CN105428513A - White light LED light source - Google Patents
White light LED light source Download PDFInfo
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- CN105428513A CN105428513A CN201510910753.0A CN201510910753A CN105428513A CN 105428513 A CN105428513 A CN 105428513A CN 201510910753 A CN201510910753 A CN 201510910753A CN 105428513 A CN105428513 A CN 105428513A
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- fixedly connected
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- heating panel
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/647—Heat extraction or cooling elements the elements conducting electric current to or from the semiconductor body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/642—Heat extraction or cooling elements characterized by the shape
Abstract
A white light LED light source comprises a lens (1), a frame body (2), a support apparatus (3), a base plate apparatus (4), a cooling device (5) and a luminescence apparatus (6). The lens (1) is provided with a reflective bucket (11). The frame body (2) is provided with a square hole (22), a first through hole (21), an epoxy resin colloid layer (23), a fluorescent powder adhesive layer (24) and a second through hole (25). The support apparatus (3) is provided with a thermal-conductive plate (31), a first support (32), a second support (33), a spring (34) and a fixing block (35). The base plate apparatus (4) comprises a heat sink (41), a base plate (42) and a fastener (43). The cooling device (5) comprises a cooling frame (51), a fifth through hole and a water pipe (52). The luminescence apparatus (6) comprises a luminescence chip (61), a gold thread (62), a welding leg (63), a positioning block (64) and a positioning rod (65). By using the light source of the invention, effective heat dissipation can be performed on a circuit board and heat dissipation efficiency is high.
Description
Technical field
The present invention relates to LED technology field, particularly relate to a kind of white LED light source.
Background technology
Along with the fast development of LED technology, luminous efficiency improves gradually, the market application of LED will be more extensive, especially under global energy shortage jeopardizes the background raised once again, LED more gets most of the attention in the prospect of illumination market, in the face of the huge market opportunity, each major company of the world accelerates the paces of innovation one after another, and the development of the development of LED industry and semiconductor technology and lighting source technology is closely related.
At present, universally recognized LED light source structure is various LED chip group by being fixed on an impact faces, then makes the light sent become white light by coating phosphor gel, and the glue that generally we commonly use is silica gel or epoxy resin.But the heat radiation of chip is a problem always, limit the raising of LED luminous efficiency.
Therefore, need to provide a kind of new technical scheme to solve the problems of the technologies described above.
Summary of the invention
The object of this invention is to provide a kind of white LED light source that can effectively solve the problems of the technologies described above.
In order to solve the problems of the technologies described above, the present invention adopts following technical scheme:
A kind of white LED light source, described white LED light source comprises lens, be positioned at the framework below described lens, be positioned at the holder device of the described framework left and right sides, be positioned at the pallet device below described holder device, the light-emitting device being positioned at the cooling device below described pallet device and being arranged on described pallet device, described lens are provided with reflective bucket, and described framework is provided with the square hole being positioned at upper surface, be positioned at the first through hole of side, be positioned at inner epoxy resin colloid layer, be positioned at the fluorescent material glue-line below described epoxy resin colloid layer and be positioned at the second through hole of lower surface, described holder device is provided with heat-conducting plate, be positioned at the first support of described heat-conducting plate side, be positioned at the second support of described first support side, the fixed block being arranged at the spring on described second support and being positioned at below described spring, described pallet device comprises heating panel, be positioned at the backing plate below described heating panel, be positioned at the fastener of the described heating panel left and right sides, described cooling device comprises cooling frame, be arranged at the some fifth holes on described cooling frame and be positioned at the water pipe of described cooling frame, described light-emitting device comprises luminescence chip, be arranged at the gold thread on described luminescence chip, be positioned at the leg of described luminescence chip side, be arranged at the locating piece on described leg and backstay.
Described reflective bucket is hollow round table-like, and the upper end of described reflective bucket is fixedly connected with the inner surface of described lens, and the lower surface of described reflective bucket and the lower surface of described lens are in same plane.
Described first through hole be provided with several and the left and right being evenly distributed on described framework on the surface, described first through hole communicates with the inside of described framework, described square hole is rectangular-shaped, described square hole communicates with the inside of described framework, described epoxy resin colloid layer is cuboid, described epoxy resin colloid layer is fixedly connected with the inner surface of described framework, described fluorescent material glue-line is cuboid, the upper surface of described fluorescent material glue-line contacts with the lower surface of described epoxy resin colloid layer, the side of described fluorescent material glue-line is fixedly connected with the inner surface of described framework, described second through hole is provided with two and lays respectively at the left and right sides, described second through hole communicates with the inside of described framework, the lower surface of described reflective bucket is fixedly connected with the upper surface of described framework.
Described heat-conducting plate is cuboid, the side of described heat-conducting plate is fixedly connected with the side of described framework, the upper surface of described heat-conducting plate and the upper surface of described framework are in same plane, the lower surface of described heat-conducting plate and the lower surface of described framework are in same plane, described first support is concave shape, one end of described first support is fixedly connected with the side of described heat-conducting plate, the other end of described first support is fixedly connected with the side of described lens, described fixed block is cuboid, the side of described fixed block is fixedly connected with the side of described heat-conducting plate, the lower surface of described fixed block and the lower surface of described heat-conducting plate are in same level, described second support is concave shape, one end of described second support is fixedly connected with the side of described fixed block, the other end of described second support is fixedly connected with described first support, described spring is horizontal, one end of described spring is fixedly connected with described heat-conducting plate, the other end of described spring is fixedly connected with described second support.
Described heating panel is cuboid, described heating panel horizontal positioned, the upper surface of described heating panel is fixedly connected with the lower surface of described framework, the lower surface of described fixed block is fixedly connected with the lower surface of described heating panel, described heating panel is provided with the third through-hole running through its upper and lower surface, described third through-hole is positioned at immediately below described second through hole, described backing plate is cuboid, described backing plate horizontal positioned, the upper surface of described backing plate is fixedly connected with the lower surface of described heating panel, described backing plate is provided with the fourth hole running through its upper and lower surface, described fourth hole is provided with two and lays respectively at the left and right sides, described fourth hole is positioned at the below of described third through-hole, described fastener is provided with two and lays respectively at the left and right sides, described fastener is concave shape, described fastener is buckled in the two ends of described heating panel and backing plate.
The cross section of described cooling frame is concave shape, the upper surface of described cooling frame is fixedly connected with the lower surface of described backing plate, described fifth hole is provided with several and is evenly distributed on described cooling frame, described fifth hole communicates with the inside of described cooling frame, described water pipe is provided with several, and described water pipe adopts Heat Conduction Material to make.
Described luminescence chip is fixedly connected with the inner surface of described framework, described luminescence chip is positioned at the top of described second through hole, one end and the described luminescence chip of described gold thread are electrically connected, the other end and the described leg of described gold thread are electrically connected, described leg is L-type, described leg runs through the surfaces externally and internally of described framework and the upper and lower surface of heating panel and backing plate and is fixedly connected with it, described locating piece is cuboid, the upper surface of described locating piece is fixedly connected with the lower surface of described backing plate, the side of described locating piece is fixedly connected with described leg, described backstay is cuboid, described backstay horizontal positioned, one end of described backstay is fixedly connected with the inner surface of described framework, the other end of described backstay is fixedly connected with described leg.
After adopting technique scheme, tool of the present invention has the following advantages:
White LED light source structure of the present invention is simple, easy to use, effectively can dispel the heat to the heat that circuit board produces, radiating efficiency is high, and the light sent can be made to be white, meets specific requirement, stabilized structure, effectively can extend the useful life of product.
Accompanying drawing explanation
Be described further below in conjunction with the embodiment of accompanying drawing to white LED light source of the present invention:
Fig. 1 is the structural representation of white LED light source of the present invention.
Embodiment
As shown in Figure 1, the white LED light source of the present invention light-emitting device 6 that comprises lens 1, be positioned at framework 2 below described lens 1, be positioned at the holder device 3 of described framework 2 left and right sides, be positioned at pallet device 4 below described holder device 3, be positioned at the cooling device 5 below described pallet device 4 and be arranged on described pallet device 4.
As shown in Figure 1, described lens 1 are in hollow hemispherical, and described lens 1 adopt transparent material to make.Described lens 1 are provided with reflective bucket 11, and described reflective bucket 11 is in hollow round table-like, and the upper end of described reflective bucket 11 is fixedly connected with the inner surface of described lens 1.The lower surface of described reflective bucket 11 and the lower surface of described lens 1 are in same plane.
As shown in Figure 1, described framework 2 is in hollow cuboid, described framework 2 horizontal positioned, the lower surface of described lens 1 is fixedly connected with the upper surface of described framework 2, and described framework 2 is provided with the square hole 22 being positioned at upper surface, the first through hole 21 being positioned at side, is positioned at inner epoxy resin colloid layer 23, is positioned at the fluorescent material glue-line 24 below described epoxy resin colloid layer 23 and is positioned at the second through hole 25 of lower surface.Described first through hole 21 be provided with several and the left and right being evenly distributed on described framework 2 on the surface, described first through hole 21 is in cylindrical shape, and described first through hole 21 communicates with the inside of described framework 2.Described square hole 22 is in rectangular-shaped, and described square hole 22 communicates with the inside of described framework 2.Described epoxy resin colloid layer 23 is in cuboid, and described epoxy resin colloid layer 23 is fixedly connected with the inner surface of described framework 2.Described fluorescent material glue-line 24 is in cuboid, and the upper surface of described fluorescent material glue-line 24 contacts with the lower surface of described epoxy resin colloid layer 23, and the side of described fluorescent material glue-line 24 is fixedly connected with the inner surface of described framework 2.Described second through hole 25 is provided with two and lays respectively at the left and right sides, and described second through hole 25 is in cylindrical shape, and described second through hole 25 communicates with the inside of described framework 2.The lower surface of described reflective bucket 11 is fixedly connected with the upper surface of described framework 2.
As shown in Figure 1, described holder device 3 is provided with two and lays respectively at the left and right sides, and described holder device 3 is provided with heat-conducting plate 31, be positioned at the first support 32 of described heat-conducting plate 31 side, the second support 33 of being positioned at described first support 32 side, the fixed block 35 that is arranged at the spring 34 on described second support 33 and is positioned at below described spring 34.Described heat-conducting plate 31 is in cuboid, the side of described heat-conducting plate 31 is fixedly connected with the side of described framework 2, thus can fast the heat in framework 2 be distributed, the upper surface of described heat-conducting plate 31 and the upper surface of described framework 2 are in same plane, and the lower surface of described heat-conducting plate 31 and the lower surface of described framework 2 are in same plane.Described first support 32 is in concave shape, and one end of described first support 32 is fixedly connected with the side of described heat-conducting plate 31, and the other end of described first support 32 is fixedly connected with the side of described lens 1.Described fixed block 35 is in cuboid, and the side of described fixed block 35 is fixedly connected with the side of described heat-conducting plate 31, and the lower surface of described fixed block 35 and the lower surface of described heat-conducting plate 31 are in same level.Described second support 33 is in concave shape, and one end of described second support 33 is fixedly connected with the side of described fixed block 35, and the other end of described second support 33 is fixedly connected with described first support 32.Described spring 34 is horizontal, and one end of described spring 34 is fixedly connected with described heat-conducting plate 31, and the other end of described spring 34 is fixedly connected with described second support 33.
As shown in Figure 1, described pallet device 4 fastener 43 that comprises heating panel 41, be positioned at backing plate 42 below book heating panel 41, be positioned at described heating panel 41 left and right sides.Described heating panel 41 is in cuboid, described heating panel 41 horizontal positioned, the upper surface of described heating panel 41 is fixedly connected with the lower surface of described framework 2, the lower surface of described fixed block 35 is fixedly connected with the lower surface of described heating panel 41, described heating panel 41 is provided with the third through-hole 411 running through its upper and lower surface, described third through-hole 411 is in cylindrical shape, and described third through-hole 411 is positioned at immediately below described second through hole 25.Described backing plate 42 is in cuboid, described backing plate 42 horizontal positioned, the upper surface of described backing plate 42 is fixedly connected with the lower surface of described heating panel 41, described backing plate 42 is provided with the fourth hole 412 running through its upper and lower surface, described fourth hole 412 is provided with two and lays respectively at the left and right sides, described fourth hole 412 is in cylindrical shape, and described fourth hole 412 is positioned at the below of described third through-hole 411.Described fastener 43 is provided with two and lays respectively at the left and right sides, and described fastener 43 is in concave shape, and described fastener 43 is buckled in the two ends of described heating panel 41 and backing plate 42, thus can by heating panel 41 and fixing the linking together of backing plate 42.
As shown in Figure 1, described cooling device 5 comprises cooling frame 51, is arranged at the some fifth holes on described cooling frame 51 and is positioned at the water pipe 52 of described cooling frame 51.The cross section of described cooling frame 51 is concave shape, and the upper surface of described cooling frame 51 is fixedly connected with the lower surface of described backing plate 42.Described fifth hole is provided with several and is evenly distributed on described cooling frame 51, and described fifth hole is cylindrical shape, and described fifth hole communicates with the inside of described cooling frame 51.Described water pipe 52 is provided with several, and described water pipe 52 adopts Heat Conduction Material to make, and is placed with water in described water pipe 52.
As shown in Figure 1, described light-emitting device 6 is provided with two and lays respectively at the left and right sides, described light-emitting device 6 comprises luminescence chip 61, the gold thread 62 be arranged on described luminescence chip 61, be positioned at described luminescence chip 61 side leg 63, be arranged at locating piece 64 on described leg 63 and backstay 65.Described luminescence chip 61 is fixedly connected with the inner surface of described framework 2, and described luminescence chip 61 is positioned at the top of described second through hole 25, thus the heat that luminescence chip 61 can be made to produce distributes as soon as possible.One end and the described luminescence chip 61 of described gold thread 62 are electrically connected, and the other end and the described leg 63 of described gold thread 62 are electrically connected.Described leg 63 is in L-type, and described leg 63 runs through the surfaces externally and internally of described framework 2 and the upper and lower surface of heating panel 41 and backing plate 42 and is fixedly connected with it.Described locating piece 64 is in cuboid, and the upper surface of described locating piece 64 is fixedly connected with the lower surface of described backing plate 42, and the side of described locating piece 64 is fixedly connected with described leg 63.Described backstay 65 is in cuboid, and described backstay 65 horizontal positioned, one end of described backstay 65 is fixedly connected with the inner surface of described framework 2, and the other end of described backstay 65 is fixedly connected with described leg 63.
As shown in Figure 1, when described white LED light source of the present invention uses, first luminescence chip 61 produces radiance, then after fluorescent material glue-line 24 and epoxy resin colloid layer 23, become white light, then through the aggtegation of reflective bucket 11, white light is gathered together and reflects away, thus can satisfy the demands, holder device 3 can play fixation to lens 1 simultaneously.The setting of the first through hole 21, second through hole 25 etc., can play good radiating effect simultaneously.And the setting of water pipe 52, makes better heat-radiation effect, accelerate the effect of heat radiation.So far, white LED light source use procedure of the present invention is described.
The above; be only the specific embodiment of the present invention, but protection scope of the present invention is not limited thereto, any those skilled in the art are in the technical scope that the present invention discloses; change can be expected easily or replace, all should be encompassed within protection scope of the present invention.Therefore, protection scope of the present invention should be as the criterion with the protection range of described claim.
Claims (7)
1. a white LED light source, it is characterized in that: described white LED light source comprises lens (1), be positioned at the framework (2) of described lens (1) below, be positioned at the holder device (3) of described framework (2) left and right sides, be positioned at the pallet device (4) of described holder device (3) below, the cooling device (5) being positioned at described pallet device (4) below and the light-emitting device (6) be arranged on described pallet device (4), described lens (1) are provided with reflective bucket (11), described framework (2) is provided with the square hole (22) being positioned at upper surface, be positioned at first through hole (21) of side, be positioned at inner epoxy resin colloid layer (23), be positioned at the fluorescent material glue-line (24) of described epoxy resin colloid layer (23) below and be positioned at second through hole (25) of lower surface, described holder device (3) is provided with heat-conducting plate (31), be positioned at first support (32) of described heat-conducting plate (31) side, be positioned at second support (33) of described first support (32) side, be arranged at the spring (34) on described second support (33) and be positioned at the fixed block (35) below described spring (34), described pallet device (4) comprises heating panel (41), be positioned at the backing plate (42) of described heating panel (41) below, be positioned at the fastener (43) of described heating panel (41) left and right sides, described cooling device (5) comprises cooling frame (51), be arranged at the some fifth holes on described cooling frame (51) and be positioned at the water pipe (52) of described cooling frame (51), described light-emitting device (6) comprises luminescence chip (61), be arranged at the gold thread (62) on described luminescence chip (61), be positioned at the leg (63) of described luminescence chip (61) side, be arranged at the locating piece (64) on described leg (63) and backstay (65).
2. white LED light source according to claim 1, it is characterized in that: described reflective bucket (11) is in hollow round table-like, the upper end of described reflective bucket (11) is fixedly connected with the inner surface of described lens (1), and the lower surface of described reflective bucket (11) and the lower surface of described lens (1) are in same plane.
3. white LED light source according to claim 2, it is characterized in that: described first through hole (21) be provided with several and the left and right being evenly distributed on described framework (2) on the surface, described first through hole (21) communicates with the inside of described framework (2), described square hole (22) is in rectangular-shaped, described square hole (22) communicates with the inside of described framework (2), described epoxy resin colloid layer (23) is in cuboid, described epoxy resin colloid layer (23) is fixedly connected with the inner surface of described framework (2), described fluorescent material glue-line (24) is in cuboid, the upper surface of described fluorescent material glue-line (24) contacts with the lower surface of described epoxy resin colloid layer (23), the side of described fluorescent material glue-line (24) is fixedly connected with the inner surface of described framework (2), described second through hole (25) is provided with two and lays respectively at the left and right sides, described second through hole (25) communicates with the inside of described framework (2), the lower surface of described reflective bucket (11) is fixedly connected with the upper surface of described framework (2).
4. white LED light source according to claim 3, it is characterized in that: described heat-conducting plate (31) is in cuboid, the side of described heat-conducting plate (31) is fixedly connected with the side of described framework (2), the upper surface of described heat-conducting plate (31) and the upper surface of described framework (2) are in same plane, the lower surface of described heat-conducting plate (31) and the lower surface of described framework (2) are in same plane, described first support (32) is in concave shape, one end of described first support (32) is fixedly connected with the side of described heat-conducting plate (31), the other end of described first support (32) is fixedly connected with the side of described lens (1), described fixed block (35) is in cuboid, the side of described fixed block (35) is fixedly connected with the side of described heat-conducting plate (31), the lower surface of described fixed block (35) and the lower surface of described heat-conducting plate (31) are in same level, described second support (33) is in concave shape, one end of described second support (33) is fixedly connected with the side of described fixed block (35), the other end of described second support (33) is fixedly connected with described first support (32), described spring (34) is horizontal, one end of described spring (34) is fixedly connected with described heat-conducting plate (31), the other end of described spring (34) is fixedly connected with described second support (33).
5. white LED light source according to claim 4, it is characterized in that: described heating panel (41) is in cuboid, described heating panel (41) horizontal positioned, the upper surface of described heating panel (41) is fixedly connected with the lower surface of described framework (2), the lower surface of described fixed block (35) is fixedly connected with the lower surface of described heating panel (41), described heating panel (41) is provided with the third through-hole (411) running through its upper and lower surface, described third through-hole (411) is positioned at immediately below described second through hole (25), described backing plate (42) is in cuboid, described backing plate (42) horizontal positioned, the upper surface of described backing plate (42) is fixedly connected with the lower surface of described heating panel (41), described backing plate (42) is provided with the fourth hole (412) running through its upper and lower surface, described fourth hole (412) is provided with two and lays respectively at the left and right sides, described fourth hole (412) is positioned at the below of described third through-hole (411), described fastener (43) is provided with two and lays respectively at the left and right sides, described fastener (43) is in concave shape, described fastener (43) is buckled in the two ends of described heating panel (41) and backing plate (42).
6. white LED light source according to claim 5, it is characterized in that: the cross section of described cooling frame (51) is concave shape, the upper surface of described cooling frame (51) is fixedly connected with the lower surface of described backing plate (42), described fifth hole is provided with several and is evenly distributed on described cooling frame (51), described fifth hole communicates with the inside of described cooling frame (51), described water pipe (52) is provided with several, and described water pipe (52) adopts Heat Conduction Material to make.
7. white LED light source according to claim 6, it is characterized in that: described luminescence chip (61) is fixedly connected with the inner surface of described framework (2), described luminescence chip (61) is positioned at the top of described second through hole (25), one end and the described luminescence chip (61) of described gold thread (62) are electrically connected, the other end and the described leg (63) of described gold thread (62) are electrically connected, described leg (63) is in L-type, described leg (63) runs through the surfaces externally and internally of described framework (2) and the upper and lower surface of heating panel (41) and backing plate (42) and is fixedly connected with it, described locating piece (64) is in cuboid, the upper surface of described locating piece (64) is fixedly connected with the lower surface of described backing plate (42), the side of described locating piece (64) is fixedly connected with described leg (63), described backstay (65) is in cuboid, described backstay (65) horizontal positioned, one end of described backstay (65) is fixedly connected with the inner surface of described framework (2), the other end of described backstay (65) is fixedly connected with described leg (63).
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| CN201510910753.0A CN105428513B (en) | 2015-12-10 | 2015-12-10 | A kind of white LED light source |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201510910753.0A CN105428513B (en) | 2015-12-10 | 2015-12-10 | A kind of white LED light source |
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| CN105428513A true CN105428513A (en) | 2016-03-23 |
| CN105428513B CN105428513B (en) | 2018-01-19 |
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| CN102802382A (en) * | 2009-10-30 | 2012-11-28 | 沈育浓 | Radiator device and module using same |
| CN102878456A (en) * | 2012-09-07 | 2013-01-16 | 浙江中博光电科技有限公司 | High-power LED (light-emitting diode) lamp module of chip-on-board |
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2015
- 2015-12-10 CN CN201510910753.0A patent/CN105428513B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006222454A (en) * | 2006-05-01 | 2006-08-24 | Toshiba Electronic Engineering Corp | Semiconductor light emitting device and surface-mounted package |
| CN102802382A (en) * | 2009-10-30 | 2012-11-28 | 沈育浓 | Radiator device and module using same |
| CN101820044A (en) * | 2010-04-09 | 2010-09-01 | 江苏伯乐达光电科技有限公司 | Metal substrate and light-emitting diode encapsulation method of metal substrate |
| CN102878456A (en) * | 2012-09-07 | 2013-01-16 | 浙江中博光电科技有限公司 | High-power LED (light-emitting diode) lamp module of chip-on-board |
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| CN105428513B (en) | 2018-01-19 |
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Effective date of registration: 20200514 Address after: 102299 2F, building 2, No. 27, Chuangxin Road, science and Technology Park, Changping District, Beijing (Changping demonstration area) Patentee after: Golden Scorpion Co.,Ltd. Address before: 528226, A8 building, Guangdong new light source base, Luo Cun, Nanhai District, Foshan, Guangdong Patentee before: FOSHAN CITY NANHAI DISTRICT GUANGDONG NEW LIGHT SOURCE INDUSTRY INNOVATION CENTER |