CN101992165A - Device for chemical liquid spraying treatment of round lamellar object - Google Patents
Device for chemical liquid spraying treatment of round lamellar object Download PDFInfo
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- CN101992165A CN101992165A CN2009100134931A CN200910013493A CN101992165A CN 101992165 A CN101992165 A CN 101992165A CN 2009100134931 A CN2009100134931 A CN 2009100134931A CN 200910013493 A CN200910013493 A CN 200910013493A CN 101992165 A CN101992165 A CN 101992165A
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Abstract
The invention relates to the field of chemical liquid spraying treatment, in particular to a device for chemical liquid spraying treatment of a silicon wafer or other round lamellar objects, wherein a microelectronic device is further prepared by processing a wafer made of a semiconductor material. The device comprises a processing cavity, a rotating and elevating mechanism and a cover plate, the processing cavity is provided with an outer-layer side wall and an inner-layer side wall which are radially arranged and form a double-layer hollow structure, the inner-layer side wall is formed by stacking two or more layers of collection rings, the collection rings are all concave structures with perforated centers and are provided with drain ports at the bottom, an exhaust seam is arranged between two adjacent connection rings, a round lamellar object is placed on the rotating and elevating mechanism, and the cover plate is in a movable structure. The invention can effectively prevent the problems of acid mist, particle pollution and the like, and when the device is used to spray different chemical liquids, a rotation disc is elevated to different collection rings correspondingly so as to collect different chemical liquids separately and avoid cross pollution.
Description
Technical field
The present invention relates to chemical liquids and spray process field, specifically is that a kind of silicon chip that is used for carries out the device that chemical liquids is sprayed processing with other thin rounded flakes shape object, by the disk of processing semiconductor material, thereby further prepares microelectronic component.
Background technology
At present, comprise that many microelectronic components in the microprocessor, interior existence all are to make having on the material disk of characteristic of semiconductor.These materials with characteristic of semiconductor generally are silicon, germanium and other compound, and wherein most widely used is silicon.From initial silicon chip, could finally make microelectronic component by comprising many treatment steps of wet-chemical such as cleaning, etching.
The multi-disc rotating centrifugal is handled in some step of preparation semiconductor devices widely-used, and the entire process process is to carry out in the rotating centrifugal processing unit.This kind unit generally comprises the rotating disc of reaction cylindrical cavity and clamping multi-disc silicon chip, organizes the sidewall that shower nozzle is positioned at the reaction cylindrical cavity more, and chemical liquids, pure water or gas spray from shower nozzle, are sprayed onto silicon chip surface.Rotating disc clamping silicon chip is rotation at a high speed within a certain period of time, rotates the centrifugal force that is produced at a high speed and makes chemical liquids be evenly distributed on silicon chip surface, or remove chemical liquids by centrifugal force.The rotating centrifugal processing method also is used for handling light shield, the similar device with other of CD.
When being rotated centrifugal treating, the chemical liquids of being sprayed generally all has severe corrosive, and when processing finished, silicon chip surface will have higher cleanliness factor.Therefore, to carry out the design of anticorrosion and anti-particle contamination being rotated centrifugal unit, especially will note the acid mist pollution that is produced in the chemical liquids sprinkling process.Motor, elevating mechanism and other the perishable parts of long-term acid mist pollution in will the corrosion treatment unit, thus inefficacy caused.
Summary of the invention
The object of the present invention is to provide a kind of thin rounded flakes shape object that is used for to carry out the device that chemical liquids is sprayed processing, this device is a single silicon-chip rotating centrifugal processing unit, by exhaust and respective design, can effectively prevent problems such as acid mist and particle contamination, thereby carry out obtaining result preferably when silicon chip is handled.
Technical scheme of the present invention is:
A kind of thin rounded flakes shape object that is used for carries out the device that chemical liquids is sprayed processing, this device is provided with process chamber, rotation and elevating mechanism and cover plate, process chamber has outer sidewall and the internal layer sidewall that radially is provided with, outer sidewall and internal layer sidewall form double-deck hollow structure, internal layer sidewall is piled up by two-layer or two-layer above collection circle and is formed, collect the concave structure that circle is center drilling, collect the circle bottom and have leakage fluid dram, adjacent two layers is collected and is had the exhaust seam between the circle, on rotation and elevating mechanism, place thin rounded flakes shape object, cover plate places the process chamber top, adopts moveable structure.
Described rotation and elevating mechanism are provided with rotating disc, quill shaft motor, turning cylinder, fixed sleeving, rotating shaft electric motor, leading screw and slide block, central authorities at process chamber are provided with rotating disc, thin rounded flakes shape object is positioned on the rotating disc, the quill shaft motor is connected with the rotating disc bottom by turning cylinder, fixed sleeving is enclosed within the turning cylinder outside, the output of rotating shaft electric motor connects leading screw, and slide block is housed on the leading screw, and the quill shaft motor links to each other with the motor leading screw by slide block.
Described leakage fluid dram is connected with discharging tube, has blast pipe on the outer sidewall, and blast pipe is communicated with by the double-deck hollow structure that outer sidewall and internal layer sidewall form with the exhaust seam.
Have at least one blast pipe on the described outer sidewall.
The bottom of described collection circle has at least one leakage fluid dram.
The described thin rounded flakes shape object that is used for carries out the device that chemical liquids is sprayed processing; in process chamber, also be provided with protective casing; protective casing is made by the scalable corrugated material of acid-proof; the protective casing upper and lower end is collected circle with fixed sleeving and bottom respectively and closely is connected; make the process chamber bottom form the structure of sealing, whole rotation and the elevating mechanism protected sleeve pipe of part in process chamber wraps up.
The described thin rounded flakes shape object that is used for carries out the device that chemical liquids is sprayed processing, the gripping body that is used for mobile cover plate is provided with clamper, slide rail, motor, motor output end is connected with an end of clamper by connector, the other end of clamper connects slide rail, and the slide rail that is used for the clamping cover plate is and the corresponding structure of cover plate.
In the described clamper controller is housed, controller control slide rail shrinks the gripping cover plate, and cover plate is put down in the slide rail diastole.
Described cover plate center is provided with the opening that can supply nozzle to pass through.
Advantage of the present invention and beneficial effect are:
1, apparatus of the present invention are to design at having the severe corrosive chemical liquid in the microelectronic component processing procedure, comprise the rotating disc and the motor rotation and lifting mechanism of circular process chamber, clamping silicon chip.Circular process chamber is for radially be two-layer sidewall: internal layer sidewall and outer sidewall axially have two-layer or two-layer above liquid collection and enclose.Radially each layer of internal layer sidewall collected between the circle and had long and narrow slit, and the radial outer sidewall has one or more exhaust ports, is hollow structure between the ectonexine sidewall.There is a rotating disc in central authorities at circular process chamber, and silicon slice placed places on the rotating disc, and the mode of clamping silicon chip can adopt pneumatic mode or mechanical grip.Be rotation and lifting mechanism below rotating disc, this mechanism can make rotating disc rotation oscilaltion simultaneously.In circular process chamber inside, whole elevating mechanism is surrounded by the made sleeve pipe of telescopic anticorrosive, circular process chamber and telescopic tube form the environment of a sealing, thereby the motor in the jacking system etc. can not corroded by the acid mist in the circular process chamber.There is a packaged type cover plate in the top of circular process chamber, opens when picking and placeing silicon chip, closes when handling.
2, when silicon chip rotated at a high speed on rotating disc, chemical liquids was sprayed onto silicon chip surface, and centrifugal force makes chemical liquids in the equally distributed while of silicon chip surface, also it was thrown to from silicon chip surface in the collection circle of internal layer sidewall of circular process chamber.The bottom of collecting circle has 1～10 leakage fluid dram, and there is downward-sloping angle in the lower edge of collection circle and is connected with discharging tube.Being thrown to liquid landing downwards under the gravity effect of collecting circle from silicon chip surface also finally flows out from discharging tube.The exhaust seam is arranged above every layer of collection circle.Because there is negative pressure in the outside of exhaust seam, the acid mist that is produced in the chemical liquids spray process will be deflated seam and absorb.The sidewall of circular process chamber is radially double-deck hollow structure.Have 1～4 blast pipe on the outer sidewall, these several blast pipes finally link to each other with the total air escape pipe of semiconductor processes factory in every way.General semiconductor factory total air escape pipe is to draw various waste gas by negative pressure mode, and each layer collected and had the exhaust seam between the circle on the circular process chamber internal layer sidewall, draws the acid mist that is produced when spraying chemistry.Hollow structure between the ectonexine sidewall also can play the effect of gas-liquid separation.The liquid that is entered by the exhaust seam separates landing with acid mist in hollow layer on a small quantity, discharges by discharging tube at last.
3, the collection circle on the circular process chamber internal layer sidewall of the present invention has sandwich construction at above-below direction, the oscilaltion of rotating disc clamping silicon chip, and the different collection circle of correspondence is avoided the cross pollution of chemical liquids when spraying different chemical liquids.For example: rotating disc is moved on to ground floor collect the circle position, spray chemical liquids to silicon chip surface, centrifugal force is thrown to chemical liquids in the ground floor collection circle and reclaims; Rotating disc is risen to the second layer again and collect the circle position, spray chemical liquids to silicon chip surface, centrifugal force is thrown to chemical liquids in the second layer collection circle and reclaims.Simultaneously, collect the circle position in lower floor and spray the chemical liquids that more easily produces acid mist, collect the circle position when rotating disc rises to the upper strata, rotating disc will shelter from whole lower region, prevents that acid mist is to circular process chamber external diffusion.Since rotating disc with collect circle and have certain slit, a spot of chemical liquids can be put down landing, but the orlop of circular process chamber is an enclosed construction, the chemical liquids that retains can be discharged along the discharging tube of below.
Description of drawings
Fig. 1 is apparatus of the present invention structural representation.
Fig. 2 A-Fig. 2 B is that diverse location sprays chemical liquids work schematic diagram in apparatus of the present invention.Wherein, Fig. 2 A is for spraying chemical liquids A; Fig. 2 B is for spraying chemical liquids B.
Fig. 3 A-Fig. 3 D is apparatus of the present invention upper cover plate opening process schematic diagram.
Among the figure, 1 process chamber; 2 rotation and elevating mechanisms; 3 cover plates; 4 silicon chips; 5 nozzles; 6 chemical liquids nozzles; 11 outer sidewalls; 12 blast pipes; 13 internal layer sidewalls; 14 collect the circle I; 15 collect the circle II; 16 bottoms are collected circle; 17 discharging tube I; 18 discharging tube II; 19 discharging tube III; 20 exhausts seam; 21 rotating discs; 22 quill shaft motors; 23 turning cylinders; 24 rotating shaft electric motors; 25 leading screws; 26 slide blocks; 27 fixed sleevings; 28 protective casings; 29 arrow I; 30 arrow II; 31 zones; 32 arrow III; 33 arrow IV; 34 arrow V; 41 openings; 42 clampers; 43 slide rails; 44 controllers; 45 motors; The A chemical liquids; The B chemical liquids.
The specific embodiment
As shown in Figure 1, whole contrive equipment comprises circular process chamber 1, silicon chip rotation and elevating mechanism 2 and removable cover plate 3, circular process chamber 1 has outer sidewall 11 and the internal layer sidewall 13 that radially is provided with, outer sidewall 11 and internal layer sidewall 13 form double-deck hollow structure, internal layer sidewall is that the liquid that has similar shape more than two-layer or two-layer is collected circle I 14, collecting 16 accumulations of circle II 15 and bottom collection circle forms, collect circle I 14, collect circle II 15 and bottom and collect the concave structure that circle 16 is center drilling, discharging tube I 17, discharging tube II 18 and discharging tube III 19 lay respectively at collects circle I 14, collect circle II 15 and bottom and collect the bottom of circle 16, adjacent two layers is collected and is had exhaust seam 20 between the circle, have blast pipe 12 on the outer sidewall 11, the double-deck hollow structure that the acid mist that each layer exhaust seam is absorbed forms by outer sidewall and internal layer sidewall is at last discharged from blast pipe 12.
Rotation mainly comprises rotating disc 21, quill shaft motor 22, turning cylinder 23, fixed sleeving 27, rotating shaft electric motor 24, leading screw 25 and slide block 26 with elevating mechanism 2, there is a rotating disc 21 in central authorities at circular process chamber, silicon chip 4 is positioned on the rotating disc 21, quill shaft motor 22 is connected with rotating disc 21 bottoms by turning cylinder 23, but turning cylinder 23 driven rotary dish 21 rotations at a high speed.Fixed sleeving 27 is enclosed within turning cylinder 23 outsides, can make turning cylinder 23 keep vertical, make rotating disc maintenance level.The output of rotating shaft electric motor 24 connects leading screw 25, and slide block 26 is housed on the leading screw 25, and quill shaft motor 22 links to each other with leading screw 25 by slide block 26.When rotating shaft electric motor 24 startups, leading screw 25 rotates simultaneously, and leading screw 25 rotations can make slide block 26 move up and down, and slide block and its all attaching parts straight line up and down move, thereby make the rotary system oscilaltion in process chamber 1 that comprises rotating disc 21.
Among the present invention, the size of collecting circle I 14, collecting circle II 15 center drillings is just to be as the criterion (rotating disc 21 with collect circle I 14 and collect slit requirement between the circle II 15 at 0.3～30 millimeter) generally speaking, by rotating disc 21; Bottom is collected the size of circle 16 center drillings, with just by fixed sleeving 27 be as the criterion (generally speaking, fixed sleeving 27 and the bottom slit of collecting circle 16 requires at 0.3～30 millimeter).
Shown in Fig. 1, Fig. 2 A and Fig. 2 B, in circular process chamber 1, also be provided with protective casing 28, protective casing 28 is made by the scalable corrugated material of acid-proof (as poly fourfluoroplastics), and the shape indentation is flexible by the variation realization of zigzag fashion.Protective casing 28 upper and lower ends are collected circle 16 with fixed sleeving 27 and bottom respectively and closely are connected; thereby can make process chamber 1 bottom form the structure of a sealing; whole rotation and the elevating mechanism protected sleeve pipe of part in circular process chamber wraps up; can stretch along the vertical direction simultaneously, effectively protect perishable parts such as turning cylinder and motor.
Shown in Fig. 2 A, when chemical liquids A sprayed, cover plate 3 placed circular process chamber 1 top, and circular process chamber 1 is closed, and entire process chamber 1 forms the system of a sealing, thereby can prevent effectively that acid mist from diffusing out circular process chamber 1.Chemical liquids A is sprayed to silicon chip 4 surfaces from nozzle 5.Rotary centrifugal force makes chemical liquids A evenly distribute at silicon chip surface, and it is got rid of to collecting in the circle II 15, there is downward-sloping angle in the lower edge of collection circle II 15 and links to each other with discharging tube II 18, and gravity effect meeting makes chemical liquids A enter in the discharging tube II 18 along arrow I 29 directions.Have negative pressure owing to collecting circle I 14, collection circle II 15 and bottom collection circle 16 exterior lateral area 31, the acid mist that is produced in the chemical liquids sprinkling process can stitch 20 along arrow II 30 directions from exhaust and enter zone 31, finally from blast pipe 12 discharge process chambers 1.
Shown in Fig. 2 B, when spraying another kind of chemical liquids B, rotating disc rises to collection circle I 14 positions from collecting circle II 15 positions, centrifugal revolving force gets rid of chemical liquids B to collecting in the circle I 14, there is downward-sloping angle in the lower edge of collection circle and links to each other with discharging tube I 17, chemical liquids B is because the effect of gravity enters discharging tube I 17 along arrow III 32 directions, and the acid mist that is produced enters zone 31 along arrow IV 33 directions, finally also discharges process chamber 1 from blast pipe 12.Simultaneously, rotating disc can be collected lower region such as circle 16 and play sealing process collecting circle I 14 positions collecting circle II 15 and bottom, will be enclosed in the lower region spraying extensive chemical liquid A institute issuable acid mist is residual, finally discharge, can upwards not be diffused into other zone from arrow II 30 and arrow V 34 directions.In same process chamber, the layering of chemical liquids A and B is handled can effectively prevent cross pollution.
Among the present invention, cover plate 3 is a kind of moveable structures, the gripping body that is used for mobile cover plate 3 mainly comprises clamper 42, slide rail 43, controller 44, motor 45 etc., motor 45 outputs are connected with an end of clamper 42 by connector, clamper 42 can interiorly be adorned conventional controller 44, the other end of clamper 42 connects slide rail 43, the slide rail 43 that is used for clamping cover plate 3 is and cover plate 3 corresponding structures, shrink gripping cover plate 3 by controller 44 control slide rails 43, cover plate 3 is then put down in slide rail 3 diastoles.In addition, opening 41 is established at cover plate 3 centers, and opening 41 can pass through for nozzle 5 or chemical liquids nozzle 6, enters in the circular process chamber, sprays chemical liquids to thin rounded flakes shape body surface.
The result shows that the present invention can be used for silicon chip and other thin rounded flakes shape object carries out chemical liquids sprinkling processing, and when when silicon chip surface sprays chemical liquids, the centrifugal force that the rotating disc rotation is produced makes soup evenly distribute at silicon chip surface, and gets rid of in the collection circle and add.When spraying different chemical liquids, the rotating disc lifting is to corresponding different collection circle, and different chemical liquids separate collections is avoided cross pollution.
Claims (9)
1. one kind is used for the device that thin rounded flakes shape object carries out chemical liquids sprinkling processing, it is characterized in that, this device is provided with process chamber, rotation and elevating mechanism and cover plate, process chamber has outer sidewall and the internal layer sidewall that radially is provided with, outer sidewall and internal layer sidewall form double-deck hollow structure, internal layer sidewall is piled up by two-layer or two-layer above collection circle and is formed, collect the concave structure that circle is center drilling, collect the circle bottom and have leakage fluid dram, adjacent two layers is collected and is had the exhaust seam between the circle, place thin rounded flakes shape object on rotation and elevating mechanism, cover plate places the process chamber top, adopts moveable structure.
2. carry out the device that chemical liquids is sprayed processing according to the described thin rounded flakes shape object that is used for of claim 1, it is characterized in that, described rotation and elevating mechanism are provided with rotating disc, the quill shaft motor, turning cylinder, fixed sleeving, rotating shaft electric motor, leading screw and slide block, central authorities at process chamber are provided with rotating disc, thin rounded flakes shape object is positioned on the rotating disc, the quill shaft motor is connected with the rotating disc bottom by turning cylinder, fixed sleeving is enclosed within the turning cylinder outside, the output of rotating shaft electric motor connects leading screw, slide block is housed on the leading screw, and the quill shaft motor links to each other with the motor leading screw by slide block.
3. carry out the device that chemical liquids is sprayed processing according to the described thin rounded flakes shape object that is used for of claim 1, it is characterized in that, described leakage fluid dram is connected with discharging tube, have blast pipe on the outer sidewall, blast pipe is communicated with by the double-deck hollow structure that outer sidewall and internal layer sidewall form with the exhaust seam.
4. carry out the device that chemical liquids is sprayed processing according to the described thin rounded flakes shape object that is used for of claim 3, it is characterized in that, have at least one blast pipe on the described outer sidewall.
5. carry out the device that chemical liquids is sprayed processing according to the described thin rounded flakes shape object that is used for of claim 1, it is characterized in that the bottom of described collection circle has at least one leakage fluid dram.
6. carry out the device that chemical liquids is sprayed processing according to the described thin rounded flakes shape object that is used for of claim 1; it is characterized in that; in process chamber, also be provided with protective casing; protective casing is made by the scalable corrugated material of acid-proof; the protective casing upper and lower end is collected circle with fixed sleeving and bottom respectively and closely is connected; make the process chamber bottom form the structure of sealing, whole rotation and the elevating mechanism protected sleeve pipe of part in process chamber wraps up.
7. carry out the device that chemical liquids is sprayed processing according to the described thin rounded flakes shape object that is used for of claim 1, it is characterized in that, the gripping body that is used for mobile cover plate is provided with clamper, slide rail, motor, motor output end is connected with an end of clamper by connector, the other end of clamper connects slide rail, and the slide rail that is used for the clamping cover plate is and the corresponding structure of cover plate.
8. carry out the device that chemical liquids is sprayed processing according to the described thin rounded flakes shape object that is used for of claim 7, it is characterized in that, in the described clamper controller is housed, controller control slide rail shrinks the gripping cover plate, and cover plate is put down in the slide rail diastole.
9. carry out the device that chemical liquids is sprayed processing according to the described thin rounded flakes shape object that is used for of claim 1, it is characterized in that described cover plate center is provided with the opening that can supply nozzle to pass through.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910013493A CN101992165B (en) | 2009-08-27 | 2009-08-27 | Device for chemical liquid spraying treatment of round lamellar object |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910013493A CN101992165B (en) | 2009-08-27 | 2009-08-27 | Device for chemical liquid spraying treatment of round lamellar object |
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| CN101992165A true CN101992165A (en) | 2011-03-30 |
| CN101992165B CN101992165B (en) | 2012-10-24 |
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| CN200910013493A Active CN101992165B (en) | 2009-08-27 | 2009-08-27 | Device for chemical liquid spraying treatment of round lamellar object |
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| CN103084297A (en) * | 2011-10-27 | 2013-05-08 | 沈阳芯源微电子设备有限公司 | Liquid coating apparatus |
| CN104066518A (en) * | 2011-12-16 | 2014-09-24 | Ppg工业俄亥俄公司 | Carrier systems for coating panels |
| CN104607342A (en) * | 2013-11-05 | 2015-05-13 | 沈阳芯源微电子设备有限公司 | Rotary outer ring adhesion protecting device |
| CN105097608A (en) * | 2014-05-22 | 2015-11-25 | 沈阳芯源微电子设备有限公司 | CUP structure preventing high-pressure water mist splashing |
| CN106733462A (en) * | 2016-12-29 | 2017-05-31 | 南京信息职业技术学院 | A kind of device for uniform coating adhesive |
| CN111013879A (en) * | 2020-01-10 | 2020-04-17 | 彭国良 | Coloring equipment for galvanized guardrail |
| CN113634396A (en) * | 2021-08-06 | 2021-11-12 | 浙江炊大王炊具有限公司 | Spraying device of cooker |
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| GB2601472A (en) * | 2020-06-30 | 2022-06-08 | Universal Circuit Board Equipment Co Ltd | Surface treatment device |
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| AT500984B1 (en) * | 2002-06-25 | 2007-05-15 | Sez Ag | DEVICE FOR LIQUID TREATMENT OF DISK OBJECTS |
| JP4441530B2 (en) * | 2003-03-20 | 2010-03-31 | ラム・リサーチ・アクチエンゲゼルシヤフト | Apparatus and method for wet processing of disk-shaped objects |
| US7793610B2 (en) * | 2006-04-18 | 2010-09-14 | Tokyo Electron Limited | Liquid processing apparatus |
| JP2008129378A (en) * | 2006-11-22 | 2008-06-05 | Seiko Epson Corp | Manufacturing method for electro-optical device |
| CN201454758U (en) * | 2009-08-27 | 2010-05-12 | 沈阳芯源微电子设备有限公司 | Device for chemical liquid sprinkling treatment of round lamelliform objects |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103084297A (en) * | 2011-10-27 | 2013-05-08 | 沈阳芯源微电子设备有限公司 | Liquid coating apparatus |
| CN104066518A (en) * | 2011-12-16 | 2014-09-24 | Ppg工业俄亥俄公司 | Carrier systems for coating panels |
| CN104066518B (en) * | 2011-12-16 | 2017-12-05 | Ppg工业俄亥俄公司 | Rack system for coating panel |
| CN104607342A (en) * | 2013-11-05 | 2015-05-13 | 沈阳芯源微电子设备有限公司 | Rotary outer ring adhesion protecting device |
| CN105097608A (en) * | 2014-05-22 | 2015-11-25 | 沈阳芯源微电子设备有限公司 | CUP structure preventing high-pressure water mist splashing |
| CN105097608B (en) * | 2014-05-22 | 2018-04-24 | 沈阳芯源微电子设备有限公司 | A kind of CUP structures for preventing high-pressure water mist splash |
| CN106733462A (en) * | 2016-12-29 | 2017-05-31 | 南京信息职业技术学院 | A kind of device for uniform coating adhesive |
| CN111013879A (en) * | 2020-01-10 | 2020-04-17 | 彭国良 | Coloring equipment for galvanized guardrail |
| WO2022000703A1 (en) * | 2020-06-30 | 2022-01-06 | 东莞宇宙电路板设备有限公司 | Surface treatment device |
| GB2601472A (en) * | 2020-06-30 | 2022-06-08 | Universal Circuit Board Equipment Co Ltd | Surface treatment device |
| CN113634396A (en) * | 2021-08-06 | 2021-11-12 | 浙江炊大王炊具有限公司 | Spraying device of cooker |
| CN113634396B (en) * | 2021-08-06 | 2022-04-19 | 浙江炊大王炊具有限公司 | Spraying device of cooker |
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Address after: 110168 No. 16 Feiyun Road, Hunnan District, Shenyang City, Liaoning Province Patentee after: Shenyang Core Source Microelectronic Equipment Co., Ltd. Address before: 110168 No. 16 Feiyun Road, Hunnan New District, Shenyang City, Liaoning Province Patentee before: Shenyang Siayuan Electronic Equipment Co., Ltd. |