CN102046331A - 半导体晶片抛光装置和抛光方法 - Google Patents

半导体晶片抛光装置和抛光方法 Download PDF

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Publication number
CN102046331A
CN102046331A CN2009801202686A CN200980120268A CN102046331A CN 102046331 A CN102046331 A CN 102046331A CN 2009801202686 A CN2009801202686 A CN 2009801202686A CN 200980120268 A CN200980120268 A CN 200980120268A CN 102046331 A CN102046331 A CN 102046331A
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CN
China
Prior art keywords
wafer
polishing
platen
front surface
support plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2009801202686A
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English (en)
Chinese (zh)
Inventor
P·D·阿尔布雷克特
Z·郭强
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SunEdison Inc
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SunEdison Inc
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Publication date
Application filed by SunEdison Inc filed Critical SunEdison Inc
Publication of CN102046331A publication Critical patent/CN102046331A/zh
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
CN2009801202686A 2008-05-30 2009-05-19 半导体晶片抛光装置和抛光方法 Pending CN102046331A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/130,190 US8192248B2 (en) 2008-05-30 2008-05-30 Semiconductor wafer polishing apparatus and method of polishing
US12/130,190 2008-05-30
PCT/US2009/044501 WO2009146274A1 (en) 2008-05-30 2009-05-19 Semiconductor wafer polishing apparatus and method of polishing

Publications (1)

Publication Number Publication Date
CN102046331A true CN102046331A (zh) 2011-05-04

Family

ID=40941363

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2009801202686A Pending CN102046331A (zh) 2008-05-30 2009-05-19 半导体晶片抛光装置和抛光方法

Country Status (6)

Country Link
US (1) US8192248B2 (cg-RX-API-DMAC7.html)
EP (1) EP2293902A1 (cg-RX-API-DMAC7.html)
JP (1) JP2011522416A (cg-RX-API-DMAC7.html)
KR (1) KR20110055483A (cg-RX-API-DMAC7.html)
CN (1) CN102046331A (cg-RX-API-DMAC7.html)
WO (1) WO2009146274A1 (cg-RX-API-DMAC7.html)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108296931A (zh) * 2018-02-02 2018-07-20 成都精密光学工程研究中心 一种带磨损补偿的偏摆式平面抛光装置
CN110026885A (zh) * 2018-12-27 2019-07-19 杭州众硅电子科技有限公司 一种抛光垫寿命在线检测的系统和方法
CN110228003A (zh) * 2019-05-23 2019-09-13 黄彬庆 基于双位定位原理的半导体晶片机械抛光加工装置
CN110421479A (zh) * 2019-07-19 2019-11-08 许昌学院 一种电子器件用半导体晶片抛光设备
CN110587469A (zh) * 2019-09-29 2019-12-20 苏州光斯奥光电科技有限公司 一种用于液晶面板的研磨机构
CN111906600A (zh) * 2020-08-29 2020-11-10 中国航发南方工业有限公司 一种偏心型腔内端面磨削方法及装置
CN114871941A (zh) * 2022-04-25 2022-08-09 季华实验室 一种抛光头及抛光机
CN115106898A (zh) * 2021-03-23 2022-09-27 安德里亚·瓦伦蒂尼 适用于与手持抛光或砂光动力工具可拆卸附接的板状垫板

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10600634B2 (en) 2015-12-21 2020-03-24 Globalwafers Co., Ltd. Semiconductor substrate polishing methods with dynamic control
CN108698195B (zh) * 2016-02-26 2021-07-02 福吉米株式会社 抛光方法和抛光垫
US10456696B2 (en) 2016-09-13 2019-10-29 Universal City Studios Llc Systems and methods for customizing amusement park attraction experiences using pneumatic robotic systems
US11081359B2 (en) 2018-09-10 2021-08-03 Globalwafers Co., Ltd. Methods for polishing semiconductor substrates that adjust for pad-to-pad variance
CN116394153B (zh) * 2023-02-28 2023-10-24 名正(浙江)电子装备有限公司 一种晶圆研磨抛光系统

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1996036459A1 (en) * 1995-05-18 1996-11-21 Exclusive Design Company, Inc. Improved method and apparatus for chemical mechanical polishing
JP2891068B2 (ja) * 1993-10-18 1999-05-17 信越半導体株式会社 ウエーハの研磨方法および研磨装置
US6174221B1 (en) * 1998-09-01 2001-01-16 Micron Technology, Inc. Polishing chucks, semiconductor wafer polishing chucks, abrading methods, polishing methods, semiconductor wafer polishing methods, and methods of forming polishing chucks
CN1352587A (zh) * 1999-03-31 2002-06-05 Memc电子材料有限公司 修整抛光垫的设备和方法
WO2002066206A2 (en) * 2000-11-16 2002-08-29 Motorola, Inc. Wafer carrier and method of material removal from a semiconductor wafer

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4918869A (en) * 1987-10-28 1990-04-24 Fujikoshi Machinery Corporation Method for lapping a wafer material and an apparatus therefor
US5036630A (en) * 1990-04-13 1991-08-06 International Business Machines Corporation Radial uniformity control of semiconductor wafer polishing
US5486129A (en) * 1993-08-25 1996-01-23 Micron Technology, Inc. System and method for real-time control of semiconductor a wafer polishing, and a polishing head
US5658183A (en) 1993-08-25 1997-08-19 Micron Technology, Inc. System for real-time control of semiconductor wafer polishing including optical monitoring
US5584746A (en) 1993-10-18 1996-12-17 Shin-Etsu Handotai Co., Ltd. Method of polishing semiconductor wafers and apparatus therefor
JP3311116B2 (ja) * 1993-10-28 2002-08-05 株式会社東芝 半導体製造装置
US5624299A (en) * 1993-12-27 1997-04-29 Applied Materials, Inc. Chemical mechanical polishing apparatus with improved carrier and method of use
US5664987A (en) 1994-01-31 1997-09-09 National Semiconductor Corporation Methods and apparatus for control of polishing pad conditioning for wafer planarization
US5816900A (en) * 1997-07-17 1998-10-06 Lsi Logic Corporation Apparatus for polishing a substrate at radially varying polish rates
US5934974A (en) 1997-11-05 1999-08-10 Aplex Group In-situ monitoring of polishing pad wear
US6531397B1 (en) 1998-01-09 2003-03-11 Lsi Logic Corporation Method and apparatus for using across wafer back pressure differentials to influence the performance of chemical mechanical polishing
US6176764B1 (en) * 1999-03-10 2001-01-23 Micron Technology, Inc. Polishing chucks, semiconductor wafer polishing chucks, abrading methods, polishing methods, simiconductor wafer polishing methods, and methods of forming polishing chucks
JP4056205B2 (ja) * 1999-10-15 2008-03-05 株式会社荏原製作所 ポリッシング装置および方法
JP4307674B2 (ja) * 2000-01-26 2009-08-05 不二越機械工業株式会社 ウェーハの研磨装置
KR20020092407A (ko) 2000-03-30 2002-12-11 엠이엠씨 일렉트로닉 머티리얼스 쏘시에떼 퍼 아찌오니 웨이퍼 연마 방법
US7140956B1 (en) 2000-03-31 2006-11-28 Speedfam-Ipec Corporation Work piece carrier with adjustable pressure zones and barriers and a method of planarizing a work piece
US6616513B1 (en) 2000-04-07 2003-09-09 Applied Materials, Inc. Grid relief in CMP polishing pad to accurately measure pad wear, pad profile and pad wear profile
EP1335814A1 (en) 2000-11-21 2003-08-20 Memc Electronic Materials S.P.A. Semiconductor wafer, polishing apparatus and method
US6764387B1 (en) 2003-03-07 2004-07-20 Applied Materials Inc. Control of a multi-chamber carrier head
US7207871B1 (en) 2005-10-06 2007-04-24 Applied Materials, Inc. Carrier head with multiple chambers

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2891068B2 (ja) * 1993-10-18 1999-05-17 信越半導体株式会社 ウエーハの研磨方法および研磨装置
WO1996036459A1 (en) * 1995-05-18 1996-11-21 Exclusive Design Company, Inc. Improved method and apparatus for chemical mechanical polishing
US6174221B1 (en) * 1998-09-01 2001-01-16 Micron Technology, Inc. Polishing chucks, semiconductor wafer polishing chucks, abrading methods, polishing methods, semiconductor wafer polishing methods, and methods of forming polishing chucks
CN1352587A (zh) * 1999-03-31 2002-06-05 Memc电子材料有限公司 修整抛光垫的设备和方法
WO2002066206A2 (en) * 2000-11-16 2002-08-29 Motorola, Inc. Wafer carrier and method of material removal from a semiconductor wafer

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108296931A (zh) * 2018-02-02 2018-07-20 成都精密光学工程研究中心 一种带磨损补偿的偏摆式平面抛光装置
CN110026885A (zh) * 2018-12-27 2019-07-19 杭州众硅电子科技有限公司 一种抛光垫寿命在线检测的系统和方法
CN110228003A (zh) * 2019-05-23 2019-09-13 黄彬庆 基于双位定位原理的半导体晶片机械抛光加工装置
CN110421479A (zh) * 2019-07-19 2019-11-08 许昌学院 一种电子器件用半导体晶片抛光设备
CN110587469A (zh) * 2019-09-29 2019-12-20 苏州光斯奥光电科技有限公司 一种用于液晶面板的研磨机构
CN111906600A (zh) * 2020-08-29 2020-11-10 中国航发南方工业有限公司 一种偏心型腔内端面磨削方法及装置
CN111906600B (zh) * 2020-08-29 2021-09-28 中国航发南方工业有限公司 一种偏心型腔内端面磨削方法及装置
CN115106898A (zh) * 2021-03-23 2022-09-27 安德里亚·瓦伦蒂尼 适用于与手持抛光或砂光动力工具可拆卸附接的板状垫板
CN115106898B (zh) * 2021-03-23 2024-01-30 安德里亚·瓦伦蒂尼 适用于与手持抛光或砂光动力工具可拆卸附接的板状垫板
CN114871941A (zh) * 2022-04-25 2022-08-09 季华实验室 一种抛光头及抛光机
CN114871941B (zh) * 2022-04-25 2024-04-05 季华实验室 一种抛光头及抛光机

Also Published As

Publication number Publication date
US8192248B2 (en) 2012-06-05
KR20110055483A (ko) 2011-05-25
EP2293902A1 (en) 2011-03-16
JP2011522416A (ja) 2011-07-28
WO2009146274A1 (en) 2009-12-03
US20090298399A1 (en) 2009-12-03

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Application publication date: 20110504