CN102026493A - Manufacturing method of printed circuit board having reflection board function - Google Patents
Manufacturing method of printed circuit board having reflection board function Download PDFInfo
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- CN102026493A CN102026493A CN2010102874878A CN201010287487A CN102026493A CN 102026493 A CN102026493 A CN 102026493A CN 2010102874878 A CN2010102874878 A CN 2010102874878A CN 201010287487 A CN201010287487 A CN 201010287487A CN 102026493 A CN102026493 A CN 102026493A
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Abstract
The invention aims at providing a manufacturing method of a printed circuit board having a reflection board function, the printed circuit board has a high-reflectivity solder mask film capable of effectively using LED light, and the high-reflectivity solder mask film, which is excellent in heat resistance and definition and can restrain coloration caused by degradation of the reflectivity as time goes on, is formed on the printed circuit board. The manufacturing method of the printed circuit board having the reflection board function is characterized by comprising the following steps: a step of coating a white solder mask A on a substrate on which electronic circuit wiring is formed, and solidifying the solder mask A; and a step of further coating a white solder mask B on the white solder mask A, and solidifying the white solder mask B.
Description
Technical field
The present invention relates to have manufacture method as the printed substrate of the function of light reflecting board, relate in particular to the manufacture method of printed substrate of function that has as with light-emitting diode (LED) being the light reflecting board backlight of light source, the described printed substrate that has as the light reflecting board function is to form by the white solder resist film of high reflectance of solder resist that twice coating is suitable as the permanent mask of printed substrate.
Background technology
In recent years, as the display equipment of the display of notebook computer and desktop computer, TV, mobile phone etc., but use the display unit such as liquid crystal of slimming mostly.For example, liquid crystal indicator is not owing to himself be luminous element, therefore can be provided with to be called as flat light source backlight.Because flat light source requires usury efficient, thereby also require further high performance for its employed light reflecting material.
So, for the whole picture of uniform irradiation liquid crystal indicator, the reflecting plate role is very big.The reflecting plate that satisfies this effect requires to have the reflection characteristic of height, in the past, uses inside to contain the film of micro-bubble, added the film of Chinese white etc. always separately, or these films and stickups such as metallic plate, plastic plate are got up to use.
As above-mentioned film, for example known a kind of thermoplastic polyester foaming thin sheet, its with overlapping coiling thermoplastic polyester thin slice and spacer and the coiled material that forms remain in the pressurized inert gas environment, after making the thermoplastic polyester thin slice contain inert gas, under normal pressure, the above-mentioned thermoplastic polyester thin slice that contains inert gas is heated, make its foaming (patent documentation 1), this thermoplastic polyester foaming thin sheet goes on the market with the title of MCPET (registered trade mark) (The Furakawa Electric Co., Ltd.'s system).But this white film need be carried out the shaping processing as reflecting plate, and it is not suitable for forming processing when giving complicated shape.
On the other hand, in recent years, in backlight liquid crystal display of mobile phone terminal, PC, TV etc. etc., therefore brought into use with the luminous light-emitting diode of low electric power (LED), having formed on the printed substrate of solder resist film directly in covering, the situation of encapsulation LED also increases gradually.
In order effectively to utilize the light of light-emitting diode, developed printed substrate with white solder resist film just like record in patent documentation 2, the patent documentation 3.
But, under the situation that makes the thickness attenuation, if only apply the solder resist of above-mentioned white, then can not bring sufficient reflectivity as reflecting plate, on the other hand, when strengthening thickness, then can't tackle the requirement of the high definition that requires miniaturization if obtain high reflectance, therefore, be difficult to realize with the effective printed substrate of the light-emitting diodes of high reflectance, high-density packages.
And, if only come thick film to form above-mentioned white solder resist with photosensitive polymer combination, though then can tackle the requirement of high definition, but since as photosensitive polymer combination must composition Photoepolymerizationinitiater initiater self have light yellowly to brown and in time through through oxidation Decomposition takes place, cause the such problem of reflectivity decline so exist the surface of photosensitive polymer combination film to become yellow.
Patent documentation 1: Japanese kokai publication hei 8-72084
Patent documentation 2: TOHKEMY 2007-322546
Patent documentation 3: TOHKEMY 2008-211036
Summary of the invention
In view of the foregoing, the objective of the invention is to, provide a kind of light that can effectively utilize light-emitting diode (LED), have a manufacture method of the printed substrate of high reflectance solder resist film, it is the manufacture method that has formed the printed substrate of solder resist film with high reflectance function, the thermal endurance of this solder resist film, definition excellence can suppress to pass through in time and the reflectivity deterioration is caused painted.
The present invention's first form is a kind of manufacture method with printed substrate of reflecting plate function backlight, it is characterized in that, comprising: be formed with the white solder resist A of coating on the substrate of electronic circuit wiring and making the operation of its curing; And on above-mentioned white solder resist A the further white solder resist B of coating and make the operation of its curing.That is, be coated with white solder resist A after, carry out drying, the further white solder resist B of coating on above-mentioned white solder resist A forms double-deck white solder resist film thus afterwards.Because white solder resist film is a double-layer structural, therefore can make the thickness of each white solder resist film, compare attenuation with the thickness of existing individual layer white solder resist film.
The present invention's second form is the manufacture method of printed substrate, it is characterized in that, above-mentioned white solder resist A is a photosensitive polymer combination, forms image by the photographic process method.
The present invention's the 3rd form is the manufacture method of printed substrate, it is characterized in that, above-mentioned white solder resist B is a compositions of thermosetting resin, forms overlay film by the screen painting method.
The present invention's the 4th form is the manufacture method of printed substrate, it is characterized in that, the reflectivity of filming of above-mentioned white solder resist B is more than the reflectivity of filming of above-mentioned white solder resist A.That is, in being the white solder resist film of double-layer structural, the reflectivity of the white solder resist film in the outside is, or value it more than identical with the reflectivity of the white solder resist film of substrate-side.
The present invention's the 5th form is the manufacture method of printed substrate, it is characterized in that, also is included in the operation that above-mentioned white solder resist B goes up the white solder resist C of coating and makes its curing.That is, in this form, white solder resist film is three-layer structure.
The present invention's the 6th form is the manufacture method of printed substrate, it is characterized in that, above-mentioned white solder resist C is a compositions of thermosetting resin, forms overlay film by the screen painting method.
The present invention's the 7th form is the manufacture method of printed substrate, it is characterized in that, the reflectivity of filming of above-mentioned white solder resist C is more than the reflectivity of filming of above-mentioned white solder resist A, and more than the reflectivity of filming of above-mentioned white solder resist B.That is, the reflectivity of outermost white solder resist film is, with the equal above value of reflectivity of the white solder resist film in substrate-side and intermediate layer.
According to first form of the present invention, owing to be coated with white solder resist at twice, therefore can form sufficient white solder resist thickness, obtain sufficient reflectivity as reflecting plate.And owing to be coated with white solder resist at twice, it is thinner than in the past therefore the thickness that once is coated with in the membrane process to be become, and can also obtain the high definition of overlay film.Thereby, can easily make the light-emitting diode effective printed substrate of having realized high reflectance, high-density packages.
According to second form of the present invention, the white solder resist A that is in substrate-side in the white solder resist film of bilayer is a photosensitive polymer combination, therefore prevents to catch printing ink, prints the limit of collapsing, and can further improve the definition of white solder resist film.
According to the 3rd form of the present invention, the white solder resist B that is in the outside in the white solder resist film of bilayer is not for comprising the compositions of thermosetting resin of Photoepolymerizationinitiater initiater, therefore can prevent printed substrate in time through and the caused reflectivity of surperficial flavescence descends.
According to the 4th form of the present invention, the reflectivity of white solder resist B film is more than the reflectivity of above-mentioned white solder resist A film, even, can remain valid and utilize the light of light sources such as light-emitting diode therefore in time through also suppressing the white generation variable color of print circuit board surface.
According to the 5th form of the present invention, on white solder resist B film, further form white solder resist C film, therefore can form sufficient white solder resist thickness, thereby can obtain sufficient reflectivity as reflecting plate.And, the white solder resist film of printed substrate can be made as thick film, so the covering power excellence.
According to the 6th form of the present invention, the white solder resist C that constitutes outermost film is a compositions of thermosetting resin, even the therefore three-layer structure of thick filmization also can prevent the print circuit board surface flavescence and causes that reflectivity descends.
According to the 7th form of the present invention, as the reflectivity of outermost white solder resist C film more than the reflectivity of white solder resist A, B film, even so three-decker of thick filmization, also can suppress print circuit board surface because of in time through the variable color that causes, can utilize the light of light source such as light-emitting diode with remaining valid.
Description of drawings
Fig. 1 is the partial cross section figure with the printed substrate of the manufacture method manufacturing of embodiment of the present invention.
Fig. 2 is the key diagram of the printed substrate of embodiment 1.
Fig. 3 is the key diagram of the printed substrate of embodiment 2.
Fig. 4 is the key diagram of the printed substrate of embodiment 3.
Fig. 5 is the key diagram of the printed substrate of embodiment 4.
Fig. 6 is the key diagram of the printed substrate of embodiment 5.
Fig. 7 (a) is the key diagram of the printed substrate of comparative example 1,3, and Fig. 7 (b) is the key diagram of the printed substrate of comparative example 2,4.
The key diagram that Fig. 8 estimates for the definition of using the minimal openings footpath.
The explanation of label
1... printed substrate; 2... photosensitive polymer combination film; 3... compositions of thermosetting resin film; 4... substrate; 7... solder resist A film; 8... solder resist B film; 9... solder resist C film; 12... solder resist A film; 13... solder resist A film.
Embodiment
Below, the manufacture method of the printed substrate of embodiment of the present invention is described.As shown in Figure 1, at this,, use to be provided with being bonded in that Copper Foil on the substrate 4 carries out etching and the printed substrate of the electronic circuit wiring 5 that forms as printed substrate 1.White solder resist with covered substrate 4 is made as double-layer structural, and the white solder resist A usability photosensitive resin composition of substrate 4 sides, the white solder resist B in the outside uses the manufacture method of the printed substrate 1 of compositions of thermosetting resin to describe.
As shown in Figure 1, the coating made from the related manufacture method of embodiments of the present invention the printed substrate 1 of double-deck white solder resist, be to make by method as described below: (for example grind on the surface to the substrate 4 that is formed with electronic circuit wiring 5, polishing is ground) after, coating is as the photosensitive polymer combination of white solder resist A, make it solidify to form photosensitive polymer combination film 2 afterwards, then, to be applied to as the compositions of thermosetting resin of white solder resist B on the above-mentioned photosensitive polymer combination film 2, and make it solidify to form compositions of thermosetting resin film 3 afterwards.
Specifically, photosensitive polymer combination film 2 is to form through operation as described below: on substrate 4 surfaces of having ground, make the DRY thickness become the operation of specific thickness by the coating of screen painting method as the photosensitive polymer combination of white solder resist A; The substrate 4 that has been coated with photosensitive polymer combination is prepared dry operation; Cover the operation of exposure mask post-exposure on the photosensitive polymer combination film 2 that forms preparing drying with predetermined pattern; And the operation that makes its video picture behind back, as the to remove covering mask that exposes.
And compositions of thermosetting resin film 3 forms compositions of thermosetting resin film 3 through operation as described below: on photosensitive polymer combination film 2, cover the operation of the mask used for printing with predetermined pattern and thickness; Be coated with compositions of thermosetting resin so that the DRY thickness becomes the operation of the thickness of regulation by the screen painting method from mask used for printing; And the operation of the substrate 4 that has been coated with compositions of thermosetting resin being prepared drying.Then, under set point of temperature, the substrate 4 that has formed compositions of thermosetting resin film 3 is carried out heat treated, thus, photosensitive polymer combination film 2 and compositions of thermosetting resin film 3 are further solidified, make the printed substrate 1 that has been coated with double-deck white solder resist.
At first, the formation operation to photosensitive polymer combination film 2 is elaborated.Employed photosensitive polymer combination is so long as can become white and film, then do not do special qualification, for example have to comprise (A) and contain carboxyl photoresist, (B) Photoepolymerizationinitiater initiater, (C) diluent, (D) titanium oxide and (E) the white photosensitive polymer combination of epoxy compounds.
(A) composition, the resin that preferably has the carboxyl that does not contain aromatic rings, but do not do special qualification, can use photonasty to contain carboxy resin, not have in the carboxy resin any one of containing of photonasty unsaturated double-bond with more than one photonasty unsaturated double-bond.Example as (A) composition, can enumerate at least a portion of the epoxy radicals that makes the cycloaliphatic ring framework ring epoxy resins that has two above epoxy radicals in the molecule, after free-radical polymerised unsaturated monocarboxylic acid reaction such as acrylic or methacrylic acid, the hydroxyl that generates and multi-anhydride reacted and the material that obtains.
(B) composition for example has oxime series initiators, diphenylhydroxyethanone, acetophenone, 2-hydroxy-2-methyl-1-phenyl-1-acetone, 1-hydroxy-cyclohexyl benzophenone, benzophenone etc. so long as the general Photoepolymerizationinitiater initiater that uses is not then done special qualification.The use amount of Photoepolymerizationinitiater initiater is 5～20 mass parts for photoresist 100 mass parts with respect to (A) composition for example.
(C) diluent of composition is a photopolymerization monomer for example, be used to make the abundant photocuring of photoresist of (A) composition and obtain to have acid resistance, the filming of thermal endurance, alkali resistance etc.As photopolymerization monomer, for example can enumerate 1,4-butanediol two (methyl) acrylate, 1,6-hexylene glycol two (methyl) acrylate, neopentyl glycol two (methyl) acrylate, polyethylene glycol two (methyl) acrylate etc.The addition of diluent is 2.0～40 mass parts for photoresist 100 mass parts with respect to (A) composition for example.
(D) titanium oxide of composition is the titanium oxide microparticle with anatase and rutile crystal structure, to film whitening and uses in order to make.From the viewpoint of whiteness, preferably Titanium Dioxide Rutile Top grade.In order to improve the whiteness of filming, the use amount of titanium oxide is 10～120 mass parts for photoresist 100 mass parts with respect to (A) composition for example.
(E) epoxy compounds of composition is in order to make white photosensitive polymer combination improve the crosslink density of cured coating film, obtain the variable color of filming and the less resin cured film of decline of reflectivity simultaneously and use, for example add epoxy resin by the white that UV irradiation, thermal process cause.As epoxy resin, for example can enumerate bisphenol A type epoxy resin, phenol aldehyde type epoxy resin (phenol phenol aldehyde type epoxy resin, orthoresol phenolic aldehyde type epoxy resin, p-t-butyl phenol phenol aldehyde type etc.), make Bisphenol F, bisphenol S and epichlorohydrin reaction and the Bisphenol F type that obtains, bisphenol-s epoxy resin, has the cyclohexene oxide base in addition, oxidation tristane base, the fatty ring-like epoxy resin of cyclopentene oxide base etc., has three (2, the 3-epoxypropyl) isocyanuric acid ester, the triglycidyl group isocyanuric acid ester with triazine ring of three (2-ethoxy) cyamelide three-glycidyl ester etc., dicyclopentadiene-type epoxy resin, adamantane type epoxy resin.The use amount of epoxy resin is 10～50 mass parts for photoresist 100 mass parts with respect to conduct (A) composition for example.
Then, the operation that is coated with above-mentioned photosensitive polymer combination is described.When photosensitive polymer combination is applied to substrate 4, for example use the screen painting method.At this moment; the screen painting of photosensitive polymer combination is printing comprehensively; and the thickness of the photosensitive polymer combination during in the following manner to screen painting is adjusted; promptly; external impact from follow flow chart and the viewpoint of peeling off protection that causes; make the lower limit of DRY thickness be made as 10 μ m; be preferably 20 μ m from the viewpoint of the conductor oxidation that prevents substrate; in addition; from film, remove the viewpoint of solvent and hardness thereof; make the upper limit of DRY thickness be made as 30 μ m, the viewpoint that is involved in bubble when preventing to apply is preferably 25 μ m.
Thereby the preparation drying process of photosensitive polymer combination is to be used for from the photosensitive polymer combination solvent flashing forming photosensitive polymer combination film 2 so that the surface of overlay film becomes the state of surface drying, and preferably preparing baking temperature and be 50～100 ℃, drying time is 20～25 minutes.The heater of preparation drying process is not done special qualification, for example can use hot-blast stove or electric furnace etc.
In the exposure process of photosensitive polymer combination film 2, utilize the exposure of laser direct imaging, perhaps utilize the active-energy line exposing that has used the intransitable negative mask of active energy ray.In the exposure that utilizes active energy ray, as the negative mask that covers, when being ultraviolet ray, uses active energy ray negative film, use the metallicity mask during electronics line, use the lead mask during X line.In embodiments of the present invention, can use on this viewpoint of simple negative film, preferably in active energy ray, use ultraviolet ray.The exposure of active energy ray is 10～1000mJ/cm
2The exposure of using negative film is for example to make connect up part beyond the weld zone of soldering welding of 5 patterns of electronic circuit become the negative film of the pattern of light transmission by having, be fitted on the photosensitive polymer combination film 2 and from it quadrature penetrate ultraviolet ray and carry out.
In the video picture operation, territory, the non-exposed area diluted alkaline solution removal by will be corresponding with the weld zone that above-mentioned soldering is welded makes 2 video pictures of photosensitive polymer combination film.The developing method that removes the territory, non-exposed area on photosensitive polymer combination film 2 with spray form injection diluted alkaline solution is arranged as concrete example.Employed diluted alkaline solution is not done special qualification, for example can use the sodium carbonate liquor of 0.5～5 quality %.
Below, the formation operation that forms compositions of thermosetting resin film 3 on the photosensitive polymer combination film 2 of video picture is elaborated.Employed compositions of thermosetting resin, film and then do not do special qualification so long as can become white, for example have contain compound, (C) curable that (A) epoxy resin, (B) has a carboxyl as epoxy hardener promote compound, (D) organic solvent and (E) titanium oxide, white heat-hardening resin composition.
(A) epoxy resin of composition is not so long as the general material that uses is then done special qualification, for example can enumerate " EPICLON840 ", " EPICLON1050 " as bisphenol A type epoxy resin, " EPICLON3050 " (big Japanese ink chemical industry system) etc.
Has the compound of carboxyl for (B) composition as epoxy hardener, do not do special qualification, the material that does not preferably have aromatic rings for example can be enumerated Daiseru Chemicals corporate system " CYCLOMER P (ACA) Z-251 ", " CYCLOMER P (ACA) Z-250 ", " CYCLOMER P (ACA) Z-300 ", " CYCLOMER P (ACA) Z-320 " etc.Its use amount is 50～150 mass parts for epoxy resin 100 mass parts with respect to (A) composition for example.
(C) curable of composition promotes that compound is used to make cross linking of epoxy resin, therefore so long as the general material that uses is not then done special qualification, for example can enumerate melamine, imidazoles, dicyandiamide etc.Its use amount is 0.01～10 mass parts for epoxy resin 100 mass parts with respect to (A) composition for example.
(D) organic solvent of composition if with the intermiscibility of above-mentioned (A) composition, (B) composition well, for example can enumerate ketones such as methyl ethyl ketone, cyclohexanone, toluene, dimethylbenzene, durol etc. aromatic hydrocarbon based etc.Its use amount is 1～500 mass parts for epoxy resin 100 mass parts with respect to (A) composition for example.
And, (E) titanium oxide of composition, identical with the explanation of the titanium oxide of putting down in writing in above-mentioned photosensitive polymer combination, in addition, its use amount is 10～120 mass parts for epoxy resin 100 mass parts with respect to (A) composition for example.
Below, the operation that is coated with above-mentioned compositions of thermosetting resin is described.After will the mask used for printing corresponding covering on the photosensitive polymer combination film 2, with the above-mentioned compositions of thermosetting resin of screen painting method coating with the pattern of the photosensitive polymer combination film 2 of video picture.At this moment, the thickness of the compositions of thermosetting resin during in such a way to screen painting is adjusted, promptly, from the viewpoint of reflectivity, make the lower limit of the DRY thickness of compositions of thermosetting resin be made as 10 μ m, preferably be set as 20 μ m from the viewpoint of high reflectance more, in addition, remove the viewpoint of solvent and hardness thereof from film, make the upper limit of DRY thickness be set as 30 μ m, the viewpoint that is involved in bubble when preventing painting process preferably is set as 25 μ m.
Thereby the preparation drying process of compositions of thermosetting resin is to be used for forming compositions of thermosetting resin film 3 from the compositions of thermosetting resin solvent flashing so that the surface of overlay film becomes the state of surface drying.The preparation drying condition is identical with the preparation drying process of photosensitive polymer combination, and preferably preparing baking temperature and be 50～100 ℃, drying time is 20～25 minutes, and heater is not done special qualification, for example can use hot-blast stove or electric furnace etc.
The back curing process that photosensitive polymer combination film 2 and compositions of thermosetting resin film 3 are further solidified, for example its heating-up temperature is 130～170 ℃, be 20～80 minutes heating time.Heater is not then done special qualification, for example can use hot-blast stove or electric furnace etc.
Below, other execution modes of the present invention are described.In the above-described embodiment, white solder resist A as substrate 4 sides has used photosensitive polymer combination, white solder resist B as the outside has used compositions of thermosetting resin, but substitute these, can also use compositions of thermosetting resin as white solder resist A, as white solder resist B usability photosensitive resin composition.And, can also also can be used as white solder resist A, B and all use compositions of thermosetting resin as the equal usability photosensitive resin composition of white solder resist A, B.
And, can also on white solder resist B, further be coated with white solder resist C, so that the solder resist film becomes thicker.White solder resist C can be photosensitive polymer combination, also can be compositions of thermosetting resin, and then curing process is as long as implement once after the coating of white solder resist C.Certainly, as required, can also on white solder resist C, further be coated with white solder resist, it is solidified, thereby white solder resist film is made structure more than four layers.
In the above-described embodiment, used comprehensive printing of being undertaken by the screen painting method, but so long as the painting method that can evenly apply is not then done special qualification, for example substitute that the screen painting method can use that blade coating, heat fusing coating, rod are coated with, dressing, scraper plate coating, scraper coating, air-blade type coating, curtain formula flow coating, roller coating, the coating of intaglio plate formula, hectographic printing, dip-coating, brushing, other usual ways all can.
Below, by embodiment the present invention is described, but the invention is not restricted to this.
With following described operation, make printed substrate.The explanation of the printed substrate 1 that embodiment 1～5 is related is illustrated respectively in Fig. 2～6, and the instruction card of the printed substrate 11 that comparative example 1,3 is related is shown among Fig. 7 (a), and the instruction card of the printed substrate 11 that comparative example 2,4 is related is shown among Fig. 7 (b).In addition, for the structure identical, use identical label with Fig. 1.
In embodiment 1～4, on substrate 4, formed solder resist A film 7 and solder resist B film 8, and in embodiment 5, further formed solder resist C film 9.And, in comparative example 1,3, only formed solder resist A film 12, in comparative example 2,4, only formed solder resist A film 13.
The surface treatment of substrate 4: polishing is ground
Formation about the photosensitive polymer combination film
Photosensitive polymer combination: DSR-330S70-11W (TAMURAization is ground Co., Ltd.'s system)
Coating: screen painting
Thickness: DRY20～23 μ m film
Preparation is dry: 70 ℃, 20 minutes (interior 25 minutes of box type furnace)
Exposure: be 400mJ/cm on the resist
2(the system HMW-680GW of OAK society)
Video picture: 1%Na
2CO
3-30 ℃-0.1MPa-60 second
Solidify the back: 150 ℃ following 60 minutes (interior 70 minutes of box type furnace).But, only when applying, implement as outermost layer.
Formation for the compositions of thermosetting resin film
Compositions of thermosetting resin: RPW-210 (TAMURAization is ground Co., Ltd.'s system)
Coating: screen painting
Thickness: DRY20～23 μ m film
Preparation is dry: 70 ℃ following 20 minutes (interior 25 minutes of box type furnace)
Solidify the back: 150 ℃ following 60 minutes (interior 70 minutes of box type furnace).But, only when applying, implement as outermost layer.
The kind and the thickness of the resin combination of the solder resist film of table 1 expression embodiment 1～5 and comparative example 1～4.
Below, for the various performances of the solder resist film of investigating the embodiment 1～5 that makes in the above-mentioned operation and comparative example 1～4, do following test, estimate.
(1) mensuration of reflectivity
For reflectivity, use spectrophotometer U-3410 ((strain) Hitachi system:
Integrating sphere) measures the reflectivity of 450nm.In addition, the initial reflectance in the table 1 is meant the reflectivity of the solder resist film of the substrate of making in the above-mentioned operation 4.And the reflectivity after the heat treated is meant at 260 ℃ of following reflectivity of the solder resist film of the substrate 4 handled in five minutes of heating, and it is used as being used to confirm thermal endurance and having or not in time through the index of the reflectivity deterioration that causes.
(2) visual assessment after the heating
As being used to confirm thermal endurance and having or not the white that causes time lapse to use, to the solder resist film through the substrate 4 of 150 ℃, 1000 hours heat treated, visual assessment range estimation variable color degree to the index of yellow variable color.Be white in color and do not find the ◎ that is designated as of variable color fully, become yellow slightly but not in-problemly qualitatively be designated as zero, become yellow and may have the △ that is designated as of quality problems, become yellow and obviously exist being designated as of quality problems *, estimate by these four ranks.
(3) definition
As shown in Figure 8, the energy opening is formed the minimal openings footpath of circular pattern
Be made as the value of definition.
(4) pencil hardness
The pencil from B to 9H that core point youngster is scabbled is with roughly 45.Angle by being pressed on the solder resist film, record does not produce the pencil hardness of filming and peeling off.
[table 1]
As can be seen from Table 1, among the embodiment 1～5 of the solder resist film more than formation is two-layer, obtained excellent characteristic in all assessment items of the visual assessment after the reflectivity after initial stage and the heat treated, the heating, definition, pencil hardness.And distinguish thermal endurance among the embodiment 1～5, definition, reflectivity excellence, can suppress reflectivity deterioration and its colour changed into yellow through causing in time.Especially, as solder resist A usability photosensitive resin composition, use the embodiment 2,5 of compositions of thermosetting resin in all assessment items, to obtain excellent characteristic as constituting outermost layer solder resist B or C, wherein, total film thickness is that reflectivity is extremely excellent among the embodiment 5 of 60 μ m.
And, from the result of the reflectivity of embodiment 2,3 as can be seen, when using compositions of thermosetting resin as solder resist B, reflectivity all is higher than the situation of usability photosensitive resin composition after reaching heat treated in the early stage, so especially can suppress the variable color of the solder resist film of printed substrate.Think that this may be because do not comprise through time lapse and the Photoepolymerizationinitiater initiater of flavescence in the compositions of thermosetting resin, so when using compositions of thermosetting resin in solder resist B, the reflectivity of the solder resist film of multi-ply construction is higher than the situation of usability photosensitive resin composition in solder resist B.
On the other hand, at the existing product that has formed one deck solder resist film is in the comparative example 1～4, visual assessment after the heating of comparative example 1 and pencil intensity, the definition of comparative example 2 and pencil intensity, the visual assessment inequality after the initial stage of comparative example 3,4 and the reflectivity after the heat treated and the heating.
Industrial applicibility
Have heat resistance, definition and can suppress in time printed substrate through the solder resist film of the caused painted high reflectance function of the deterioration of bringing owing to obtaining to have formed, so in the backlight technology field of light-emitting diode as light source, its value height.
Claims (7)
1. the manufacture method with printed substrate of reflecting plate function backlight is characterized in that, comprising:
Be formed with the white solder resist A of coating on the substrate of electronic circuit wiring and making the operation of its curing; And
The further operation that is coated with white solder resist B and makes its curing on described white solder resist A.
2. the manufacture method of printed substrate as claimed in claim 1 is characterized in that,
Described white solder resist A is a photosensitive polymer combination, forms image by the photographic process method.
3. the manufacture method of printed substrate as claimed in claim 1 is characterized in that,
Described white solder resist B is a compositions of thermosetting resin, forms overlay film by the screen painting method.
4. the manufacture method of printed substrate as claimed in claim 1 is characterized in that,
The reflectivity of filming of described white solder resist B is more than the reflectivity of filming of described white solder resist A.
5. the manufacture method of printed substrate as claimed in claim 1 is characterized in that, also comprises:
The white solder resist C of coating and make the operation of its curing on described white solder resist B.
6. the manufacture method of printed substrate as claimed in claim 5 is characterized in that,
Described white solder resist C is a compositions of thermosetting resin, forms overlay film by the screen painting method.
7. as the manufacture method of claim 5 or 6 described printed substrates, it is characterized in that,
The reflectivity of filming of described white solder resist C is more than the reflectivity of filming of described white solder resist A, and more than the reflectivity of filming of described white solder resist B.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009-216553 | 2009-09-18 | ||
| JP2009216553A JP4855507B2 (en) | 2009-09-18 | 2009-09-18 | Method for manufacturing printed wiring board having reflector function |
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| Publication Number | Publication Date |
|---|---|
| CN102026493A true CN102026493A (en) | 2011-04-20 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010102874878A Pending CN102026493A (en) | 2009-09-18 | 2010-09-17 | Manufacturing method of printed circuit board having reflection board function |
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| JP (1) | JP4855507B2 (en) |
| CN (1) | CN102026493A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102278665A (en) * | 2011-06-02 | 2011-12-14 | 鞍山亚世光电显示有限公司 | Thin backlight source device |
| CN104570606A (en) * | 2014-12-24 | 2015-04-29 | 欧利生东邦涂料（东莞）有限公司 | Photocuring and thermosetting composition and preparation method thereof as well as printing ink for printed circuit board |
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| CN102278665A (en) * | 2011-06-02 | 2011-12-14 | 鞍山亚世光电显示有限公司 | Thin backlight source device |
| CN104570606A (en) * | 2014-12-24 | 2015-04-29 | 欧利生东邦涂料（东莞）有限公司 | Photocuring and thermosetting composition and preparation method thereof as well as printing ink for printed circuit board |
| CN104570606B (en) * | 2014-12-24 | 2019-05-31 | 欧利生东邦涂料（东莞）有限公司 | Photocuring heat-curable composition and preparation method thereof and printed wiring board ink |
| CN109561595A (en) * | 2017-09-27 | 2019-04-02 | 株式会社田村制作所 | The pattern forming method of solder mask and the manufacturing method of electric substrate |
| CN109561595B (en) * | 2017-09-27 | 2023-09-19 | 株式会社田村制作所 | Method for forming pattern of solder resist film, and method for manufacturing electronic substrate |
| CN108882548A (en) * | 2018-08-21 | 2018-11-23 | 浙江罗奇泰克电子有限公司 | A kind of LED light source board solder mask surface cure technique |
| CN112654142A (en) * | 2020-11-10 | 2021-04-13 | 广东高仕电研科技有限公司 | Circuit board solder mask, printed circuit board and printed circuit board preparation method |
| CN112654142B (en) * | 2020-11-10 | 2022-07-01 | 广东高仕电研科技有限公司 | Circuit board solder mask, printed circuit board and printed circuit board preparation method |
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Also Published As
| Publication number | Publication date |
|---|---|
| JP4855507B2 (en) | 2012-01-18 |
| JP2011066267A (en) | 2011-03-31 |
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