CN102056399A - 印刷电路板 - Google Patents

印刷电路板 Download PDF

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CN102056399A
CN102056399A CN200910308911XA CN200910308911A CN102056399A CN 102056399 A CN102056399 A CN 102056399A CN 200910308911X A CN200910308911X A CN 200910308911XA CN 200910308911 A CN200910308911 A CN 200910308911A CN 102056399 A CN102056399 A CN 102056399A
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circuit board
printed circuit
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pcb
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周华丽
白家南
许寿国
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Priority to CN200910308911XA priority Critical patent/CN102056399A/zh
Priority to US12/647,396 priority patent/US20110094783A1/en
Publication of CN102056399A publication Critical patent/CN102056399A/zh
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
    • H05K1/0253—Impedance adaptations of transmission lines by special lay-out of power planes, e.g. providing openings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09381—Shape of non-curved single flat metallic pad, land or exposed part thereof; Shape of electrode of leadless component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/0969—Apertured conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10015—Non-printed capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10022—Non-printed resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

一种印刷电路板，包括一信号层及一参考层，所述信号层上设置有安装被动元件的焊盘及与所述焊盘相连的信号传输线，所述参考层为所述信号层上流过所述被动元件及所述信号传输线的信号提供回流路径，所述参考层对应所述被动元件的部分开设一挖空区域，以加大信号的回流路径。所述印刷电路板可有效提高信号完整性。

Description

印刷电路板
技术领域
本发明涉及一种印刷电路板。
背景技术
在印刷电路板设计中，高速串行信号线常采用被动元件(如电阻、电容等)对信号进行端接或电流处理等。一般情况下，被动元件的焊盘(PAD)的参考层没有经过特殊处理，是一个完整的平面，如图1中电阻R在印刷电路板10上参考层12为一个完整的平面，传输线14上流经电阻R的信号在参考层12中的返回信号会直接从电阻R的下方回流(见回流路径16)，由于电阻R的焊盘18的宽度远大于传输线14的宽度，特征阻抗在传输线14和焊盘18之间发生了突变，使信号从高阻抗路径进入低阻抗路径，受到阻抗不匹配的影响，信号会产生反射，进而影响信号完整性。
发明内容
鉴于上述内容，有必要提供一种可有效提高信号完整性的印刷电路板。
一种印刷电路板，包括一信号层及一参考层，所述信号层上设置有安装被动元件的焊盘及与所述焊盘相连的信号传输线，所述参考层为所述信号层上流过所述被动元件及所述信号传输线的信号提供回流路径，所述参考层对应所述被动元件的部分开设一挖空区域，以加大信号的回流路径。
上述印刷电路板在参考层对应所述被动元件的部分开设一挖空区域，由于被动元件下方的参考层被挖空，信号回流经过挖空区域时会沿着挖空区域的边缘绕行，这样就加大了信号的回流路径，阻抗会变大，如此当信号经过被动元件的区域时，可以保持更好的阻抗匹配，进而可提高信号的完整性。
附图说明
下面参照附图结合具体实施方式对本发明作进一步的描述。
图1为现有一种印刷电路板的示意图。
图2为本发明印刷电路板较佳实施方式的示意图。
图3为图2的印刷电路板中参考层的俯视图。
图4为图2的印刷电路板的截面图。
图5及图6为0402封装的被动元件分别设于现有印刷电路板及本发明印刷电路板上的信号仿真比对图。
图7及图8为0603封装的被动元件分别设于现有印刷电路板及本发明印刷电路板上的信号仿真比对图。
图9及图10为0805封装的被动元件分别设于现有印刷电路板及本发明印刷电路板上的信号仿真比对图。
具体实施方式
请参照图2，本发明印刷电路板100的较佳实施方式包括一信号层110及一参考层120，所述信号层110上设有两个用于安装一被动元件114(如电阻、电容元件)的焊盘112，所述参考层120为信号层110上流过所述被动元件114及信号传输线116的信号提供回流路径。本实施方式中，所述信号传输线116为高速串行信号线，其他实施方式中也可为其他类型的信号线。
请参考图3及图4，所述参考层120对应所述被动元件114的部分开设一椭圆形挖空区域122，其他实施方式中，也可以为其他形状的挖空区域，不局限于椭圆形。由于被动元件114下方的参考层120被挖空，信号回流经过挖空区域122时，会沿着挖空区域的边缘绕行，这样就加大了信号的回流路径(见回流路径124)，阻抗会变大，如此当信号经过被动元件114的区域时，可以保持更好的阻抗匹配，提高信号的完整性。
设所述两焊盘112整体的宽度为Wpad，所述两焊盘112整体的长度为Spad，所述信号传输线116的宽度为Wtrace，所述信号传输线116的高度为T，所述挖空区域122短轴的距离为W1，长轴的距离为W2，当所述被动元件114为0402规格的贴片元件时，根据相关实验数据推导得出所述挖空区域122的面积S0402大约为：
Figure B200910308911XD0000021
且Wpad≤W1≤2Wpad，0.8W1≤W2≤3W1。
图5及图6分别示出了当所述被动元件114为0402规格的贴片元件，且Wpad＝20mil，Spad＝54mil，Wtrace＝5mil，S0402＝1258mil2时，未开设挖空区域122及开设了挖空区域122时的信号仿真比对图，从图5及图6中易知，开设挖空区域122后的印刷电路板的信号完整性明显提高了。
当所述被动元件114为0603规格的贴片元件时，根据相关实验数据推导得出所述挖空区域122的面积S0603大约为：
Wpad≤W1≤2Wpad，1.5W1≤W2≤3.5W1。
当所述被动元件114为0805规格的贴片元件时，根据相关实验数据推导得出所述挖空区域122的面积S0805大约为：
Figure B200910308911XD0000031
Wpad≤W1≤2Wpad，1.5W1≤W2≤2.5W1。
图7及图8分别示出了当所述被动元件114为0603规格的贴片元件，且Wpad＝30mil，Spad＝88mil，Wtrace＝5mil，S0603＝3108mil2时，未开设挖空区域122及开设了挖空区域122时的信号仿真比对图。图9及图10分别示出了当所述被动元件114为0805规格的贴片元件，且Wpad＝50mil，Spad＝130mil，Wtrace＝5mil，S0805＝8550mil2时，未开设挖空区域122及开设了挖空区域122时的信号仿真比对图。从图7至图10中也可易知，开设挖空区域122后的印刷电路板的信号完整性明显提高了。

Claims (10)

1.一种印刷电路板，包括一信号层及一参考层，所述信号层上设置有安装被动元件的焊盘及与所述焊盘相连的信号传输线，所述参考层为所述信号层上流过所述被动元件及所述信号传输线的信号提供回流路径，其特征在于：所述参考层对应所述被动元件的部分开设一挖空区域，以加大信号的回流路径。
2.如权利要求1所述的印刷电路板，其特征在于：所述挖空区域为椭圆形。
3.如权利要求2所述的印刷电路板，其特征在于：当所述被动元件为0402规格的贴片元件时，所述挖空区域的面积S0402大约为：
Figure F200910308911XC0000011
且Wpad≤W1≤2Wpad，0.8W1≤W2≤3W1，其中所述焊盘整体的宽度为Wpad，所述信号传输线的宽度为Wtrace，所述信号传输线的高度为T，所述挖空区域短轴的距离为W1，长轴的距离为W2，所述焊盘整体的长度为Spad。
4.如权利要求3所述的印刷电路板，其特征在于：所述焊盘整体的宽度Wpad为20mil，所述焊盘整体的长度Spad为54mil，所述信号传输线的宽度Wtrace为5mil，所述挖空区域的面积S0402约为1258mil2。
5.如权利要求2所述的印刷电路板，其特征在于：当所述被动元件为0603规格的贴片元件时，所述挖空区域的面积S0603大约为：
Figure F200910308911XC0000012
Wpad≤W1≤2Wpad，1.5W1≤W2≤3.5W1，其中所述焊盘整体的宽度为Wpad，所述信号传输线的宽度为Wtrace，所述信号传输线的高度为T，所述挖空区域短轴的距离为W1，长轴的距离为W2，所述焊盘整体的长度为Spad。
6.如权利要求5所述的印刷电路板，其特征在于：所述焊盘整体的宽度Wpad为30mil，所述焊盘整体的长度Spad为88mil，所述信号传输线的宽度Wtrace为5mil，所述挖空区域的面积S0603约为3108mil2。
7.如权利要求2所述的印刷电路板，其特征在于：当所述被动元件为0805规格的贴片元件时，所述挖空区域的面积S0805大约为：
Figure F200910308911XC0000021
Wpad≤W1≤2Wpad，1.5W1≤W2≤2.5W1，其中所述焊盘整体的宽度为Wpad，所述信号传输线的宽度为Wtrace，所述信号传输线的高度为T，所述挖空区域短轴的距离为W1，长轴的距离为W2，所述焊盘整体的长度为Spad。
8.如权利要求7所述的印刷电路板，其特征在于：所述焊盘整体的宽度Wpad为50mil，所述焊盘整体的长度Spad为130mil，所述信号传输线的宽度Wtrace为5mil，所述挖空区域的面积S0805约为8550mil2。
9.如权利要求1所述的印刷电路板，其特征在于：所述被动元件为电阻或电容。
10.如权利要求1所述的印刷电路板，其特征在于：所述信号传输线为高速串行信号线。
CN200910308911XA 2009-10-28 2009-10-28 印刷电路板 Pending CN102056399A (zh)

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Cited By (4)

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CN103076486A (zh) * 2013-01-18 2013-05-01 浪潮电子信息产业股份有限公司 一种提高电源反馈精度的布线方法
CN104010437B (zh) * 2013-02-22 2017-05-24 上海斐讯数据通信技术有限公司 线路板
CN106646777B (zh) * 2016-12-14 2019-05-28 青岛海信宽带多媒体技术有限公司 一种光模块及其设计方法
CN109936913A (zh) * 2017-12-19 2019-06-25 三星电子株式会社 印刷电路板、存储器模块和包括存储器模块的存储器系统

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CN103687290B (zh) * 2013-12-03 2016-08-17 广州杰赛科技股份有限公司 刚挠结合板及其信号传输线布线方法和装置
CN106061098B (zh) * 2016-07-01 2018-11-02 青岛海信移动通信技术股份有限公司 一种用于传输高速信号的介质板

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US6043987A (en) * 1997-08-25 2000-03-28 Compaq Computer Corporation Printed circuit board having a well structure accommodating one or more capacitor components
US6433286B1 (en) * 2000-09-29 2002-08-13 Intel Corporation Method of making higher impedance traces on a low impedance circuit board
WO2006044739A2 (en) * 2004-10-18 2006-04-27 Intraglobal Corporation Microelectronics package and method

Cited By (5)

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Publication number Priority date Publication date Assignee Title
CN103076486A (zh) * 2013-01-18 2013-05-01 浪潮电子信息产业股份有限公司 一种提高电源反馈精度的布线方法
CN104010437B (zh) * 2013-02-22 2017-05-24 上海斐讯数据通信技术有限公司 线路板
CN106646777B (zh) * 2016-12-14 2019-05-28 青岛海信宽带多媒体技术有限公司 一种光模块及其设计方法
CN109936913A (zh) * 2017-12-19 2019-06-25 三星电子株式会社 印刷电路板、存储器模块和包括存储器模块的存储器系统
CN109936913B (zh) * 2017-12-19 2024-06-04 三星电子株式会社 印刷电路板、存储器模块和包括存储器模块的存储器系统

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Application publication date: 20110511