CN102044322A - Common-mode filter and manufacturing method thereof - Google Patents
Common-mode filter and manufacturing method thereof Download PDFInfo
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- CN102044322A CN102044322A CN2009101811154A CN200910181115A CN102044322A CN 102044322 A CN102044322 A CN 102044322A CN 2009101811154 A CN2009101811154 A CN 2009101811154A CN 200910181115 A CN200910181115 A CN 200910181115A CN 102044322 A CN102044322 A CN 102044322A
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Abstract
The invention relates to a common-mode filter and a manufacturing method thereof. he common-mode filter comprises an insulating base material, a lower coil leading-out layer, a coil main body laminated structure and an upper coil leading-out layer; the upper coil leading-out layer comprises at least one upper leading-out wire, at least one upper leading-out terminal and at least one upper contact, the lower coil leading-out layer comprises at least one lower leading-out wire, at least one lower leading-out terminal and at least one lower contact; two ends of the upper leading-out wire are respectively connected with the upper leading-out terminal and the upper contact, and extend and encircle the upper contact; two sides of the lower leading-out wire are respectively connected with the lower leading-out terminal and the lower contact, and extend and encircle the lower contact; and the coil main body laminated structure is clamped and arranged between the upper coil leading-out layer and the lower coil leading-out layer, and the lower coil leading-out layer is arranged on the insulating base material. In the invention, different patterns of the leading-out wires are designed for regulating common-mode signal impedance, and precise pattern control can be achieved by adopting a general yellow light imaging technique.
Description
Technical field
The present invention relates to a kind of common-mode filter and manufacture method thereof, particularly a kind of film common-mode filter and manufacture method thereof.
Background technology
Common-mode filter is one to be used to suppress the element of common mode current, and this common mode current can cause the generation of electromagnetic interference in the parallel transmission circuit.At present common-mode filter can be applied to portable communicator for wanting, and requires the structure of miniaturization and densification more, so diaphragm type and laminated common-mode filter replace conventional roll line style common-mode filter gradually.The winding type common-mode filter is to go up the shape that volume is paid coil in columned FERRITE CORE (Ferrite Core) just like its name.And film-type and stack-up type must adopt more production process, and for example: the film-type common-mode filter adopts photoetching technique (Photo Lithography) technology normally on tabular ferrite, form plane coil.In addition, the stack-up type common-mode filter then is on tabular ferrite, adopts half tone (Screen) printing technology to form coil, re-uses to burn till the technology of pressing and finish.
For the common code impedance (common impedance) that can adjust coil line, United States Patent (USP) announces the 7th, 145, a kind of common-mode noise filter element is disclosed for 427B2 number, it is that coil line is formed on the magnetic base material, and the structure of the non-coil line of part dug a hole via etching technique, insert again be mixed with Magnaglo colloid in the hole.After adopting the flatening process technology with flattening surface then, bonding via bonding technique and another magnetic base material again, to finish the making of this element.This one is to adjust common code impedance via changing thickness of insulating layer in first to file, so THICKNESS CONTROL just becomes the key factor of control mode impedance value.Yet the THICKNESS CONTROL of insulating barrier is the character according to technology mode, technological parameter and insulating material, obviously is not easy or must increases suitable manufacturing cost at accurate value range for wanting control thickness.
In addition, United States Patent (USP) announces the 6th, 356, and 181B1 number and the 6th, 618,929B2 number a kind of lamination common-mode filter is disclosed, also for making loop construction on magnetic base material, and to cover magnetic material be loam cake.This one particularly changes the wiring pattern of coil in first to file, thereby reduces the impedance of differential wave.Yet the wiring pattern of coil continues and distributes and is positioned at different laminations, so change comparatively complexity, and the parameter of influence is more.
In sum, need a kind of making simple and easy and can precisely change mode impedance value on the market, thereby can overcome the shortcoming that above-mentioned known common-mode filter has, and can reduce manufacturing cost.
Summary of the invention
The invention provides a kind of common-mode filter of the common code impedance adjusted simple in structure, the lead of drawing of this common-mode filter centers on respect to the contact of perforate, therefore can be only draw lead around the change of pattern and accurately adjust mode impedance value by this.
The invention provides a kind of low-cost method of making common-mode filter, draw the pattern of lead and adjust the common-mode signal impedance by designing difference, and adopt general gold-tinted developing technique just can reach pattern control accurately, thereby reach mode impedance value adjustment more accurately, but can additionally not increase manufacturing cost.
In sum, the present invention discloses a kind of common-mode filter, and it comprises an insulating substrate, a lower coil and draws on layer, the coil main body laminated construction and a coil and draw layer.Should go up coil and draw layer and comprise and draw lead, at least one leading-out terminal and at least one upper contact gone up at least one, again this lower coil draw layer comprise at least one draw down lead, at least one leading-out terminal down and at least one under contact.Should on draw lead two ends respectively and should go up leading-out terminal and this upper contact is connected, and extension and center on this upper contact.The two ends that lead is drawn in this time are connected with this time leading-out terminal and this time contact respectively, and extend and around this time contact.This coil main body laminated construction is to be located on this that coil is drawn layer and this lower coil is drawn between the layer, and this lower coil is drawn layer and is located on this insulating substrate again.
The present invention discloses a kind of manufacture method of common-mode filter in addition, and it is as follows to comprise step: an insulating substrate is provided; On this insulating substrate, form a lower coil and draw layer, wherein this lower coil draw layer comprise at least one draw down lead, at least one leading-out terminal down and at least one under contact, the two ends that lead is drawn in this time are connected with this time leading-out terminal and this time contact respectively, and extend and around this time contact; Forming a coil main body laminated construction draws on the layer in this lower coil; Coil is drawn layer on this coil main body lamination in the formation one, wherein should go up coil draws layer and comprises and draw lead, at least one leading-out terminal and at least one upper contact gone up at least one, should on draw lead two ends respectively and should go up leading-out terminal and this upper contact is connected, and extension and center on this upper contact.
One example of the present invention is that coil is drawn layer top formation one magnetic material layer on this.
Description of drawings
Fig. 1 is the decomposing schematic representation of the common-mode filter of one embodiment of the invention;
Fig. 2 is the decomposing schematic representation of the common-mode filter of another embodiment of the present invention;
Fig. 3 A is the schematic diagram of another lead-out wire group 33 of the present invention;
Fig. 3 B be a lead-out wire group 33 more of the present invention ' schematic diagram;
Fig. 3 C is known lead-out wire group 33 " schematic diagram;
Fig. 4 be among Fig. 3 A of the present invention and the 3B lead-out wire group compared to the insertion loss figure of traditional lead-out wire group;
Fig. 5 A is the structural representation of the common-mode filter 50 of another embodiment of the present invention;
Fig. 5 B be further embodiment of this invention common-mode filter 50 ' structural representation; And
Fig. 6 A to 6J is each step schematic diagram of manufacture method of the common-mode filter of one embodiment of the invention.
And the description of reference numerals in the above-mentioned accompanying drawing is as follows:
10 common-mode filters
11 insulated substrates
121 first insulating barriers
1221 perforates
1222 guide pillars
122 second insulating barriers
123 the 3rd insulating barriers
124 the 4th insulating barriers
1241 perforates
1242 guide pillars
125 the 5th insulating barriers
13 lower coil are drawn layer
Lead-out wire group under 13a, the 13b
Draw lead 131 times
132 times leading-out terminals
133 times contacts
14 first coil main body layers
141,142 helical coil circuits
15 second coil main body layers
151,152 helical coil circuits
Coil is drawn layer on 16
The last lead-out wire group of 16a, 16b
Draw lead on 161
Leading-out terminal on 162
163 upper contacts
17 magnetic material layers
18 coil main body laminated construction
20 common-mode filters
21 insulating barriers
221 first insulating barriers
222 second insulating barriers
223 the 3rd insulating barriers
224 the 4th insulating barriers
225 the 5th insulating barriers
23 lower coil are drawn layer
24 first coil main body layers
25 second coil main body layers
Coil is drawn layer on 26
27 magnetic material layers
28 coil main body laminated construction
33,33 ', 33 " lead-out wire groups
331,331 ', 331 " draw lead
332,332 ', 332 " leading-out terminals
333,333 ', 333 " contacts
50,50 ' common-mode filter
571 first magnetic material layers
572 second magnetic material layers
573 the 3rd magnetic material layers
574 the 4th magnetic material layers
Embodiment
Fig. 1 is the decomposing schematic representation of the common-mode filter of one embodiment of the invention.As shown in Figure 1, a common-mode filter 10 comprises an insulated substrate 11, one first insulating barrier 121, a lower coil and draws on layer 13,1 second insulating barrier 122, one first coil main body layer 14, one the 3rd insulating barrier 123, one second coil main body layer 15, one the 4th insulating barrier 124, a coil and draw layer 16,1 the 5th insulating barrier 125 and a magnetic material layer 17.This second insulating barrier 122, the first coil main body layer 14, the 3rd insulating barrier 123, the second coil main body layer 15 and the 4th insulating barrier 124 constitute a coil main body laminated construction 18 again.
This lower coil is drawn layer 13 has two following lead- out wire group 13a and 13b, and each lead-out wire group comprises draws lead 131, once leading-out terminal 132 and contact 133 once.The two ends that lead 131 is drawn in this time are connected with this time leading-out terminal 132 and this time contact 133 respectively, and extend and around this time contact 133.Drawing lead 131 under this has electric current through out-of-date, and its path this time contact 133 relatively centers on, and can produce inductive effect, therefore can increase mode impedance value and reduce the common mode frequency.Similarly, coil is drawn layer 16 on this has two to go up lead- out wire group 16a and 16b, and each lead-out wire group comprises draws a leading-out terminal 162 and a upper contact 163 on the lead 161, on one.Should on draw lead 161 two ends respectively and should go up leading-out terminal 162 and this upper contact 163 is connected, and extension and center on this upper contact 163.
This first coil main body layer 14 comprises two helical coil circuits 141 and 142, and this helical coil circuit 141 and 142 passes through guide pillar 1222 in each perforate 1221 of this second insulating barrier 122 respectively, and is electrical connected to following lead-out wire group 13a and 13b.Similarly, this second coil main body layer 15 comprises two helical coil circuits 151 and 152, this helical coil circuit 151 and 152 is respectively by guide pillar 1242 in each perforate 1241 of the 4th insulating barrier 124, and is electrical connected and is electrical connected to lead-out wire group 16a and 16b.Present embodiment has two groups of helical coil circuits, but not as limit, can be made in the same common-mode filter by more groups of helical coil circuits.
The material of this insulated substrate 11 is aluminium oxide (Al
2O
3), aluminium nitride (AlN), glass (Glass), quartzy (Quartz) or magnet material (Ferrite).The material of these first insulating barrier, 121 to the 5th insulating barriers 125 can be polyimides (polyimide), epoxy resin (epoxy resin), benzocyclobutane olefine resin (BCB) or other high molecular polymer (polymer).The material that this lower coil is drawn layer 13, this first coil main body layer 14, this second coil main body layer 15 and coil is drawn layer 16 this on can be silver (Ag), palladium (Pd), aluminium (Al), chromium (Cr), nickel (Ni), titanium (Ti), golden (Au), copper (Cu) or platinum (Pt).The material of this magnetic material layer 17 can be magnetic base material or be mixed with the Magnaglo colloid.The mixing preparation that this Magnaglo colloid can be Magnaglo and polyimides (polyimide), epoxy resin (epoxy resin), benzocyclobutane olefine resin (BCB) or other high molecular polymer (polymer) forms.
Fig. 2 is the decomposing schematic representation of the common-mode filter of another embodiment of the present invention.As shown in Figure 2, a common-mode filter 20 comprises an insulated substrate 21, one first insulating barrier 221, a lower coil and draws on layer 23,1 second insulating barrier 222, one first coil main body layer 24, one the 3rd insulating barrier 223, one second coil main body layer 25, one the 4th insulating barrier 224, a coil and draw layer 26,1 the 5th insulating barrier 225 and a magnetic material layer 27.Embodiment in Fig. 1, present embodiment is one group of helical coil circuit.This second insulating barrier 222, the first coil main body layer 24, the 3rd insulating barrier 223, the second coil main body layer 25 and the 4th insulating barrier 224 are coil main body laminated construction 28 again.
Fig. 3 A is the schematic diagram of another lead-out wire group 33 of the present invention.The two ends of drawing lead 331 are connected with leading-out terminal 332 and contact 333 respectively, and extend and around this contact 333.Draw lead 331 among the figure roughly around this contact 333 1 whole circles, and rough present square around the path.This draws lead 331 can do difformity around the variation in path, for example: rectangle, circle, octangle, irregular shape etc., adjust the mode impedance value of this common-mode noise filter element thus.
Fig. 3 B be a lead-out wire group 33 more of the present invention ' schematic diagram.Draw lead 331 ' two ends respectively with leading-out terminal 332 ' and contact 333 ' is connected, and extend and center on this contact 333 '.Draw lead 331 ' roughly among the figure around this contact 3/333rds ' four circles, also can select in addition around a few of a few or mark of 1/2nd circles, 1/4th circles, multiple.
Fig. 3 C is known lead-out wire group 33 " schematic diagram." be connected, and directly by this contact 333 " draws and do not center on to draw lead 331 " two ends respectively with leading-out terminal 332 " and contact 333.
Fig. 4 is that the lead-out wire group is schemed compared to the insertion loss (S21Insertion Loss) of traditional lead-out wire group among Fig. 3 A of the present invention and the 3B.Traditional herein lead-out wire group draw lead around this contact, that is " be check sample with lead-out wire group 33 among Fig. 3 C.Lead- out wire group 33 and 33 among Fig. 3 A and the 3B ' can increase common code impedance also just reduces common mode resonance frequency as seen from the figure, so promotes and can adjust the high frequency characteristics and the operation common mode rejection frequency scope of common-mode filter.
Except as among Fig. 1 and Fig. 2 magnetic material being laminated in the superiors, can also criticize being overlying on the superiors and orlop.Fig. 5 A is the structural representation of the common-mode filter 50 of another embodiment of the present invention, 571 batches of lower surfaces that are overlying on insulated substrate 11 of first magnetic material layer among the figure, 572 batches of upper surfaces that are overlying on the 5th insulating barrier 125 of second magnetic material layer again.Fig. 5 B be further embodiment of this invention common-mode filter 50 ' structural representation, the 3rd magnetic material layer 573 and 574 batches of the 4th magnetic material layers are overlying on common-mode filter 50 ' relative both side surface among the figure.Both side surface is provided with electrode in addition, does not then criticize to cover magnetic material layer.Above-mentioned magnetic material layer can increase the inductive effect of common-mode filter.
Fig. 6 A to 6J is each step schematic diagram of manufacture method of the common-mode filter of one embodiment of the invention.As shown in Figure 6A, one first insulating barrier 121 in spin coating on the insulating substrate 11.Utilize thin film metal deposition technology, gold-tinted developing technique or electroplating technology etc., make a lower coil and draw layer 13, shown in Fig. 6 B.Then, one second insulating barrier 122 in the spin coating, and utilize gold-tinted developing technique or etching technique etc., make the perforate 1221 that lead connects usefulness, shown in Fig. 6 C.Utilize thin film metal deposition technology, gold-tinted developing technique or electroplating technology etc. again, make one first coil main body layer 14, shown in Fig. 6 D.Spin coating 1 the 3rd insulating barrier 123 is shown in Fig. 6 E.Utilize thin film metal deposition technology, gold-tinted developing technique or electroplating technology etc., make one second coil main body layer 15, shown in Fig. 6 F.One the 4th insulating barrier 124 in the spin coating, and utilize gold-tinted developing technique or etching technique etc., make the perforate 1241 that lead connects, shown in Fig. 6 G.Utilize thin film metal deposition technology, gold-tinted developing technique or electroplating technology etc., coil is drawn layer 16 in the making one, shown in Fig. 6 H.Spin coating 1 the 5th insulating barrier 125 is drawn layer 16 surface in last coil, shown in Fig. 6 I.Utilize gluing technique technology, wire mark technology or spin coating technique etc., on the 5th insulating barrier 125, form a magnetic material layer 17, shown in Fig. 6 J.
Technology contents of the present invention and technical characterstic are open as above, yet those of ordinary skills still may reach openly and do all replacement and modifications that does not deviate from spirit of the present invention based on teaching of the present invention.Therefore, protection scope of the present invention should be not limited to the disclosed scope of embodiment, and should comprise various do not deviate from replacement of the present invention and modifications, and is contained by the claim scope of enclosing.
Claims (26)
1. common-mode filter comprises:
One insulating substrate;
One lower coil is drawn layer, be located on this insulating substrate, and comprise and draw lead, at least one leading-out terminal down and at least one contact down under at least one, wherein this time two ends of drawing lead are connected with this time leading-out terminal and this time contact respectively, and extension and center on this time contact;
Coil is drawn layer on one, comprise to draw lead, at least one leading-out terminal and at least one upper contact gone up at least one, wherein should on draw lead two ends respectively and should go up leading-out terminal and this upper contact is connected, and extension and center on this upper contact; And
One coil main body laminated construction is located on this that coil is drawn layer and this lower coil is drawn between the layer.
2. common-mode filter according to claim 1, wherein this time draw lead around this time contact maybe should on to draw lead be square, rectangle, circle, octangle or irregular shape around the path that centers on of this upper contact.
3. common-mode filter according to claim 1, wherein this time draw lead around this time contact maybe should on draw lead around this upper contact around the path be that a circle, 3/4ths encloses, a few or mark of multiple a few.
4. common-mode filter according to claim 1, it comprises in addition is located at this insulated substrate and this lower coil and draws first insulating barrier in the middle of the layer.
5. common-mode filter according to claim 4, wherein this coil main body laminated construction comprises folded in regular turn one second insulating barrier, one first coil main body layer, one the 3rd insulating barrier, one second coil main body layer and the 4th insulating barrier of establishing, and this first coil main body layer and this second coil main body layer comprise at least one helical coil circuit respectively again.
6. common-mode filter according to claim 5, it comprises in addition and is stacked at one the 5th insulating barrier and one first magnetic material layer that coil on this is drawn layer top in regular turn.
7. common-mode filter according to claim 6, it comprises one second magnetic material layer of being located at this insulated substrate surface in addition.
8. common-mode filter according to claim 7, it comprises one the 3rd magnetic material layer and one the 4th magnetic material layer of being located at the relative dual-side of this coil main body laminated construction in addition.
9. common-mode filter according to claim 1, wherein the material of this insulated substrate is aluminium oxide, aluminium nitride, glass, quartz or magnet material.
10. common-mode filter according to claim 6, wherein the material of this first insulating barrier, this second insulating barrier, the 3rd insulating barrier, the 4th insulating barrier and the 5th insulating barrier can be polyimides, epoxy resin, benzocyclobutane olefine resin or other high molecular polymer.
11. common-mode filter according to claim 5, wherein the material that this lower coil is drawn layer, this first coil main body layer, this second coil main body layer and coil is drawn layer on this is silver, palladium, aluminium, chromium, nickel, titanium, gold, copper or platinum.
12. common-mode filter according to claim 8, wherein the material of this first magnetic material layer, this second magnetic material layer, the 3rd magnetic material layer and the 4th magnetic material layer is magnetic base material or is mixed with the Magnaglo colloid.
13. common-mode filter according to claim 12, wherein the material of this Magnaglo colloid is one a mixture in Magnaglo and polyimides, epoxy resin, benzocyclobutane olefine resin and the high molecular polymer.
14. the manufacture method of a common-mode filter, it is as follows to comprise step:
One insulating substrate is provided;
On this insulating substrate, form a lower coil and draw layer, wherein this lower coil draw layer comprise at least one draw down lead, at least one leading-out terminal down and at least one under contact, the two ends that lead is drawn in this time are connected with this time leading-out terminal and this time contact respectively, and extend and around this time contact;
Forming a coil main body laminated construction draws on the layer in this lower coil; And
Coil is drawn layer on this coil main body lamination in the formation one, wherein should go up coil draws layer and comprises and draw lead, at least one leading-out terminal and at least one upper contact gone up at least one, should on draw lead two ends respectively and should go up leading-out terminal and this upper contact is connected, and extension and center on this upper contact.
15. the manufacture method of common-mode filter according to claim 14, it is contained in the step of this insulating substrate surface coated one first insulating barrier in addition, and wherein this first insulating barrier is drawn between the layer between this insulating substrate and this lower coil.
16. the manufacture method of common-mode filter according to claim 15, the step that wherein forms this coil main body laminated construction is as follows:
Be coated with one second insulating barrier and draw on the layer, and form at least one first perforate in this second insulating barrier in this lower coil;
Form one first coil main body layer on this second insulating barrier;
Be coated with one the 3rd insulating barrier on this first coil main body layer:
Form one second coil main body layer on the 3rd insulating barrier; And
Be coated with one the 4th insulating barrier on this second coil main body layer, and form at least one second perforate in the 4th insulating barrier.
17. the manufacture method of common-mode filter according to claim 16, wherein this lower coil is drawn layer, this first coil main body layer, this second coil main body layer and should be gone up coil and draw layer and formed with thin film metal deposition technology, gold-tinted developing technique or electroplating technology.
18. the manufacture method of common-mode filter according to claim 16, it is contained in coil on this in addition and draws the step that layer forms one the 5th insulating barrier and one first magnetic material layer in regular turn.
19. the manufacture method of common-mode filter according to claim 16, wherein this first insulating barrier, this second insulating barrier, the 3rd insulating barrier, the 4th insulating barrier and the 5th insulating barrier are formed with coating.
20. the manufacture method of common-mode filter according to claim 18, it is contained in the surface that this insulating substrate draws layer with respect to this lower coil in addition and forms the step of one second magnetic material.
21. the manufacture method of common-mode filter according to claim 20, it is contained in the step that the relative dual-side of this coil main body laminated construction forms one the 3rd magnetic material layer and one the 4th magnetic material layer in addition.
22. the manufacture method of common-mode filter according to claim 14, wherein the material of this insulated substrate is aluminium oxide, aluminium nitride, glass, quartz or magnet material.
23. the manufacture method of common-mode filter according to claim 18, wherein the material of this first insulating barrier, this second insulating barrier, the 3rd insulating barrier, the 4th insulating barrier and the 5th insulating barrier can be polyimides, epoxy resin, benzocyclobutane olefine resin or other high molecular polymer.
24. the manufacture method of common-mode filter according to claim 16, wherein the material that this lower coil is drawn layer, this first coil main body layer, this second coil main body layer and coil is drawn layer on this is silver, palladium, aluminium, chromium, nickel, titanium, gold, copper or platinum.
25. the manufacture method of common-mode filter according to claim 21, wherein the material of this first magnetic material layer, this second magnetic material layer, the 3rd magnetic material layer and the 4th magnetic material layer is magnetic base material or is mixed with the Magnaglo colloid.
26. the manufacture method of common-mode filter according to claim 25, wherein the material of this Magnaglo colloid is one a mixture in Magnaglo and polyimides, epoxy resin, benzocyclobutane olefine resin and the high molecular polymer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009101811154A CN102044322A (en) | 2009-10-12 | 2009-10-12 | Common-mode filter and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009101811154A CN102044322A (en) | 2009-10-12 | 2009-10-12 | Common-mode filter and manufacturing method thereof |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103093947A (en) * | 2011-11-07 | 2013-05-08 | 三星电机株式会社 | Layered inductor and manufacturing method fo the same |
| CN103929142A (en) * | 2014-04-03 | 2014-07-16 | 深圳顺络电子股份有限公司 | Laminated sheet type low pass filter for CATV |
| CN105659340A (en) * | 2014-01-15 | 2016-06-08 | 株式会社村田制作所 | Electric circuit |
| CN110391064A (en) * | 2018-04-18 | 2019-10-29 | 株式会社村田制作所 | Common mode choke |
-
2009
- 2009-10-12 CN CN2009101811154A patent/CN102044322A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103093947A (en) * | 2011-11-07 | 2013-05-08 | 三星电机株式会社 | Layered inductor and manufacturing method fo the same |
| CN105659340A (en) * | 2014-01-15 | 2016-06-08 | 株式会社村田制作所 | Electric circuit |
| US10157705B2 (en) | 2014-01-15 | 2018-12-18 | Murata Manufacturing Co., Ltd. | Electric circuit |
| CN103929142A (en) * | 2014-04-03 | 2014-07-16 | 深圳顺络电子股份有限公司 | Laminated sheet type low pass filter for CATV |
| CN103929142B (en) * | 2014-04-03 | 2016-08-24 | 深圳顺络电子股份有限公司 | Lamination sheet type low pass filter for CATV |
| CN110391064A (en) * | 2018-04-18 | 2019-10-29 | 株式会社村田制作所 | Common mode choke |
| CN110391064B (en) * | 2018-04-18 | 2021-06-15 | 株式会社村田制作所 | Common mode choke coil |
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