CN102314994A - Thin common-mode filter and manufacturing method thereof - Google Patents
Thin common-mode filter and manufacturing method thereof Download PDFInfo
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- CN102314994A CN102314994A CN2010102248200A CN201010224820A CN102314994A CN 102314994 A CN102314994 A CN 102314994A CN 2010102248200 A CN2010102248200 A CN 2010102248200A CN 201010224820 A CN201010224820 A CN 201010224820A CN 102314994 A CN102314994 A CN 102314994A
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Abstract
The invention discloses a thin common-mode filter and a manufacturing method thereof. The thin common-mode filter comprises an insulative flexible substrate, a first magnetic material layer, a first coil lead-out layer, a coil main body lamination structure, a second coil lead-out layer and a second magnetic material layer. The first coil lead-out layer is formed on the first surface of the flexible substrate, and the first magnetic material layer is formed on the second surface of the flexible substrate, wherein the first surface is opposite to the second surface. The coil main body lamination structure, the second coil lead-out layer and the second magnetic material layer are sequentially stacked on the first coil lead-out layer. According to the invention, the thin-film type common-mode filter can be manufactured under lower cost, and the manufacturing and technological processes required by entire production are largely simplified.
Description
Technical field
The present invention relates to a kind of common-mode filter and manufacturing approach thereof, particularly a kind of thin gauge film common-mode filter and manufacturing approach thereof.
Background technology
Common-mode filter is one to be used to suppress the element of common mode current, and this common mode current can cause the generation of electromagnetic interference in the parallel transmission circuit.At present common-mode filter can be applied to portable communicator for wanting, and requires the structure of miniaturization and densification more, so diaphragm type and laminated common-mode filter replace conventional roll line style common-mode filter gradually.The winding type common-mode filter is to go up the shape that volume is paid coil at columned FERRITE CORE (Ferrite Core) just like its name.And film-type and stack-up type must adopt more semiconductor fabrication program, and for example: the film-type common-mode filter adopts photoetching technique (Photo Lithography) technology normally on tabular ferrite, form plane coil.In addition, the stack-up type common-mode filter then is on tabular ferrite, adopts half tone (Screen) printing technology to form coil, re-uses to burn till the technology completion of pressing.
For the common code impedance (common impedance) that can adjust coil line; United States Patent (USP) announces the 7th; 145,427B2 number a kind of common-mode noise filter element is disclosed, it is formed on coil line on the magnetic base material; And the structure of the non-coil line of part dug a hole via etching technique, insert again be mixed with Magnaglo colloid in the hole.After adopting the flatening process technology with flattening surface then, bonding via bonding technique and another magnetic base material again, to accomplish the making of this element.This prior art scheme is to adjust common code impedance via changing thickness of insulating layer, so THICKNESS CONTROL just becomes the key factor of control mode impedance value.Yet the THICKNESS CONTROL of insulating barrier wants control thickness obviously to be not easy perhaps must increase suitable manufacturing cost at accurate value range according to the character of technology mode, technological parameter and insulating material.
In addition, United States Patent (USP) announces the 6th, 356, and 181B1 number and the 6th, 618,929B2 number a kind of lamination common-mode filter is disclosed, also on magnetic base material, making loop construction, and to cover magnetic material be loam cake.This prior art scheme particularly changes the wiring pattern of coil, thereby reduces the impedance of differential signal.Yet the wiring pattern of coil continues and distributes and is positioned at different laminations, so change comparatively complicacy, and the variable of influence is more.
Existing common-mode filter needs the substrate or the base material of low " dielectric absorption (dielectric loss) " to make usually, so the material of substrate or base material, more options ferrite (ferrite) material, aluminium oxide (Al
2O
3), aluminium nitride (AlN), glass (Glass) or quartzy (Quartz).Described substrate of above-mentioned prior art (substrate) or base material (sheet) all refer to the ceramic substrate of sintering (sintering) moulding, for example ferrite, aluminium oxide, aluminium nitride; Or high temperature burns till the non-ceramic substrate of (firing), for example: glass, quartz.Or with above-mentioned material and mixed with resin and combined type (composite) base material of moulding.
Above-mentioned these substrates or base material all have its restriction aspect thickness, for being suitable for a large amount of making, its thickness is most to be required more than 300 μ m.In addition, the technology of these substrates or base material is all quite complicated and consuming time, and cost is also very high.Especially thickness requirement is below 300 μ m, even the substrate below the 200 μ m or base material are then especially because of being inappropriate for very costliness of volume production.When these substrates or substrate applications during in the manufacturing of common mode filtering element, because substrate thickness is very thick, cause this element aspect thickness, its certain limit is arranged, and be unfavorable for the development of element " light, thin ".
The definition of above-mentioned " substrate " is that general reference is through the flat board (plate) of pbz polymer (polymer) material not of high-temperature process and body more than 600 ℃.And the definition of " base material " to be general reference handle more than 600 ℃ without the high temperature place and body in contain the flat board of macromolecular material.But in aforesaid substrate or the base material, having only aluminum oxide substrate is the industry of a maturation, and its cost must determine through supply and demand market balance.The substrate of other materials or base material all belong to rarely, and its source is limited with technology, and the cost and the source of goods are subject to minority supplier again.
And substrate, base material below the 300 μ m are common then for being used for printed circuit board (PCB) (Printed CircuitBoard; PCB) glass mat.Yet the thickness of printed circuit board (PCB) also has bottleneck, and greatly about about 200 μ m, and dielectric absorption is too big, be about aforementioned ferrite, aluminium oxide, aluminium nitride, glass, quartzy about hundred times.
Material as for other slim base materials; For example: plastic cement macromolecules such as PP, PE; Though be easy to obtain the The thin plate of these materials; But except the problem of high dielectric absorption, need consider reflow welding (reflow) technology that electronic component will pass through, so these general high molecular weight plastics are can't bear this reflow temperature and can be out of shape or decompose.
In sum, need a kind of common-mode filter and manufacturing approach of effective minimizing component thickness on the market, thereby can overcome the shortcoming that above-mentioned existing common-mode filter has to be had, and can reduce manufacturing cost.
Summary of the invention
To the problem that exists in the prior art, the object of the present invention is to provide a kind of thin gauge film common-mode filter simple in structure, this thin gauge film common-mode filter uses the flexible base material of insulation to be substrate.This flexible base material is very thin thickness not only, and can resist the temperature of reflow welding, the advantage that therefore thin gauge film common-mode filter thickness is provided and uses.
The present invention provides a kind of low-cost method of making common-mode filter, can produce continuously as substrate through the flexible base material that uses insulation, not only can reach the structure of low dielectric absorption, and can extra increase manufacturing cost.
In sum, the present invention discloses a kind of slim common-mode filter, and flexible base material, one first magnetic material layer, one first coil that comprises an insulation draws that layer, a coil main body laminated construction, one second coil are drawn layer and one second magnetic material layer.This first coil is drawn layer and is formed on the first surface of this flexible base material, and this first magnetic material layer is formed on the second surface of this flexible base material again, and wherein this first surface is relative with this second surface.This coil main body laminated construction, this second coil are drawn layer and this second magnetic material layer is stacked in this first coil in regular turn and draws on the layer again.
The present invention discloses a kind of manufacturing approach of common-mode filter in addition, and it is following to comprise step: the flexible base material that an insulation is provided; On the first surface of this flexible base material, form one first coil and draw layer; On the second surface of this flexible base material, form one first magnetic material layer, wherein this first surface is relative with this second surface; Forming a coil main body laminated construction draws on the layer in this first coil; Form one second coil and draw layer on this coil main body lamination; And form one second magnetic material layer and draw on the layer in this second coil.
Beneficial effect of the present invention is; But the present invention is utilized in the structure of making insulating barrier and coil in regular turn on the high dielectric polyimide takeup type of the low-loss base material, but and utilizes fabrography to make one magnetic/nonmagnetic substance combination layer in uppermost surface and polyimides takeup type substrate backside.Through above-mentioned processing step, can under lower cost, make the diaphragm type common-mode filter, and required preparation and the processing step of production also simplified many.
Description of drawings
Fig. 1 is the decomposing schematic representation of the common-mode filter of one embodiment of the invention;
Fig. 2 is the decomposing schematic representation of the common-mode filter of another embodiment of the present invention;
Fig. 3 A to Fig. 3 J is each step sketch map of manufacturing approach of the common-mode filter of one embodiment of the invention; And
Fig. 4 is the generalized section of the common-mode filter of another embodiment of the present invention.
Wherein, description of reference numerals is following:
10,20,40 common-mode filters
11 flexible base materials
12 first magnetic/nonmagnetic substance combination layer
13 first coils are drawn layer
14 coil main body laminated construction
15 second coils are drawn layer
16 the 4th insulating barriers
17 second magnetic/nonmagnetic substance combination layer
111 first surfaces
112 second surfaces
121 first magnetic material layers
122 first layer of non-magnetic material
131 first electrodes
132 second electrodes
133 leads
141 first insulating barriers
142 second insulating barriers
143 the 3rd insulating barriers
144 connecting holes
145 connecting holes
146 first coil main body layers
147 second coil main body layers
151 first electrodes
152 second electrodes
153 leads
171 second magnetic material layers
172 second layer of non-magnetic material
211 the 5th insulating barriers
382 magnetic material layers
1,461 first electrodes
1,462 second electrodes
1463 helical coils
1,471 first electrodes
1,472 second electrodes
1473 helical coils
Embodiment
Fig. 1 is the decomposing schematic representation of the slim common-mode filter of one embodiment of the invention.As shown in Figure 1, a common-mode filter 10 comprises that flexible base material 11, first magnetic/nonmagnetic substance combination layer 12, one first coil of an insulation are drawn layer 13, one coil main body laminated construction 14, one second coil is drawn layer 15,1 the 4th insulating barrier 16 and second magnetic/nonmagnetic substance combination layer 17.First insulating barrier 141, the first coil main body layer 146, second insulating barrier 142, the second coil main body layer 147 and the 3rd insulating barrier 143 constitute these coil main body laminated construction 14 again.
The flexible base material 11 of this insulation can be that (Flexible Print Circuit FPC), can select polyimides (polyimide to the flexible circuit board; PI) as the material of flexible base material 11, or other pliability materials with low dielectric absorption and anti-reflow welding high temperature also can.
Because polyimide material has preferable electric, mechanical property, be preferred materials as flexible base material 11, for example: 288 ℃ of the serviceability temperatures of high-low temperature resistant characteristic-continuously, interrupted 480 ℃, also can use under the utmost point low temperature (below the 1K); Abrasion performance under the abrasion performance-unlubricated is more than 10 times of common engineering plastics, the impact abrasion with shake abrasion very strong patience also arranged; Even not yielding-as at high temperature also can not soften, can support high load capacity, at 260 ℃, 180kg/cm
2Condition under kept 1000 hours, its creep (creep) only has 0.6%; Electric insulation-insulation endurance is 22kv/mm, and anti-plasma and radioactive ray are good again; Chemical resistance-Nai lubricating grease, oil, solvent; Machining property-be easy to machining.In addition, benzocyclobutene (Benzocyclobutene; BCB) resin also can be as the material of this flexible base material 11.
Polyimide material is made polyimide or film (PI film), has been the industry of a maturation, and thickness generally all can be controlled in below the 50 μ m.Ripe at present, common commercial specification is 17.5 μ m, 35 μ m and 50 μ m.With conventional substrate such as aforementioned conventional pottery, non-potteries, need the above thickness of 300 μ m that significant difference is arranged easily.Especially the circuit main part of utilizing thin-film technique to make common-mode filter only has the thickness about 50 μ m mostly, but if use conventional substrate will occupy 300 μ m, obviously can't satisfy the demand of present slim common-mode filter.
This first magnetic/nonmagnetic substance combination layer 12 is formed at the second surface 112 of this flexible base material 11 with wire mark or other coating methods; It comprises one first magnetic material layer 121 and one first layer of non-magnetic material 122, and wherein this first layer of non-magnetic material 122 is positioned at the both sides of this first magnetic material layer 121.The pattern of this of present embodiment first magnetic material layer 121 and this first layer of non-magnetic material 122 and the scope of patent protection of the present invention of letting loose can also have other patterns, or only have this first magnetic material layer 121 to cover this second surface 112.This first magnetic material layer 121 can be magnetic base material or is mixed with the Magnaglo colloid, allocates and forms and the Magnaglo colloid can be Magnaglo and one of polyimides (polyimide), epoxy resin (epoxy resin), benzocyclobutene (BCB) or other high molecular polymer (polymer).And the material of this first layer of non-magnetic material 122 can be polyimides (polyimide), epoxy resin (epoxy resin), benzocyclobutene (BCB) or other high molecular polymer (polymer).
This first coil is drawn the first surface 111 that layer 13 is formed at this flexible base material 11, and it comprises the lead 133 that one first electrode 131, one second electrode 132 and connect this first electrode 131 and second electrode 132.Drawing layer in this first coil has on 13 one first insulating barrier 141 to cover, and has a connecting hole 144 to run through this first insulating barrier 141 again, in order to connect helical coil circuit in this first electrode 131 and this coil main body laminated construction 14.
This first coil main body layer 146 is located on this first insulating barrier 141, and it comprises one first electrode 1461, one second electrode 1462 and a helical coil 1463.Between this first coil main body layer 146 and this second coil main body layer 147, be provided with this second insulating barrier 142, this second coil main body layer 147 also comprises one first electrode 1471, one second electrode 1472 and a helical coil 1473 again.On this second coil main body layer 147, be provided with one the 3rd insulating barrier 143, have a connecting hole 145 to run through the 3rd insulating barrier 143, draw layer 15 in order to connect this first electrode 1471 and this second coil.This second coil is drawn layer 15 and is comprised the lead 153 that one first electrode 151, one second electrode 152 and connect this first electrode 151 and second electrode 152.Draw layer 15 in this second coil and be provided with the cementing layer of the 4th insulating barrier 16, the four insulating barriers 16 for having viscosity.And this second magnetic/nonmagnetic substance combination layer 17 is set on the 4th insulating barrier 16.This second magnetic/nonmagnetic substance combination layer 17 comprises one second magnetic material layer 171 and one second layer of non-magnetic material 172.
This coil main body laminated construction 14 of present embodiment has one group of helical coil circuit, but not as limit, can be made in the same common-mode filter by more group helical coil circuits.
This first coil is drawn layer 13, this first coil main body layer 146, this second coil main body layer 147 and this second coil, and to draw the material of layer 15 can be silver (Ag), palladium (Pd), aluminium (Al), chromium (Cr), nickel (Ni), titanium (Ti), gold (Au), copper (Cu) or platinum (Pt).
Fig. 2 is the decomposing schematic representation of the common-mode filter of another embodiment of the present invention.As shown in Figure 2, a common-mode filter 20 comprises that the flexible base material 11, first magnetic of an insulation/nonmagnetic substance combination layer 12, one the 5th insulating barrier 112, one first coil are drawn layer 13, one coil main body laminated construction 14, one second coil is drawn layer 15,1 the 4th insulating barrier 16 and second magnetic/nonmagnetic substance combination layer 17.Common-mode filter 10 in Fig. 1; The common-mode filter 20 of Fig. 2 has one the 5th insulating barrier 211 in addition in this flexible base material 11 and this first magnetic/12 of nonmagnetic substance combination layers; Its cementing layer for having viscosity is so can be adhered together this flexible base material 11 and this first magnetic/nonmagnetic substance combination layer 12.
Fig. 3 A to Fig. 3 J is each step sketch map of manufacturing approach of the common-mode filter of one embodiment of the invention.Shown in Fig. 3 A, utilize wire mark technology or other coating processes, first magnetic material layer 121 and this first layer of non-magnetic material 122 are formed on the second surface 112 of this flexible base material 11.
Utilize thin film metal deposition technology, gold-tinted developing technique or electroplating technology etc., make first coil and draw layer 13, shown in Fig. 3 B.Then, one first insulating barrier 141 in the spin coating, and utilize gold-tinted developing technique or etching technique etc., make the connecting hole 144 that upper and lower electrode connects usefulness, shown in Fig. 3 C.Utilize thin film metal deposition technology, gold-tinted developing technique or electroplating technology etc. again, make one first coil main body layer 146, shown in Fig. 3 D.Spin coating one second insulating barrier 142 is shown in 3E.Utilize thin film metal deposition technology, gold-tinted developing technique or electroplating technology etc., make one second coil main body layer 147, shown in Fig. 3 F.One the 3rd insulating barrier 143 in the spin coating, and utilize gold-tinted developing technique or etching technique etc., make the connecting hole 145 that electrode connects, shown in Fig. 2 G.Utilize thin film metal deposition technology, gold-tinted developing technique or electroplating technology etc., make one second coil and draw layer 15, shown in Fig. 3 H.Spin coating 1 the 4th insulating barrier 16 is drawn layer 15 surface in this second coil, shown in Fig. 3 I.Utilize gluing technique technology, wire mark technology or spin coating technique etc., on the 4th insulating barrier 16, form this second magnetic/nonmagnetic substance combination layer 17, shown in Fig. 3 J.
Fig. 4 is the generalized section of the slim common-mode filter of another embodiment of the present invention.This common-mode filter 10 in Fig. 3 J, the dual-side of this common-mode filter 40 among Fig. 4 (side of no outer electrode) covers a magnetic material layer (the 3rd magnetic material layer and the 4th magnetic material layer) 382 respectively.
It is can coiled base material that the present invention utilizes polyimide piece; But above this polyimides takeup type base material, utilize spin coating technique, gold-tinted developing process, the auxiliary vapour deposition of electricity slurry, electroplating technology and film etching technology, deposition is made film coil structure and insulating barrier in regular turn.Outer surface then utilizes wire mark technology again, in the position of needs, be exactly usually Inside coil directly over, magnetic material thick film (thickfilm) layer in the preparation one.Be the back side of this coiling property base material at last, utilize wire mark technology, in the position of needs; Usually be exactly Inside coil under; But not whole " back side of coiling property base material " prepares magnetic material thick film layers, and then accomplishes the making of this common mode filtering element.
Above-mentioned etch process can adopt dry ecthing or wet etching process, and dry ecthing can be reactive ion etching (RIE) technology, and wet etching can adopt the chemical solution etch process.
Can know by above step; But the present invention is utilized in the structure of making insulating barrier and coil in regular turn on the high dielectric polyimide takeup type of the low-loss base material, but and utilizes fabrography to make one magnetic/nonmagnetic substance combination layer in uppermost surface and polyimides takeup type substrate backside.Through above-mentioned processing step, can under lower cost, make the diaphragm type common-mode filter, and required preparation and the processing step of production also simplified many.
The structure of diaphragm type common-mode filter of the present invention is illustrated in figure 1 as the structure of single element, and right the present invention also can be applicable on array (array) component structure.
Technology contents of the present invention and technical characterstic disclose as above, yet those skilled in the art still maybe be based on teaching of the present invention and announcements and done all replacement and modifications that does not deviate from spirit of the present invention.Therefore, protection scope of the present invention should be not limited to that embodiment discloses, and should comprise various do not deviate from replacement of the present invention and modifications, and is contained by following claim.
Claims (26)
1. slim common-mode filter comprises:
The flexible base material of one insulation;
One first coil is drawn layer, is formed on the first surface of this flexible base material;
One first magnetic material layer is formed on the second surface of this flexible base material, and wherein this first surface is relative with this second surface;
One coil main body laminated construction is located at this first coil and is drawn on the layer;
One second coil is drawn layer, is located on this coil main body laminated construction; And
One second magnetic material layer is located at this second coil and is drawn on the layer.
2. slim common-mode filter according to claim 1 is characterized in that, the material of this flexible base material is polyimides or benzocyclobutane olefine resin.
3. slim common-mode filter according to claim 1 is characterized in that, the thickness of this flexible base material is below 50 μ m.
4. slim common-mode filter according to claim 1; It is characterized in that; This coil main body laminated construction comprises folded in regular turn one first insulating barrier, one first coil main body layer, one second insulating barrier, one second coil main body layer and one the 3rd insulating barrier of establishing, and this first coil main body layer and this second coil main body layer comprise at least one helical coil circuit respectively again.
5. slim common-mode filter according to claim 4 is characterized in that, this slim common-mode filter also comprise be located at this second magnetic material layer and this second coil draw layer between the 4th insulating barrier.
6. slim common-mode filter according to claim 5 is characterized in that, this slim common-mode filter also comprises is located at this flexible base material and the 5th middle insulating barrier of this first magnetic material layer.
7. slim common-mode filter according to claim 4 is characterized in that, this slim common-mode filter also comprises one and is located at first layer of non-magnetic material of this second surface jointly with this first magnetic material layer.
8. slim common-mode filter according to claim 7; It is characterized in that; This first layer of non-magnetic material is located at this first magnetic material layer both sides, and the position of this first magnetic material layer and this first coil main body layer and this second coil main body layer is overlapping in vertical direction.
9. slim common-mode filter according to claim 5 is characterized in that, this slim common-mode filter also comprises one and is located at lip-deep second layer of non-magnetic material of the 4th insulating barrier jointly with this second magnetic material layer.
10. slim common-mode filter according to claim 6; It is characterized in that the material of this first insulating barrier, this second insulating barrier, the 3rd insulating barrier, the 4th insulating barrier and the 5th insulating barrier is polyimides, epoxy resin or benzocyclobutane olefine resin.
11. slim common-mode filter according to claim 4; It is characterized in that this first coil is drawn layer, this first coil main body layer, this second coil main body layer and this second coil and drawn the material of layer and be silver, palladium, aluminium, chromium, nickel, titanium, gold, copper or platinum.
12. slim common-mode filter according to claim 1 is characterized in that, the material of this first magnetic material layer and this second magnetic material layer is the colloid that is mixed with Magnaglo.
13. slim common-mode filter according to claim 12 is characterized in that, the colloid that the powder that this colloid that is mixed with Magnaglo is a magnetic material mixes with polyimides, epoxy resin or benzocyclobutene.
14. slim common-mode filter according to claim 1; It is characterized in that; This slim common-mode filter also comprises one the 3rd magnetic material layer and one the 4th magnetic material layer, and the 3rd magnetic material layer and the 4th magnetic material layer are located at the side that this slim common-mode filter does not have outer electrode respectively.
15. the manufacturing approach of a slim common-mode filter, it is following to comprise step:
The flexible base material of one insulation is provided;
On the first surface of this flexible base material, form one first coil and draw layer;
On the second surface of this flexible base material, form one first magnetic material layer, wherein this first surface is relative with this second surface;
Forming a coil main body laminated construction draws on the layer in this first coil;
Form one second coil and draw layer on this coil main body laminated construction; And
Forming one second magnetic material layer draws on the layer in this second coil.
16. the manufacturing approach of slim common-mode filter according to claim 15 is characterized in that, the step that forms this coil main body laminated construction is following:
Be coated with one first insulating barrier and draw on the layer, and form at least one first connecting hole in this first insulating barrier in this first coil;
Form one first coil main body layer on this first insulating barrier;
Be coated with one second insulating barrier on this first coil main body layer:
Form one second coil main body layer on this second insulating barrier; And
Be coated with one the 3rd insulating barrier on this second coil main body layer, and form at least one second connecting hole in the 4th insulating barrier.
17. the manufacturing approach of slim common-mode filter according to claim 16; It is characterized in that, this first coil draw layer, this first coil main body layer, this second coil main body layer and this second coil draw the layer formed with thin film metal deposition technology, gold-tinted developing technique or electroplating technology.
18. the manufacturing approach of slim common-mode filter according to claim 16 is characterized in that, the manufacturing approach of this slim common-mode filter also is contained in this second coil and draws the step that layer is gone up formation one the 4th insulating barrier.
19. the manufacturing approach of slim common-mode filter according to claim 15; It is characterized in that; The manufacturing approach of this slim common-mode filter also comprises the step that forms one first layer of non-magnetic material, and this first layer of non-magnetic material and this first magnetic material layer are located at this second surface jointly.
20. the manufacturing approach of slim common-mode filter according to claim 18; It is characterized in that; The manufacturing approach of this slim common-mode filter also comprises the step that forms one second layer of non-magnetic material, and this second layer of non-magnetic material and this second magnetic material layer are located at the surface of the 4th insulating barrier jointly.
21. the manufacturing approach of slim common-mode filter according to claim 18 is characterized in that, the manufacturing approach of this slim common-mode filter also is contained in this flexible base material and this first coil is drawn the middle step that forms one the 5th insulating barrier of layer.
22. the manufacturing approach of slim common-mode filter according to claim 21; It is characterized in that the material of this first insulating barrier, this second insulating barrier, the 3rd insulating barrier, the 4th insulating barrier and the 5th insulating barrier is polyimides, epoxy resin or benzocyclobutane olefine resin.
23. the manufacturing approach of slim common-mode filter according to claim 15 is characterized in that, the material of this flexible base material is polyimides or benzocyclobutane olefine resin.
24. the manufacturing approach of slim common-mode filter according to claim 16; It is characterized in that this first coil is drawn layer, this first coil main body layer, this second coil main body layer and this second coil and drawn the material of layer and be silver, palladium, aluminium, chromium, nickel, titanium, gold, copper or platinum.
25. the manufacturing approach of slim common-mode filter according to claim 16 is characterized in that, this first connecting hole and this second connecting hole use gold-tinted developing technique or etch process to make.
26. the manufacturing approach of slim common-mode filter according to claim 17 is characterized in that, this etch process is dry etching process or wet etching process, and this dry ecthing is a reactive ion etching process again, and this wet etching is the chemical solution etch process.
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| CN103138712A (en) * | 2013-01-30 | 2013-06-05 | 深圳市麦捷微电子科技股份有限公司 | Novel laminated two-channel common mode electro-static discharge (ESD) filter |
| CN103295731A (en) * | 2012-03-02 | 2013-09-11 | 株式会社村田制作所 | Laminated electronic component and method of manufacturing laminated electronic component |
| CN103426626A (en) * | 2012-05-18 | 2013-12-04 | 佳邦科技股份有限公司 | Preparation method of thin-film element and preparation method of common-mode filter of thin-film element |
| WO2014005311A1 (en) * | 2012-07-05 | 2014-01-09 | Laird Technologies (Shenzhen) Ltd. | Common mode filters |
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| CN103295731A (en) * | 2012-03-02 | 2013-09-11 | 株式会社村田制作所 | Laminated electronic component and method of manufacturing laminated electronic component |
| CN103295731B (en) * | 2012-03-02 | 2015-11-18 | 株式会社村田制作所 | The manufacture method of laminated electronic element and laminated electronic element |
| CN103426626A (en) * | 2012-05-18 | 2013-12-04 | 佳邦科技股份有限公司 | Preparation method of thin-film element and preparation method of common-mode filter of thin-film element |
| WO2014005311A1 (en) * | 2012-07-05 | 2014-01-09 | Laird Technologies (Shenzhen) Ltd. | Common mode filters |
| CN103138712A (en) * | 2013-01-30 | 2013-06-05 | 深圳市麦捷微电子科技股份有限公司 | Novel laminated two-channel common mode electro-static discharge (ESD) filter |
| CN103138712B (en) * | 2013-01-30 | 2015-08-19 | 深圳市麦捷微电子科技股份有限公司 | A kind of novel lamination binary channels common mode ESD filter |
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Application publication date: 20120111 |