CN102020235B - Low-moisture content packaging method for thin outline (TO) packaging structure - Google Patents
Low-moisture content packaging method for thin outline (TO) packaging structure Download PDFInfo
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- CN102020235B CN102020235B CN2010105400892A CN201010540089A CN102020235B CN 102020235 B CN102020235 B CN 102020235B CN 2010105400892 A CN2010105400892 A CN 2010105400892A CN 201010540089 A CN201010540089 A CN 201010540089A CN 102020235 B CN102020235 B CN 102020235B
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Abstract
The invention relates to a low-moisture content packaging method for a thin outline (TO) packaging structure and a packaging assembly thereof, belonging to the technical field of air tightness packaging. The invention is characterized in that an aeration hole is designed on the base of a TO packaging assembly and is used for degassing and aeration treatment and the leakage rate detection of a sealing weld joint, and the design of the aeration hole changes the traditional packaging mode of the TO assembly. On the basis of the TO assembly with an aeration hole structure, the invention adopts a TO packaging assembly packaging method for achieving the packaging by two-time packaging. The invention solves the problem of low-moisture content packaging of the TO packaging assembly; the moisture content in a packaging body can be controlled within 500*10<-6>; the gas purity is controlled to be at least 99 percent; the pressure in the packaging body can be controlled; for low-vacuum packaged products, the gas pressure control precision is within +/-100Pa; and the accurate leakage rate detection can be carried out on the packaging body. The invention has very high efficiency and reliability.
Description
Technical field
The present invention relates to the air-tight packaging technical field, be specifically related to low moisture content method for packing of a kind of TO encapsulating structure and package assembling thereof.
Background technology
For MEMS transducer MEMS mechanics sensor particularly; Like MEMS pressure sensor, MEMS acceleration transducer and MEMS angular rate sensor, in its encapsulation process, if the transducer sensitive structure package interior contains a certain amount of steam; Can adsorb or condense in the sensitive structure surface; And absorption or condensation number constantly change with variation of temperature, thereby have caused the variation of sensitive structure parameter, directly influence the performance of MEMS transducer.Therefore, moisture content control is the key of MEMS sensor package.For the sealing of microelectronic component, according to the regulation in GJB597A-96 " semiconductor integrated circuit general specification " and GJB548A-96 " microelectronic component experimental technique and the program " method: the internal steam content of product must not surpass 5000 * 10
-6But for MEMS transducer, 5000 * 10
-6The corresponding dew point temperature of moisture content be merely about-3 ℃, under lower temperature, package interior water just possibly occur or ice, this is fatal to the MEMS transducer.The general requirement of the device of military use can be used down at-55 ℃～+ 125 ℃, therefore just requires the moisture content of package interior must be lower than 500 * 10
-6High-precision MEMS transducer also has strict requirement to the gas componant of its sensitive structure work simultaneously; General gaseous species commonly used has hydrogen, helium, nitrogen, argon etc.; The general requirement of gas purity is controlled at more than 99%; The general requirement of air pressure is low pressure or ultimate vacuum, for the MEMS transducer of in the low vacuum environment, working, the air pressure precision is general to be required to be controlled at ± 100Pa in.The leak rate of sensitive structure packaging body also is an important indicator of package quality, and the leak rate of instrument requires and can confirm according to operating time, accuracy class etc., generally requires leak rate to be superior to 1 * 10 for the high reliability device
-12Pam
3/ s.
The TO encapsulating structure is a glass-metal encapsulating structure commonly used in a kind of air-tight packaging, and traditional T O encapsulation is a kind of packaged type of maturation, in the level Hermetic Package of electronic device, is widely used, and its advantage is that cost is low, reliability is high.Traditional T O method for packing, what generally adopt is in glove box, to charge into dry process gas, adopts sealing sealing welding technique for extra such as parallel soldering and sealing, stored energy welding to carry out soldering and sealing then.Though this method is applicable to the sealing of ordinary electronic device, be applied to the MEMS sensor package and have following problem, the first, moisture content is higher.Because the source of TO encapsulation internal steam mainly contains two aspects, the one, from the steam in the packaging environment atmosphere, the 2nd, from the contained steam of TO component internal and the steam of surface adsorption.And the inner space of glove box is bigger; And air-tightness is not high; Packaging environment is retained large quantity of moisture easily; Though can heat glove box inside and the process gas that charges into, because heating-up temperature lower (generally not being higher than 150 ℃), still can residual a large amount of steam in packaging environment and the encapsulation parts.Therefore moisture content generally can only reach 5000 * 10
-6, far above of the requirement of MEMS transducer to moisture content; The second, what traditional T O encapsulation was adopted is the scheme that a soldering and sealing realizes sealing, generally is to use sealing sealing welding technique for extra such as parallel soldering and sealing, stored energy welding.Because these methods all are to lean on metal molten that the TO assembly is connected firmly to realize sealing together, thus all exist the foreign gas that discharges because of metal molten to be deposited in the sensitive structure package interior, thus influence the problem of the gas purity of package interior; The 3rd, glove box can not strict control charge into the pressure of gas, so can't accurately control the pressure of package interior process gas, more can not be used for the high vacuum encapsulation; The 4th, because traditional T O package assembling does not have leakage detecting structure,, can not satisfy of the requirement of MEMS transducer to package reliability so after soldering and sealing is accomplished, can't carry out accurate leak rate detection by butt welded seam.Therefore, traditional T O method for packing can not satisfy the requirement of MEMS sensor package.
Summary of the invention
The object of the present invention is to provide low moisture content method for packing of a kind of TO encapsulating structure that can realize that moisture content is low, gas purity is high, pressure controling precision is high and leak rate detects and package assembling thereof, to satisfy the encapsulation requirement of MEMS transducer.
Realize the technical scheme of the object of the invention:
A kind of TO encapsulating structure hangs down the moisture content method for packing, may further comprise the steps:
The first step is installed in device to be packaged on the base of TO package assembling;
Second step, sealed in unit, device to be packaged and package assembling are carried out degassing processing, and detect moisture content and residual gas composition, wherein, sealed in unit comprises inflation, degassing apparatus and frock:
In the 3rd step,, form the packaging body of semitight with the base and a soldering and sealing of pipe cap employing of TO package assembling;
In the 4th step, the air-filled pore through the TO package assembling carries out leak rate to the weld seam of a soldering and sealing and detects;
In the 5th step, packaging body is carried out degassing processing, and detect moisture content and residual gas composition;
In the 6th step, packaging body is inflated processing;
The 7th step, use laser-beam welding machine, the air-filled pore of packaging body is sealed welding, accomplish the hermetically sealed soldering and sealing of packaging body.
Aforesaid a kind of TO encapsulating structure hangs down the moisture content method for packing, and degasification is the method that adopts the high-temperature vacuum baking to combine the gas heat flush and be interrupted exhaust in second step and the 5th step, and concrete steps are following:
(1) treat depassing unit and under high vacuum environment, carry out high-temperature baking, wherein the high vacuum environment vacuum ranges is 1 * 10
-3Pa to 1 * 10
-4Pa, high-temperature baking is selected 100 ℃～700 ℃ baking temperature, keeps 10～60 minutes;
(2) charge into hydrogen or helium or the nitrogen or the argon process gas of heat, keeps after 10～15 minutes, pumping high vacuum once more, the pumping process employing is interrupted method for exhausting;
(3) repeat one the step inflate and vacuumize 2～4 circulations after, proceed high-temperature baking again.
Effect of the present invention is: on the base of TO package assembling, designed air-filled pore, the leak rate that is used for degasification, inflation processing and soldering and sealing weld seam detects, and the design of air-filled pore has changed the traditional packaged type of TO assembly.
On the basis of the TO assembly that has the air-filled pore structure, the present invention has adopted a kind of twice soldering and sealing to realize the TO package assembling method for packing of sealing.At first after the degasification of accomplishing equipment and packaging, use melting welding equipment that the base and the pipe cap of TO package assembling are welded an i.e. soldering and sealing.Because the existence of air-filled pore, the base of TO package assembling is a kind of semitight structure with the packaging body that pipe cap welding back forms, and can carry out accurate leak rate detection to the weld seam of a soldering and sealing this moment through air-filled pore.In having the hermetically sealed can of windowpane, successively packaging body is carried out degasification, inflation processing then according to designing requirement.Use laser-beam welding machine at last, through the windowpane of hermetically sealed can, the air-filled pore to packaging body under qualified gaseous environment seals welding, i.e. the hermetically sealed soldering and sealing of packaging body is accomplished in secondary soldering and sealing.
This method adopts two-stage high-temperature degassing scheme to be divided into degasification of parts level and the degasification of the whole level of packaging body.The degasification of parts level is meant: before the TO package assembling carries out soldering and sealing, respectively TO base and TO pipe cap are carried out degasification, this link can be removed the most of steam that contains in TO component internal and the sealed in unit.The degasification of the whole level of packaging body is meant after the TO assembly is accomplished soldering and sealing; Foreign gas through metal molten in the air-filled pore of reserving on the TO base steam that package interior is residual and the soldering and sealing process discharges is extracted out, so just can guarantee that the moisture content of package interior and the purity of working gas meet the demands.Take high-temperature baking to combine the gas heat flush simultaneously and be interrupted the degasification method of exhaust; Utilize the high-temperature technology gas of easy desorption to remove to displace the steam and other pernicious gas that is difficult for desorption; Make equipment before product is carried out degas operation, the foreign gases such as steam of working cavity and pipeline absorption become the gas that need charge into.
The low moisture content method for packing of the TO encapsulating structure that the present invention proposes has solved the difficult problem of the low moisture content encapsulation of TO encapsulating structure, and the moisture content of package interior can be controlled at 500 * 10
-6In, gas purity is controlled at more than 99%, can control the pressure of package interior, and for the product of low vacuum encapsulation, the air pressure control precision and can be carried out accurate leak rate to packaging body and detect in ± 100Pa, has very high efficient and reliability.
Description of drawings
Fig. 1 is existing TO package assembling structural representation;
Fig. 2 is a kind of TO package assembling structural representation provided by the present invention;
Fig. 3 is that a soldering and sealing weld seam leak rate detects sketch map among the embodiment;
Fig. 4 is an air-filled pore sealing soldering and sealing sketch map among the embodiment;
Fig. 5 is the low moisture content method for packing flow chart of a kind of TO encapsulating structure provided by the present invention.
Among the figure: 1. base; 2. pipe cap; 3. glass insulator; 4. output pin; 5. air-filled pore; 6. packaging body; 7. soldering and sealing weld seam; 9. leak detector; 10. hermetically sealed can; 11. glass window; 12. laser beam; 13. blow vent.
Embodiment
Below in conjunction with accompanying drawing and embodiment the present invention is further described.
As shown in Figure 2, a kind of package assembling that is used for the low moisture content method for packing of TO encapsulating structure of the present invention comprises base 1; And with the pipe cap 2 of base 1 sealing welding, base 1 is provided with air-filled pore 5 and output pin 4, output pin 4 is fixedly connected with base 1 through glass insulator 3; Air-filled pore 5 is a tapered openings; Diameter range is 0.3～0.5cm, and the surface roughness Ra value is smaller or equal to 0.8, and range of taper is between 5 °～10 °.In the present embodiment, the air-filled pore diameter is 0.35cm, and the surface roughness Ra value is 0.32, and tapering is 5 °.
As shown in Figure 5, a kind of TO encapsulating structure hangs down the moisture content method for packing, may further comprise the steps:
The first step is installed in device to be packaged on the base of TO package assembling;
Second step, sealed in unit, device to be packaged and package assembling are carried out degassing processing, and detect moisture content and residual gas composition, wherein, sealed in unit comprises inflation, degassing apparatus and frock:
At first working cavity and the pipeline to sealed in unit carries out high-temperature baking under high vacuum environment; In order to improve degasification speed; Select high baking temperature as far as possible, consider the temperature tolerance of equipment and product, generally select 300 ℃～400 ℃ baking temperature proper.Keep charging into process gass such as hot hydrogen, helium, nitrogen, argon after 30～60 minutes, the kind that charges into process gas should be identical with the working gas of inertia type instrument package interior.Kept about 10 minutes, and carried out pumping high vacuum again, pumping process adopts and is interrupted method for exhausting.Repeat inflation and vacuumize 2～4 circulations, proceed the high-temperature baking degasification again.Select 400 ℃ in the present embodiment, keep pouring argon gas after 30 minutes, kept 10 minutes, carry out pumping high vacuum again, repeat inflation and vacuumize 3 circulations, proceed the high-temperature baking degasification again.After the device processes completion, make to use the same method, treat packaging and package assembling simultaneously and carry out degassing processing, and use the gas ingredients in the residual gas analyzer testing cavity.
In the 3rd step,, form the packaging body 6 of semitight with the base and a soldering and sealing of pipe cap employing of TO package assembling:
Use the energy storage welding equipment, TO base and TO pipe cap are carried out air-tightness soldering and sealing.
In the 4th step, the air-filled pore through the TO package assembling carries out leak rate to the weld seam of a soldering and sealing and detects:
As shown in Figure 3, use helium mass spectrometer leak detector 9, through the air-filled pore of reserving 5, a soldering and sealing weld seam 7 is carried out leak rate detect.The leak rate index of product can be confirmed according to operating time, accuracy class etc., generally require leak rate to be superior to 1 * 10 for the high reliability device
-12Pam
3/ s.In the present embodiment, requiring leak rate is 1 * 10
-12Pam
3/ s.
In the 5th step, the packaging body that forms in the 3rd step is carried out degassing processing, and detects packaging body moisture content and residual gas composition:
The operation of this step is identical with second one step process, and the depassing unit in this enforcement adopts the band heater shown in Figure 4 and the hermetically sealed can 10 of windowpane, after accomplishing the degasification inflation, can directly encapsulate, and avoids the TO package assembling to be exposed to atmosphere.
In the 6th step, packaging body is inflated processing:
According to the moisture content testing result; Through judging after moisture content meets the demands; Use hermetically sealed can 10 shown in Figure 4, sealing jar 10 sidewalls have blow vent 13 and connect vacuum system and gas charging system, require to charge into the working gas of drying according to the pressure of product design.The working gas kind generally can be selected safe gases such as hydrogen, helium, nitrogen, argon, and air pressure is generally selected 0.1～1 atmospheric pressure.In the present embodiment, it is smaller or equal to 500 * 10 that moisture content requires
-6, working gas adopts argon gas, and air pressure is selected 0.5 atmospheric pressure.
The 7th step, use laser-beam welding machine to weld, laser beam 12 is through the windowpane 11 of hermetically sealed can 10, and the air-filled pore 5 of packaging body 6 is sealed welding, accomplishes the hermetically sealed soldering and sealing of packaging body 6.The selection that laser power need be carried out according to the aperture of air-filled pore 5 is 2 times of air-filled pore area with the area that forms the weldering spot generally, and fusion welding metal thickness 0.5～1mm is advisable.In the present embodiment, the parameter of laser welding is electric current 150A, pulsewidth 5ms, frequency 10Hz.
After the hermetically sealed soldering and sealing of accomplishing packaging body, use helium mass spectrometer leak detector to adopt the negative pressure method, packaging body is carried out leak rate detect.In the present embodiment, require leak rate to be superior to 1 * 10
-12Pam
3/ s.And the package interior gas componant detected.
Obviously, those skilled in the art can carry out various changes and modification to the present invention and not break away from the spirit and scope of the present invention.Belong within the scope of claim of the present invention and equivalent technologies thereof if these are revised with modification, then the present invention also is intended to comprise these changes and modification interior.
Claims (2)
1. a TO encapsulating structure hangs down the moisture content method for packing, it is characterized in that: may further comprise the steps:
The first step is installed in device to be packaged on the base of TO package assembling;
Second step, sealed in unit, device to be packaged and package assembling are carried out degassing processing, and detect moisture content and residual gas composition, wherein, sealed in unit comprises inflation, degassing apparatus and frock:
In the 3rd step,, form the packaging body of semitight with the base and a soldering and sealing of pipe cap employing of TO package assembling;
In the 4th step, the air-filled pore through the TO package assembling carries out leak rate to the weld seam of a soldering and sealing and detects;
In the 5th step, packaging body is carried out degassing processing, and detect moisture content and residual gas composition;
In the 6th step, packaging body is inflated processing;
The 7th step, use laser-beam welding machine, the air-filled pore of packaging body is sealed welding, accomplish the hermetically sealed soldering and sealing of packaging body.
2. according to the low moisture content method for packing of the described a kind of TO encapsulating structure of claim 1, it is characterized in that: degasification is the method that adopts the high-temperature vacuum baking to combine the gas heat flush and be interrupted exhaust in described second step and the 5th step, and concrete steps are following:
(1) treat depassing unit and under high vacuum environment, carry out high-temperature baking, wherein the high vacuum environment vacuum ranges is 1 * 10
-3Pa to 1 * 10
-4Pa, high-temperature baking is selected 100 ℃～700 ℃ baking temperature, keeps 10～60 minutes;
(2) charge into hydrogen or helium or the nitrogen or the argon process gas of heat, keeps after 10～15 minutes, pumping high vacuum once more, the pumping process employing is interrupted method for exhausting;
(3) repeat one the step inflate and vacuumize 2～4 circulations after, proceed high-temperature baking again.
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| CN102522343B (en) * | 2011-12-15 | 2014-04-16 | 烟台睿创微纳技术有限公司 | Microcomponent vacuum packaging exhaust device and method |
| CN103035540B (en) * | 2012-12-11 | 2015-06-03 | 北京中科飞鸿科技有限公司 | Low moisture content encapsulation device and method of jumbo size non-standard metal encapsulation device |
| CN105197880B (en) * | 2014-06-24 | 2018-03-20 | 中芯国际集成电路制造(上海)有限公司 | A kind of bonding method with cavity chip |
| CN104535084A (en) * | 2014-12-30 | 2015-04-22 | 上海华虹宏力半导体制造有限公司 | Encapsulating method |
| CN106064280A (en) * | 2016-06-30 | 2016-11-02 | 随州泰华电子科技有限公司 | A kind of tuning fork crystal sealing welding technique for extra |
| CN108802101A (en) * | 2018-06-15 | 2018-11-13 | 贵州振华群英电器有限公司（国营第八九厂） | A method of control interiors of products filling gas moisture content |
| CN110895284A (en) * | 2018-09-13 | 2020-03-20 | 航天科工惯性技术有限公司 | Accelerometer packaging structure, and sealing detection system and method |
| CN109254364A (en) * | 2018-11-14 | 2019-01-22 | 四川光恒通信技术有限公司 | A kind of unidirectional optical device of novel fully-sealed single fiber and its packaging method |
| CN111029308B (en) * | 2019-12-16 | 2021-11-23 | 武汉英飞光创科技有限公司 | Method and system for filling dry gas into shell of optical module device |
| CN111192839B (en) * | 2020-01-07 | 2023-05-12 | 贵州振华风光半导体股份有限公司 | Method for controlling internal water vapor content of black ceramic low-melting glass shell integrated circuit |
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| CN1445831A (en) * | 2002-03-18 | 2003-10-01 | 美新半导体（无锡）有限公司 | Cavity type method for packaging micro-electronics circuit |
| CN101478634A (en) * | 2008-12-25 | 2009-07-08 | 中国传媒大学 | Uncooled array type infrared image sensor |
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| US8067778B2 (en) * | 2006-09-28 | 2011-11-29 | Seoul Opto Device Co., Ltd. | Ultraviolet light emitting diode package |
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| CN1445831A (en) * | 2002-03-18 | 2003-10-01 | 美新半导体（无锡）有限公司 | Cavity type method for packaging micro-electronics circuit |
| CN101478634A (en) * | 2008-12-25 | 2009-07-08 | 中国传媒大学 | Uncooled array type infrared image sensor |
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