CN101995008A - Ceramic radiator with conductive circuit - Google Patents
Ceramic radiator with conductive circuit Download PDFInfo
- Publication number
- CN101995008A CN101995008A CN2009103057621A CN200910305762A CN101995008A CN 101995008 A CN101995008 A CN 101995008A CN 2009103057621 A CN2009103057621 A CN 2009103057621A CN 200910305762 A CN200910305762 A CN 200910305762A CN 101995008 A CN101995008 A CN 101995008A
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- heat radiation
- radiation projection
- radiator
- order wire
- wire circuit
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Abstract
The invention discloses a ceramic radiator with a conductive circuit. The ceramic radiator is used for combining light-emitting diode (LED) electronic components so as to absorb and disperse heat energy quickly produced by the operation of the LED electronic components. The ceramic radiator comprises a radiator entity and a conductive circuit, wherein the radiator entity is prepared by molding ceramic materials into a whole, and is provided with a front surface and a back surface, namely, one body with two surfaces; the conductive circuit is combined on the front surface of the radiator entity; the back surface of the radiator entity is provided with radiator bumps which can increase the heat dissipating area and accelerate the heat dissipating speed; and because the conductive circuit is combined on the front surface of the radiator entity, the LED electronic components can obtain electric power by means of the conductive circuit so as to produce lighting effect.
Description
Technical field
The present invention relates to a kind of ceramic heat sink with order wire circuit.
Background technology
Because the phenomenon of global warming is on the rise, carbon reduction is done one's utmost to appeal in various places, environmental protection becomes the important issue in the daily life, thereby relevant product is also more and more paid attention to, wherein, use general bulb in the daily life, a big emphasis especially, therefore the LED illumination replaces conventional bulb gradually on the market, yet can produce heat during the LED illumination, at present copper that adopt more, aluminium or its alloy are master's radiator, but radiating efficiency is low, therefore cause the temperature in the light fixture too high easily, and huge thick and heavy radiating module Bing can't reach the purpose of saving the cost and the energy simultaneously after being equipped with the increase volume.
Therefore, occurred utilizing the semiconductor thermoelectric cooling package as improving radiating effect, reduce the mode of temperature, see also the novel patent of Fig. 1 and notification number M351993 Taiwan " ceramic semiconductors thermoelectric-cooled LED lamp ", hereinafter to be referred as conventional construction, this conventional construction mainly is light fixture (30), semiconductor thermoelectric cooling package (40), order wire circuit (50) is formed with radiating module (60), wherein, this light fixture (30) is a light emitting diode, this semiconductor thermoelectric cooling package (40) is a ceramic entity, this order wire circuit (50) is on the one side of this pottery entity, directly lay silver-colored circuit, bestow the metallic film of electronickelling and tin again, give LED in order to electric current to be provided, and make LED luminous, this radiating module (60) links on the another side of this pottery entity, it is the aluminum or aluminum alloy material, yet this structure has following shortcoming:
In conventional construction, the heat energy system that light fixture (30) is produced conducts to semiconductor thermoelectric cooling package (40) by order wire circuit (50), and by the common heat radiation of semiconductor thermoelectric cooling package (40) and its radiating module that simultaneously is connected (60), yet, its physics coefficient (thermal conductivity coefficient of the radiating module of aluminum or aluminum alloy material (60), the thermal radiation coefficient, specific heat etc.) inconsistent with semiconductor thermoelectric cooling package (40) Bing of ceramic material, causing between the two, radiating efficiency differs, and the combination of each external member, the centre has the slit, cause the conduction of heat discontinuous, reduce thermal conductance efficient, both influenced heat sinking function, (combination set also needs personnel operation to make structure complicated again, production efficiency differs), and semiconductor thermoelectric cooling package (40) directly absorbs light fixture (30) heat energy, if the heat radiation of the radiating module (60) of outermost end is too slow, to make heat energy be gathered in semiconductor thermoelectric cooling package (40) in a large number, and can't get rid of rapidly.
Summary of the invention
The invention provides a kind of ceramic heat sink with order wire circuit, it has overcome the existing shortcoming of the ceramic heat sink in the background technology.
The technical solution adopted for the present invention to solve the technical problems is:
Ceramic heat sink with order wire circuit, it is used for the electronic building brick in conjunction with LED, and the heat absorption Bing that produces fast when the LED electronic building brick can be operated leaves, and it comprises:
One by the one-body molded radiator entity of making of ceramic material, and this radiator entity has a positive and back side, is provided with the heat radiation projection on this back side, and this heat radiation projection can increase area of dissipation, can accelerate radiating rate; And
One is combined in the order wire circuit in radiator entity front, and this order wire circuit can allow the LED electronic building brick obtain electric power and can produce illuminating effect.
Among one preferred embodiment, this heat radiation projection becomes regular concavo-convex meander-like.
Among one preferred embodiment, this heat radiation projection becomes irregular concavo-convex meander-like.
Among one preferred embodiment, this heat radiation projection is a radiating fin.
Among one preferred embodiment, this heat radiation projection is that integral body is wavy heat radiation projection.
Among one preferred embodiment, the heat radiation projection that this heat radiation projection is a column.
Among one preferred embodiment, the heat radiation projection that this heat radiation projection is the vertebra shape.
Among one preferred embodiment, the heat radiation projection that this heat radiation projection is a hollow form.
The technical program compared with prior art, it has following advantage: the present invention's the direct and one-body molded radiator entity of LED electronic building brick system is connected, see through in the heat energy importing radiator entity of order wire circuit with the generation of LED electronic building brick, high heat conduction high radiation character by ceramic material is left, therefore need not radiating module, so saved the existing deficiency of background technology, Bing has following advantage: 1, the radiating module in the saving background technology, reduce manufacturing cost; 2, the ceramic heat-dissipating assembly only needs disposal molding, and the upright demand of group does not reduce bad that human factor causes, and more meets economic benefit; 3, the problems such as producing slit or unlike material of avoiding dispelling the heat between the external member hinder, and can stablize, bring into play fast heat sinking function; 4, the radiator entity is one-body molded by ceramic material, this ceramic material has high conduction, physical characteristics such as high radiation, the high heat that LED electronic building brick like this is sent can leave rapidly by the media of this ceramic heat sink entity, to keep the LED lamp in constant low temperature standards, and can stablize the lasting running of Bing, and avoid the Yin Gaowen accumulation to produce the phenomenon of unstable even quick damage; 5, the entity front is combined with order wire circuit, can produce illuminating effect and can allow solid its of odd number or a plurality of LED electronic building brick group go up Bing acquisition electric power.Because the back side of radiator entity is provided with the heat radiation projection, this heat radiation projection can increase area of dissipation outwardly, can improve radiating rate.This heat radiation projection is wavy etc., better heat-radiation effect.
Description of drawings
The invention will be further described below in conjunction with drawings and Examples.
Fig. 1 is the stereogram of conventional construction.
Fig. 2 is the present invention's stereogram.
Fig. 3 is the present invention's STRUCTURE DECOMPOSITION figure.
Fig. 4 is the heat radiation projection schematic diagram of column for the present invention.
Fig. 5 is the heat radiation projection schematic diagram of vertebra shape for the present invention.
Fig. 6 is the heat radiation projection schematic diagram of hollow form for the present invention.
Fig. 7 is wavy heat radiation projection schematic diagram for the present invention.
[primary clustering symbol description]
(10) radiator entity
(11) order wire circuit
(12) radiating fin
(121) heat radiation projection
(122) heat radiation projection
(123) heat radiation projection
(124) heat radiation projection
(20) LED electronic building brick
(21) lampshade
(30) light fixture
(40) semiconductor thermoelectric cooling
(50) order wire circuit
(60) radiating module
The specific embodiment
Can further understand feature of the present invention and structure is formed by explanation hereinafter, and the effect that can produce, cooperate graphicly, be described in detail as follows:
See also Fig. 2, shown in Figure 3, the present invention is a kind of ceramic heat sink with order wire circuit, being used for when the LED electronic building brick operated fast, the heat absorption Bing of generation leaves, guarantee that the LED electronic building brick is in a constant low temperature state, continue running and can stablize Bing, the present invention mainly comprises the high conduction of utilizing ceramic material, high radiation physics characteristic, the integrated radiator entity (10) of making, wherein, this radiator entity (10) has a positive and back side, this front directly is combined with order wire circuit (11), directly lay silver-colored circuit, bestow the metallic film of electronickelling and tin again, Bing can allow solid its of odd number or a plurality of LED electronic building brick (20) group go up Bing acquisition electric power and can produce illuminating effect, and this back side then is provided with a plurality of heat radiation projections, among the preferred embodiment, this heat radiation projection is outside outstanding various rules or irregular radiating fin (12), and it is used to increase radiating efficiency.
This LED electronic building brick (20) is that device is connected on the order wire circuit (11), and receive electric power and can produce illuminating effect via order wire circuit (11), in LED electronic building brick (20) outside, then be stamped a lampshade (21) (then not needing the design of this lampshade when the indoor use) by screw closure.
When the luminous Bing of LED electronic building brick (20) produces a large amount of heat energy, via order wire circuit (11) with thermal energy conduction to radiator entity (10), the high heat conduction high radiation character of Bing mat ceramic material is left, thereby can keep LED electronic building brick (20) in constant low temperature standards, and avoid the Yin Gaowen accumulation to produce the phenomenon of unstable even quick damage.
Among another preferred embodiment, it and a last preferred embodiment difference: please refer to Fig. 4, the heat radiation projection of radiator entity (10) is the heat radiation projection (121) of column.
Among another preferred embodiment, it and a last preferred embodiment difference: please refer to Fig. 5, the heat radiation projection of radiator entity (10) is the heat radiation projection (122) of vertebra shape.
Among another preferred embodiment, it and a last preferred embodiment difference: please refer to Fig. 6, the heat radiation projection of radiator entity (10) is the heat radiation projection (123) of hollow form.
Among another preferred embodiment, it and a last preferred embodiment difference: please refer to Fig. 7, the heat radiation projection of radiator entity (10) is that the integral body of flat column is wavy heat radiation projection (124).
From the above: the heat radiation projection of this radiator entity (10) can be rule or irregular concavo-convex meander-like (as the heat radiation projection (123) of the heat radiation projection (122) of the heat radiation projection (121) of column, vertebra shape, hollow form, Pang etc.).
The above, only for preferred embodiment of the present invention, so can not limit scope of the invention process according to this, i.e. the equivalence of doing according to claim of the present invention and description changes and modification, all should still belong in the scope that the present invention contains.
Claims (8)
1. the ceramic heat sink that has order wire circuit, it is used for the electronic building brick in conjunction with LED, and the heat absorption Bing that produces fast when the LED electronic building brick can be operated leaves, and it is characterized in that: it comprises:
One by the one-body molded radiator entity of making of ceramic material, and this radiator entity has a positive and back side, is provided with the heat radiation projection on this back side, and this heat radiation projection can increase area of dissipation, can accelerate radiating rate; And
One is combined in the order wire circuit in radiator entity front, and this order wire circuit can allow the LED electronic building brick obtain electric power and can produce illuminating effect.
2. the ceramic heat sink with order wire circuit according to claim 1 is characterized in that: this heat radiation projection becomes regular concavo-convex meander-like.
3. the ceramic heat sink with order wire circuit according to claim 1 is characterized in that: this heat radiation projection becomes irregular concavo-convex meander-like.
4. the ceramic heat sink with order wire circuit according to claim 1 is characterized in that: this heat radiation projection is a radiating fin.
5. the ceramic heat sink with order wire circuit according to claim 1 is characterized in that: this heat radiation projection is that integral body is wavy heat radiation projection.
6. the ceramic heat sink with order wire circuit according to claim 1 is characterized in that: the heat radiation projection that this heat radiation projection is a column.
7. the ceramic heat sink with order wire circuit according to claim 1 is characterized in that: the heat radiation projection that this heat radiation projection is the vertebra shape.
8. the ceramic heat sink with order wire circuit according to claim 1 is characterized in that: the heat radiation projection that this heat radiation projection is a hollow form.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009103057621A CN101995008A (en) | 2009-08-18 | 2009-08-18 | Ceramic radiator with conductive circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009103057621A CN101995008A (en) | 2009-08-18 | 2009-08-18 | Ceramic radiator with conductive circuit |
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| Publication Number | Publication Date |
|---|---|
| CN101995008A true CN101995008A (en) | 2011-03-30 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009103057621A Pending CN101995008A (en) | 2009-08-18 | 2009-08-18 | Ceramic radiator with conductive circuit |
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| CN (1) | CN101995008A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102519029A (en) * | 2012-01-09 | 2012-06-27 | 丁允一 | Ceramic radiator for high-power light-emitting diode (LED) module or lamp and manufacturing process for ceramic radiator |
| CN102913875A (en) * | 2012-09-24 | 2013-02-06 | 王习之 | Ceramic radiator and LED (light-emitting diode) illuminating lamp adopting same |
| CN103035592A (en) * | 2011-10-09 | 2013-04-10 | 李明烈 | Heat dissipation device transmitting heat by using phonons |
| CN108231714A (en) * | 2016-12-14 | 2018-06-29 | 株洲中车时代电气股份有限公司 | A kind of power module and preparation method thereof |
-
2009
- 2009-08-18 CN CN2009103057621A patent/CN101995008A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103035592A (en) * | 2011-10-09 | 2013-04-10 | 李明烈 | Heat dissipation device transmitting heat by using phonons |
| CN102519029A (en) * | 2012-01-09 | 2012-06-27 | 丁允一 | Ceramic radiator for high-power light-emitting diode (LED) module or lamp and manufacturing process for ceramic radiator |
| CN102519029B (en) * | 2012-01-09 | 2013-03-27 | 丁允一 | Ceramic radiator for high-power light-emitting diode (LED) module or lamp and manufacturing process for ceramic radiator |
| CN102913875A (en) * | 2012-09-24 | 2013-02-06 | 王习之 | Ceramic radiator and LED (light-emitting diode) illuminating lamp adopting same |
| CN108231714A (en) * | 2016-12-14 | 2018-06-29 | 株洲中车时代电气股份有限公司 | A kind of power module and preparation method thereof |
| CN108231714B (en) * | 2016-12-14 | 2019-12-27 | 株洲中车时代电气股份有限公司 | Power module and manufacturing method thereof |
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Application publication date: 20110330 |