CN101989467B - Radiating module with heat conduction pipe and production method thereof - Google Patents
Radiating module with heat conduction pipe and production method thereof Download PDFInfo
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- CN101989467B CN101989467B CN200910162125.3A CN200910162125A CN101989467B CN 101989467 B CN101989467 B CN 101989467B CN 200910162125 A CN200910162125 A CN 200910162125A CN 101989467 B CN101989467 B CN 101989467B
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- conduction clamping
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Abstract
The invention discloses a radiating device and a production method thereof. The radiating device comprises a heat conduction clamping plate, a heat conduction base plate superimposed with the heat conduction clamping plate, a radiating fin group and a heat conduction pipe. A plurality of channels and partition blocks which are arranged in a staggered manner are formed by the heat conduction clamping plate. The heat conduction base plate forms a plurality of raised strips which are arranged at intervals and positioned on the same plane. The raised strips of the heat conduction base plate are respectively correspondingly wedged into the channels of the heat conduction clamping plate. The radiating fin group comprises a plurality of radiating fins which are arranged and erected on the heat conduction clamping plate and the heat conduction base plate in superimposition at intervals. One part of each radiating fin is clamped between each pair of the adjacent partition block and the raised strip. In addition, the heat conduction pipe is clamped between interfaces of the heat conduction clamping plate and the heat conduction base plate.
Description
Technical field
The present invention relates to a kind of heat abstractor and method for making thereof, relate in particular to and only need to use impact style one radiating fin assembling can be set to heat abstractor and the method for making of a heat-conducting plate.
Background technology
General heat abstractor is mainly to consist of a radiating fin group and a heat-conducting plate combined together.Traditionally, the assembling of this heat abstractor be mainly utilize tin cream or heat-conducting glue by this radiating fin bond pads or gluing to this heat-conducting plate.With regard to " soldering ", this radiating fin group and heat-conducting plate need pass through surface treatment (such as: electroplate), the complicated processing procedure such as solder paste coating and reflow just can complete, and causes cost high.On the other hand, if adopt the mode of " gluing ", this radiating fin group and base plate are only by heat-conducting glue bonding, therefore both less stable in combination, radiating fin group has pine, de-anxiety.In addition,, because the heat-conduction coefficient of heat-conducting glue is starkly lower than radiating fin group or the heat-conducting plate of metal material, make the radiating efficiency of whole heat abstractor seriously limited.
The novel M337724 case of TaiWan, China discloses a Sandwich type radiating module, it comprises that a copper pedestal, plural number are located at metal fins on this copper pedestal, are connected to the sandwich assembly of a bronze medal between those metal fins, and is connected to the bronze medal heat pipe between this copper pedestal and the sandwich assembly of this copper.In addition, this Sandwich type radiating module more comprises a locked assembly, be located between those metal fins and the sandwich assembly of this copper, and so that those metal fins and the sandwich assembly of this copper are locked together, therefore suitable time-consuming taking a lot of work.Again, only according to this locked assembly, be still difficult to force the sandwich assembly of those copper closely to clamp those heat radiator, still need and use the mode of welding the sandwich assembly of this copper could be connected between those metal fins.In other words, the assembling mode of this Sandwich type radiating module need to screw togather packing and coordinate soldering operation, and quite time-consuming taking a lot of work, urgently improves.
Summary of the invention
The invention provides a kind of heat abstractor and manufacture method thereof of using impact style can complete assembling of only needing, this heat abstractor not only has good heat radiating efficiency, simultaneously stabilized structure.
In details of the words, this heat abstractor comprises heat conduction clamping plate, a heat conduction
baseplate, a heat pipe and a radiating fin group.These heat conduction clamping plate and this heat conduction
baseplate is mutually to coincide, and this heat pipe is to be folded between these heat conduction clamping plate and the interface of this heat-conducting substrate.These heat conduction clamping plate are formed with plural staggered passage and spacing block.This heat-conducting substrate is formed with plural spaced raised line at the same face.When these heat conduction clamping plate and this heat conduction clamping plate are while mutually coinciding, those raised lines of this heat-conducting substrate are those passages of wedging accordingly respectively these heat conduction clamping plate.In addition, this radiating fin group has complex cooling fin, is erected to spaced arrangement on these heat conduction clamping plate and heat-conducting substrate that coincide mutually.The part system of each heat radiator is clamped between every pair of adjacent spacing block and raised line.
On the other hand, the method for this heat abstractor of manufacture of the present invention comprises the following steps:
One heat conduction clamping plate, a heat-conducting substrate, a heat pipe and a radiating fin group are provided, and these heat conduction clamping plate are formed with plural staggered passage and spacing block; This heat-conducting substrate is formed with plural spaced raised line at the same face, and the passage of these heat conduction clamping plate be able to be wedged in the size of those raised lines and position; And this radiating fin group has complex cooling fin;
These heat conduction clamping plate repeatedly to this radiating fin group, and are made to reclining accordingly two adjacent heat radiator of this radiating fin group of the two side of each spacing block of these heat conduction clamping plate;
This heat-conducting substrate is changed to these heat conduction clamping plate, and make each raised line on this heat-conducting substrate face toward respectively corresponding passage on these heat conduction clamping plate;
This heat pipe is put between this heat-conducting substrate and this heat conduction clamping plate; And
Carry out a punching press program, this heat-conducting substrate, this heat pipe and these heat conduction clamping plate ginseng person are closely overlapped together, and each heat radiator each some of this radiating fin group is clamped between every a pair of staggered spacing block and raised line.
So, the present invention completes these heat conduction clamping plate, heat-conducting substrate by a punching press program, radiating tube and radiating fin group form the task of a heat abstractor, and complicated scolding tin or screw togather packing operation in need not prior art, have save time, the advantage of saving of labor and low manufacturing cost.
As for other summary of the invention of the present invention and more detailed technology and effect explanation, by the explanation disclosing subsequently.
Accompanying drawing explanation
First Fig. 1 is the three-dimensional exploded view of a preferred embodiment of heat abstractor of the present invention.
Second Fig. 2 is that this heat abstractor is used in the schematic diagram on a circuit board.
The 3rd Fig. 3 is a sectional view of Fig. 2.
The 4th Fig. 4, shows the local amplification profile of the heat radiation clamping plate of this heat abstractor.
The 5th Fig. 5, shows the local amplification profile of the heat-radiating substrate of this heat abstractor.
Fig. 6 (A)～Fig. 6 (F), is the processing procedure sectional view that shows the method for making of this heat abstractor, and it is the cross section of Fig. 1 A-A along the line.
Embodiment
Fig. 1 is a preferred embodiment that shows heat abstractor of the present invention, wherein points out that this heat abstractor 100 comprises a heat-conducting substrate 1, a heat pipe (heat pipe) 2, one heat conduction clamping plate 3 and a radiating fin group 4.
As shown in Figure 1, the end face of this heat-conducting substrate 1 is formed with plural spaced raised line 10, and defines a long ditch 12 for the bottom setting of this heat pipe 2 along its length direction.These heat conduction clamping plate 3 are formed with plural staggered passage 30 and spacing block 31, and the bottom surface of these heat conduction clamping plate 3 defines a long ditch 32 for the top setting of this heat pipe 2 along its length direction.So, this heat pipe 2 can be folded between this heat-conducting substrate 1 and the interface of these heat conduction clamping plate 3.In addition, those passages 30 of these heat conduction clamping plate 3 are top, two sides, the end of running through these heat conduction clamping plate 3, supply those raised lines 10 of this heat-conducting substrate 1 to wear.This radiating fin group 4 has complex cooling fin 41, is spaced and is erected on this heat-conducting substrate 1 and these heat conduction clamping plate 3 coinciding mutually.
Above-mentioned each member can be selected identical or different Heat Conduction Material, for example aluminium or copper.Be preferably whole use same materials, aluminium for example, to facilitate making.In addition, this heat-conducting substrate 1 can arbitrarily utilize to electroplate with these heat conduction clamping plate 3 and form different colours, or utilizes printing to form different colours and/or pattern.
Fig. 2 and Fig. 3 show that this heat abstractor 100 is used in situation on a circuit board 5.This heat abstractor 100 for an electronic package 4 on this circuit board 5 (for example: a central processing unit) heat radiation is mainly.Wherein, the framework that the surrounding of this radiating fin group 3 is comprised of a backboard 6 and two baffle plates 7 in addition.
Consult again Fig. 3, when this heat-conducting substrate 1 coincides mutually with these heat conduction clamping plate 3, those raised lines 10 of this heat-conducting substrate 1 are to wedge accordingly respectively in those passages 30 of these heat conduction clamping plate 3.Again, those heat radiator 41 of this radiating fin group 4 are to be erected on this heat-conducting substrate coinciding mutually 1 and heat conduction clamping plate 3 with being spaced, and a part for each heat radiator 41 is to be clamped between every pair of adjacent raised line 10 and spacing block 31.So, when this electronic package 4 on this circuit board 5 produces used heat because of running, this used heat can pass to raised line 10 on it and the spacing block 31 on this heat conduction clamping plate 3 via the bottom surface of this heat-conducting substrate 1, make to be sandwiched in each heat radiator 41 of 31 of every a pair of raised line 10 and spacing blocks, can both will to raised line 10 and this used heat of spacing block 31, pass from each soon.Because every a pair of raised line 10 is all to contact in large-area mode with spacing block 31 and those nipped heat radiator 41, so heat abstractor of the present invention has splendid radiating efficiency and structure is quite firm.
In addition, the bottom surface of each spacing block 31 of these heat conduction clamping plate 3 is to abut on the end face of this heat-conducting substrate 1, and the top of each spacing block 31 is formed with a v-depression 311, and its degree of depth approaches the bottom of this spacing block 31.In fact, as shown in Figure 4, these heat conduction clamping plate 3 are when not yet repeatedly to this heat-conducting substrate 1, and the top of each spacing block 31 is to form two branches 310 that have jag and extend out.So, after these heat conduction clamping plate 3 coincide mutually with this heat-conducting substrate 1, inwardly extruding of ，Gai Liang branch 310 as shown in Figure 3, make each heat radiator 41 more can be urgent with raised line 10 by the branch 310 of its both sides, wedge securely by this between paired branch 310 and raised line 10.
Consult Fig. 3 and Fig. 5, for convenience of those raised lines 10 of this heat-conducting substrate 1, can wedge accordingly respectively in those passages 30 of these heat conduction clamping plate 3, the top of each raised line 10 of this heat-conducting substrate 1 is formed with lead angle 101 (chamfer).Preferably, the width of each raised line 10 of this heat-conducting substrate 1 is small size convergent from bottom toward top, as shown in Figure 5.So, when this heat conduction clamping plate 3 and this heat-conducting substrate 1 coincide mutually by punching press, those raised lines 10 closely wedge in those passages 30.
Fig. 6 (A)～Fig. 6 (F) shows a kind of method of manufacturing this heat abstractor, and it comprises the following steps.First, as shown in Fig. 6 (A) by this radiating fin group
4 are erected on a tool 8, and wherein those heat radiator 41 are that paired status is in the both sides of each supporting pillar 80 of this tool 8.Secondly, as shown in Fig. 6 (B), these heat conduction clamping plate 3 are upside down in this radiating fin group 4, make reclining accordingly two adjacent heat radiator 41 of this radiating fin group 4 of the two side of each spacing block 31 of these heat conduction clamping plate 3.In other words, those heat radiator 41 of this radiating fin group 4 are to abut in couples on the two side of each spacing block 31.Again, those spacing blocks 31 of these heat conduction clamping plate 3 are supported by the supporting pillar 80 of this tool 8.As shown in Fig. 6 (B), those supporting pillars 80 just push up respectively the end between two branches 310 of each spacing block 31 accordingly.
Then, as shown in Fig. 6 (C), this heat pipe 2 is placed in the long ditch 32 of these heat conduction clamping plate 3.Subsequently, as shown in Fig. 6 (D), this heat-conducting substrate 1 is inverted and is repeatedly placed on these heat conduction clamping plate 3 and this heat pipe 2, and make each raised line 10 of this heat-conducting substrate 1 respectively facing to corresponding passage 30 on these heat conduction clamping plate 3.Now, this heat pipe 2 is just contained between the long ditch 31 of this heat-conducting substrate 1 and the long ditch 32 of these heat conduction clamping plate 3.And then, with press, carry out a punching press program, this heat-conducting substrate 1, this heat pipe 2 and these heat conduction clamping plate 3 threes are closely coincided together, as shown in Fig. 6 (E).Thus, each heat radiator 41 each some meeting of this radiating fin group are closely clipped between every a pair of staggered spacing block 31 and raised line 10.Finally, remove this tool 8 and can obtain the heat abstractor of the present invention as shown in Fig. 6 (F).
As mentioned above, because this heat-conducting substrate 1, these heat conduction clamping plate 3 and this radiating fin group 4 have respectively above-mentioned structure, so can use press fast they to be formed to a complete heat abstractor as shown in Fig. 6 (D)～Fig. 6 (E).Compared to prior art, the manufacture process of heat abstractor of the present invention, does not need welding, does not need to screw togather time and labour saving and have the advantage of lower manufacturing cost yet.More particularly, two relatively short sides due to the top of each raised line 10 on this heat-conducting substrate 1 are to be formed with as illustrated in fig. 5 lead angle 101.So, can make those raised lines 10 in above-mentioned punching course, can wedge more swimmingly in the passage 30 of these heat conduction clamping plate 3.In addition, due to the special construction at those spacing block 31 tops, make in the punching course of wedged those passages 30 of those raised lines 10 difference, two branches 310 of each spacing block 31 can take advantage of a situation and inwardly be squeezed directly by corresponding raised line 10, reach closely sealed order ground.
In sum, because this heat-conducting substrate 1 and this heat conduction clamping plate 3 have respectively structure as above, so both not only can combine this heat-conducting substrate 1 and this heat conduction clamping plate 3 swimmingly, and can eliminate the tolerance that they produce on making, both finally can closely coincide together mutually to make this heat-conducting substrate 1 and this heat conduction clamping plate 3, and each heat radiator 30 can closely be clamped with spacing block 31 by every a pair of raised line 10.
In any case anyone can obtain enough instructions from the explanation of above-mentioned example, and according to and understand content of the present invention and be really different from prior art, and there is the practicality in industry, and creative enough.Be that the present invention has really met patent requirement, now file an application in accordance with the law.
Claims (7)
1. a heat abstractor, is characterized in that comprising:
One heat conduction clamping plate, are formed with plural staggered passage and spacing block;
One heat-conducting substrate, coincides mutually with described heat conduction clamping plate, and is formed with plural spaced raised line at the same face; Described raised line is wedged respectively the described passage of described heat conduction clamping plate accordingly;
One radiating fin group, has complex cooling fin, be spaced and be erected on the described heat conduction clamping plate and heat-conducting substrate that coincide mutually, and a part for each heat radiator is to be clamped between every pair of adjacent spacing block and raised line; And
One heat pipe, is folded between described heat conduction clamping plate and the interface of described heat-conducting substrate;
Wherein, the bottom surface of each spacing block of described heat conduction clamping plate is to abut on the end face of described heat-conducting substrate, and the end face of each spacing block is formed with a v-depression, its degree of depth approaches the bottom of described spacing block, two branches that have jag and extend out are formed on the top of described each spacing block, when described heat conduction clamping plate and described heat-conducting substrate coincide mutually, described two branches inwardly push, and make described each heat radiator urgent by the described branch of its both sides and described raised line.
2. according to heat abstractor claimed in claim 1, the top that it is characterized in that each raised line of described heat-conducting substrate is to be formed with lead angle.
3. according to heat abstractor claimed in claim 2, the width of each raised line that it is characterized in that described heat-conducting substrate is small size convergent from bottom toward top.
4. a method for making for heat abstractor, is characterized in that comprising the following steps:
One heat conduction clamping plate, a heat-conducting substrate, a heat pipe and a radiating fin group are provided, and described heat conduction clamping plate are formed with plural staggered passage and spacing block; Described heat-conducting substrate is formed with plural spaced raised line at the same face, and the passage of these heat conduction clamping plate be able to be wedged in the size of described raised line and position; And described radiating fin group has complex cooling fin;
Described heat conduction clamping plate repeatedly to described radiating fin group, and are made to reclining accordingly two adjacent heat radiator of described radiating fin group of the two side of each spacing block of described heat conduction clamping plate;
Described heat-conducting substrate is changed to described heat conduction clamping plate, and make each raised line on described heat-conducting substrate face toward respectively corresponding passage on described heat conduction clamping plate;
Described heat pipe is put between described heat-conducting substrate and described heat conduction clamping plate;
Two branches that have jag and extend out are formed on the top at each spacing block of described heat conduction clamping plate; And
Carry out a punching press program, described heat-conducting substrate, described heat pipe and described heat conduction clamping plate three are closely overlapped together, described two branches are inwardly pushed, described each heat radiator is urgent by the described branch of its both sides and described raised line, and each heat radiator of described radiating fin group is wedged between staggered in pairs described branch and described raised line securely.
5. according to the method for making of heat abstractor claimed in claim 4, it is characterized in that described punching press program comprises provides a tool, the one side of described tool is for withstanding the described heat radiator of described radiating fin group, and the described face of described tool is formed with plural spaced support piece, each supports piece contact each spacing block of described heat conduction clamping plate.
6. according to the method for making of the heat abstractor described in claim 4 or 5, it is characterized in that being included in that to make the top of each raised line of described heat-conducting substrate before punching press program be to be formed with lead angle.
7. according to the method for making of heat abstractor claimed in claim 6, it is characterized in that being included in that to make the width of each raised line of described heat-conducting substrate before punching press program be small size convergent from bottom toward top.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910162125.3A CN101989467B (en) | 2009-08-04 | 2009-08-04 | Radiating module with heat conduction pipe and production method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910162125.3A CN101989467B (en) | 2009-08-04 | 2009-08-04 | Radiating module with heat conduction pipe and production method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101989467A CN101989467A (en) | 2011-03-23 |
| CN101989467B true CN101989467B (en) | 2014-02-26 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN200910162125.3A Active CN101989467B (en) | 2009-08-04 | 2009-08-04 | Radiating module with heat conduction pipe and production method thereof |
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Families Citing this family (1)
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| CN104128530B (en) * | 2012-11-22 | 2015-11-18 | 江苏理工学院 | The method of work of evaporator fin automatic charging slice arranging apparatus |
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|---|---|---|---|---|
| CN2349605Y (en) * | 1998-05-19 | 1999-11-17 | 奇鋐股份有限公司 | Improved radiator snap fastener |
| CN2582047Y (en) * | 2002-10-23 | 2003-10-22 | 鸿富锦精密工业（深圳）有限公司 | Radiator device combination |
| CN2615861Y (en) * | 2003-04-08 | 2004-05-12 | 奇鋐科技股份有限公司 | Support mechanism of CPU radiator |
| TWM337724U (en) * | 2008-02-13 | 2008-08-01 | Giga Byte Tech Co Ltd | Heat-dissipation module |
| CN201115247Y (en) * | 2007-08-28 | 2008-09-10 | 陈世明 | Improved pressing tight structure for heat radiation device including heat conductive tube |
| CN101829741A (en) * | 2009-03-09 | 2010-09-15 | 技嘉科技股份有限公司 | Method for manufacturing heat-dissipating device |
-
2009
- 2009-08-04 CN CN200910162125.3A patent/CN101989467B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2349605Y (en) * | 1998-05-19 | 1999-11-17 | 奇鋐股份有限公司 | Improved radiator snap fastener |
| CN2582047Y (en) * | 2002-10-23 | 2003-10-22 | 鸿富锦精密工业（深圳）有限公司 | Radiator device combination |
| CN2615861Y (en) * | 2003-04-08 | 2004-05-12 | 奇鋐科技股份有限公司 | Support mechanism of CPU radiator |
| CN201115247Y (en) * | 2007-08-28 | 2008-09-10 | 陈世明 | Improved pressing tight structure for heat radiation device including heat conductive tube |
| TWM337724U (en) * | 2008-02-13 | 2008-08-01 | Giga Byte Tech Co Ltd | Heat-dissipation module |
| CN101829741A (en) * | 2009-03-09 | 2010-09-15 | 技嘉科技股份有限公司 | Method for manufacturing heat-dissipating device |
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| Publication number | Publication date |
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| CN101989467A (en) | 2011-03-23 |
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