CN101996907A - Bumping device for pressing wafer-level elastomer into microsphere - Google Patents
Bumping device for pressing wafer-level elastomer into microsphere Download PDFInfo
- Publication number
- CN101996907A CN101996907A CN 201010276711 CN201010276711A CN101996907A CN 101996907 A CN101996907 A CN 101996907A CN 201010276711 CN201010276711 CN 201010276711 CN 201010276711 A CN201010276711 A CN 201010276711A CN 101996907 A CN101996907 A CN 101996907A
- Authority
- CN
- China
- Prior art keywords
- motion
- ball
- microballoon
- elastomer
- pressed
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 229920001971 elastomer Polymers 0.000 title claims abstract description 45
- 239000000806 elastomer Substances 0.000 title claims abstract description 42
- 239000004005 microsphere Substances 0.000 title abstract 7
- 230000033001 locomotion Effects 0.000 claims abstract description 67
- 230000007246 mechanism Effects 0.000 claims abstract description 50
- 239000004744 fabric Substances 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 7
- 230000001360 synchronised effect Effects 0.000 claims description 4
- 208000027418 Wounds and injury Diseases 0.000 abstract description 2
- 230000006378 damage Effects 0.000 abstract description 2
- 208000014674 injury Diseases 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 4
- 238000001514 detection method Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 230000004807 localization Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 230000007723 transport mechanism Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
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Abstract
The invention relates to a bumping device for pressing a wafer-level elastomer to a microsphere, comprising a stand, a support leg, a meshed plate, a Y-direction motion mechanism, an X-direction motion mechanism, a linear guide rail, a Z-direction motion mechanism, a rotating mechanism, a microsphere feeding mechanism and an elastomer bumping head, wherein the support leg is provided with four corners at the bottom of the stand, the meshed plate is fixed at the middle part of the stand, the Y-direction motion mechanism is arranged at one side of the meshed plate, one end of the X-direction motion mechanism is arranged above the Y-direction motion mechanism, the other end of the X-direction motion mechanism is arranged on the linear guide rail, the linear guide rail is arranged at the other side of the meshed plate, the Z-direction motion mechanism is arranged at the upper part of the X-direction motion mechanism, the rotating mechanism and the microsphere feeding mechanism are fixed on the Z-direction motion mechanism, and an elastomer bumping head is arranged at the lower part of the microsphere feeding mechanism. Compared with the prior art, the invention has the advantages of relatively simple making, greatly-reduced cost, small injury to the microsphere, high bumping success ratio and high microsphere utilization ratio.
Description
Technical field
The present invention relates to a kind of semiconductor packaging device, especially relate to a kind of wafer scale elastomer and be pressed into the microballoon ball-planting device.
Background technology
Wafer scale microballoon ball attachment machine is a kind of high-end semiconductor packaging device, is used for microballoon (microballoon that comprises unlike materials such as tin ball, copper ball and gold goal) precisely is placed into the wafer of having smeared scaling powder, and one of its core technology is exactly to plant the ball mode.
Existing wafer scale to be planted ball equipment and in order realizing microballoon accurately to be implanted wafer, and basic in the world the employing sweeps that ball is planted ball, tool is inhaled the mode that ball is planted ball or sieve ball.
Sweep the ball mode and be and make a swivel head with the silk hairbrush and on web plate, back and forth sweep ball and ball is swept in the web plate hole be implanted on the wafer, this kind mode silk hairbrush consumption is big, the manufacturing process complex steps, need the professional often to change, thereby cost is higher, sweeps also relatively waste of microballoon in the ball process, the situation influence that microballoon splashes occurs easily and produce.
Tool inhale ball be make one with the identical tool of wafer size, make on the tool and need plant the corresponding pin of ball position, utilize vacuum in the feeder channel that shakes, microballoon to be drawn onto on the tool, by the accurate localization system microballoon is implanted wafer again.This kind mode actuating mechanism complexity needs image identification system, Precise Position System, high-performance detection system etc., and quality of hardware is had relatively high expectations, and price is extremely expensive.
Sieve ball mode mechanism is simple, but plant the ball precision not high, plant the not high and easy oxidation of ball efficient, that therefore uses is less.
Summary of the invention
Purpose of the present invention is exactly to provide in order to overcome the defective that above-mentioned prior art exists that a kind of making is simple relatively, cost is lower, plant the high wafer scale elastomer of ball success rate is pressed into the microballoon ball-planting device.
Purpose of the present invention can be achieved through the following technical solutions:
A kind of wafer scale elastomer is pressed into the microballoon ball-planting device, it is characterized in that, this device comprises pallet, leg, web plate, Y is to motion, X is to motion, line slideway, Z is to motion, rotating mechanism, ball mechanism and elastomer are planted bulb, described leg has 4, be located at four jiaos of pallet bottom, described web plate is fixed on the middle part of pallet, described Y is located at a side of web plate to motion, described X is erected at Y on motion to motion one end, the other end is nested on the line slideway, described line slideway is located at the opposite side of web plate, with Y to the motion level, described Z is located at X to motion top to motion, and described rotating mechanism and ball mechanism are fixed in Z on the slide block of motion, and described elastomer is planted the bottom that bulb is located at ball mechanism.
X adopts motor to add ball-screw or synchronous cog belt drive to motion and Z to motion to motion, Y.
Described motor is AC servo motor or stepping motor.
Described rotating mechanism is hollow rotating motor or common electric machine, and hollow rotating motor or common electric machine drive the quill shaft rotation.
Described common electric machine is AC servo motor or stepping motor.
Described ball mechanism comprises the microballoon container and for the bulb road, the described bottom that supplies the bulb road to be located at the microballoon container, the bottom on this confession bulb road connect elastomer and plant bulb.
Described elastomer is planted bulb and is made up of elastomeric body, contiguous block and antistatic cloth, and described antistatic cloth is wrapped in the outside of elastomeric body, and described contiguous block is located at the top of elastomeric body, compresses antistatic cloth.
The material of described elastomeric body is the material with certain expansion performance, comprises sponge or soft rubber.
Described X can do along the Y direction to motion and seesaw, and described Z can do side-to-side movement along directions X to motion, and described ball mechanism and rotating mechanism can move up and down along the Z direction.
Compared with prior art, the present invention has the following advantages:
(1) originally plant the used elastomer of ball mode and plant the bulb material and purchase, make simple relatively easily, cost significantly reduces;
(2) originally planting the ball mode does not need image identification system and high-performance detection system in planting the ball process, inhale ball with tool and plant the ball mode and compare cost and significantly reduce;
(3) to plant bulb little to microballoon injury for elastomer, plants ball success rate height, microballoon utilance height.
Description of drawings
Fig. 1 is a structural representation of the present invention;
Fig. 2 is a plan structure schematic diagram of the present invention.
Among the figure, 1 for rotating mechanism, 8 for ball mechanism, 9 for elastomer plants bulb, 10 for line slideway for web plate, 7 to motion, 5 for leg, 6 to motion, 4 for X to motion, 3 for Z for Y for pallet, 2.
Embodiment
The present invention is described in detail below in conjunction with the drawings and specific embodiments.
Embodiment
A kind of wafer scale elastomer is pressed into the microballoon ball-planting device, its structure is shown in Fig. 1～2, this device comprises pallet 1, Y is to motion 2, Z is to motion 3, X is to motion 4, leg 5, web plate 6, rotating mechanism 7, ball mechanism 8, elastomer is planted bulb 9, line slideway 10, leg 5 has four, be located at four jiaos of pallet 1 bottom, web plate 6 is fixed on the middle part of pallet 1, Y is located at a side of web plate 6 to motion 2, X is erected at Y on motion 2 to motion 4 one ends, the other end is nested on the line slideway 10, line slideway 10 is located at the opposite side of web plate 6, with Y to motion 2 levels, X can do along the Y direction to motion 4 and seesaw, Z is located at X to motion 4 tops to motion 3, can do side-to-side movement along directions X, and rotating mechanism 7 and ball mechanism 8 are fixed in Z on the slide block of motion 3, can move up and down along the Z direction, elastomer is planted the bottom that bulb 9 is located at ball mechanism 8.
In preceding working procedure application finish scaling powder wafer via the wafer transport mechanism deliver to be close to web plate 6 below after, elastomer is planted bulb 9 and to the drive of motion 3 under is moved to lift-launch initial position to motion 4, Y to motion 2 and Z at X, and ball mechanism 8 provides microballoon then.After supplying ball to finish, elastomer is planted bulb 9 and is dropped to loading position, and turns at the drive backspin of rotating mechanism 7.Elastomer plant bulb 9 X to motion 4 and Y under the drive of motion 2, according to the path of prior setting microballoon is pressed on the wafer in web plate 6 holes.
X to motion 4, Y to motion 2 and Z to motion 3, both can adopt motor to add the type of drive of ball-screw, also can adopt motor to add the type of drive of synchronous cog belt; Motor both can adopt AC servo motor, also can adopt stepping motor.To motion 4 and the Y cooperation to motion 2, making elastomer plant bulb 9 can move in the scope of whole web plate 6, and can set moving line in advance so that plant the ball best results in industrial computer or other controllers by X.
Z is equipped with rotating mechanism 7, ball mechanism 8, elastomer and plants mechanisms such as bulb 9 on motion 3, and the parts such as transducer that match with it, because Z is heavier to motion 3 integral body, the motor situation decision Z that needs in actual applications to plant the quality situation of all mechanisms such as bulb 9 and use according to rotating mechanism 7, ball mechanism 8 and elastomer is to motion 3 needs electromagnetic brake mechanism whether.
It is available that rotating mechanism 7 has hollow rotating motor and common electric machine to drive quill shaft rotation dual mode, is used to drive that elastomer is planted the bulb rotation so that to plant the ball effect better.Hollow rotating motor manufacture craft is had relatively high expectations, the price height but volume is exerted oneself for a short time height, take up room little.And use common AC servo motor or stepping motor to drive the mode of quill shaft rotation by modes such as synchronous cog belt or gears, and realize comparatively complexity but cost is lower, easy to maintenance.
Elastomer is planted bulb 9 and is made up of elastomeric body, contiguous block and antistatic cloth, and antistatic cloth wraps in the elastomer outside, compresses via contiguous block, is used for microballoon is pressed into wafer from the web plate hole.Elastomer can be any materials with certain expansion performance such as sponge, soft rubber.Elastomeric expansion performance makes boarded head have the downward pressure of certain necessity to microballoon, boarded head is less to the infringement of microballoon simultaneously, antistatic cloth can be eliminated static between microballoon preventing to plant the generation of situation such as microballoon adhesion in the ball process, and the existence of antistatic cloth has simultaneously also avoided elastomer fines that microballoon and elastomeric direct contact friction institute may cause to wafer generation pollution.The height of elastomer boarded head 9 can be adjusted to improve according to the situation of microballoon and web plate and carry success rate simultaneously.
Claims (8)
1. a wafer scale elastomer is pressed into the microballoon ball-planting device, it is characterized in that, this device comprises pallet, leg, web plate, Y is to motion, X is to motion, line slideway, Z is to motion, rotating mechanism, ball mechanism and elastomer are planted bulb, described leg has 4, be located at four jiaos of pallet bottom, described web plate is fixed on the middle part of pallet, described Y is located at a side of web plate to motion, described X is erected at Y on motion to motion one end, the other end is nested on the line slideway, described line slideway is located at the opposite side of web plate, with Y to the motion level, described Z is located at X to motion top to motion, and described rotating mechanism and ball mechanism are fixed in Z on the slide block of motion, and described elastomer is planted the bottom that bulb is located at ball mechanism.
2. a kind of wafer scale elastomer according to claim 1 is pressed into the microballoon ball-planting device, it is characterized in that, X adopts motor to add ball-screw or synchronous cog belt drive to motion and Z to motion to motion, Y.
3. a kind of wafer scale elastomer according to claim 2 is pressed into the microballoon ball-planting device, it is characterized in that, described motor is AC servo motor or stepping motor.
4. a kind of wafer scale elastomer according to claim 1 is pressed into the microballoon ball-planting device, it is characterized in that, described rotating mechanism is hollow rotating motor or common electric machine, and hollow rotating motor or common electric machine drive the quill shaft rotation.
5. a kind of wafer scale elastomer according to claim 4 is pressed into the microballoon ball-planting device, it is characterized in that, described common electric machine is AC servo motor or stepping motor.
6. a kind of wafer scale elastomer according to claim 1 is pressed into the microballoon ball-planting device, it is characterized in that, described ball mechanism comprises the microballoon container and for the bulb road, the described bottom that supplies the bulb road to be located at the microballoon container, the bottom on this confession bulb road connect elastomer and plant bulb.
7. a kind of wafer scale elastomer according to claim 1 is pressed into the microballoon ball-planting device, it is characterized in that, described elastomer is planted bulb and is made up of elastomeric body, contiguous block and antistatic cloth, described antistatic cloth is wrapped in the outside of elastomeric body, described contiguous block is located at the top of elastomeric body, compresses antistatic cloth.
8. a kind of wafer scale elastomer according to claim 7 is pressed into the microballoon ball-planting device, it is characterized in that the material of described elastomeric body is the material with certain expansion performance, comprises sponge or soft rubber.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102767113A CN101996907B (en) | 2010-09-09 | 2010-09-09 | Bumping device for pressing wafer-level elastomer into microsphere |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102767113A CN101996907B (en) | 2010-09-09 | 2010-09-09 | Bumping device for pressing wafer-level elastomer into microsphere |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101996907A true CN101996907A (en) | 2011-03-30 |
| CN101996907B CN101996907B (en) | 2012-04-18 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010102767113A Active CN101996907B (en) | 2010-09-09 | 2010-09-09 | Bumping device for pressing wafer-level elastomer into microsphere |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101996907B (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103794541A (en) * | 2014-01-15 | 2014-05-14 | 上海微松工业自动化有限公司 | Carrying platform for wafer-level ball mounter |
| CN103871915A (en) * | 2014-03-24 | 2014-06-18 | 上海微松工业自动化有限公司 | Manual BGA ball mounting machine |
| CN103904833A (en) * | 2012-12-28 | 2014-07-02 | 上海微电子装备有限公司 | Magnet array tool device of planar motor and installation method thereof |
| CN104576415A (en) * | 2013-10-09 | 2015-04-29 | 上海微松工业自动化有限公司 | Bumping device with ball grid array structure |
| CN105789095A (en) * | 2016-04-12 | 2016-07-20 | 上海微松工业自动化有限公司 | Automatic ball mounter and ball mounting method |
| CN106112182A (en) * | 2016-07-12 | 2016-11-16 | 上海微松工业自动化有限公司 | A kind of full-automatic ball attachment device and application thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050205995A1 (en) * | 2004-03-18 | 2005-09-22 | Denso Corporation | Wire bonding method and semiconductor device |
| CN101106098B (en) * | 2006-07-12 | 2010-08-25 | 爱立发股份有限公司 | Ball filling device and method |
-
2010
- 2010-09-09 CN CN2010102767113A patent/CN101996907B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050205995A1 (en) * | 2004-03-18 | 2005-09-22 | Denso Corporation | Wire bonding method and semiconductor device |
| CN101106098B (en) * | 2006-07-12 | 2010-08-25 | 爱立发股份有限公司 | Ball filling device and method |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103904833A (en) * | 2012-12-28 | 2014-07-02 | 上海微电子装备有限公司 | Magnet array tool device of planar motor and installation method thereof |
| CN103904833B (en) * | 2012-12-28 | 2016-08-03 | 上海微电子装备有限公司 | Planar motor magnetic array fitting device and installation method thereof |
| CN104576415A (en) * | 2013-10-09 | 2015-04-29 | 上海微松工业自动化有限公司 | Bumping device with ball grid array structure |
| CN103794541A (en) * | 2014-01-15 | 2014-05-14 | 上海微松工业自动化有限公司 | Carrying platform for wafer-level ball mounter |
| CN103871915A (en) * | 2014-03-24 | 2014-06-18 | 上海微松工业自动化有限公司 | Manual BGA ball mounting machine |
| CN103871915B (en) * | 2014-03-24 | 2016-08-17 | 上海微松工业自动化有限公司 | Manually BGA ball attachment machine |
| CN105789095A (en) * | 2016-04-12 | 2016-07-20 | 上海微松工业自动化有限公司 | Automatic ball mounter and ball mounting method |
| CN105789095B (en) * | 2016-04-12 | 2018-06-29 | 上海微松工业自动化有限公司 | A kind of full-automatic ball attachment machine and its ball-establishing method |
| CN106112182A (en) * | 2016-07-12 | 2016-11-16 | 上海微松工业自动化有限公司 | A kind of full-automatic ball attachment device and application thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101996907B (en) | 2012-04-18 |
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| Date | Code | Title | Description |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C35 | Partial or whole invalidation of patent or utility model | ||
| IP01 | Partial invalidation of patent right |
Commission number: 4W101813 Conclusion of examination: The claim No. 201010276711.3 of the patent for invention No. 1-5 is invalid, and the patent right shall remain valid on the basis of claim 6 and 7 of the authorization notice. Decision date of declaring invalidation: 20130531 Decision number of declaring invalidation: 20719 Denomination of invention: Bumping device for pressing wafer-level elastomer into microsphere Granted publication date: 20120418 Patentee: SHANGHAI WEISONG INDUSTRY AUTOMATION Co.,Ltd.|SHANGHAI MICRO ELECTRONICS EQUIPMENT Co.,Ltd. |