CN102017202A - Housing for high-power LEDs - Google Patents
Housing for high-power LEDs Download PDFInfo
- Publication number
- CN102017202A CN102017202A CN2009801154150A CN200980115415A CN102017202A CN 102017202 A CN102017202 A CN 102017202A CN 2009801154150 A CN2009801154150 A CN 2009801154150A CN 200980115415 A CN200980115415 A CN 200980115415A CN 102017202 A CN102017202 A CN 102017202A
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- China
- Prior art keywords
- outer cover
- base portion
- head
- further characterized
- glassy layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
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Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/641—Heat extraction or cooling elements characterized by the materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/49105—Connecting at different heights
- H01L2224/49109—Connecting at different heights outside the semiconductor or solid-state body
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S362/00—Illumination
- Y10S362/80—Light emitting diode
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49826—Assembling or joining
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Light Receiving Elements (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
The present invention relates to a housing for radiation-emitting or radiation-receiving optoelectronic components, such as LEDs, and to a method for producing said housing. The housing comprises a composite assembly comprising a base part (1) and a head part (5) which are connected by means of a glass layer (2). One section of the top side of the base part defines a mounting region (12) for an optoelectronic functional element (60) and is additionally a heat sink for the optoelectronic functional element. The head part extends, at least in sections, over the periphery of the mounting region and forms, above the mounting region, a passage region (52, 61) for the radiation emitted by the optoelectronic functional element or the radiation to be received. When assembling the base part, the glass layer and the head part, the glass layer is heated to such an extent that the glass reaches a viscosity at which the glass adheres, and the base part and the head part form a composite assembly by means of the first glass layer. Glass makes it possible to produce a hermetic encapsulation with increased thermal stability.
Description
Technical field
The present invention relates to a kind of outer cover and a kind of method that is used to produce described outer cover that is used for such as the optoelectronic components of LED.
Background technology
So-called " High Power LED " (LED) is encapsulated in resin structure or the plastic construction at present.For example, in WO 2004-053933 A2, this packing or outer cover have been described.This resin comprises organic material.Because such as the processing of getter action and/or yellow, these can cause shorten the useful life of LED.In addition, LED is not encapsulated in this outer cover hermetically.Therefore, environmental impact can cause the degeneration of material, surface and electrical connection.For example being used for, the thermal stability of the resin of the high output device of 5W LED also becomes problem.
Summary of the invention
Under this background, the objective of the invention is to make can obtain a kind ofly being used for optoelectronic components, especially for outer cover and a kind of method that is used to produce this outer cover of high-capacity LED, this outer cover has reduced the shortcoming of above-mentioned prior art at least.
Possible is to obtain having the outer cover of sealing property in this way.It also will be economical producing this outer cover.
This purpose realizes by outer cover and the method according to independent claims.Advantageous embodiments is the theme of concrete dependent claims.
Within the scope of the invention, a kind ofly be used for the photoelectric functional element,, comprise especially for the outer cover of LED:
-synthetic, described synthetic is the synthetic that is at least the synthetic of base portion and head or is made of base portion and head at least, described base portion and head be by at least the first glassy layer combination, and described first glassy layer is positioned between the bottom of the top of base portion and head, and
The part at the top of-base portion is defined for the installation region of at least one photoelectric functional element, thereby base portion is be used for the optoelectronic function element heat sink, and
-head is at least with sector mode or fully extend above the peripheral extent of installation region, and constitutes passage area above the assembling district, and described passage area is used for from the emission of photoelectric functional element and/or the radiation that will be received by the photoelectric functional element,
-especially, wherein head comprises that metal and/or base portion comprise metal, and bottom pre-oxidation and/or head, the top of base portion is pre-oxidation.
The present invention also is extended down to a kind of method, and this method is used to produce photoelectric functional element outer cover, especially for the photoelectric functional element outer cover of LED, comprises
-at least one base portion is set, the end face of this at least one base portion preferably is defined for the assembling district of at least one photoelectric functional element at least with sector mode, thus base portion is configured for the heat sink of optoelectronic function element,
-at least one head be set, this at least one head is at least with sector mode or fully extend above the peripheral extent in assembling district, form passage area above the installation region, described passage area is used for from the photoelectric functional element emission and/or the radiation that will be received by the photoelectric functional element
-especially, wherein base portion be formed in the matrix with a plurality of base portions (1) available and/or head be formed in the matrix with a plurality of heads available,
-between the bottom of the top of base portion and head, be provided with or arrange at least the first glassy layer, and
-assembling base portion, first glassy layer and head, and
-heating first glassy layer reaches bonding glass and base portion and head form synthetic at least by first glassy layer viscosity until glass,
Especially, thereby produce a plurality of outer covers simultaneously,
Especially, wherein this outer cover utilization connection cross bar is secured to the matrix with a plurality of base portions and/or is secured to the matrix with a plurality of heads by base portion and/or head.
In one embodiment, in matrix, can obtain base portion, head and/or the connecting portion addressed after a while in each.Especially, can produce or produce by the method according to this invention according to outer cover of the present invention.The method according to this invention is preferably designed so that and is used for producing according to outer cover of the present invention.
Head covers base portion with sector mode.Yet, its also unnecessary closure that constitutes outer cover at its place, top.Especially, it constitutes at least a portion or the enclosure wall of enclosure wall.Therefore head can also be called enclosure wall or framework.Especially, head is at least with sector mode or fully around the assembling district.Then function element to be installed is positioned at inner portion.It also represents one type the lid that is used for base portion.In one embodiment, head constitutes or has at least one electrical connection zone, especially for the electrical connection zone of function element.The part of head has been described in this district, and for example metal wire or conductor path can be fastened to the described part of head.Can be via the connection that join domain produces outer cover inside or function element arrives surround.If head conducts electricity, then join domain can be provided by the body of head self.Therefore head in one embodiment still is used for one type conductor frame of function element to be installed, and described function element preferably is arranged in inner portion.For join domain is provided, projection or brazing member, so-called soldering lug plate can make on the outside of head or it is secured to the outside of head.
The material that has the material of temperature stability when in one embodiment, head is included in up at least 400 ℃ or have temperature stability by up at least 400 ℃ the time is formed.Head preferably includes at least a inorganic material or head is made up of at least a inorganic material.In one type, therefore head is inorganic or roughly inorganic head.In one embodiment, head comprises or pottery and/or metal.In one embodiment, metal is metal self or alloy.In this case, metal is a member who is selected from the group of being made up of following material at least, and described group comprises copper, aluminium, nickel, iron, preferably ferritic steel or special steel and preferably austenitic steel or special steel.Head with material of suitable selection also helps heat to get rid of.
Because head is not distinguished with function element to be installed with assembling usually and directly contacted, perhaps do not contact, so head in one embodiment has at least one join domain that is used for function element in the inboard with their formation.Especially, the function element join domain extends above the peripheral extent of installation region with sector mode at least.In one embodiment, the function element join domain is made base portion or pedestal.This base portion or pedestal preferably are positioned at or design in a side of the bottom of head and be projected in the passage area of being addressed.
Passage area limits light or radiation can be by the scope that also therefore can enter and/or leave.Therefore passage area can also be called as passage.Preferably passage area is formed the opening in the head.For example, in order to guarantee the improved radiation output of LED, bottom from the head preferably enlarges the cross section of passage area continuously to its top.In one embodiment, passage area has the truncated cone of being in the nature configuration or cuts the pyramid configuration with sector mode at least.After the combination function element, for example can be arranged in the passage area or be arranged on the passage area top preferably as lid such as the optics of lens.Optics preferably is tightened to and makes the inner space seal with being sealed.
In one embodiment, can also be arranged on so-called optical device/converter system in the passage area or the passage area top.Optics/converter system preferably is called the optics/converter system described in the patent application of " optics/converter system (Optics/Converter System for (W) LEDs) that is used for (W) LED " in name.The patent application of being addressed be submit on the same day with present patent application and have internal file 08SGL0020DEP and a P3156.The scope of this patent application is incorporated into the full breadth in the present patent application.
The material that is used for the transducer of optics/converter system preferably is called the material described in the patent application of " in particular for the white that comprises semiconductor light sources or the transition material of color light source; the light source (Conversion material especially for a white or colored light source comprising a semiconductor light source; method for producing the same, and light source comprising said conversion material.) that is used to produce the method for this transition material and comprises described transition material " in name.The patent application of being addressed be submit on the same day with present patent application and have internal file 08SGL0097DEP and a P3179.The scope of this patent application is incorporated into the full breadth in the present patent application.
In order to improve illumination, the inner surface or the inner face of passage area in one embodiment have reflecting properties with sector mode at least.On the one hand, can realize reflecting properties by suitable processing such as the inner surface that polishes.As an alternative or as a supplement, can also apply or coat inner surface with sector mode.The preferred material that for example is used for this coating or coating for the metal representative of silver.Therefore passage area or head self can also be called as reflector.
The photoelectric functional element preferably is introduced in the outer cover by passage area and is secured to base portion.The photoelectric functional element is radiation-emission or radiation-receiving-member.Function element preferably is designed to chip.Function element is at least one parts that is selected from the group of being made up of LED, photodiode and laser diode.Especially,, use to be fit to according to outer cover of the present invention for preferably having greater than the about height output LED of the power of 5W because for them efficient heat to get rid of be necessary and outer cover must be enough heat-staple.Especially, for non-photoelectric functional element, also can be fit to the power semiconductor of described non-photoelectric functional element such as the thermal stability that for example its instructions for use is enough according to this outer cover of the present invention.Therefore according to outer cover of the present invention can also be the outer cover that is used for photoelectric functional element and/or non-photoelectric functional element.This is equally applicable to according to method of the present invention.Passage area here is the scope that is used to insert or introduce function element and/or cavity resonator.
This at least one function element is placed on the base portion.On the one hand, the base portion representative is used for the support component of function element.Therefore base portion can also be called as support or basis.Base portion can be integral piece or can be divided into independent scope therefore can have block design (seeing the hereinafter content about this respect) here.
After in being installed in outer cover, function element directly contacts with base portion.In this case, the top of base portion, especially assembling district roughly are smooth.For example function element can be bonded or be soldered to base portion.Preferably use unleaded slicken solder as scolder.Adhesive is preferably such as the electroconductive binder that is rich in silver-colored epoxy resin.Therefore direct contact also means the contact by adhesive, scolder or binding agent.
Because also represent according to base portion of the present invention to be used for the heat sink of function element, so it comprises the material with suitable thermal conductivity.Base portion preferably has at least approximately 50W/mK, the thermal conductivity of 150W/mK at least roughly preferably.Base portion can be thermally connected to other parts.Base portion preferably includes at least a inorganic material, and perhaps base portion is made of at least a inorganic material.In one type, therefore base portion is inorganic or roughly inorganic base portion.In one embodiment, base portion comprises at least a metal or metal or a kind of metal or alloy.For example, proper metal is copper and/or aluminium and/or nickel and/or iron and/or molybdenum and/or copper-tungsten material and/or Cu-Mo.Yet, passage or port line, so-called heat through-hole can also be introduced or be arranged in the base portion, such as for example being in the copper vias in the plate of for example Ni/Fe plate.
In one embodiment of the invention, construct base portion with one type " interlayer " structure and/or " multi-part ".For this reason, base portion is made of at least two layers.At least two layers of this of base portion are arranged in a mode on another top or are arranged side by side.Base portion in one embodiment is made up of at least the first material and second material.First material has the thermal conductivity higher than second material.Second material has the thermal coefficient of expansion lower than first material.
By sandwich construction and/or the structure of being made by at least the first material and second material, especially, possible is, makes the thermal expansion of base portion be fit to the thermal expansion of first glassy layer, and to make possible be to carry out corresponding heat from function element and get rid of.For this reason, the layer and function element thermo-contact that comprise first material of base portion.The layer that comprises second material of base portion is oriented to make the thermal expansion of first material coefficient of thermal expansion and first glassy layer to be complementary.The layer of second material can be placed in the base portion and/or on the base portion as the intermediate layer and/or as a kind of framework.
In an embodiment of base portion, it is at least with sector mode, particularly construct on its end face.Therefore, for example the independent block of base portion can be made electric insulation.
In another embodiment, base portion is configured such that first material embeds in second material or second material embeds in first material.
In one embodiment, base portion has at least one join domain that is used for function element, is electrically connected the zone in particular.This range describe the part of base portion, metal wire or conductor path for example can be fastened to a described part.Can be by the connection that join domain produces outer cover inside or function element arrives surround.If base portion conducts electricity, then join domain can be provided by the body of base portion self.For this purpose, the outside of base portion can be made or be secured to projection or brazing member, so-called soldering lug plate on the outside of base portion.
In one embodiment, the bottom of head directly contacts with first glassy layer and/or the top of base portion directly contacts with first glassy layer.First glassy layer preferably directly is positioned on the bottom of head on the top with base portion to be connected base portion and head.The two vicinity of the bottom of first glassy layer and head and the top of base portion.Before assembling, base portion and head are aimed at and are made that the bottom of the top of base portion and head is stacked.
Two-layer design makes the lower cost production of outer cover become possibility.In another embodiment, comprise the 3rd layer according to outer cover of the present invention or synthetic.For this purpose, also have at least one connecting portion according to synthetic of the present invention, described at least one connecting portion preferably is connected to synthetic by first and/or second glassy layer at least.The contact of at least one or function element preferably takes place by connecting portion.Connecting portion can also be called as conductor path, conductor band or conductor frame.
Connecting portion extends through the wall of outer cover.It constitutes at least one assembly of the wall of outer cover.Connecting portion preferably is projected in the inner space of outer cover by passage area and/or is projected in the space outerpace.It preferably particularly flatly and/or is vertically roughly medially located in enclosure wall.
The inner space or the function element of outer cover are connected to surround by connecting portion.For example metal wire or conductor path can be fastened to inner space that is used for contacting or the scope that is projected into the inner space that is used to contact pointed to.In an identical manner, for example metal wire or conductor path can be fastened to space outerpace that is used for contacting or the scope that is projected into the space outerpace that is used to contact pointed to.Connecting portion is preferably outstanding in the inner space and/or in passage area, makes that the receiving ability of function element and/or emitting performance are roughly not weakened.
Connecting portion preferably includes at least a inorganic material or connecting portion is made of at least a inorganic material.In one type, therefore connecting portion is inorganic or roughly inorganic connecting portion.In one embodiment, connecting portion comprises or connecting portion is an electric conducting material, preferably metal or alloy.In this case, metal is a member who is selected from the group of being made up of following material at least, and described group comprises copper, aluminium, nickel, iron, steel or special steel, ferritic steel or special steel and austenitic steel or special steel.By suitably selecting material, therefore connecting portion also helps heat to get rid of.
In one embodiment, connecting portion is arranged between the top of the bottom of head and base portion.At length, connecting portion is arranged between first glassy layer and second glassy layer.In one embodiment, the bottom of head directly contacts with second glassy layer and/or the top of connecting portion directly contacts with second glassy layer.First glassy layer is adjacent to the bottom of connecting portion and the top of base portion.
In this system of at least three layers, head is roughly born light guiding or is focused on from the function of the function element emission to be installed and/or the radiation that will be received by function element to be installed.Function element roughly contacts by connecting portion.On the other hand, in two layer system, head is mainly born the function of light guiding and contact.
The use that substitutes the glass of employed adhesive in the prior art makes the improvement of the function element in the outer cover and permanent combination (bonding) and the airtight possibility that is encapsulated into.Glassy layer also means glass flake.Each glassy layer is positioned between the suitable parts.According to the preferably inorganic or roughly inorganic outer cover of outer cover of the present invention.
The glass that is used for glassy layer has the softening point or the softening temperature of the scope below material melting point, and described material is used for head, base portion and/or connecting portion.The bottom by first glassy layer being applied to head and/or the top of base portion can be provided with first glassy layer.By bottom or the top that second glassy layer is applied to connecting portion second glassy layer can be set.
By silk screen printing, by distributing, utilize the glass band of preferably perforation and/or utilize independent preformed member that glass and first glassy layer and/or second glassy layer are set.For example, can make the glass band to use with the form of the band of cast tablets.In one embodiment, in matrix preparation first glassy layer and/or second glassy layer the two.
Especially, after described layer piles up, glass, be that first glassy layer and/or second glassy layer are heated to reach until glass and make bonding glass therefore be able to combination to the viscosity and the described layer of specific layer in this case.Glass preferably has 10 when combined
7Pas is to about 10
3Viscosity in the scope of Pas.Glassy layer that this is specific and adjacent layer formation cohesive bond.Heating is for example carried out in smelting furnace.Can also be during heating or in the scope of softening temperature that described layer is pinched together." collapse " that can control first and/or second glassy layer by sealing temperature of sequence and/or time.Assembling or glued occur in about 5 minutes to about 30 minutes, preferably in about 10 minutes to the 15 minutes time period scope.In this time period, the organic binder bond and/or the residual solvent that are present in the glass are roughly burnt fully.
The glass of first glassy layer is phosphate glass and/or soft glass preferably.The glass of second glassy layer is preferably phosphate glass and/or soft glass similarly.The example of phosphate glass is the glass with label SCHOTT G018-122.The example of soft glass is the glass with label SCHOTT 8061 and/or SCHOTT 8421.Phosphate glass is heated at about 300 ℃ of temperature in about 450 ℃ scope.Soft glass is heated at about 700 ℃ of temperature in about 900 ℃ scope.On the one hand, low temperature makes the faster and simpler possibility that is treated as.On the other hand, the outer cover of producing thus is not to have chemical resistance so.Therefore when the assembling outer cover, no longer can carry out for example multiple processing of metal-plated by independent layer.
In one embodiment, reduce the height of first glassy layer and/or second glassy layer in the scope on resting against connecting portion.The reduction of height makes the height of connecting portion or scope roughly be compensated.We can say that therefore connecting portion embeds between first glassy layer and second glassy layer.If connecting portion or a plurality of connecting portion are extending above the periphery in assembling district and up to the outer cover border land in this case by halves, then first glassy layer and second glassy layer directly adjoin each other with sector mode.
In another embodiment, be placed on described layer to spacer of major general between.After assembling, spacer is arranged in the plane of particular glass layer.At length, at least one spacer is placed between base portion and the head and/or between base portion and the connecting portion and/or between head and the connecting portion.Can optionally limit " collapse " or " combining " owing to the softening glassy layer that causes thus, and can limit the minimum interval.Therefore can set the thickness of particular glass layer in autotelic mode.Spacer has fusing point or the softening point higher than glass.
Spacer in one embodiment is the separate part that preferably is placed between the layer.For example, spacer can be a kind of band.The possible material that is used for spacer comprises metal, pottery, has than the glass that is used in conjunction with the high softening point of the glass of described layer.
In alternative or complementarity embodiment, the appropriate structuring of at least a portion of at least a portion by base portion, at least a portion of head and/or connecting portion forms spacer.For this reason, for example one type base portion or pedestal can be made at least a portion at the top of base portion and/or at least a portion of the bottom of connecting portion and/or at least a portion at the top of connecting portion and/or at least a portion of the bottom of head.
The shape and size of first glassy layer and/or second glassy layer are suitable for the shape and size of head, base portion and connecting portion.First glassy layer and/or second glassy layer extend above the peripheral extent of outer cover.In them each all has groove in inside.On the one hand, this groove provides the assembling district.On the other hand, it can also be the parts of passage area.
This outer cover has about 5mm
2To about 1000mm
2The area of coverage.From above observe the view at top of outer cover, the ratio of the surface area of the surface area of first glassy layer or second glassy layer and the surface area of outer cover is about 1/10 to about 9/10, preferably from about 1/4 to about 3/4.This makes stable synthetic and suitable airtight sealing become possibility.In order to make good bonding force and airtight synthetic or to be combined into possibility, first glassy layer and/or second glassy layer have the thickness of (having) about 100 μ m to 500 μ m.Base portion has the thickness of about 0.2mm to about 2mm.Head has the thickness of about 0.2mm to about 2mm.Connecting portion has the thickness of about 0.1mm to about 0.3mm.
In order to produce glassy layer to certain layer, arrive the better bonding force of head and/or base portion and/or connecting portion specifically, the glass contact surf zone of head and/or the glass contact surf zone of base portion and/or the glass contact surf zone of connecting portion are carried out preliminary treatment.Preliminary treatment for example can make the roughening of glass contact surf zone.Can for example carry out preliminary treatment by etching and/or pre-oxidation glass contact surf zone.Pre-oxidation means for example autotelic and controlled surface oxidation in comprising the atmosphere of oxygen.For the solid connection that is created between metal parts and the glassy layer, proved that oxidation is useful.At length, the oxidation of the oxidation at the top of base portion and/or the bottom of head, i.e. the oxidation of the glass contact surf zone of the oxidation of the glass contact surf zone of base portion and/or head has proved very favorable.
It is highly stable that the synthetic of glass and copper or Cu oxide has proved surprisingly.In order to realize this point, in one embodiment, at least the top of base portion and/or at least the bottom of head be equipped with by copper.In a preferred embodiment of the invention, the whole or roughly whole metal-glass contact surfaces zone in outer cover is formed copper-glass contact surf zone or is formed Cu oxide-glass contact surf zone.Copper can itself be that the parts of copper form available by constructing.The copper layer that can also pass through to be applied can be used copper.This layer can for example apply by plating, lamination and/or roll extrusion.With the situation of copper combination under, phosphate glass and/or soft glass have proved and have been highly profitable.
For this purpose, metal, preferably copper is oxidized in autotelic mode in comprising the atmosphere of oxygen.For oxide weight, about 0.02mg/cm
2To about 0.25mg/cm
2, about 0.067mg/cm preferably
2To about 0.13mg/cm
2It is favourable that the basis weight of oxide weight has proved.Oxide is bonding well and do not peel off.At about 0.27mg/cm
2Oxide under oxide weight or the above basis weight situation " peels off ".At about 0.5mg/cm
2Under oxide weight or the above basis weight situation, exist " heavy " oxide.We can say that oxide skin(coating) is " jumping falls " from the metal surface.
In order to improve the special properties of head, base portion and/or connecting portion, for example reflectivity, combinableness and/or conductivity, it can also be coated and/or coats.Metal-plated is represented a kind of method.According to the treatment temperature and the softening temperature of the kind of employed glass, before the independent layer of assembling and/or after this carry out and apply.
In one embodiment of the invention, the join domain of connecting portion, head and/or the join domain of base portion are gathered together, made to be provided with or to be provided with a plurality of function element by single anode and/or by single negative electrode.
In another embodiment, a plurality of function element can be connected to or be connected to the join domain of connecting portion, head and/or the join domain of base portion, thereby can be provided with or be provided with a plurality of function element by single anode and/or by single negative electrode.
If head, base portion and/or connecting portion are made by metal material, then head, base portion and/or connecting portion each all produce by so-called conductor frame method.The example of this production method has photochemical etching, punching, laser cutting and/or water jet cutting.In one embodiment of the invention, consider favourable production cost especially, preferably only use can punching material or metal produce base portion, connecting portion and/or head.In one embodiment, plate is constructed in such a manner, makes each plate form a plurality of parts.Outer cover is the parts of the matrix of independent outer cover.So matrix is one type basis inserting or be provided with specific features.Comprise a plurality of outer covers, preferably the layout of above-mentioned outer cover or matrix be therefore also within the scope of the invention.By so-called cross bar or brace, independent outer cover is secured to particular substrate.For the ease of later separation, independent outer cover can get loose from independent matrix.This carries out after producing synthetic.So if by base portion, head and/or connecting portion outer cover is fastened at least one matrix, then this is enough.Therefore described layout is characterised in that, outer cover preferably roughly fully discharges to the connection of at least one matrix.
The structure of the matrix that connecting portion is provided in one embodiment is designed such that in such a manner connecting portion is arrived with line set, thereby side by side supplies a plurality of outer covers and/or function element by single anode and/or by single negative electrode.At length, the join domain of the connecting portion of independent outer cover, the join domain of head and/or base portion is gathered together in such a manner, makes to supply a plurality of outer covers by single anode and/or by single negative electrode.In another embodiment, the join domain of the connecting portion of independent outer cover, the join domain of head and/or base portion puts together in such a manner, makes to supply a plurality of function element in an outer cover by single anode and/or by single negative electrode.At least two connecting portions of each outer cover setting are with a plurality of function element of supply in an outer cover.
A kind of optoelectronic components is also contained in the present invention, and described optoelectronic components comprises according to outer cover of the present invention and is positioned at least one photoelectric functional element of LED particularly in this outer cover.
A kind of lighting device also within the scope of the invention, described lighting device comprises according at least one outer cover of the present invention and/or an optoelectronic components.The example of lighting device is a floor lamp; Reading lamp; Work light, especially can be in ceiling or wall integrated work light; Object illumination in furniture and/or building; Preferably head lamp in motor vehicles and/or taillight and/or interior lamp and/or utility light or display lamp; And/or be used for the background illumination of LCD display.
To at length explain the present invention with reference to the example of following embodiment.In this respect with reference to the accompanying drawings.Same reference numerals in independent accompanying drawing relates to identical part.
Description of drawings
Fig. 1 .a and 1.b illustrate the combination of three matrixes in perspective view, described three matrixes have a plurality of parts to produce three layers outer cover.
Fig. 2 schematically shows the independent step of the method that is used to produce outer cover.
Fig. 3 .a schematically shows the detailed view of the extracts of the matrix with layout outer cover wherein to 3.d.
Fig. 4 .a schematically shows various embodiments according to outer cover of the present invention to 4.j.
Fig. 5 illustrates the FINAL APPEARANCE of connecting portion.
Fig. 6 .a shows glass to the bonding force (Fig. 6 .a and 6.b) of metal band and the result of the test of the depth distribution (Fig. 6 .c) of copper in glass to 6.c.
Fig. 7 .a schematically shows the layout (Fig. 7 .a and 7.b) and the layout (Fig. 7 .c) of LED in an outer cover of outer cover to 7.c.
Embodiment
Fig. 1 .a and 1.b illustrate the independent parts of three-tier system before producing three-tier system.Fig. 1 .b shows the cross section of Fig. 1 .a.Three-tier system here or outer cover 100 are made of base portion 1, two connecting portions 3 arranging in the plane and the head 5 that is called reflector 5 hereinafter, and described base portion 1, two connecting portions 3 and head 5 are connected maybe and will be connected by first glassy layer 2 and second glassy layer 4.Base portion 1 is attached to two connecting portions 3 that are called conductor band 3 below by first glassy layer 2.Conductor band 3 self is connected to reflector 4 again by second glassy layer 4.
For the production that reduces cost that makes outer cover 100 becomes possibility, parts 1,3,5 are disposed in the matrix 10,30,50 separately.Therefore can produce a plurality of outer covers 100 simultaneously.The parts 1,3,5 here all are made of metal.By structure metallic plate, production particular substrate 10,30,50.Therefore, base portion 1, head 3 and connecting portion 5 each freedom metallic plate preparation of constructing.The plate is here constructed in such a manner, makes each plate form a plurality of parts 1,3,5.The possible method that is used to construct is photochemical etching, punching, laser cutting and/or water jet cutting.Parts 1,3,5 are fastened on the particular substrate 10,30,50 by so-called connection cross bar 11,31,51 or fastening cross bar 11,31,51 or are fastened on the specific frame.Above-mentioned metallic plate can also for example be coated before or after being configured to matrix.Fig. 2 with reference to subsequently is used for the details about independent method step.Fig. 4 a illustrates the possible embodiment that can pass through according to the outer cover 100 of method production of the present invention to 4.d.
Fig. 2 illustrates the independent method step that is used to produce according to outer cover 100 of the present invention.By a plurality of parts in the matrix, carry out this method.Yet, will only make an explanation based on single outer cover 100.At first prepare base portion 1, described base portion 1 is configured for the support of LED60 to be installed and heat sink.First glassy layer 2 is applied to the top 1a of base portion 1.The method for printing screen representative is used to apply a kind of possible method of first glassy layer 2.First glassy layer 2 heart therein has groove 21.Preferably after assembling outer cover 100 fully, LED60 or led chip are installed in this groove 21." keeping open " surf zone on a base portion 1 or an one part is configured for the assembling district 12 of LED60.Yet the groove 21 in first glassy layer 2 can also be the parts of passage area 61 simultaneously.First glassy layer 2 extends above the peripheral extent in assembling district 12 fully.This scope 22 of first glassy layer 2 has the height of reduction, and two conductor bands 3 are installed in described scope 22 subsequently.This scope 22 also extend to outer cover 100 in the heart.Scope 22 with height of reduction preferably roughly is configured for the stop or the support surface area 22 of conductor path 3 fully.
In the next step of described method, matrix 30 is provided with conductor path 3.The outer cover 100 here is equipped with two connecting portions 3 or conductor path 3.Connecting portion 3 is positioned in such a way on first glassy layer 2, makes them rest on the scope 22 of the height with reduction.
In the later step of this method, the structure of base portion 1, first glassy layer 2 and conductor band 3 and the structure of second glassy layer 4 and reflector 5 are concentrated in together.They are assembled in such a manner, make second glassy layer 4 be positioned between conductor band 3 and the reflector 5 with sector mode.Because two conductor bands 3 extend above the peripheral extent of outer cover 100 by halves,, first glassy layer 2 contacts so also forming with second glassy layer 4.
We can say, after independent layer 1,3,5 piles up,, thereby reach this low viscosity that makes that layer 1,3,5 is mutually combined for example by radiations heat energy 80 heating glass 2 and 4.Except layer 1,3,5 is pinched together, can also provide pressure.For phosphate glass, reached about 300 ℃ to 450 ℃ temperature range here.On the other hand, for soft glass, reached about 700 ℃ to 900 ℃ temperature range.Can control " collapse " or " combining " of glassy layer 2 and 4 by temperature and sealing time.Also possible is, so-called spacer 90 is placed between the independent layer 1,2,3, and spacer 90 is limited to the minimum interval between the independent layer 1,2,3.Spacer 90 can be the parts of outer cover 100.Yet they can also be positioned on the particular substrate 10,30,50.
According to employed glass, can carry out the optional coating of independent layer 10,20,30 or 1,2,3 before assembling or after the assembling.Under situation such as the glass of the lower softening point of having of phosphate glass and the lower seal temperature that caused, in being assembled into outer cover 100 before, all metal partss 10,20,30 or 1,2,3 are metal-plated preferably.This also provides following flexibility, that is, under the situation of the selection coating technology that does not need to use lid, so-called " mask " or other costliness, different layers 10,20,30 or 1,2,3 can be coated with or metal is coated with different materials.For example, conductor band 3 or 30 can be coated with gold, to improve the combination through metal wire, so-called " metal wire combination ". Other layer 1 and 5 or 10 and 50 for example can be coated with nickel.For example silver can also be arranged on the inboard of passage area 61 or become possibility so that increase reflectivity on the inboard of groove 52.
After three matrixes 10,30,50 of assembling, formed synthetic can be used, for example, a plurality of LED in location above the passage area 61 in the assembling district 12 of specific outer cover 100.Yet after assembling, outer cover 100 can also fully or with sector mode separate from particular substrate 10,30,50 by separation process (for example by the cutting such as laser cutting).Therefore for example, at three-tier system and under the situation of the matrix 10,30,50 of three combinations, parts 1 and 3 or 1 and 5 or 3 and 5 can be separated in two matrixes 10 and 30 or 10 and 50 or 30 and 50.In the system of matrix 10 two-layer and that therefore have two combinations and 50, parts 1 and 5 can be separated in matrix 10 or 50.In both cases, outer cover 100 each all remain in a kind of layout or be in the matrix.On the one hand, therefore can handle a plurality of outer covers 100 in simple mode.On the other hand, for example after the possible process that LED is installed, can separate outer cover 100 individually in simple mode, because they still only are secured to matrix 10 or matrix 30 or matrix 50.Being used for outer cover 100 is punching from a kind of possible method that matrix 10 or matrix 30 or matrix 50 separate.Illustrate about how the independent possibility of a plurality of outer covers 100 can be set in 3d at Fig. 3 a.Fig. 3 a illustrates top view (left side) and cross section (right side) with perspective fashion.The outer cover 100 here only still is positioned in the matrix 10 of forming base portion 1 by the connection cross bar 11 of base portion 1.Fig. 3 .b shows top view (left side) and cross section (right side) with perspective fashion, and shows outer cover 100 and be positioned at embodiment in the matrix 30 by two connecting portions 3 and/or by connecting cross bar 31.Fig. 3 .c shows the connection cross bar 51 of outer cover 100 by reflector 5 and is positioned on the matrix 50 or is fastened to another embodiment on the matrix 50.Fig. 3 .d shows outer cover 100 and still is positioned on all three matrixes 10,30 and 50 or is fastened to embodiment on all three matrixes 10,30 and 50.
Fig. 4 a to 4c with cross-sectional illustration separated from the synthetic matrix or by the various embodiment of outer cover 100 after being separated from the matrix 10,30,50 of combination after separating individually or at outer cover 100 at outer cover 100.Fig. 4 .a shows two layers of jackets.It is made of the head 5 and the base portion 1 that connect by first glassy layer 2.There is the LED60 that is positioned at outer cover 100 inboards.LED60 is positioned in the assembling district 12 that the part by the top 1a of base portion 1 provides.The passage area 61 that is used for the light of passage area 61 emissions is positioned at the LED60 top.The LED60 here has the contact that is positioned on its front end face and is positioned at contact on the end face thereafter.Front contact is connected to reflector 5, and described reflector 5 conducts electricity in this case.At length, form with the substrate of in the scope of the bottom face 5b of reflector 5, introducing 53 and be connected.Substrate 53 is one with reflector 5.Realize contact by metal wire 73.Back contact is connected to the end face 1a of conductive base 1 by strutting piece.Base portion 1 for example is a copper coin.Directly LED60 is positioned at and has also guaranteed effective heat eliminating on the end face 1a." outside " contact of reflector 5 contacts with " outside " of base portion 1 under each situation and all takes place by the join domain 54 and 13 such as for example so-called soldering lug plate or conductor path.Join domain 54 and 14 is integral with head 5 and base portion 1 separately.
Fig. 4 .c illustrates three layers of outer cover.It is made of a kind of synthetic or comprises a kind of synthetic, and this synthetic is made of base portion 1, first glassy layer 2, two connecting portions 3, second glassy layer 4 and heads 5.
Illustrated outer cover 100 is corresponding to illustrated outer cover 100 in Fig. 4 .c in Fig. 4 .d.In contrast to this, also optics/converter system 200 is placed on the end face 100a of outer cover 100.Optics/converter system 200 is and system like the system class in patent application 08SGL0020DEP that preceding quotes and P3156.Optics/converter system 200 comprises with lower member or by constituting with lower member: transducer 201; Optics 202; Ring 203, described ring 203 preferably is made of metal, and ring 203 is as strutting piece; And have and apply 204 connectors that for example have a brazing material.Optics/converter system 200 for example is connected to outer cover 100 by soldering.Form airtight sealing.
In particular for " High Power LED ", get rid of from the heat of function element 60 and to prove very crucial as function element 60.Therefore, the metal such as the high thermal conductivity of having of copper and aluminium is normally used for base portion 1.Yet pointed metal also has following defective, that is, they have the thermal coefficient of expansion higher than glass usually.
Though each the foregoing description shows " integral type " base portion 1, have " interlayer " structure and/or " multi-part " structure of one type at Fig. 4 .e illustrated each base portion 1 in the 4.j.This particular configuration is corresponding to illustrated outer cover 100 in Fig. 4 .c.Yet the base portion of outer cover 100 1 is made of first material 101 with high thermal conductivity and second material 102 with thermal coefficient of expansion lower than first material 101 now at least.This multilayer of base portion 1 and/or multicomponent structure have compensated the thermal expansion of the metal higher than the thermal expansion of the glass of first glassy layer 2.Get rid of in order to produce the needed heat that is used for function element 60, function element 60 also with the first material thermo-contact with high thermal conductivity.Function element 60 is directly or indirectly against first material 101.
Copper has been proved to be and extremely has been suitable for first material 101.This is because on the one hand, copper has good thermal conductivity.On the other hand, copper-glass combination or Cu oxide-glass are in conjunction with also being proved to be extremely stable.As the evidence of this point, with reference to figure 6.a and 6.b and following description.In addition, copper is chemically stable with respect to employed glass and has sufficiently high fusing point.Copper can also be bought and/or the especially machine work of punching with rational cost.Therefore, copper preferably always constitutes the parts of base portion 1.
In Fig. 4 .e, base portion 1 is made of three layers 103,104,105.Get rid of or dispersion in order to produce the suitable heat that is used for function element 60, top layer 103 is made of first material 101.The 3rd layer 105 of the bottom because symmetric former thereby be positioned and preferably made by first material 101 equally.In order to obtain suitable thermal conductivity, the layer of first material 101 is 103 and 105 in this case, has the thickness greater than 200 μ m.For compensate for heat expansion, intermediate layer 104 or the layer with second material 102 of the thermal coefficient of expansion lower than first material 101 are arranged between upper strata 103 and the bottom 105.Required thermal expansion " is pressed and is passed " in intermediate layer 104 on first material 101.In order to realize heat transfer, intermediate layer 104 is made thinner than exterior layer 103 and 105 usually.Typical thickness be at about 80 μ m in the scope of 120 μ m.Possible is to adjust hot expansion property by changing layer material and/or layer thickness.Owing to the cost reason, the base portion 1 that constitutes by several layers 103,104,105 by roll extrusion production for example.
Illustrated outer cover 100 is corresponding to illustrated outer cover 100 in Fig. 4 .e in Fig. 4 .f.In contrast to this, the top layer 103 that contacts with first glassy layer 2 of base portion 1 has a kind of Structured Design.Function element 60 be positioned on one type the platform and especially with the foreign range electric insulation of the top layer 103 of base portion 1.
Illustrated outer cover 100 is corresponding to illustrated outer cover 100 in Fig. 4 .e in Fig. 4 .g.Though the level course structure has been shown in Fig. 4 .e or has had the layer structure of overlapped layers 103,104 and 105, in contrast to this, the base portion 1 shown in Fig. 4 .g is constructed by in a lateral direction a plurality of thin slices or layer 106 and 107.In other words, layer 106 and 107 is arranged side by side.First material 101 is placed with function element 60 and contacts.First material 101 is positioned at as intermediate layer 106 in the zone at center 106 of base portion 1.Second material 102 is extending with sector mode above the peripheral extent at center 106 at least as a kind of framework 107.This framework 107 " is pressed and is passed " thermal expansion or compensates its rapid expansion on center 106.For example can first material 101 be introduced in second material 102 by being driven.
In Fig. 4 .h, illustrate outer cover 100 corresponding to illustrated outer cover 100 in Fig. 4 .g.Another layer 108 is placed on second material 102 in addition as bonding auxiliary layer.This other layer 108 encircles 108 in particular.Ring 108 in a preferred embodiment is the copper rings with oxidized surface.According to the thickness of this other layer 108, by electroplating or lamination will encircle 108 and be applied to base portion 1.This other layer 108 is preferably by the material of punching.This makes the synthetic between the base portion 1 and first glassy layer 2 have the stability of increase.Preferably another that is made of copper layer can also be positioned in the bottom surface 5b of head 5 and the bonding auxiliary layer between second glassy layer 4.Yet this is not shown in the drawings.Because thermal conductivity high in this scope is dispensable, so this layer 108 can be designed to have the less thickness in 10 mu m ranges at 5 μ m.
Fig. 4 .i shows a kind of invention of enhancing, and wherein base portion 1 roughly is made of the layer 103 of first material 101.In order to mate needed expansion, the layer 109 of second material 102 for example is placed on the end face 1a of base portion 1 as ring 109.Yet the bottom surface 1b that ring can also be placed on base portion 1 goes up (not shown in FIG.).
For example, Fig. 4 .j shows the embodiment of outer cover 100, and wherein base portion 1 is made of " matrix " material, has embedded suitable material in described " matrix " material.The material that " totally " upward or combinedly has the thermal expansion of necessary thermal conductivity and necessity is made up mutually, and the material of the thermal expansion of the thermal conductivity of described necessity and necessity is suitable for employed glass.The material that for example, can be used for base portion 1 by SINTERING PRODUCTION.In the embodiment shown, for example for example be embedded in the matrix such as first material 101 of copper matrix such as the particle of second material 102 of molybdenum.
In one embodiment, by the optics/converter system 200 of transducer 201 and the interaction of LED60 obtain so-called White LED 60 in particular.The light of being launched is received device and is perceived as white light.Form so-called (W) LED60.White light produces by adding blend of colors.LED60 for example is blue emission LED60, and transducer 201 is the glass that comprises such as the luminescent dye of so-called yellow phosphorus.The shortwave blue ray excites dyestuff with radius.This effect is called as luminescence generated by light.Yellow light with longer wavelength is launched.Usually, be not that whole blue rays is converted.Therefore white light is produced by the blue and yellow mixture of colours that adds of two kinds of spectrum colours.
Fig. 5 shows the cutaway view of the outer cover 100 of the detailed view with connecting portion 3.Outer cover 100 can be mounted for example on retainer 71 or plate 71.Electrically contacting of unshowned function element 60 by making by for example connecting portion 3 of soldered fitting 71 connections and the conductor path 72 of plate 71.The connecting portion 3 here is bent to its final form.Base portion 1 mechanically stable like this of outer cover 100 or outer cover 100 makes to become possible to be crooked connecting portion 3 under the situation of not crooked whole outer cover 100.
Comparing with known outer cover, is extremely heat-staple according to outer cover 100 of the present invention.This outer cover design makes with the ordinary resin that may use prior art to be compared with plastics, becomes possibility with higher operating temperature work.Therefore, can also use " unleaded " soldering tech, the common demanding treatment temperature of this technology (being higher than 200 ℃).This design has presented the multiple option of the structure that is used for this outer cover 100.In particular for soldering, this has presented other option, is used for function element 60 is fastened to base portion 1.Also make enclosed package become possibility.
The difference of embodiment also is particularly to pass through the bonding force of the increase of Cu oxide layer between glass and copper, in described embodiment, in conjunction with being undertaken by copper, particularly Cu oxide layer and glass.In this respect, each all shows the result of the test of glass to the bonding force of metal band to Fig. 6 .a to 6.b.At length, illustrate " peeling off " behavior of bead, on the one hand be bead " peeling off " behavior of (Fig. 6 .a) on the NiFe band, and be that bead has about 0.1mg/cm on the other hand on the copper bar band
2The oxide skin(coating) of basis weight on " peeling off " behavior of (Fig. 6 .b).Under the situation of NiFe band, bead " fully " after applying certain loads jumps out of from band, here begins with the specific curvature angle.The surface of NiFe band is not changed.In contrast to this, under the situation of copper bar band, tear and do not occur in glass/metal at the interface, but laterally take place by glass.Glass keeps being adhered on the copper.In other words, glass " is torn " rather than is got loose from the surface.Therefore there is significant bonding force.
Be not bound by under the theoretical situation, inventor's supposition has suitable effect at the oxide skin(coating) on the copper on bonding force.When copper combined with glass, Cu oxide peeled off with sector mode or dissolves.Cu oxide is diffused in the glass.Develop into gradient layer.The amount of the Cu oxide in glass reduces to more than half glass from the surface.Surprisingly, exist Cu oxide to reach the diffusion of the degree of depth of about 200 μ m in the glass deeply.In this respect, as an example, Fig. 6 .c shows the degree of depth of copper penetration in the glass S-8061.(EDX) measures by energy-dispersive X-ray analysis.The depth distribution that records and the concentration of copper illustrate as the function (being standardized as the concentration of copper in the surface) of the degree of depth.Before being used for the fuse process of combination, directly depend on oxide thickness at the interface concentration.It can amount to a few percent.Usually, the concentration of at the interface copper about 0.1% in about 15% scope.
Has other advantage that surmounts known outer cover by the outer cover of producing according to method of the present invention 100.Can also satisfy specification such as needed those specifications in the processing of LED.Material with high thermal conductivity can be set to basis 1 or base portion 1.The heat that is produced by LED can be provided by base portion heat sinkly scatters effectively and takes away, because at base portion 1 in this case, LED to be installed directly contacts with heat sink.Packing does not roughly have organic material.This method is compatible mutually with the so-called method that is used for SMD (" surface mount device ").Possible is, with substrate forms production with carry outer cover 100.This method makes the production that reduces cost become possibility.It is possible having design taper, local step-like reflector, and/or the combined possibility of existence and glass lens and/or optics/converter system 200.
Each all illustrates Fig. 7 .a and 7.b according to grouping of the present invention or a plurality of outer cover 100.In other situation, this so-called array is important for commercial use, for example all head lamp and/or taillight and/or the interior lightings of being used in automotive field in this way of described commercial use.Outer cover 100 here illustrates with circle by example.Array can be produced by outer cover 100 is remained in matrix 10 and 50, as Fig. 3 .a in the 3.c illustrated.The connecting portion 3 of independent outer cover can be brought together, thereby can operate a plurality of outer covers by single anode and/or by single negative electrode.On the other hand, Fig. 7 .c illustrates the outer cover 100 that is furnished with a plurality of LED60 in outer cover 100, is four LED as example here.All LED60 are arranged in the assembling district 12 of outer cover 100 inboards.As shown, LED60 can have they self connection 3 separately, and perhaps they self lead-in 3 for example has at least two lines.Yet the connection 3 of independent LED60 can also be made up or the part combination, thereby outer cover 100 can have the only single connector 3 that is used for all LED.The metal wire herein 73 of independent LED60 can also be fed to a connector 3 or two connectors 3.
To those skilled in the art, be apparent that described embodiment is considered to example.The invention is not restricted to described example, but can under the prerequisite that does not depart from essence of the present invention, change with countless ways.The feature of independent embodiment and in the general part of explanation the feature addressed each all can be between self combination or and combination with one another.
Reference numerals list:
1 base portion or basis or support member
The top of 1a base portion (face)
The bottom of 1b base portion (face)
2 first glassy layer or glass flakes
3 connecting portions or conductor sheet
The top (face) of 3a connector band
The bottom of 3b connecting portion (face)
4 second glassy layer or glass flakes
5 heads or reflector
The top of 5a head (face)
The bottom of 5b head (face)
10 are used for the matrix of base portion
11 base portions-matrix connects cross bar
12 are used for the assembling district of function element
The join domain of 13 base portions
Groove in 21 first glassy layers
22 are used for the supporting zone of connecting portion
30 are used for the matrix of connecting portion
31 connecting portions-matrix connects cross bar
Groove in 41 second glassy layers
42 are used for the supporting zone of connecting portion
50 are used for the matrix of head
51 heads-matrix connecting portion
Groove in 52 heads
53 function element join domain or bases
The join domain of 54 heads
60 photoelectric functional element or LED
61 passage area
70 solder joints
71 retainers or plate
The conductor path of 72 plates
73 metal wires or metal wire combination
80 heats or thermal radiation
90 spacers
91 opticses or lens
100 outer covers or function element outer cover
The end face of 100a outer cover
101 have first material of high thermal conductivity
102 have second material of less thermal expansion
The top layer of 103 base portions or exterior layer
The intermediate layer of 104 base portions
The bottom of 105 base portions or exterior layer
The center of 106 base portions
The framework of 107 base portions
Other layer or the ring of 108 first materials
Other layer or the ring of 109 second materials
200 optics/converter system or converter unit
201 transducers
202 opticses or optics
203 rings or becket or metallic supports
204 apply or coat
Claims (36)
1. outer cover (100) that is used for photoelectric functional element (60), particularly LED (60), described outer cover (100) is come by producing or be produced according to the method for one of following claim, and described outer cover (100) comprises
-synthetic, described synthetic is by base portion (1) and head (5) constitute at least, described base portion (1) and described head (5) are at least by first glassy layer (2) combination, described first glassy layer (2) is positioned between the bottom surface (5b) of the end face (1a) of described base portion (1) and described head (5), and
-and the part of the end face (1a) of described base portion (1) be defined for the assembling district (12) of at least one photoelectric functional element (60), thereby described base portion (1) is formed for the heat sink of described photoelectric functional element (60), and
-described head (5) extends in the peripheral extent top in described assembling district (12) with sector mode at least, and form passage area (52 in top, described assembling district (12), 61), described passage area (52,61) be used for from described photoelectric functional element (60) radiation emitted and/or the radiation that will receive by described photoelectric functional element (60), wherein
-described head (5) comprises metal, and described base portion (1) comprises metal, and the bottom surface (5b) of the pre-oxidation and/or described head of end face (1a) (5) of described base portion (1) is pre-oxidation.
2. according to the outer cover of last claim, be further characterized in that
Described base portion (1) is made of at least two layers (103,104,105,106,107,108,109).
3. according to the outer cover of last claim, be further characterized in that
Described at least two layers (103,104,105,106,107,108,109) of described base portion (1) are stacked on top of each other and/or be arranged side by side.
4. according to the outer cover of one of aforementioned claim, be further characterized in that
Described base portion (1) is made of at least the first material (101) and second material (102).
5. according to the outer cover of last claim, be further characterized in that
Described first material (101) has higher thermal conductivity than described second material (102), and described second material (102) has lower thermal coefficient of expansion than described first material (101).
6. according to the outer cover of one of aforementioned claim, be further characterized in that
The layer that comprises described first material (101) (103,106) of described base portion (1) and described function element (60) thermo-contact.
7. according to the outer cover of one of aforementioned claim, be further characterized in that
The layer that comprises described second material (102) (103,106) of described base portion (1) is arranged on described first glassy layer (2), to mate the thermal expansion of described first material (101).
8. according to the outer cover of one of aforementioned claim, be further characterized in that
Described base portion (1) is particularly constructed with sector mode on its end face (1a) at least.
9. according to the outer cover of one of aforementioned claim, be further characterized in that
Described base portion (1) is constructed such that described first material (101) embeds in described second material (102) or described second material (102) embeds in described first material (101).
10. according to the outer cover of one of aforementioned claim, be further characterized in that
Described head (5) has at least one join domain (53) that is used for described function element (60).
11. the outer cover according to last claim is further characterized in that
Described join domain (53) on the inner face of described head (5) is designed to one type substrate (53).
12. the outer cover according to one of aforementioned claim is further characterized in that
The inner face of described passage area (52,61) has reflecting properties with sector mode at least.
13. the outer cover according to one of aforementioned claim is further characterized in that
Described base portion (1) has at least one join domain (1a) that is used for described function element (60).
14. the outer cover according to one of aforementioned claim is further characterized in that
At least one connecting portion (31) is set between the end face (1a) of the bottom surface (5b) of described head (5) and described base portion (1).
15. the outer cover according to last claim is further characterized in that
Described connecting portion (3) is connected to described synthetic by described first glassy layer (2) and/or second glassy layer (4) at least.
16. the outer cover according to one of two claims in front is further characterized in that
Described connecting portion (3) is set between described first glassy layer (2) and second glassy layer (4).
17. the outer cover according to one of aforementioned claim is further characterized in that
Reduce the height of described first glassy layer (2) and/or described second glassy layer (2) in the zone (22) on resting against described connecting portion (3).
18. the outer cover according to one of aforementioned claim is further characterized in that
At least one spacer (90) is set between described base portion (1) and the described head (5) and/or between described base portion (1) and the described connecting portion (3) and/or between described head (5) and described connecting portion (3).
19. the outer cover according to one of aforementioned claim is further characterized in that
Ratio between the surface area of the surface area of the surface area of described first glassy layer (2) or described second glassy layer (4) and described outer cover (100) is about 1/10 to about 9/10, from 1/4 to about 3/4 ratio preferably.
20. the outer cover according to one of aforementioned claim is further characterized in that
Described connecting portion (3), described join domain (1a) and/or described join domain (53) are connected as follows, promptly can supply a plurality of function element (60) by single anode and/or by single negative electrode.
21. the outer cover according to one of aforementioned claim is further characterized in that
A plurality of function element (60) can be connected to described connecting portion (3), described join domain (1a) and/or described join domain (53), thereby can supply a plurality of function element (60) by single anode and/or by single negative electrode.
22. the outer cover according to one of aforementioned claim is further characterized in that
The metal of described base portion (1) is a copper.
23. the outer cover according to one of aforementioned claim is further characterized in that
The end face (1a) of described at least base portion (1) and/or the bottom surface (5b) of described at least head (5) are by the copper setting.
24. the outer cover according to one of aforementioned claim is further characterized in that
The end face (1a) of described base portion (1) and/or the bottom surface (5b) of described head (5) are pre-oxidation, thereby form oxide weight, and described oxide weight has about 0.02mg/cm
2To about 0.25mg/cm
2, preferably from about 0.067mg/cm
2To about 0.13mg/cm
2Basis weight.
25. a matrix, described matrix comprise a plurality of outer covers according to one of aforementioned claim (100).
26. the matrix according to last claim is further characterized in that
The described connecting portion (3) of independent outer cover (100), described join domain (1a) and/or described join domain (53) are gathered together as follows, promptly can be supplied a plurality of outer covers (100) by single anode and/or by single negative electrode.
27. the matrix according to one of two claims in front is further characterized in that
The described connecting portion (3) of independent outer cover (100), described join domain (1a) and/or described join domain (53) are gathered together as follows, promptly can be by single anode and/or by a plurality of function element in the single negative electrode supply outer cover (100).
28. the outer cover according to last claim is further characterized in that
Each outer cover (100) is provided with at least two connecting portions (3), so that supply a plurality of function element (60) in outer cover (100).
29. an optoelectronic components, described optoelectronic components comprises: according to the outer cover (100) of one of aforementioned claim; Be arranged on photoelectric functional element (60), the particularly LED (60) that at least one radiated emission in the described outer cover (100) and/or radiation receive.
30. a lighting device, described lighting device comprise at least one outer cover according to one of aforementioned claim (100) or at least one optoelectronic components according to last claim.
31. a method, described method be used for producing especially for LED (60), preferably according to the photoelectric functional element outer cover (100) of one of aforementioned claim, this method comprises
-at least one base portion (1) is set, the end face (1a) of described at least one base portion (1) preferably is defined for the assembling district (12) of at least one photoelectric functional element (60) at least with sector mode, thereby described base portion (1) is formed for the heat sink of described photoelectric functional element (60)
-at least one head (5) be set, described at least one head (5) extends in the peripheral extent top in described assembling district (12) with sector mode at least, and form passage area (52,61) in top, described assembling district (12), described passage area (52,61) is used for from described photoelectric functional element (60) radiation emitted and/or the radiation that will be received by described photoelectric functional element (60)
-wherein, described base portion (1) is made into can be used in the matrix (10) with a plurality of base portions (1) and/or described head (5) is made into can be used in the matrix (50) with a plurality of heads (5),
-at least the first glassy layer (2) is set between the bottom surface (5b) of the end face (1a) of described base portion (1) and described head, and
-assemble described base portion (1), described first glassy layer (2) and described head (5), and
-heating described first glassy layer (2) reaches described bonding glass and described base portion (1) and described head (5) until glass and forms the viscosity of synthetic at least by described first glassy layer (2), thereby produces a plurality of outer covers (100) simultaneously,
Wherein, described outer cover (100) utilizes connection cross bar (11,51) to be secured to the matrix (10) with described a plurality of base portion (1) and/or to be secured to the matrix (50) with described a plurality of head (5) by described base portion (1) and/or described head (5).
32. the method according to last claim is further characterized in that
At least one connecting portion (3) is set, and described connecting portion (3) is set between the end face (1a) of the bottom surface (5b) of described head (5) and described base portion (1).
33. the method according to one of two claims in front is further characterized in that
At least the second glassy layer (4) is set between the bottom surface (5b) of the end face (1a) of described base portion (1) and described head (5), and described second glassy layer (4) is incorporated into described synthetic by heating.
34. the method according to last claim is further characterized in that
Described connecting portion (3) is set between described first glassy layer (2) and described second glassy layer (4).
35. the method according to one of aforementioned claim is further characterized in that
The end face (1a) of described at least base portion (1) and/or the bottom surface (5b) of described at least head (5) are by the copper setting.
36. the method according to one of aforementioned claim is further characterized in that
The end face (1a) of described at least base portion (1) and/or the bottom surface (5b) of described at least head (5) are pre-oxidation.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102008021435.3 | 2008-04-29 | ||
| DE102008021435A DE102008021435A1 (en) | 2008-04-29 | 2008-04-29 | Housing for LEDs with high performance |
| PCT/EP2009/003109 WO2009132838A1 (en) | 2008-04-29 | 2009-04-29 | Housing for high-power leds |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102017202A true CN102017202A (en) | 2011-04-13 |
| CN102017202B CN102017202B (en) | 2012-11-21 |
Family
ID=40910752
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009801154150A Expired - Fee Related CN102017202B (en) | 2008-04-29 | 2009-04-29 | Housing for high-power LEDs |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US8796709B2 (en) |
| EP (1) | EP2269238B1 (en) |
| JP (2) | JP5536755B2 (en) |
| KR (1) | KR101351738B1 (en) |
| CN (1) | CN102017202B (en) |
| DE (1) | DE102008021435A1 (en) |
| WO (1) | WO2009132838A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104819444A (en) * | 2014-01-31 | 2015-08-05 | 科视数字系统加拿大股份有限公司 | A light emitting device with a heat sink composed of two materials |
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| JP5554680B2 (en) * | 2010-10-15 | 2014-07-23 | スタンレー電気株式会社 | Light-emitting element mounting substrate, light-emitting device, and manufacturing method thereof |
| JP2012154318A (en) * | 2011-01-06 | 2012-08-16 | Ibiden Co Ltd | Exhaust emission treatment device |
| DE102011013276A1 (en) | 2011-03-07 | 2012-09-13 | Schott Ag | Housing for electronic component e.g. LED used in lighting device, has glass layer that is arranged between the head section and base, and is made of alkali-titanium silicate glass |
| DE102011013278B4 (en) * | 2011-03-07 | 2020-06-18 | Schott Ag | Housing for high-performance LEDs - "1-layer system" |
| DE102011013277A1 (en) | 2011-03-07 | 2012-09-13 | Schott Ag | Housing for high-performance light-emitting diodes - "2-layer system" |
| CN103415479B (en) * | 2011-03-07 | 2016-08-31 | 肖特公开股份有限公司 | For sealingly engaging the glass system of Cu parts and for the housing of electronic unit |
| JP6293995B2 (en) * | 2012-03-23 | 2018-03-14 | 新光電気工業株式会社 | Light emitting element mounting package, method for manufacturing the same, and light emitting element package |
| DE102012211553A1 (en) * | 2012-07-03 | 2014-01-09 | Osram Gmbh | Housing for LED light module, has plate-like inner region serving as assembled coverage areas comprising sorting regions surrounded by separation lines, where separation lines are formed at side turned towards semiconductor light module |
| DE102014111278A1 (en) * | 2014-08-07 | 2016-02-11 | Osram Opto Semiconductors Gmbh | Light-emitting diode holder and LED lamp or luminaire for lighting |
| JP6005779B2 (en) * | 2015-03-02 | 2016-10-12 | ローム株式会社 | LIGHT EMITTING DEVICE, LIGHT EMITTING DEVICE MANUFACTURING METHOD, AND OPTICAL DEVICE |
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| JPS584955A (en) * | 1981-06-30 | 1983-01-12 | Shinko Electric Ind Co Ltd | Package of gold-plated electronic parts |
| US4524238A (en) * | 1982-12-29 | 1985-06-18 | Olin Corporation | Semiconductor packages |
| DE10118630A1 (en) * | 2001-04-12 | 2002-10-17 | Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh | Production of an optoelectronic semiconductor component comprises preparing sintered glass blanks, applying an adhesive to the surfaces of the blank to be connected, fixing both blanks in a tool, and forming a mechanical composite |
| US7692206B2 (en) | 2002-12-06 | 2010-04-06 | Cree, Inc. | Composite leadframe LED package and method of making the same |
| KR100693969B1 (en) * | 2003-03-10 | 2007-03-12 | 도요다 고세이 가부시키가이샤 | Solid element device and method for manufacture thereof |
| CN101740560B (en) * | 2003-04-01 | 2012-11-21 | 夏普株式会社 | Light-emitting apparatus, backlight apparatus, and display apparatus |
| US7095053B2 (en) * | 2003-05-05 | 2006-08-22 | Lamina Ceramics, Inc. | Light emitting diodes packaged for high temperature operation |
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| DE102004014207A1 (en) * | 2004-03-23 | 2005-10-13 | Osram Opto Semiconductors Gmbh | Optoelectronic component with a multi-part housing body |
| GB2413698B (en) | 2004-04-27 | 2006-04-05 | Lingsen Precision Ind Ltd | Led package and the process making the same |
| JP2006012868A (en) * | 2004-06-22 | 2006-01-12 | Toshiba Corp | Package for semiconductor light emitting element and semiconductor light emitting device using the same |
| JP4012936B2 (en) * | 2004-08-06 | 2007-11-28 | 株式会社アライドマテリアル | Assembly board |
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| KR100780196B1 (en) * | 2006-02-27 | 2007-11-27 | 삼성전기주식회사 | Light emitting diode package, substrate for light emitting diode package and method of manufacturing the same |
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-
2008
- 2008-04-29 DE DE102008021435A patent/DE102008021435A1/en not_active Ceased
-
2009
- 2009-04-29 JP JP2011506607A patent/JP5536755B2/en not_active Expired - Fee Related
- 2009-04-29 KR KR1020107026602A patent/KR101351738B1/en active IP Right Grant
- 2009-04-29 CN CN2009801154150A patent/CN102017202B/en not_active Expired - Fee Related
- 2009-04-29 WO PCT/EP2009/003109 patent/WO2009132838A1/en active Application Filing
- 2009-04-29 EP EP09737882.2A patent/EP2269238B1/en active Active
- 2009-04-29 US US12/990,437 patent/US8796709B2/en active Active
-
2013
- 2013-12-25 JP JP2013266947A patent/JP5763742B2/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104819444A (en) * | 2014-01-31 | 2015-08-05 | 科视数字系统加拿大股份有限公司 | A light emitting device with a heat sink composed of two materials |
| CN104819444B (en) * | 2014-01-31 | 2018-04-20 | 美国科视数字系统股份有限公司 | Light-emitting device with the heat sink being made of two kinds of materials |
Also Published As
| Publication number | Publication date |
|---|---|
| JP5536755B2 (en) | 2014-07-02 |
| DE102008021435A1 (en) | 2009-11-19 |
| KR101351738B1 (en) | 2014-01-14 |
| JP2011523502A (en) | 2011-08-11 |
| EP2269238B1 (en) | 2020-08-05 |
| US8796709B2 (en) | 2014-08-05 |
| US20110108857A1 (en) | 2011-05-12 |
| EP2269238A1 (en) | 2011-01-05 |
| JP2014078749A (en) | 2014-05-01 |
| KR20110025900A (en) | 2011-03-14 |
| WO2009132838A1 (en) | 2009-11-05 |
| JP5763742B2 (en) | 2015-08-12 |
| CN102017202B (en) | 2012-11-21 |
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