CN101840768B - Film-type common-mode noise filter structure and manufacture method - Google Patents
Film-type common-mode noise filter structure and manufacture method Download PDFInfo
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- CN101840768B CN101840768B CN2009101295042A CN200910129504A CN101840768B CN 101840768 B CN101840768 B CN 101840768B CN 2009101295042 A CN2009101295042 A CN 2009101295042A CN 200910129504 A CN200910129504 A CN 200910129504A CN 101840768 B CN101840768 B CN 101840768B
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Abstract
The invention discloses a film-type common-mode noise filter structure and a manufacture method. The manufacture method comprises the following steps of: forming a plurality of electric insulating layers, coil lead-drawing layers and coil main body layers on an insulated substrate by utilizing a yellow light developing technique, a chemical air-phase deposition process, an etching technology or other chemical processes; and then, covering with an electric insulating cementing layer and a magnetic material layer to form a film-type common-mode noise filter. The film-type common-mode noise filter can be manufactured and finished under lower cost and the common-mode noise filtration characteristic can be improved.
Description
Technical field
The present invention relates to a kind of structure and manufacturing approach of film-type common-mode noise filter, be meant especially on an insulating substrate and make film coil, film coil can be made under lower cost, and can reach the purpose of filtering high frequency common mode noise characteristic.
Background technology
United States Patent (USP) the 7th; 145,427B2 number " COIL COMPONENT AND METHOD OF MANUFACTURING THE SAME " patent case mainly discloses a kind of common-mode noise filtering unit; System is produced on magnetic base material upper end with loop construction; Dig a hole on the assembly of the non-loop construction of part with etching technique again, in this hole, insert the colloid that is mixed with Magnaglo again, be aided with the planarization process technique with flattening surface after; Bind via bonding technique and another magnetic base material again, to reach the making of this assembly.
Another U.S. the 6th, 356,181B1 number and the 6th; 618,929B2 patent case mainly discloses a kind of stratiform common-mode filter; This two case also is to make loop construction in magnetic base material upper end; The loam cake lid of processing with magnetic material again covers, and the more special place of this two case is to mention the wire laying mode of coil, in the hope of reducing the impedance of differential signal.
Yet above-mentioned known technology, its processing procedure are all too complicated, consuming time, and expend cost, especially use magnetic material as base material, the filtering characteristic of common-mode noise only can reach-20dB about, the manufacturing cost of common-mode noise filtering unit also can remain high.
Therefore, the inventor proposes a kind of simple in structure, the common-mode noise filtering characteristic can greater than-more than the 30dB, and can reduce the structure and the manufacturing approach of cost of manufacture.
Summary of the invention
Therefore; The present invention aims to provide a kind of structure and manufacturing approach of film-type common-mode noise filter, is to use insulating substrate as substrate, utilizes spin coating technique, gold-tinted developing manufacture process, the auxiliary vapour deposition of electricity slurry, electroplating process and film etching technology again in this substrate top; Deposition is made film coil structure and insulating barrier in regular turn; The superiors utilize bonding technique, spin coating technique or wire mark processing procedure again, prepare a magnetic material layer, and then accomplish the making of this common-mode noise filtering unit.
Structure and manufacturing approach according to film-type common-mode noise filter of the present invention; System uses aluminium oxide (Al2O3), aluminium nitride (AlN), glass (Glass) or quartzy materials such as (Quartz) as insulating substrate; By using insulating substrate as low-loss and the base material of high insulation can make processing procedure simplify, manufacturing cost reduces; And can reach better common-mode noise filtering characteristic, be an of the present invention purpose.
Your auditor can do further understanding and understanding for ease of, to lift the embodiment conjunction with figs. now, specify as follows the object of the invention, shape, constructing apparatus characteristic and effect thereof:
Description of drawings
Fig. 1 is the perspective exploded view of the structure of film-type common-mode noise filter of the present invention.
Fig. 2 A～2J is the manufacturing process sketch map of the structure of film-type common-mode noise filter of the present invention.
Fig. 3 is second embodiment of the present invention figure.
Fig. 4 is third embodiment of the present invention figure.
Fig. 5 is fourth embodiment of the present invention figure.
Fig. 6 is that the electrical characteristic of the structure of film-type common-mode noise filter of the present invention measures figure.
[primary clustering symbol description]
1: 2: the first electric insulation layers of insulating substrate
Winding wire was drawn 4: the second electric insulation layer of layer in 3: the first
6: the three electric insulation layer of 5: the first coil main body layers
8: the four electric insulation layer of 7: the second coil main body layers
Winding wire was drawn layer 10 in 9: the second: the insulation cementing layer
11: 31: the first electrodes of magnetic material layer
Electrode 33 in 32: the second: lead
41: 51: the first electrodes of wire connection hole
Electrode 53 in 52: the second: helical coil
72: the second electrodes of 71: the first electrodes
73: helical coil 81: wire connection hole
92: the second electrodes of 91: the first electrodes
93: lead
401,402,403,404: magnetic material layer
501: 502: the first electric insulation layers of insulating substrate
The antithesis winding wire was drawn layer in 503: the first
505: the first antithesis coils of 504: the second electric insulation layers body layer
507: the second antithesis coils of 506: the three electric insulation layers body layer
508: the four electric insulation layers
The antithesis winding wire was drawn layer in 509: the second
600: insulation cementing layer 601: magnetic material layer
Embodiment
The structure of film-type common-mode noise filter of the present invention; As shown in Figure 1, comprise in regular turn from lower to upper: an insulating substrate 1, one first electric insulation layer 2, one first winding wire are drawn layer 3,1 second electric insulation layer 4, one first coil main body layer 5, one the 3rd electric insulation layer 6, one second coil main body layer 7, one the 4th electric insulation layer 8, one second winding wire is drawn layer 9, one an insulation cementing layer 10; An and magnetic material layer 11.
The structure of the film-type common-mode noise filter of the invention described above makes via following steps:
1, selects aluminium oxide (Al2O3), aluminium nitride (AlN), glass (Glass) or quartzy base materials such as (Quartz) for use; Prepare an insulating substrate 1; Again in upper end face spin coating one first electric insulation layer 2 of this insulating substrate 1; The material of first electric insulation layer 2 is optional from polyimides (polyimide), epoxy resin (epoxy resin), benzocyclobutane olefine resin (BCB) or other high molecular polymer (polymer); Its spin coating thickness can be in order to adjustment resistance value (impedance value), shown in Fig. 2 A;
2, at the upper end face of first electric insulation layer 2; Utilize thin film metal deposition processing procedure, gold-tinted developing manufacture process and electroplating process; Make one first coil and draw layer 3; The material that first coil is drawn layer 3 can be selected from one of silver (Ag), palladium (Pd), aluminium (Al), chromium (Cr), nickel (Ni), titanium (Ti), gold (Au), copper (Cu), platinum (Pt) or its alloy; First coil is drawn layer 3 and is included between first electrode 31 and second electrode, 32, the first electrodes 31 and second electrode 32 with lead 33 connections, shown in Fig. 2 B;
3, utilize gold-tinted developing manufacture process or etching technique; First coil draw the layer 3 above spin coating one second electric insulation layer 4; And utilize gold-tinted developing technique or etching technique to make a wire connection hole 41; The position of wire connection hole 41 is to drawing first electrode 31 of layer 3 to first coil; The material of this second electric insulation layer 4 is same optional from polyimides (polyimide), epoxy resin (epoxy resin), benzocyclobutane olefine resin (BCB) or other high molecular polymer (polymer), shown in Fig. 2 C;
4, above second electric insulation layer 4; Utilize thin film metal deposition processing procedure, gold-tinted developing technique and electroplating process; Make the first coil main body layer 5, coil is drawn layer 5 material can be selected from one of silver (Ag), palladium (Pd), aluminium (Al), chromium (Cr), nickel (Ni), titanium (Ti), gold (Au), copper (Cu), platinum (Pt) or its alloy equally, and this first coil main body layer 5 comprises first electrode 51, second electrode 52; And the helical coil 53 that connects first electrode 51 and second electrode 52; Wherein, first electrode 51 can be connected with first electrode 31 that first coil is drawn layer 3 through the wire connection hole 41 of second electric insulation layer 4, shown in Fig. 2 D;
5, above the first coil main body layer 5; Utilize spin coating processing procedure spin coating one second electric insulation layer 6; The material of second electric insulation layer 6 is same optional from polyimides (polyimide), epoxy resin (epoxy resin), benzocyclobutane olefine resin (BCB) or other high molecular polymer (polymer), shown in Fig. 2 E;
6, utilize thin film metal deposition processing procedure, gold-tinted developing technique and electroplating process again; Make one second coil main body layer 7; This second coil main body layer 7 is formed at the top of second electric insulation layer 6; The material of this second coil main body layer 7 can be selected from one of silver (Ag), palladium (Pd), aluminium (Al), chromium (Cr), nickel (Ni), titanium (Ti), gold (Au), copper (Cu), platinum (Pt) or its alloy equally; The second coil main body layer 7 comprises first electrode 71, second electrode 72, and the helical coil 73 that connects first electrode 71 and second electrode 72, shown in Fig. 2 F;
7, again in upper end spin coating 1 the 4th electric insulation layer 8 of the second coil main body layer 7, and utilize gold-tinted developing technique or etching technique to make a wire connection hole 81, shown in Fig. 2 G;
8, utilize thin film metal deposition processing procedure, gold-tinted developing technique and electroplating process then; Make one second coil in the top of the 4th electric insulation layer 8 and draw layer 9; The material that second coil is drawn layer 9 can be selected from one of silver (Ag), palladium (Pd), aluminium (Al), chromium (Cr), nickel (Ni), titanium (Ti), gold (Au), copper (Cu), platinum (Pt) or its alloy equally; Second coil is drawn layer 9 and is included first electrode 91 and second electrode 92; Connect with lead 93 between first electrode 91 and second electrode 92, first electrode 91 is connected through the wire connection hole 81 of the 4th electric insulation layer 8 and first electrode 71 of the second coil main body layer 7, shown in Fig. 2 H;
9, draw the upper end of layer 9 again in second coil, spin coating one insulation cementing layer 10 is shown in Fig. 2 I;
10, last; Utilize gummed process technique, wire mark processing procedure or spin coating technique; Make magnetic material layer 11 as loam cake; Magnetic material layer 11 can be magnetic base material or is mixed with the Magnaglo colloid, allocates and forms and the Magnaglo colloid can be Magnaglo and one of polyimides (polyimide), epoxy resin (epoxy resin), benzocyclobutane olefine resin (BCB) or other high molecular polymer (polymer), shown in Fig. 2 J.
Above-mentioned etch process can adopt dry ecthing or wet etching processing procedure, and dry ecthing can be the RIE processing procedure, and wet etching can adopt the chemical solution etch process.
Can know by above step; The present invention is utilized in the structure of making insulating barrier and coil in regular turn on the high insulating substrate of a low-loss; And utilize bonding technique to make a magnetic material layer in uppermost surface, and perhaps, wire mark processing procedure also capable of using or spin coating processing procedure; Print above that one be mixed with Magnaglo colloid, this colloid can be polyimides (polyimide), epoxy resin (epoxy resin) or one of them composition of other high molecular polymer (polymer).
By above-mentioned fabrication steps, can under lower cost, make the structure of film-type common-mode noise filter, and whole preparation process is simplified many.
As shown in Figure 6, the structure of the film-type common-mode noise filter that completes according to manufacturing approach of the present invention through the network analyzer measurement, can be reached higher common-mode noise filtration result, wherein shows, and Scc21 can reach-below the 30dB.
The structure of film-type common-mode noise filter of the present invention can be as shown in Figure 3, and one deck magnetic material layer 301,302 respectively is covered below reaching above the black box; Also can be as shown in Figure 4, simultaneously above the black box, below, left and the right-hand one deck magnetic material layer 401,402,403,404 that respectively is covered.
Please with reference to Fig. 5; For another of the structure of film-type common-mode noise filter of the present invention implemented illustration; As shown in the figure, the structure of film-type common-mode noise filter of the present invention can be in response to the needs of electronic product; Make each winding wire draw the layer and the coil main body layer all form antithesis even numbers setting, promptly comprise from lower to upper:
One insulating substrate 501, one first electric insulation layer 502, one first antithesis winding wire are drawn layer 503,1 second electric insulation layer 504, one first antithesis coil body layer 505, one the 3rd electric insulation layer 506, one second antithesis coil body layer 507, one the 4th electric insulation layer 508, one second antithesis winding wire is drawn layer 509, one an insulation cementing layer 600; An and magnetic material layer 601.
Comprehensive the above, the structure of film-type common-mode noise filter of the present invention and manufacturing approach have unprecedented innovation structure really; It both be not shown in any publication; And also not seeing on the market has any similar products like, so it has novelty and should not have doubt.In addition, specific characteristic that the present invention had and function are far from prior art institute comparable, so it has more its progressive than prior art really, and meet the regulation of the application important document of the relevant patent of invention of China's Patent Law, are to mention patent application in accordance with the law.
The above is merely the preferred specific embodiment of the present invention, however structural feature of the present invention be not limited thereto, anyly be familiar with this art in field of the present invention, can think easily and variation or modification, all can be encompassed in the claim of the present invention.
Claims (8)
1. the structure of a film-type common-mode noise filter comprises:
One insulating substrate;
One is formed at first electric insulation layer of insulating substrate top;
One be formed at first electric insulation layer top first winding wire draw layer, this first winding wire is drawn layer and is included first electrode, second electrode and connect first electrode and the lead of second electrode;
One is formed at second electric insulation layer that first winding wire is drawn layer top, and this second electric insulation layer is provided with a wire connection hole;
One is formed at the first coil main body layer of second electric insulation layer top; This first coil main body layer includes first electrode, second electrode and connects first electrode and the helical coil of second electrode, and first electrode is connected with first electrode that first winding wire is drawn layer through the wire connection hole of second electric insulation layer;
One is formed at the 3rd electric insulation layer of first coil main body layer top;
One is formed at the second coil main body layer of the 3rd electric insulation layer top; This second coil main body layer includes first electrode, second electrode and connects first electrode and the helical coil of second electrode;
One is formed at the 4th electric insulation layer of the second coil main body layer top; The 4th electric insulation layer is provided with a wire connection hole;
One be formed at the 4th electric insulation layer top second winding wire draw layer; This second winding wire is drawn layer and is included first electrode, second electrode and connect first electrode and the lead of second electrode, and first electrode is connected through the wire connection hole of the 4th electric insulation layer and first electrode of the second coil main body layer;
One is formed at the electric insulation cementing layer that second winding wire is drawn layer top; And
One is formed at the magnetic material layer of electric insulation cementing layer top;
Wherein, the material of above-mentioned insulating substrate is one of them of aluminium oxide, aluminium nitride, glass or quartz; Above-mentioned electric insulation layer is an epoxy resin; The material that above-mentioned coil and lead are drawn layer is one of silver, palladium, aluminium, chromium, nickel, titanium, gold, platinum or its alloy; Above-mentioned magnetic material layer is magnetic base material or is mixed with the Magnaglo colloid.
2. the structure of film-type common-mode noise filter as claimed in claim 1, wherein this Magnaglo colloid is allocated by one of Magnaglo and polyimides, epoxy resin, benzocyclobutane olefine resin and is formed.
3. the structure of film-type common-mode noise filter as claimed in claim 1, wherein this magnetic material layer is overlayed on the upper surface and the lower surface of assembly.
4. the manufacturing approach of a film-type common-mode noise filter may further comprise the steps:
Prepare an insulating substrate;
Upper end face spin coating one first electric insulation layer in above-mentioned insulating substrate;
Make first coil that comprises first electrode, second electrode and connect the lead of its first electrode and second electrode in the upper end face of above-mentioned first electric insulation layer and draw layer;
Draw top spin coating one second electric insulation layer of layer in above-mentioned first coil, and make this second electric insulation layer form a wire connection hole;
Make the first coil main body layer that comprises first electrode, second electrode and connect the helical coil of its first electrode and second electrode in the top of above-mentioned second electric insulation layer;
Form one the 3rd electric insulation layer in the top of the above-mentioned first coil main body layer;
Forming one in the top of the 3rd electric insulation layer comprises first electrode, second electrode and connects first electrode and the second coil main body layer of the helical coil of second electrode;
Form one the 4th electric insulation layer in second coil main body layer top, and on the 4th electric insulation layer, form a wire connection hole;
Make one comprises first electrode, second electrode and connects first electrode and second coil of the lead of second electrode is drawn layer in the top of the 4th electric insulation layer;
The top of drawing layer in second coil forms an insulation cementing layer;
Form a magnetic material layer in insulation cementing layer top;
Wherein, above-mentioned coil main body layer and coil are drawn layer and are used gold-tinted developing manufacture process, thin film deposition process, electroplating process or etch process making; The wire connection hole of above-mentioned insulating barrier uses the gold-tinted developing manufacture process to make or etch process is made; Etch process then adopts dry ecthing or wet etching processing procedure, and dry ecthing is the RIE processing procedure, and wet etching adopts the chemical solution etch process.
5. the manufacturing approach of film-type common-mode noise filter as claimed in claim 4, the material of wherein said insulating substrate is selected from aluminium oxide, aluminium nitride, glass or quartz.
6. the manufacturing approach of film-type common-mode noise filter as claimed in claim 4, the material of wherein said electric insulation layer is selected from polyimides, epoxy resin or benzocyclobutane olefine resin, and is to make with the spin coating processing procedure.
7. the material that the manufacturing approach of film-type common-mode noise filter as claimed in claim 4, wherein said coil main body layer and coil are drawn layer is selected from one of silver, palladium, aluminium, chromium, nickel, titanium, gold, copper, platinum or its alloy.
8. the manufacturing approach of film-type common-mode noise filter as claimed in claim 4; Wherein said magnetic material layer is magnetic base material or is mixed with the Magnaglo colloid, and the Magnaglo colloid is allocated by one of Magnaglo and polyimides, epoxy resin, benzocyclobutane olefine resin and formed.
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| CN102545820B (en) * | 2010-12-17 | 2015-06-17 | 佳邦科技股份有限公司 | Common mode filter and manufacturing method thereof |
| CN103578687B (en) * | 2012-08-08 | 2016-03-23 | 佳邦科技股份有限公司 | Thin-film common-mode filter |
| CN102914896A (en) * | 2012-10-08 | 2013-02-06 | 镇江海贝信息科技有限公司 | Liquid-crystal display |
| CN105098300A (en) * | 2015-09-11 | 2015-11-25 | 禾邦电子（中国）有限公司 | Common-mode filter and manufacturing method therefor |
| JP6489097B2 (en) * | 2016-10-31 | 2019-03-27 | 株式会社村田製作所 | Electronic components |
| JP2021510457A (en) * | 2018-10-17 | 2021-04-22 | 安徽安努奇科技有限公司Ａｎｈｕｉ Ａｎｕｋｉ Ｔｅｃｈｎｏｌｏｇｉｅｓ Ｃｏ．， Ｌｔｄ． | Chip inductor and its manufacturing method |
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| CN1622233A (en) * | 2003-11-28 | 2005-06-01 | Tdk株式会社 | Thin-film common mode filter and thin-film common mode filter array |
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| CN1622233A (en) * | 2003-11-28 | 2005-06-01 | Tdk株式会社 | Thin-film common mode filter and thin-film common mode filter array |
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