driving shaft 31.Should be noted that in the present embodiment this sets of fan blades 32 can be rotated with the speed of the thousands of commentaries on classics of per minute.
This active magnet 33 is installed in the end portion of this driving shaft 31 rotating with this driving shaft 31.Since the effect of magnetic attraction, the rotation of this active magnet 33 cause this unit, group Pu 2 by the rotation of moving magnet 23, cause the rotation of this group's Pu vane group 21 thus.
By structure as above; Because fluid conduit systems 4 contacts with radiating fin 11 with the body 10 of this heat dissipation element 1; When the sets of fan blades 32 of this fan unit 3 during with the high speed rotating of the thousands of commentaries on classics of per minute; This active magnet 33 with this by moving magnet 22 along with these sets of fan blades 32 high speed rotating circulate to reach the hot-swap feature of cooling fluid 29 and this body 10 and radiating fin 11 in this fluid conduit systems 4 to reach cooling fluid 29 in this fluid conduit systems 4 can make these group's Pu vane group 21 high speed rotating at high speed, reduce the temperature of this light-emitting diode (LED) module 9 thus.
Because this sets of fan blades 32 is with high speed rotating, to such an extent as to this group Pu vane group 21 thus also with the flowing velocity of high speed rotating fluid in fluid conduit systems 4 very soon can reach high efficiency heat exchange.Moreover; Because the middle interconnecting piece 42 of this fluid conduit systems 4 passes the body 10 and radiating fin 11 of this heat dissipation element 1 with cranky mode; This fluid conduit systems 4 increases with the area that the body 10 of heat dissipation element 1 contacts with radiating fin 11, strengthens radiating efficiency thus.In addition, the cooling fluid 29 of group's Pu vane group 21 high speed stirrings in ccontaining housing 20 also produces the effect of cooling fluid 29 coolings.
On the other hand, the cooling air that blows from lower to upper or blow from top to bottom that produced of sets of fan blades 32 causes the effect of cross-ventilation with further lifting cooling.
In addition, the cooling fluid in fluid conduit systems 4 29 can for water, be added with cooling fluid water, be added with the water of low ignition point liquid and similar.For example, this cooling fluid 29 can comprise 50% alcohol and 50% water.Be added with the cooling fluid 29 of low ignition point liquid owing to have the characteristic that is easy to gasify, therefore when gasification, can make the further lifting of flow velocity and the heat exchanger effectiveness of cooling fluid 29 higher.On the other hand, owing to mix, therefore aspect fail safe, there is not doubt with water.Certainly, this cooling fluid 29 also can be a gas.
Moreover; By the driving shaft 31 of fan unit 3 aims at the installation shaft 23 of group unit, Pu 2 and by contactless active magnet 32 with by the design of moving magnet 22, to such an extent as to the inside of the ccontaining housing 20 of this fluid conduit systems 4 and this unit, group Pu 2 cooling fluid 29 of one-tenth vacuum state in the ccontaining housing 20 of this fluid conduit systems 4 and this unit, group Pu 2 can not leak.
In Fig. 1; The LED encapsulation body 92 of this light-emitting diode (LED) module 9 is installed with the routing mode; Yet this LED encapsulation body 92 can also be installed to cover crystalline substance (Flip-Chip) mode, and is as shown in fig. 4; Perhaps this LED encapsulation body 92 is commercially available emitter, and is as shown in fig. 5.
Fig. 6 to 8 is the schematic plan view of the heat sink arrangement of demonstration second preferred embodiment of the invention; Wherein, Fig. 6 is the diagrammatic side view of the heat sink arrangement of this second preferred embodiment of demonstration; The top schematic view of Fig. 7 for removing fan unit, and the top schematic view of Fig. 8 for removing fan unit and radiating fin.
See also shown in Fig. 6 to 8, in the present embodiment, the ccontaining housing 20 of this unit, group Pu 2 is arranged within this perforation 12.Because the structure of this group unit, Pu 2 is identical with first preferred embodiment, repeats no more at this.On the other hand, the middle interconnecting piece 42 of fluid conduit systems 4 also passes this body 10 except passing this radiating fin 11.
Fig. 9 is an illustrative circuitry calcspar that is presented at employed safety device in the heat sink arrangement of the present invention.
See also shown in Figure 9, this safety device comprise substantially one in series be connected the fan motor 34 of this fan unit 3 and vacuum decompression circuit breaker 37, that the PTR variable resistance between the fan power supply 36 35, is electrically connected to this fan power supply be electrically connected to this circuit breaker 37 control circuit 39, and one be electrically connected to this control circuit 39 the detector 38 of rotating speed that is used to detect this fan motor 34.
This variable resistance 35 is the variable resistance that a kind of its resistance value and temperature are inversely proportional to and change.Therefore this variable resistance 35 is located on the body 10 of this heat dissipation element 1, and the temperature of the body 10 of its resistance value and this heat dissipation element 1 is inversely proportional to.That is, when the temperature of the body 10 of this heat dissipation element 1 rises,, the resistance value of variable resistance 35 drives this sets of fan blades 32 with high rotational speed to such an extent as to reducing this fan motor 34.Otherwise when the temperature of the body 10 of this heat dissipation element 1 descended, this fan motor 34 drove this sets of fan blades 32 with lower rotating speed to such an extent as to the resistance value of variable resistance 35 rises.
This circuit breaker 37 can operate and cut off this fan power supply 36.
This detector 38 is used to detect the rotating speed of this fan motor 34, and produces the detection signal of the rotating speed of this motor 34 of expression.This control circuit 39 receives this detection signal and makes comparisons the reference signal of the rated speed of this detection signal and this motor of expression.When this detection signal is bigger than this reference signal; The normal rotating speed of rotating ratio of representing this motor 34 is high; Representative has drainage, so this control circuit 39 outputs one start signal interrupts this fan power supply 36 to guarantee safety to this circuit breaker 37 with this circuit breaker 37 of start.
Figure 10 and 11 is the schematic plan view that shows the heat sink arrangement of third preferred embodiment of the invention.
See also shown in Figure 10 and 11, the heat sink arrangement of the 3rd preferred embodiment comprises one first metallic heat-radiating element 1, unit, a gang of Pu 2, a fan unit 3, a fluid conduit systems 4, and one second metallic heat-radiating element 7 substantially.
This second metallic heat-radiating element 7 have one be arranged at this light-emitting diode (LED) module 9 lip-deep body 70.This body 70 has a plurality of upwardly extending radiating fins 71 and its lower surface 701 is formed with a ccontaining alcove 703 in the position corresponding to this light-emitting diode (LED) module 9.
One auxiliary heat dissipation sheet 5 by, for example, copper becomes and is installed in the ccontaining alcove 703 of this body 70 contact with the back side of the mounting panel 90 of this light-emitting diode (LED) module 9, promotes the heat exchanger effectiveness of this heat dissipation element 7 and this light-emitting diode (LED) module 9 thus.
This first metallic heat-radiating element 1 have one be arranged at a side of this second metallic heat-radiating element 7 body 10 and a plurality of upwardly extending radiating fin 11.This body 10 above that the surface be formed with on 102 one be used for the ccontaining housing 20 of ccontaining this unit, group Pu 2 unit, group Pu installation alcove 104.Because other structures of this group unit, Pu 2 identical with shown in Fig. 1 and 6 repeated no more at this.
The structure of this fan unit 3 identical with shown in Fig. 1 and 6, therefore, it is described in detail in this and repeats no more.
Figure 12 to 14 for show can be in heat sink arrangement of the present invention the schematic plan view of employed auxiliary heat dissipation element.
See also shown in Figure 12 to 14, each auxiliary heat dissipation element 13 is attached at the surface of the radiating fin 11 of metallic heat-radiating element 1.
This auxiliary heat dissipation element 13 can be called as so-called heat pipe (heat pipe) and respectively have a bottom 130, an intermediate layer 131, first and second copper foil 132 and 133, an and top layer 134.
This bottom 130 is one to have a flexible film by what PI and BS formed.This bottom 130 has one near the first surface 1300 on the surface of a corresponding radiating fin 11 and one and these first surface 1300 opposing second surface 1301.This first copper foil 132 with, for example, mode of printing is set on this second surface 1301 and its two end portions 1320 convexedly stretches in outside this bottom 130.Should be noted that this first copper foil 132 also can replace with any other tinsel that is fit to.
This intermediate layer 131 is formed on this first copper foil 132.In the present embodiment, this intermediate layer 131 is formed by photoresist.This intermediate layer 131 is formed with and a plurality ofly extends to other end part and run through the perforate 1310 on its two surfaces from the one of which end parts.A plurality of pores 1311 are come on the hole wall that forms each perforate 1310, to form via sintering processes in this intermediate layer 131.
This second copper foil 133 is to be arranged on this intermediate layer 131 with first copper foil, 132 identical modes.Identical with this first copper foil 132, two end portion 1330 of this second copper foil 133 protrude out outside this intermediate layer 131.
This top layer 134 is to form and to be arranged on this second copper foil 133 with these bottom 130 identical materials.
First and second copper foils 132 of each auxiliary heat dissipation element 13 contact with this body 10 with corresponding radiating fin 11 respectively with 1330 with 133 end portion 1320.
By structure as above, first and second copper foils 132 and 133 can carry out heat exchange with body 10 and radiating fin 11, promote heat radiation function thus.To such an extent as to should be noted that in the perforate 1310 in this intermediate layer 131, can add the low ignition point fluid when first and second copper foils 132 with 133 and body 10 and radiating fin 132 and 133 carry out heat exchange and can gasify rapidly.Low ignition point fluid through gasification is borrowing capillary condensation principle (capillary condensation) to transform back into liquid state via this pore 1311.
Figure 15 to 19 is the sketch map of the heat sink arrangement of demonstration fourth embodiment of the invention.
See also shown in Figure 15 to 19, the heat sink arrangement of present embodiment comprises the L shaped output duct of a metallic heat-radiating element 1 ', a fan unit 3, unit, a gang of Pu 2, one 106, an input pipe 107, and a plurality of auxiliary heat dissipation elements 13 substantially.
This metallic heat-radiating element 1 ' is arranged on the back side of mounting panel 90 of this light-emitting diode (LED) module 9 and comprises roughly body 10 ', a plurality of radiating fin 11 ', and the ring-type collector pipe 14 of circular shape.
This body 10 ' has a lower surface 101 ' that contacts with the back side of the mounting panel 90 of this light-emitting diode (LED) module 9, and as shown in Figure 19, this body 10 ' is formed with the water leg 105 that extends along its periphery in inside.The ccontaining alcove 104 in unit, a gang of Pu is formed on the upper surface 102 ' of this body 10 '.
These a plurality of radiating fins 11 ' extend upward and radially separate one another along the periphery of this body 10 ' from the upper surface 102 ' of this body 10 '.Each radiating fin 11 ' is formed with at least one passage 110 that runs through its upper and lower end parts and be communicated with this water leg 105.
This ring-type collector pipe 14 is arranged at the upper part of this radiating fin 11 ' and is communicated with the passage 110 of this fin 11 '.
This fan unit 3 comprises an installing rack 30, a driving shaft vertical with this body 10 31, a sets of fan blades 32, an and magnet 33 initiatively.
This installing rack 30 is surrounded by this radiating fin 11 ' and is connected can be fixed on one and these collector pipe 14 much the same levels with this radiating fin 11 '.
This driving shaft 31 is rotatably installed on this installing rack 30 with the mode identical with aforesaid embodiment.The end portion of this driving shaft 31 is to extending below near this body 10 '.
To such an extent as to this sets of fan blades 32 is installed on the upper part of this driving shaft 31 when this driving shaft 31 is rotated by driving, this sets of fan blades 32 is rotated with this driving shaft 31.
This active magnet 33 is installed in the end portion of this driving shaft 31 rotating with this driving shaft 31.
This unit, group Pu 2 comprises a ccontaining housing 20, a gang of Pu vane group 21, and one by moving magnet 22.
To such an extent as to this ccontaining housing 20 is arranged at the roof of this ccontaining housing 20 in the ccontaining alcove 104 in the unit, group Pu of this body 10 ' near this active magnet 33.This ccontaining housing 20 has a fluid input port 200 and a fluid output port 201.In the present embodiment, this ccontaining housing 20 is processed by metal material.
This group's Pu vane group 21 is rotatably installed on one from the roof of this ccontaining housing 20 end portion to the installation shaft that extends below 23.In the present embodiment, this group's Pu vane group 21 is processed by metal material.
This is arranged at the roof of the upper part of this installation shaft 23 near this ccontaining housing 20 rotationally by moving magnet 22, and connects helping Pu vane group 21 to rotate with this with this group's Pu vane group 21.
This output duct 106 has one and is arranged at the output 1061 that this body 10 ' is inner and input 1060 and that be communicated with the fluid output port 201 of this ccontaining housing 20 extends upward and is communicated with this collector pipe 14.
It is inner and have an input 1071 that the output 1070 and that is communicated with the fluid input port 200 of this ccontaining housing 20 is communicated with this water leg 105 that this input pipe 107 is arranged at this body 10 '.
This auxiliary heat dissipation element 13 with at identical described in Figure 12 to 14 and the outer surface that is attached at the lower surface 101 ' of this body 10 ' and extends to corresponding one in this radiating fin 11 ' carrying out heat exchange with the cooling fluid 29 in this corresponding radiating fin 11 ', further promote radiating effect thus.
By as above constructing; When this group's Pu vane group 21 is rotated owing to the rotation of this sets of fan blades 32; Cooling fluid 29 will be transferred to this collector pipe 14 from this ccontaining housing 20 via this output duct 106; Then be transferred to this water leg 105, get into this ccontaining housing 20 via this input pipe 107 more at last via passage 110.
Figure 20 is a schematic sectional view that shows the heat sink arrangement of fifth embodiment of the invention.
See also shown in Figure 20ly, the heat sink arrangement of present embodiment comprises a fan unit 3 and a heat transmission unit 6.
This heat transmission unit 6 comprises that an installation base plate 60 and a plurality of is installed on the conductor of being processed by semi-conducting material 61 on this installation base plate 60.
In the present embodiment, this installation base plate 60 be a ceramic substrate and also have one first installation surface and one with this first installation surface relatively and be laid with second installation surface of predetermined circuit trace 600.This fan unit 3 is installed on first installation surface of this installation base plate 60.
Each conductor 61 have one be electrically connected to second installation surface of this installation base plate 60 first electrode 610 of corresponding electrical circuits track.Each conductor 61 has second electrode 611 that is electrically connected with the light-emitting diode 92 of a light-emitting diode (LED) module 9.In the present embodiment; First electrode 610 of this conductor 61 is N type zone for p type island region territory second electrode 611; Therefore; When this conductor 61 was provided with electric power via sort circuit track 600, this conductor 61 had and is transferred to the thermal conduction effect near an end parts of this installation base plate 60 to heat from the end parts away from this installation base plate 60.
This light-emitting diode (LED) module 9 has a transparent mounting panel 90 and a plurality of light-emitting diode 92 that is installed on the installation surface of this mounting panel 90 operationally.This light-emitting diode has second electrode 921 that first electrode 920 that connects with second electrode 611 of the corresponding conductor 61 of this conduction unit 6 and are electrically connected with corresponding electrical circuits track 98 on this mounting panel 90; Thus, this conductor 61 can reduce the operational temperature of this light-emitting diode 92.
Should be noted that; In the present embodiment; This light-emitting diode (LED) module 9 also comprises on a plurality of back sides opposite with installation surface that are installed on this mounting panel 90, is positioned at the lens 93 of the correspondence position of this light-emitting diode 92, and a reflecting plate 94 that surrounds this lens 93.In Figure 20, each lens 93 is shown as has a circular arc external surface, yet each lens 93 can also be formed has a plurality of flat outer surfaces.
Figure 21 is the schematic sectional view of the variation of a heat sink arrangement that shows the fifth embodiment of the present invention.Different with the 5th embodiment, this variation is used with solar module.This solar module comprise solar cell 95 on a mounting panel 90 ', a plurality of installation surface of coming to be installed on operationally this mounting panel 90 ' by a transparency conducting layer 96, and a plurality of back side opposite that is installed on this mounting panel 90 ' with installation surface on, be positioned at the lens 93 of the correspondence position of this solar cell 95.
Should be noted that can be more concentrated for light, can comprise also that in this variation one is installed in this mounting panel 90 ' and goes up can cover the snoot 900 that uses light to concentrate of being used to of this lens 93.
Figure 22 is the schematic sectional view of the variation of a heat sink arrangement that shows the first embodiment of the present invention.
As shown in Figure 22; The place different with first embodiment is that the mounting panel 90 of this light-emitting diode (LED) module 9 is a transparent mounting panel; And this light-emitting diode 92 is installed on the surface of projection 91 at the back side of this mounting panel 90 operationally, and mobile cooling fluid 29 is nonconducting in ccontaining housing 20 and fluid conduit systems 4.
Figure 23 A and 23B are respectively the schematic sectional view and signal part stereogram of the heat sink arrangement that shows the sixth embodiment of the present invention.
As shown in Figure 23 A and the 23B, the heat sink arrangement of present embodiment comprises a heat transmission unit 6.This heat transmission unit 6 has a microscler heat conduction installation base plate 60.This heat conduction installation base plate 60 has an installation surface and is laid on this installation surface, is arranged near a terminal predetermined circuit trace 62 (only the circuit trace 62 of part is presented at Figure 23 B).
To such an extent as to the light-emitting diode 92 of this light-emitting diode (LED) module 9 is installed on the electrode (not shown) of this light-emitting diode 92 on the installation surface of this installation base plate 60 operationally and is electrically connected with corresponding electrical circuits track 62 with matrix form.In addition, on the installation surface that light-emitting diode 92 is installed of this installation base plate 60, more be coated with the phosphor powder layer 97 of this light-emitting diode 92 of a covering.
Figure 24 is the schematic sectional view of the variation of a heat sink arrangement that shows the sixth embodiment of the present invention.
As shown in Figure 24, this variation only is that with the difference of Figure 23 A and the embodiment shown in the 23B installation of light-emitting diode 92 on the installation surface of installation base plate 60 is with lead 98 completion.
Figure 25 A and 25B are respectively the schematic sectional view and signal part stereogram of another variation of the heat sink arrangement that shows the sixth embodiment of the present invention.
As shown in Figure 25 A and the 25B, this variation only is that with the difference of Figure 23 A and the embodiment shown in the 23B this light-emitting diode 92 is the emitter star that can get on the market, therefore, can be omitted at the phosphor powder layer shown in Figure 23 A and the 23B.
Figure 26 is the schematic isometric of another variation of a heat sink arrangement that shows the sixth embodiment of the present invention.
As shown in Figure 26, be provided with one in another terminal relative end portion of this heat conduction installation base plate 60 and be placed in the cooling fluid bag 63 in it to this another end portion with being laid with circuit trace 62.To such an extent as to being installed in cooling fluid 29, this cooling fluid bag 63 in it, can promote the effect that this heat conduction installation base plate 60 reduces the operational temperature of light-emitting diode 92.
Figure 27 is a schematic sectional view that shows the aspect when heat sink arrangement of the present invention uses with the memory body module.
As shown in Figure 27, this memory body module 9 comprises a mounting panel 90 and a plurality of memory bodys 92 that are installed on operationally on this mounting panel 90.To such an extent as to this memory body module 9 places the non-electrode installation surface of this memory body 92 under this body 10 to contact with the lower surface of this body 10, the heat that when 9 runnings of memory body module, produces thus can dissipate via this body 10.
Figure 28 is the schematic sectional view of the variation of a heat sink arrangement that shows the first embodiment of the present invention.
As shown in Figure 28, the place different with first embodiment is that this module 9 is semiconductor IC module.The mounting panel 90 of this module 9 has one and is used to the lower surface of conduction connector 93 is installed and a plurality of semiconductor IC 92 is installed on the surface of the projection 91 of this mounting panel 90 operationally.
Claims (8)
1. heat sink arrangement, said heat sink arrangement is suitable for using with a module, and said module comprises a transparent mounting panel and a plurality of light-emitting diode that is installed on the installation surface of said mounting panel, and said heat sink arrangement is characterised in that and comprises:
A heat transmission unit; Said heat transmission unit comprises an installation base plate and a plurality of conductor that is installed on the said installation base plate; It is identical with said first installation surface with one and be laid with second installation surface of predetermined circuit trace that said installation base plate has one first installation surface; Each conductor has first terminal and second end portion that is electrically connected with the light-emitting diode of said module of the corresponding electrical circuits track of second installation surface that is electrically connected to said installation base plate; When said a plurality of conductors are provided with electric power, to such an extent as to the temperature of second end portion is able to be lowered than the operational temperature of the low said light-emitting diode of temperature of first end portion; And
A fan unit, said fan unit are installed on first installation surface of said installation base plate.
2. light-emitting diode (LED) module is characterized in that comprising:
A transparent mounting panel;
A plurality of light-emitting diodes that are installed on the installation surface of said mounting panel;
On a plurality of that be installed on said mounting panel and the installation surface opposing backside surface, be positioned at the lens of the correspondence position of said a plurality of light-emitting diodes;
One heat transmission unit; Said heat transmission unit comprises an installation base plate and a plurality of conductor that is installed on the said installation base plate; It is identical with said first installation surface with one and be laid with second installation surface of predetermined circuit trace that said installation base plate has one first installation surface; Each conductor has first terminal and second end portion that is electrically connected with the light-emitting diode of said module of the corresponding electrical circuits track of second installation surface that is electrically connected to said installation base plate; When said a plurality of conductors are provided with electric power, to such an extent as to the temperature of second end portion is able to be lowered than the operational temperature of the low said light-emitting diode of temperature of first end portion; And
One fan unit, said fan unit are installed on first installation surface of said installation base plate.
3. heat sink arrangement as claimed in claim 2 is characterized in that, also comprises a reflecting plate light emitting diode illuminating apparatus that surrounds said a plurality of lens.
4. heat sink arrangement as claimed in claim 2 is characterized in that, each lens can be formed has a plurality of flat outer surfaces.
5. solar module is characterized in that comprising:
A transparent mounting panel;
A transparency conducting layer that is installed on the installation surface of said mounting panel;
A plurality of solar cells that are installed on the installation surface of said mounting panel through said transparency conducting layer;
On a plurality of that be installed on said mounting panel and the installation surface opposing backside surface, be positioned at the lens of the correspondence position of said a plurality of solar cells;
A heat transmission unit; Said heat transmission unit comprises an installation base plate and a plurality of conductor that is installed on the said installation base plate; It is identical with said first installation surface with one and be laid with second installation surface of predetermined circuit trace that said installation base plate has one first installation surface; Each conductor has first terminal and second end portion that is electrically connected with the solar cell of said module of the corresponding electrical circuits track of second installation surface that is electrically connected to said installation base plate; When said a plurality of conductors are provided with electric power, to such an extent as to the temperature of second end portion is able to be lowered than the operational temperature of the low said solar cell of temperature of first end portion; And
A fan unit, said fan unit are installed on first installation surface of said installation base plate.
6. solar module as claimed in claim 5 also comprises a condenser that is covered on the said transparent mounting panel.
7. heat sink arrangement, said heat sink arrangement is suitable for using with a module, and said module comprises a mounting panel, and said heat sink arrangement is characterised in that and comprises:
A heat transmission unit; Said heat transmission unit has a microscler heat-conducting plate; The mounting panel of said module is suitable for being installed on the surface of an end portion of said heat-conducting plate, and said heat-conducting plate can be being transmitted to another end portion by the heat that element produced on the mounting panel of said module from said end portion.
8. heat sink arrangement as claimed in claim 7 is characterized in that, also comprises a cooling fluid storage tank that is installed in cooling fluid that coats said another end portion of said heat-conducting plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210263893XA CN102802382A (en) | 2009-10-30 | 2009-10-30 | Radiator device and module using same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210263893XA CN102802382A (en) | 2009-10-30 | 2009-10-30 | Radiator device and module using same |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009102090340A Division CN102056452B (en) | 2009-10-30 | 2009-10-30 | Heat radiator device and module using same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102802382A true CN102802382A (en) | 2012-11-28 |
Family
ID=47201306
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210263893XA Pending CN102802382A (en) | 2009-10-30 | 2009-10-30 | Radiator device and module using same |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102802382A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105428513A (en) * | 2015-12-10 | 2016-03-23 | 佛山市南海区联合广东新光源产业创新中心 | White light LED light source |
| CN105570692A (en) * | 2015-10-16 | 2016-05-11 | 马根昌 | Wind wheel type heat dissipation LED lamp |
| CN109874267A (en) * | 2017-12-01 | 2019-06-11 | 纬创资通股份有限公司 | Electronic equipment and its radiator with cooling system |
| CN113102560A (en) * | 2021-04-16 | 2021-07-13 | 广东言铝铝业有限公司 | Straightening machine |
-
2009
- 2009-10-30 CN CN201210263893XA patent/CN102802382A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105570692A (en) * | 2015-10-16 | 2016-05-11 | 马根昌 | Wind wheel type heat dissipation LED lamp |
| CN105570692B (en) * | 2015-10-16 | 2018-07-27 | 沈阳北方防爆股份有限公司 | Wind wheel type heat radiating LED lamp |
| CN105428513A (en) * | 2015-12-10 | 2016-03-23 | 佛山市南海区联合广东新光源产业创新中心 | White light LED light source |
| CN105428513B (en) * | 2015-12-10 | 2018-01-19 | 佛山市南海区联合广东新光源产业创新中心 | A kind of white LED light source |
| CN109874267A (en) * | 2017-12-01 | 2019-06-11 | 纬创资通股份有限公司 | Electronic equipment and its radiator with cooling system |
| CN113102560A (en) * | 2021-04-16 | 2021-07-13 | 广东言铝铝业有限公司 | Straightening machine |
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Owner name: CHANGCHUNTENG HOLDING CO., LTD. Free format text: FORMER OWNER: SHEN YUNONG Effective date: 20130204 Free format text: FORMER OWNER: WANG CONGQI Effective date: 20130204 |
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Effective date of registration: 20130204 Address after: Virgin Islands (British) Applicant after: CHANGCHUNTENG HOLDING Co.,Ltd. Address before: Taipei City, Taiwan, China Applicant before: Shen Yunong Applicant before: Wang Congqi |
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Application publication date: 20121128 |