CN102027586A - System and method for the sorting of IC units - Google Patents
System and method for the sorting of IC units Download PDFInfo
- Publication number
- CN102027586A CN102027586A CN2009801071995A CN200980107199A CN102027586A CN 102027586 A CN102027586 A CN 102027586A CN 2009801071995 A CN2009801071995 A CN 2009801071995A CN 200980107199 A CN200980107199 A CN 200980107199A CN 102027586 A CN102027586 A CN 102027586A
- Authority
- CN
- China
- Prior art keywords
- unit
- device assembly
- inspection
- choose
- inspection post
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
Abstract
The present invention discloses a method for processing a plurality of IC units comprising the steps of: inspecting said units at a first inspection station; moving said IC units along a linearly defined path to a second inspection station; inspecting the units at said second inspection station; flipping said units; inspecting the units at said third inspection station, and; sorting said units into pre-defined categories.
Description
Technical field
The present invention relates to the processing of integrated circuit unit, and especially, the downstream processes and the device of (singulated) IC unit that relating to is used to classify selects are used for the defect inspection and the packing of delivery (shipment).
Background technology
Relating to the integrated circuit unit Economics of Processing influenced by two principal elements.The first, maximization is with the speed of per hour (UPH) processing of unit, the unit measured.The second, miniaturized design is with the footprint of the machine of realizing these speed, and thereby maximization factory floor space.
Summary of the invention
First aspect the invention provides a kind of method that is used to process a plurality of IC unit, comprises the steps: to check described unit at place, first inspection post; Limit the described IC of path movement unit to second inspection post along linearity; At place, described second inspection post inspection unit; Described unit overturns; At place, the 3rd inspection post inspection unit; With with described cell type to the predefine classification.
In second aspect, the invention provides a kind of system that is used to process a plurality of IC unit, comprising: first inspection post that is used for inspection unit; Be used to engage first coupling device of described unit, described coupling device is arranged to limit the described IC of path movement unit along linearity to second inspection post, and described second inspection post is used for further checking described unit; The upset assembly of described unit is used to overturn; Be used for further checking the 3rd inspection post of described unit; With the classification station that is used for receiving according to the predefine classification described unit based on result from first, second and the 3rd inspection post.
By critical process step being arranged to the linear arrangement path, the IC unit is processed, is not " back track " but keep unidirectional path.Thereby, avoided being designed to rotation platform or had hub to transmit and to return the mechanical device of IC unit, cause considerably having saved size.And simplified system also reduces the time, thereby quickens and deceleration IC unit and be included in multiple process in the moving of described unit.
In preferred embodiment, can comprise using with choosing along moving of linear path and to get the described unit of vacuum engagement that the device assembly is connected.In preferred execution mode, the mobile upstream and downstream of upset assembly can comprise that two choosing of separating get the device assembly.In execution mode further, overturning step can be realized by two interactions of getting the device assembly of choosing that separate.Thereby, replace having the platform that rotates around horizontal axis, choose for two and get the device assembly and can partly revolve to turn 90 degrees and choose to get around horizontal axis and directly transmit the IC unit between the device assembly, and further save time and equipment cost at two.Thereby, in preferred embodiment, the process of upset IC unit can comprise the steps: to choose first and get the device assembly and turn to horizontal direction from vertical direction, make first to choose and get the device assembly and throw off and the engaging of unit, unit and second is chosen get the device assembly to engage, and chosen second and to get the device assembly and turn to vertical direction.
System comprises a plurality of inspection posts to guarantee the essential quality of final products, and in preferred embodiment, first inspection post is arranged any one or its combination in alignment with inspection unit, unit classification and orientation.And, the position and the alignment of the reference marker that second inspection post can inspection unit.Further, the 3rd inspection post can also inspection unit in the defective of the ball or the pad of described unit.
Realize that the linear layout that limits the path can comprise: one or two are chosen get the device assembly and be installed to track, get device and engage this unit and move along described track thereby choose.When at separately station place storage element of the next one, choose and get the device assembly and can turn back to then and stand the preceding to engage other unit.Thereby the unit constantly moves forward along linear path, and is not that " back track " is to standing the preceding.
In alternative arrangement, be further to improve process velocity, system can comprise second parallel orbit, second parallel orbit has first and second the choosing and get the device assembly separately that is installed on it.Thereby, the speed of processing can by repeat to move and possibly overturning step double, thereby as quickly as possible most unit are moved to the classification station from first inspection post.
In preferred embodiment, described first and/or second chooses and gets the device assembly and can laterally move and only allow that the mode that vertically moves along track is installed to track preventing.Thereby, for described choose get the device assembly in the periphery of chip flame near the IC unit, perhaps alternatively, place the IC unit in the classification station, thereby described station can laterally be moved and locatees described station in position according to choosing the needs of getting the device assembly with various classifications.For example, the similar machine that first inspection post can comprise the turntable that can laterally move along track or allow to slide is in order to receive chip flame from the chip flame box.
When receiving chip flame, can slide then and get back to the position in first inspection post, thereby align with track.Thereby, to get below the device assembly for various IC unit being positioned in choose, first inspection post can be moved along described track, thereby gets suitable IC unit, location below the device assembly choosing.
Selectively, first inspection post can be in conjunction with turntable, and chip flame is received by turntable thus, and turntable forms the part in first inspection post.Thereby chip flame can be by rotating chip flame and move first along track and choose and get the device assembly and realize to choose moving of getting that the device assembly aligns with first, thereby realize that first chooses the desirable relative positioning of getting device assembly and chip flame.
Similarly, each the device for image that connects first, second and the 3rd inspection post also can move in the direction in vertical linearity path.This can also realize by being melted to track, and device for image tracks positioned is transversely chosen and got device assembly tracks positioned along the longitudinal, for the relative positioning of realizing ideal is checked with conduction thus.
In a similar manner, each container that the IC unit is placed on it can also move at horizontal direction, and relative second choose and get device assembly location, thereby IC unit separately is placed in the proper container.
Thereby, get the device assembly and only can move in a longitudinal direction by guaranteeing to choose, relative to choosing separately get the device assembly locate various stations can by various stations relative to choosing separately get the device assembly laterally or rotate move in conjunction with realization.
Selectively, first choose and get the device assembly and can comprise track or other device that moves along axis perpendicular to linear path.Thereby in order to reach the neighboring of chip flame, first chooses and gets the device assembly and can move along this vertical axis, as required, and to engage the described unit of choosing outside the scope that normally reaches of getting the device assembly.
Similarly, second choose and get the device assembly and can also move along vertical axis.In this case, this is vertical to move can be required to mate first and chooses and get moving of device, thereby aims at overturning step.Alternatively, perhaps additionally, the vertical moving in the classification container that the unit is placed on separately can be useful, is limited by the classification of unit matching.
In preferred embodiment, system can comprise the center machining cell and or be used to monitor the control system of processing.And this control system can monitor and write down the result from various inspection posts, thereby determines and write down any checked defective.
As mention that based on the result in various inspection posts, the classification station can comprise some containers.Thereby control system can be controlled second and choose and get device and determine that the unit of defective is stored in the container that is used for this defective.Similarly, " well " unit can be passed to suitable containers.This container can be that " well " unit is placed on it the band that is used to be delivered to the terminal use." defective " container can be dish or the case that is used to dispose.
In preferred embodiment, the 3rd classification can be " doing over again ", and defective is the less defective that can easily revise by this, and such as misalignment, for example under this situation, application of compressed air is to get back to the position with unit " collision ".This container of " doing over again " can be that typing is with the canister of aligned units again when being delivered to.
In preferred embodiment, the 4th inspection post can be placed to determine whether have individual unit or ball in " well " single-unit container.In the third aspect, the invention provides the method for upset IC unit, comprise step: described IC unit is got the device assembly and engaged with choosing, and described choosing got the device assembly in vertical direction; Rotate described choosing and get the device assembly to horizontal direction; Break away from described IC unit and roughly side by side engage described unit and second in the horizontal direction and choose and get the device assembly; Rotating described second chooses and gets the device assembly to vertical direction.
In fourth aspect, the invention provides the system of the IC unit that is used to overturn, comprise that first and second choose and get the device assembly, each has vacuum source, described vacuum source described separately choose the abutting end place operation of getting the device assembly, be used to engage described IC unit; Described first and second choose and get the device assembly and can rotate from the vertical direction to the horizontal direction and locate so that the above abutting end separately is closer to each other in the horizontal direction; Wherein, in the horizontal direction, break away from first and choose the vacuum source of getting the device assembly, and engage second and choose the vacuum source of getting the device assembly, cause the IC unit to be chosen and get the device assembly and transfer to second and choose and get the device assembly, choose when rotating second that the IC unit is reversed when getting the device assembly to vertical direction and disengaging vacuum source thus from first.
In aspect the 5th, the invention provides the coupling device that is used to engage a plurality of IC unit, comprising: a plurality of the choosing at interval got device in cylindrical arrangement; Hub, this hub is positioned in the center of described cylindrical arrangement, thus described a plurality of choosing got device and can be rotated around described hub; Described coupling device can be installed to track, is used for moving along described track; Wherein, when when the track, described coupling device can turn to horizontal direction from vertical direction, thus the IC unit by described choose to get that device engages and revolve around horizontal axis turn 90 degrees.
Description of drawings
With reference to the present invention that will be more convenient for further specifying of the accompanying drawing accompanying drawing that may arrange of the present invention.Other layout of the present invention also is possible, and thereby, the particularity of accompanying drawing is not understood that to replace the generality of above-mentioned explanation of the present invention.
Fig. 1 is the plane graph according to whole IC processing lines of one embodiment of the present invention;
Fig. 2 is the schematic diagram of the categorizing system of another execution mode according to the present invention;
Fig. 3 is the plane graph according to the layout of parts in the machine of the method operation of Fig. 2;
Accompanying drawing 4A to 4C is that the rotating turret of the another execution mode according to the present invention is chosen front view and the plane graph of getting device (turrent picker); With
Fig. 5 shows that a pair of rotating turret of 4A to 4C with reference to the accompanying drawings chooses each the front view of getting device.
Embodiment
The main distinction of the present invention and prior art is that the main axis along the IC unit in the course of processing uses linear moving, rather than relies on rotation or unit to be transmitted hub type (hub type) method that turns back to central point then.This layout avoids in the acceleration of device and the loss of time in slowing down, minimum wear, saving process time, and is reduced at the mechanism under this moving.
Thereby, according to according to the present invention, being characterized as of system and method, IC moves along linear path the unit, from the loading (loading) of the chip flame of IC unit to first inspection post, the unit is passed to various downstream processes.
For following execution mode of the present invention is put into hereinafter, the integrated circuit unit scope can reach 8x8mm from 0.5x0.5mm.But, being not limited to the unit of this size, this only provides the example of machine application according to the embodiment of the present invention.
About accompanying drawing, Fig. 1 shows the production line integral arrangement that is used to process integrated unit.The first, package (package) 25 is loaded into cutting (dicing) unit 15 with the form of single transistor shell 25 or described package box, and it sequentially is delivered to cutting source 30 then, thereby selects (singulate) unit in chip flame.Herein, chip flame 35 is delivered to wash plant 20, and this wash plant allows to wash simultaneously two groups of chip flames in this embodiment at every turn.Herein, chip flame is delivered to taxon 5 in box, and this taxon is a theme of the present invention.Integrated unit is examined, classifies in taxon 5, and if suitable, sealed to prepare to be passed to the terminal use.
Fig. 2 shows the schematic diagram according to the categorizing system 60 of one embodiment of the present invention.Process starts from being loaded into by loading depot the box of the chip flame 65 of taxon 60.By engaging with anchor clamps 70, chip flame 65 is removed 75 and be passed to turntable (turntable) 85 from box, and anchor clamps 70 draw single wafer framework 65 along linear path 75, and described turntable can and be got back to first inspection post from the position that receives chip flame.Like this chip flame 65 is placed in first inspection post 90 further to pass through homogeneous lens 95 experience alignment (alignment), classification (type) and orientation inspection (orientation inspection) before the processing.
After checking, use coupling device that the single IC unit of selecting 87 is removed from chip flame 65, in this case, coupling device is got device for choosing, and in preferred execution mode, uses rotating turret to choose and get device 100.Be presented at rotating turret among accompanying drawing 4A, 4B, the 4C and 5 and choose and get device 100 and have and the abutting end 205 that selectively can engage vacuum source UNICOM, thereby when device was got in specific choosing near single IC unit 210, vacuum is engaged and chooses got device joint unit 210.Choose when rotating turret and to get choosing in the device assembly 100 and get the layout of device when having the IC unit that has all engaged, choose and get device and advance along linear track 102, according to the present invention, linear track 102 limits linear paths.Choose and get device and advance to second inspection post 115, thereby the reference marker of single IC unit (fiduciary marks) just is identified before overturning at upset (flipping) 120 places of stand in the IC unit along track.In this embodiment, have second rotating turret choose get device assembly 110, the second rotating turrets choose get device assembly 110 have its oneself to homogeneous lens 105, this is installed to second parallel orbit 103 to homogeneous lens 105.Both move track 102,103 in the same manner, promptly provide linear path to be used for separately rotating turret and choose and get device assembly 100,110, thereby rotating turret is chosen the ability that device assembly 100,110 independently acts on increases the individual unit that processing obtains from chip flame 65 of getting.Thereby, use two tracks to increase production capacity 2 parts of system according to the invention together.
Rotating turret is chosen and is got device 100,110 and transmit the IC unit to upset station 120, and unit upset on upset station 120 promptly, is inverted, so that the opposition side of chip can bear inspection.
Rotary movement shown in accompanying drawing 4A, 4B, 4C and 5, is got device 100 and second rotating turret and is chosen and get device 140 and realize by choosing in conjunction with first rotating turret in this embodiment.Rotating turret is chosen and is got device and be characterised in that they can rotate to horizontal direction from the vertical direction that engages the IC unit and thereby rotate around horizontal axis.Rotating turret is chosen and is got device 215 and revolve and turn 90 degrees horizontal direction, engaged thus first of IC unit 220 choose get device 100 make choose the junction surface 205 of getting device near also in the horizontal direction second choose the junction surface 225 of getting device 140.By choosing the vacuum source of getting device 100 and be disengaged and engage second and choose the vacuum source of getting device 140 with first, IC unit 220 is chosen from first and is got device 100 and transfer to second and choose and get device 140.Do the choosing and get that a side that device 100 engages exposes now and a side of the former exposure of IC unit is chosen and got device and engage with second now of IC unit 220 like this with first.Get device 140 and turn to vertical direction from horizontal direction by choosing second, image (vision) device that is used to check is pointed to and can be exposed to now to the exposed side of IC unit now downwards.
In fact, when vertical direction was got back in rotation, second chose and gets device 140,130 and transmit 125, the three inspection posts 125, three inspection posts, IC unit to the and be used to when choosing and detect previous pad for the hiding IC unit of camera lens when getting device 100,110 and engaging with first.Through being reversed, by using camera lens 125, definite pad exists and further be not damaged before the processing thereby the IC unit bears inspection.
Second rotating turret is chosen and is got device 130,140 and now the IC unit is delivered to classification station.Based on the result who obtains from first, second and the 3rd inspection post, the classification station comprises three possible outcomes for the IC unit in this embodiment.If find major defect from any one inspection post, the IC unit will be placed on defective disc 135 so.In order to admit the placement of defective unit, dish 135 can laterally move 137, thereby approaching separately rotating turret is chosen and got device 130,140 place the space in dish.Alternatively, if from any one station, check out defective, but defective only is little defective, such as the misalignment of IC unit or for example there is extra ball, so according to several embodiments of the present invention, the IC unit not only can be placed in the defective disc 135 but also can place and enter the canister 145 of doing over again.For example, be not installed at extra ball under the situation of chip or simple misalignment, the placement of unit in dish 135 or canister 145 can rearrange chip by the guiding that is placed on wherein, perhaps alternatively, compressed-air actuated application can rearrange chip or remove extra ball.Yet if fully by complete inspection, chip can be placed on tep reel and arrange in (tape and reel arrangment), thereby the IC unit is placed in the groove in the band, and when filling, band is passed to the terminal use.Thereby dish 150 can laterally advance 160, and each groove is filled good IC chip and finished up to dish.For guaranteeing the placement of chip, another camera lens is set up as 155, the four inspection posts 155, the 4th inspection post to check in the groove of being with whether have chip.
Fig. 3 shows embodiments of the present invention, and especially, the plane graph of the device of the schematic flow of Display Realization Fig. 2.The box 161 of chip flame is delivered to loading depot 162.The anchor clamps (not shown) is recalled chip flame 163 and chip flame 163 is placed on the turntable 165 from box 161.Turntable laterally moves then, thereby aligns with the linear path of being represented by track 187,188.First rotating turret is chosen and is got device 170 in conjunction with checking camera lenses, thereby advances together and in the identical time or just engaging the 3rd and choose and get choosing of device 170 and check the IC unit before getting device.In this embodiment, thus rotating turret choose and get device and be fixed to track and only admit linear movement in direction, lead to the IC unit in the chip flame of admitting by the turntable of rotation.The rotation of turntable and rotating turret are chosen the linear movement of getting device and are allowed rotating turret to choose to get device is delivered to the next stop near being used in the chip flame any IC unit.
Thereby in case each rotating turret is chosen and got the device assembly and have the ability, it is delivered to the Image lens that 175, the second inspection posts 175, second inspection post comprise the linear path transverse movement that can be relatively limited by track 187,188 that is installed to track with the IC unit.
Finished the 3rd inspection, second chooses and gets the device assembly and now the IC unit is delivered to specification area, if chip defectiveness or be placed in the dish 185 thus.Dish 185 is installed to track, passes the line of linear path track 187,188 thereby laterally advance.When dish 185 when filling, dish 185 is delivered to extreme near the track of the holding tray of loading depot then.Thereby when being full of and need replacing, dish 185 is delivered to the point of loading depot near chip flame box 161, and next, the operator is on the throne.The time that this arrangement minimum operator need drop into, and the terminal that need not place waste product dish 185 at inconvenience point place.Alternatively, the IC unit can be classified as " well ", thereby is placed in the dish assembly, and the dish assembly comprises the dish of one section band with connection.Band comprises groove, and individual unit is placed in the groove.When being full of tep reel, this can be passed to the terminal use then.For determining that each groove is filled, other camera lens 190 is placed on below the dish and by groove and observes, and can determine whether to exist the space of also not filled by good IC chip.
Can choose the 3rd, the chip that need simply do over again can be placed in the canister 200, and canister 200 is delivered to subsequently away from the zone of doing over again according to device of the present invention.
Claims (24)
1. method that is used to process a plurality of IC unit comprises step:
The place checks described unit in first inspection post;
Described IC unit is limited path movement to second inspection post along linearity;
At place, described second inspection post inspection unit;
Described unit overturns;
At place, the 3rd inspection post inspection unit; With
Described unit is categorized into the predefine classification.
2. method according to claim 1 further is included in after the upset, described IC unit is limited the step in path movement to the three inspection posts along linearity.
3. method according to claim 1 and 2, wherein, described mobile step comprises use first or second choosing the vacuum source of getting the device assembly and engage described unit and move described first or second along track and choose and get the device assembly separately, and the longitudinal axis of described track limits the described linear path that limits.
4. method according to claim 3, wherein, described overturning step comprises the steps:
Choose described first and to get the device assembly and turn to horizontal direction from vertical direction;
Described unit and first is chosen got the disengaging of device assembly;
Also engaging described unit and second in the horizontal direction chooses and gets the device assembly; With
Choose second and to get the device assembly and turn to described vertical direction.
5. according to the described method of aforementioned any one claim, also comprise the step of loaded with wafers framework to described first inspection post, described chip flame comprises a plurality of IC unit.
6. method according to claim 5, wherein, described loading step comprises the steps:
The box of loaded with wafers framework is to loading depot;
Be bonded on chip flame in the described box with anchor clamps;
Described framework is retracted to intermediate station from described box;
The described chip flame of setovering, thus described chip flame is placed in described first inspection post.
7. system that is used to process a plurality of IC unit comprises:
First inspection post, described first inspection post is used for inspection unit;
First coupling device, described first coupling device is used to engage described unit, and described coupling device is arranged so that described IC unit is limited path movement to second inspection post along linearity, and described second inspection post is used for further checking described unit;
The upset assembly, the described upset assembly described unit that is used to overturn;
The 3rd inspection post, described the 3rd inspection post are used for further checking described unit; With
Classification station, described classification station are used for receiving described unit based on the result from first, second and the 3rd inspection post according to the predefine classification.
8. system according to claim 7, wherein, described first inspection post is arranged any or combination with alignment, cell type and the orientation of checking described unit.
9. according to claim 7 or 8 described systems, wherein, described first inspection post comprises turntable, and described turntable is arranged with the chip flame that receives and selectively rotation comprises described unit.
10. according to any one described system of claim 7-9, wherein, described first coupling device comprises choosing gets the device assembly, and described choosing got the device assembly and comprised that at least one is chosen and get device, described choosing got utensil abutting end with vacuum source UNICOM arranged, and described abutting end is arranged to engage individual unit.
11. system according to claim 10, wherein, described first chooses and gets the device assembly and be installed to track, chooses to get the device assembly and be disposed on the described track with along the described linear path movement that limits.
12., wherein, thereby described first choose and get the device assembly and be arranged with along moving at the periphery of chip flame joint unit perpendicular to the described linear axis that limits the path according to claim 10 or 11 described systems.
13. according to any one described system of claim 7 to 12, wherein, described second inspection post is arranged position and the alignment with the reference marker of inspection unit.
14. according to any one described system of claim 7 to 13, wherein, described the 3rd inspection post is arranged the defective in the ball of described unit or pad with inspection unit.
15. according to any one described system of claim 10 to 14, wherein, described second coupling device comprises that second chooses and get the device assembly.
16. system according to claim 15, wherein, described second chooses and gets the device assembly and be installed to described track and arrange with along the described linear path movement that limits.
17. according to claim 15 or 16 described systems, wherein, described second chooses and get the device assembly and be arranged with along moving perpendicular to the described linear axis that limits the path, thereby at periphery, classification station placement unit.
18. according to claim 7 or 17 described systems, wherein, described predefine classification comprises " well " and " defective " classification, by being limited from first, second or any one of the 3rd inspection post or the output of its combination.
19. system according to claim 18, wherein, described classification station comprises the container of " well " and " defective " unit that is used to hold separately, described second choose get device arrange with described cell moving to described container separately.
20. according to claim 18 or 19 described systems, wherein, described predefine classification also comprises " doing over again " classification, described classification station also comprises the container that is used to receive described " doing over again " unit.
21. according to claim 7 or 17 described systems, wherein, described classification station comprises the 4th inspection post, described the 4th inspection post is arranged to determine whether have individual unit or ball in " well " single-unit container.
22. the method for the IC unit that overturns comprises step:
Make described IC unit get the device assembly and engage with choosing, described choosing got the device assembly in vertical direction;
Described choosing got the device assembly and turned to horizontal direction;
Break away from described IC unit and described unit roughly side by side chosen with horizontal direction second and get the device assembly and engage;
Choose described second and to get the device assembly and turn to vertical direction.
23. the system of the IC unit that is used to overturn comprises:
First and second choose and get the device assembly, and each has vacuum source, described vacuum source described separately choose the abutting end place operation of getting the device assembly, be used to engage described IC unit;
Described first and second choose and get the device assembly, thereby can turn to horizontal direction and be positioned that the above abutting end separately is closer to each other in the horizontal direction from vertical direction;
Wherein, in the horizontal direction, disengaging first is chosen the vacuum source of getting the device assembly and is engaged second and chooses the vacuum source of getting the device assembly, causing the IC unit to be chosen from first gets the device assembly and transfers to second and choose and get the device assembly, thus, choose when getting the device assembly and turning to vertical direction and break away from vacuum source the upset of described IC unit when second.
24. a coupling device that is used to engage a plurality of IC unit comprises:
A plurality of choosing got device, describedly a plurality ofly chooses that to get device spaced intermediate in cylindrical arrangement;
Hub, described hub is positioned at the center of described cylindrical arrangement, thus described a plurality of choosing got device and can be rotated around described hub;
Described coupling device can be installed to track, is used for moving along described track;
Wherein, when when the track, described coupling device can turn to horizontal direction from vertical direction, thus the IC unit by described choose to get that device engages and revolve around horizontal axis turn 90 degrees.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SG200800949-0A SG154364A1 (en) | 2008-01-30 | 2008-01-30 | System and method for the sorting of ic units |
| SG200800949-0 | 2008-01-30 | ||
| PCT/SG2009/000036 WO2009096904A2 (en) | 2008-01-30 | 2009-01-30 | System and method for the sorting of ic units |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102027586A true CN102027586A (en) | 2011-04-20 |
| CN102027586B CN102027586B (en) | 2013-09-18 |
Family
ID=40913453
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009801071995A Expired - Fee Related CN102027586B (en) | 2008-01-30 | 2009-01-30 | System and method for the sorting of IC units |
Country Status (4)
| Country | Link |
|---|---|
| CN (1) | CN102027586B (en) |
| SG (1) | SG154364A1 (en) |
| TW (1) | TW200944807A (en) |
| WO (1) | WO2009096904A2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SG171498A1 (en) * | 2009-12-01 | 2011-06-29 | Rokko Systems Pte Ltd | Method and apparatus for improved sorting of diced substrates |
| WO2016024917A1 (en) * | 2014-08-13 | 2016-02-18 | Rokko Systems Pte Ltd | Apparatus and method for processing sputtered ic units |
| KR102440451B1 (en) * | 2016-01-29 | 2022-09-06 | 한미반도체 주식회사 | Semiconductor Package Processing Apparatus |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05335386A (en) * | 1992-05-28 | 1993-12-17 | Hitachi Ltd | Ic handler |
| CN100501411C (en) * | 2005-08-17 | 2009-06-17 | 京元电子股份有限公司 | Test system for electric components |
| KR100705655B1 (en) * | 2005-10-19 | 2007-04-09 | (주) 인텍플러스 | Sorting method of semiconductor package |
| KR101188841B1 (en) * | 2006-06-13 | 2012-10-08 | 미래산업 주식회사 | Burn-in sorter and sorting method using the same |
-
2008
- 2008-01-30 SG SG200800949-0A patent/SG154364A1/en unknown
-
2009
- 2009-01-30 CN CN2009801071995A patent/CN102027586B/en not_active Expired - Fee Related
- 2009-01-30 WO PCT/SG2009/000036 patent/WO2009096904A2/en active Application Filing
- 2009-02-02 TW TW098103220A patent/TW200944807A/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| TW200944807A (en) | 2009-11-01 |
| WO2009096904A3 (en) | 2011-05-26 |
| SG154364A1 (en) | 2009-08-28 |
| WO2009096904A2 (en) | 2009-08-06 |
| CN102027586B (en) | 2013-09-18 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107611053A (en) | Chip sorting and packaging platform | |
| US10903105B2 (en) | Flip chip bonding device and bonding method | |
| CN102027586B (en) | System and method for the sorting of IC units | |
| CN106373903A (en) | Appearance inspection taping device of integrated circuit chip | |
| WO2021053456A1 (en) | Packaging plant for groups of hygienic absorbent articles, transport apparatus and related methods | |
| KR20140144121A (en) | Device Handler | |
| CN105689278A (en) | IC appearance inspection device | |
| CN105396801A (en) | System for automatically detecting, cutting, sorting and packaging metal strain gages | |
| US6967475B2 (en) | Device transfer mechanism for a test handler | |
| CN113182197A (en) | Multi-surface detection equipment | |
| KR101611876B1 (en) | Handler for semiconductor package | |
| US7458761B2 (en) | Apparatus and method for flipping electronic components | |
| CN209720964U (en) | A kind of slotting packet all-in-one machine of sheave carrying | |
| CN115196111B (en) | Multi-pad electronic component testing braid equipment | |
| KR20000047308A (en) | Singularization of semiconductor package and loading system | |
| KR101496047B1 (en) | Apparatus for sorting semiconductor packages | |
| JP2002214290A (en) | Ic handling and taping device | |
| CN115629073A (en) | Six-face inspection equipment | |
| CN102962208B (en) | Semiconductor sorting device | |
| CN211217617U (en) | High-low temperature test sorting all-in-one machine | |
| CN208043696U (en) | A kind of two-channel intelligent high-speed detecting machine and its automatic charging package detection production line | |
| CN101315408A (en) | Detection and package equipment of IC chip | |
| KR102092095B1 (en) | Apparatus and method for inspecting appearance of work | |
| CN111589738B (en) | Blanking device and camera protection glass module detection system | |
| CN215542838U (en) | Categorised test machine of magazine or tray ejection of compact |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: ROKKO SYSTEMS PTE LTD. Free format text: FORMER OWNER: ROKKO MECHATRONICS PTE LTD. Effective date: 20150720 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20150720 Address after: Singapore Singapore Patentee after: Rokko Systems Pte Ltd. Address before: Singapore Singapore Patentee before: Rokko Mechatronics Pte Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130918 Termination date: 20160130 |
|
| EXPY | Termination of patent right or utility model |