M337724 八、新型說明： 【新型所屬之技術領域】 本創作是有關於-種以式散_組，特別關於 種可增進熱離散效果之夾心式散熱模組。 【先前技術】 一般來說，習知之被動式散熱模組通常是利用其良好的 導熱係數及足夠的散熱面積來達成降低一熱源之溫度的效 ►果。然而，基於製造成本的考量，習知之被動式散熱模組大 多是由導熱係數不同之兩種金屬結合而成，因而會使得散熱 效果降低。 請參閱第1圖，一種習知之被動式散熱模組丨主要包括 有一銅底座11及複數個鋁鰭片12。銅底座u大致上具有 398w/mk至402w/mk的高導熱係數，而複數個鋁鰭片12是 a又置於銅底座η之上。更詳細的來說，每一個鋁鰭片a皆 具有一 L形接腳12a，而每一個鋁鰭片12乃是藉由豆l二 _腳12a來焊接於銅底座11。 八 ’ 當以被動式散熱模組丨進行散熱應用時，| 數之銅底座η可與—熱源（未顯示，例如，_中2;^哭熱= 合。熱源所產生之熱量首先會經由銅底座U傳導至 鰭片12，然後再經由複數個鋁鰭片12散逸至大氣之、呂 如上所述，雖然被動式散熱模組1具有加工制w 低材料成本的優點γ Ik間單及 人點，但其亦具有相當多的缺點。 由於I呂鰭片12禮3祐丄4 灵具體而吕， 僅疋猎由其L形接腳12a之一表面雄、击拉 底座11，故叙链μ t 向采連接於銅 故鋁鳍片12與銅底座u之間的有效 f 很小，相使得熱源之_散佳n面積會 1 由於鋁鰭片 5 M337724 12僅是藉由其l形接腳12a來焊接於鋼底幻 式散熱模組1之結構穩固性會不足也、、、文整個被動 f;?受到外力綱’其往往㈣折it脫當 請參閱第2圖，另-㈣知之被動式 括有-銅底座21及複數個紹鰭片22。銅底座21大致：：包 有398w/mk至4〇2w/mk的高導熱係數，而 亦具 是散合於銅底座21。 銘鰭片22 同樣地，當以被動式散熱· 2進行散熱應㈣ ►高導熱係數之銅底座21可與一熱源（未顯示，例如，一 ς有 處理器）貼合。熱源所產生之熱量首先會經由銅底ϋ = 至複數個鋁鰭片22,然後再經由複數個鋁鰭片22散逸至= 氣之中。 大 相較於上述之被動式散熱模組丨，被動式散熱模組2之鋁 鰭片22與銅底座21之間的有效熱傳導面積已增大，因而 提供相對較佳的熱離散效果。然而，被動式散熱模組2亦1 有結構穩固性不足的缺點。再者，由於銅底座21之材料價^各 昂貴，故其用來與鋁鰭片22嵌合而被挖除之部份材料會形同 浪費。同時，挖除部份銅底座21之加工過程還會增加製造成 本。此外，由於鋁鰭片22嵌合於銅底座21之深度有其限制 性，故鋁鰭片22與銅底座21之間的有效熱傳導面積會受到 一定的限制，因而限制了被動式散熱模組2所能提供之熱離 散效果。 有鑑於此、，本創作之目的是要提供一種夾心式散熱模 組，其可大幅增加有效熱傳導面積，以達成增進的熱離散效 〇 果。 6 M337724 【新型内容】 本創作基本上採用如下所詳述之特徵以為了要解決上述 之問題。也就是說，本創作包括一銅底座；複數個金屬鰭片， 設置於該銅底座之上；以及一銅夾心元件，連接於該銅底座， 並且抵接於該等金屬鰭片之間。 同時，根據本創作之夾心式散熱模組，其更包括一銅熱 導管，係連接於該銅底座與該銅夾心元件之間，並且傣被該 春銅夾心元件所包覆。 又在本創作中，夾心式散熱模組更包括一鎖固元件，係 鎖固於該等金屬鰭片與該銅夾心元件之間。 »· · : 又在本創作中，該銅夾心元件係以焊接之方式抵接於該 等金屬鰭片之間。 為使本創作之上述目的、特徵和優點能更明顯易懂，下 文特舉較佳實施例並配合所附圖式做詳細說明。M337724 VIII. New description: [New technical field] This creation is about the type of scatter group, especially for the sandwich heat dissipation module which can improve the thermal dispersion effect. [Prior Art] In general, the conventional passive heat dissipation module generally uses its good thermal conductivity and sufficient heat dissipation area to achieve the effect of lowering the temperature of a heat source. However, based on manufacturing cost considerations, conventional passive heat dissipation modules are mostly composed of two metals having different thermal conductivity, which reduces the heat dissipation effect. Referring to FIG. 1, a conventional passive heat dissipation module mainly includes a copper base 11 and a plurality of aluminum fins 12. The copper base u has a high thermal conductivity of approximately 398 w/mk to 402 w/mk, and a plurality of aluminum fins 12 are a placed on top of the copper base η. In more detail, each of the aluminum fins a has an L-shaped pin 12a, and each of the aluminum fins 12 is soldered to the copper base 11 by the bean 1-2 leg 12a.八' When using a passive cooling module for heat dissipation applications, the number of copper bases η can be combined with a heat source (not shown, for example, _中2;^哭热=合. The heat generated by the heat source will first pass through the copper base. U is conducted to the fins 12 and then dissipated to the atmosphere via a plurality of aluminum fins 12, as described above, although the passive heat dissipation module 1 has the advantage of processing a low material cost, γ Ik, and a single point, but It also has quite a few disadvantages. Because I Lu fins 12 rituals 3 丄 丄 4 spirits specific and Lu, only hunts the surface of one of its L-shaped pins 12a male, striking the base 11, so the chain μ t The effective f between the copper aluminum fins 12 and the copper base u is small, so that the heat source has a good n area. Since the aluminum fins 5 M337724 12 are only by the l-shaped pins 12a. The structural stability of the illusion heat-dissipating module 1 welded to the steel bottom will be insufficient, and the whole passive f; the external force will be subjected to the external force's often (four) folds. Please refer to Figure 2, and - (4) Known passive - a copper base 21 and a plurality of sliding fins 22. The copper base 21 is substantially: a high thermal conductivity system comprising 398 w/mk to 4 〇 2 w/mk Also, it is loosely bonded to the copper base 21. Ming Foil 22 Similarly, when passive heat dissipation is used for heat dissipation (2) ► The high thermal conductivity copper base 21 can be combined with a heat source (not shown, for example, The processor generates a heat. The heat generated by the heat source first passes through the copper ϋ = to a plurality of aluminum fins 22, and then passes through a plurality of aluminum fins 22 to the air. The phase is more passive than the passive heat dissipation described above. The effective heat conduction area between the aluminum fins 22 and the copper base 21 of the passive heat dissipation module 2 has been increased, thereby providing a relatively better thermal dispersion effect. However, the passive heat dissipation module 2 is also structurally stable. In addition, since the material price of the copper base 21 is expensive, some of the materials used for fitting with the aluminum fins 22 to be excavated are wasteful. At the same time, part of the copper is removed. The manufacturing process of the base 21 also increases the manufacturing cost. In addition, since the depth of the aluminum fin 22 is fitted to the copper base 21, the effective heat conduction area between the aluminum fin 22 and the copper base 21 is limited. Limit, thus limiting passive cooling The thermal dispersion effect that module 2 can provide. In view of this, the purpose of this creation is to provide a sandwich heat dissipation module that can greatly increase the effective heat conduction area to achieve an improved thermal dispersion effect. 6 M337724 [New content] This creation basically adopts the features detailed as follows to solve the above problems. That is, the creation includes a copper base; a plurality of metal fins are disposed on the copper base; and a a copper sandwich component is coupled to the copper base and abuts between the metal fins. Meanwhile, the sandwich heat dissipation module of the present invention further includes a copper heat pipe connected to the copper base and the Between the copper sandwich elements, and the crucible is covered by the spring copper sandwich component. In the present invention, the sandwich heat dissipation module further includes a locking component that is locked between the metal fins and the copper sandwich component. »· · : Also in this creation, the copper sandwich component abuts between the metal fins by soldering. The above described objects, features, and advantages of the present invention will become more apparent from the written description.
【實施方式】 茲配合圖式說明本創作之較佳實施例。 請參閱第3圖及第4圖，本實施例之夾心式散熱模組100 主要包括有一銅底座110、複數個金屬鰭片120、一銅夾心元 件130、一銅熱導管140及兩鎖固元件150。） 複數個金屬鰭片120是設置於銅底座110之上。在此， 金屬鰭片120可以是由鋁所製成。 銅夾心元件130是連接於銅底座110,並且銅夾心元件 130是抵接於複數個金屬鰭片120之間。 銅熱導管140是連接於銅底座110與銅夾心元件130之 7 M337724 間，並且銅熱導管140是被銅夾心元件130所包覆。 兩鎖固元件150是分別鎖固於複數個金屬鰭片120與銅 夾心元件130之間。換句話說，複數個金屬鰭片120與銅夾 心元件130可以藉由兩鎖固元件150而緊密地被鎖固在一 起。此外，兩鎖固元件150可以是螺栓的形式。 當以夾心式散熱模組100進行散熱應用時，銅底座110 -可與一熱源（未顯示，例如，一中央處理器）貼合。熱源所產 生之熱量首先會經由銅底座110傳導至銅夾心元件130及銅 熱導管140，然後再經由銅夾心元件130傳導至複數個金屬 鲁鰭片120。接著，傳導至金屬鰭片120之熱量會散逸至大氣 之中。 由於銅底座110及銅夾心元件130大致上具有398w/mk 至402w/mk的高導熱係數，而銅熱導管140大致上具有 40000w/mk至50000w/mk的超高導熱係數，並且銅夾心元件 130是抵接於複數個金屬鰭片120之間，故金屬鰭片120與 銅夾心元件130之間的有效熱傳導面積會大幅增加，因而使 得熱源之熱離散效果被大幅提升。換句話說，來自於熱源之 0熱量會因金屬鰭片120與銅夾心元件130之間的有效熱傳導 面積大幅增加而迅速地分散至金屬鰭片120之上，進而迅速 地散逸至大氣之中。 此外，如第4圖所示，由於銅夾心元件130是抵接於複 數個金屬鰭片120之間，再加上複數個金屬鰭片120與銅夾 心元件130是藉由兩鎖固元件150而緊密地被鎖固在一起， 故整個夾心式散熱模組100之結構穩固性會大幅提升。 此外，值得注意的是，雖然複數個金屬鰭片120與銅夾 心元件130是藉由兩鎖固元件150而緊密地被鎖固在一起， 8 M337724 但銅夾心元件130還可進一步地以焊接之方式抵接於複數個 金屬鰭片120之間，以更加提升整個夾心式散熱模組100之 結構穩固性。 此外，夾心式散熱模組100並不侷限於具有兩鎖固元件 150。換句話說，夾心式散熱模組100亦可省略兩鎖固元件 150之配置，而僅利用焊接之方式來使得銅夾心元件130抵 •接於複數個金屬鰭片120之間，如此即可使得夾心式散熱模 組100之製造成本被降低。 雖然本創作已以較佳實施例揭露於上，然其並非甩以限 ❿定本創作丨任何熟習此項技藝者，在不脫離本創作之精神和 範圍内，當可作些許之更動與潤飾，因此本創作之保護範圍 當視後附之申請專利範圍所界定者為準。 M337724 【圖式簡單說明】 第1圖係顯示一種習知之被動式散熱模組之侧視示意圖； 第2圖係顯示另一種習知之被動式散熱模組之侧視示意 圖， 第3圖係顧示本創作之一種實施例之夾心式散熱模組之侧 視不意圖，以及 第4圖係顯示根據第3圖之A-A剖面示意圖。 φ【主要元件符號說明】 卜2〜被動式散熱模組； 11、 21、110〜銅底座； 12、 22〜鋁鰭片； 12a〜L形接腳； 100〜夾心式散熱模組； 120〜金屬鰭片； 130〜顏1爽心兀件， 140〜銅熱導管； • 150〜鎖固元件。[Embodiment] A preferred embodiment of the present invention will be described with reference to the drawings. Referring to FIG. 3 and FIG. 4 , the sandwich heat dissipation module 100 of the present embodiment mainly includes a copper base 110 , a plurality of metal fins 120 , a copper sandwich component 130 , a copper heat pipe 140 , and two locking components . 150. A plurality of metal fins 120 are disposed on the copper base 110. Here, the metal fins 120 may be made of aluminum. The copper sandwich component 130 is coupled to the copper base 110 and the copper core component 130 is abutted between the plurality of metal fins 120. The copper heat pipe 140 is connected between the copper base 110 and the copper sandwich member 130, M337724, and the copper heat pipe 140 is covered by the copper core member 130. The two locking elements 150 are respectively locked between the plurality of metal fins 120 and the copper core member 130. In other words, the plurality of metal fins 120 and the copper core member 130 can be tightly locked together by the two locking members 150. Furthermore, the two locking elements 150 can be in the form of bolts. When the heat dissipation application is performed by the sandwich heat dissipation module 100, the copper base 110 can be attached to a heat source (not shown, for example, a central processing unit). The heat generated by the heat source is first conducted to the copper sandwich component 130 and the copper heat pipe 140 via the copper base 110 and then conducted to the plurality of metal slab fins 120 via the copper sandwich component 130. Then, the heat conducted to the metal fins 120 is dissipated into the atmosphere. Since the copper base 110 and the copper core member 130 have a high thermal conductivity of 398 w/mk to 402 w/mk, the copper heat pipe 140 has an ultrahigh thermal conductivity of approximately 40,000 w/mk to 50,000 w/mk, and the copper core member 130 It is abutted between the plurality of metal fins 120, so the effective heat conduction area between the metal fins 120 and the copper sandwich member 130 is greatly increased, so that the heat dispersion effect of the heat source is greatly improved. In other words, the heat from the heat source is rapidly dissipated onto the metal fins 120 due to the large increase in the effective heat conduction area between the metal fins 120 and the copper sandwich member 130, and is quickly dissipated into the atmosphere. In addition, as shown in FIG. 4, since the copper sandwich component 130 is in contact with the plurality of metal fins 120, the plurality of metal fins 120 and the copper sandwich component 130 are coupled by the two locking components 150. Tightly locked together, the structural stability of the entire sandwich heat dissipation module 100 is greatly enhanced. In addition, it is worth noting that although the plurality of metal fins 120 and the copper sandwich member 130 are tightly locked together by the two locking members 150, 8 M337724, the copper sandwich member 130 can be further welded. The method is abutted between the plurality of metal fins 120 to further improve the structural stability of the entire sandwich heat dissipation module 100. In addition, the sandwich heat dissipation module 100 is not limited to having two locking components 150. In other words, the sandwich type heat dissipation module 100 can also omit the configuration of the two locking elements 150, and only use the welding method to make the copper core element 130 abut between the plurality of metal fins 120, thus The manufacturing cost of the sandwich heat dissipation module 100 is reduced. Although the present invention has been disclosed in the preferred embodiments, it is not intended to limit the creation of any skill to those skilled in the art, and may make some modifications and refinements without departing from the spirit and scope of the present invention. Therefore, the scope of protection of this creation is subject to the definition of the scope of the patent application attached. M337724 [Simple diagram of the drawing] Fig. 1 is a side view showing a conventional passive heat dissipation module; Fig. 2 is a side view showing another conventional passive heat dissipation module, and Fig. 3 is a schematic view of the creation The side view of the sandwich heat dissipation module of one embodiment is not intended, and the fourth figure shows a schematic cross-sectional view of the AA according to FIG. Φ [main component symbol description] Bu 2 ~ passive cooling module; 11, 21, 110 ~ copper base; 12, 22 ~ aluminum fins; 12a ~ L-shaped pins; 100 ~ sandwich cooling module; 120 ~ metal Fin; 130 ~ Yan 1 cool heart piece, 140 ~ copper heat pipe; • 150 ~ locking element.