CN101549435B - Method for manufacturing heat sink - Google Patents
Method for manufacturing heat sink Download PDFInfo
- Publication number
- CN101549435B CN101549435B CN2008100663964A CN200810066396A CN101549435B CN 101549435 B CN101549435 B CN 101549435B CN 2008100663964 A CN2008100663964 A CN 2008100663964A CN 200810066396 A CN200810066396 A CN 200810066396A CN 101549435 B CN101549435 B CN 101549435B
- Authority
- CN
- China
- Prior art keywords
- substrate
- radiating fin
- radiator
- manufacturing
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 17
- 238000000034 method Methods 0.000 title abstract description 12
- 239000000758 substrate Substances 0.000 claims description 34
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 238000003466 welding Methods 0.000 abstract description 17
- 230000002349 favourable effect Effects 0.000 abstract 1
- 239000004411 aluminium Substances 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 238000005219 brazing Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002052 molecular layer Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000010301 surface-oxidation reaction Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/22—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded
- B23K20/233—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded without ferrous layer
- B23K20/2333—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded without ferrous layer one layer being aluminium, magnesium or beryllium
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
- H01L21/4882—Assembly of heatsink parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/04—Tubular or hollow articles
- B23K2101/14—Heat exchangers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/08—Non-ferrous metals or alloys
- B23K2103/10—Aluminium or alloys thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/08—Non-ferrous metals or alloys
- B23K2103/12—Copper or alloys thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/18—Dissimilar materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/4935—Heat exchanger or boiler making
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
Abstract
The invention relates to a method for manufacturing a heat sink. The method comprises the following steps: a base plate and a plurality of radiating fins are provided, and the radiating fins are welded on the base plate in sequence by ultrasonic welding. In the method, the radiating fins are welded on the base plate in sequence by the ultrasonic welding, thus being convenient for the combination between the radiating fins and the base plate and being favorable for increasing the heat transfer efficiency of the heat sink.
Description
Technical field
The present invention relates to a kind of radiator, particularly relates to a kind of manufacturing approach that is used for the radiator of heat-generating electronic elements heat radiation.
Background technology
Along with the fast development of electronic industry, the high speed of electronic component, high frequency and integrated its caloric value that makes increase severely, and therefore heat radiation has become the problem that dealer institute emphasis is considered.
In the heat radiation field, industry normally adopts a kind of radiator that heat-generating electronic elements is dispelled the heat, and this radiator comprises a substrate and is located at the some radiating fins on this substrate.This substrate contacts with heat-generating electronic elements, and said radiating fin is soldered on the substrate through common soldering mode.
Yet, in the above-mentioned soldering process, need to add scolder and scaling powder; Particularly in the welding process of different materials, connect, also need carry out nickel plating or other specially treateds like aluminium and brazing; Thereby cause cost high, complex procedures, and radiating fin and substrate bonded defective tightness after the welding; Higher in conjunction with thermal resistivity, be unfavorable for heat conduction, therefore need improve.
Summary of the invention
In view of this, be necessary to provide a kind of manufacturing approach of being convenient to the higher radiator of radiating fin and substrate bonded and heat transference efficiency.
A kind of manufacturing method of heat radiator may further comprise the steps: a substrate and some radiating fins are provided; The mode of each radiating fin through ultrasonic bonding is welded on this substrate successively.
In the above-mentioned manufacturing method of heat radiator, each radiating fin is welded on this substrate through the mode of ultrasonic bonding successively, and the soldering tip that therefore can solve ultrasonic bonding causes being difficult for the problem of welding more greatly.In addition, the welding effect of ultrasonic bonding is good, and the welding back combines thermal resistance low, thereby can improve the heat transference efficiency of radiator.Secondly, ultrasonic bonding is without any need for scolder, scaling powder, and weld interval is short, thereby helps reducing the cost of radiator, simplifies the production process of radiator.
With reference to the accompanying drawings, in conjunction with specific embodiment the present invention is done further description.
Description of drawings
Fig. 1 is the schematic perspective view of radiator in the present invention's first preferred embodiment.
Fig. 2 is a welded heat radiator process sketch map shown in Figure 1.
Fig. 3 is the schematic perspective view of radiator in the present invention's second preferred embodiment.
Fig. 4 is a welded heat radiator process sketch map shown in Figure 3.
The specific embodiment
Schematic perspective view for radiator 10 in the present invention's first preferred embodiment shown in Figure 1, this radiator 10 comprises a substrate 11 and a radiating fin group 13, this radiating fin group 13 is positioned on this substrate 11.
Please be simultaneously with reference to Fig. 2, this substrate 11 is used for and a heat-generating electronic elements (figure does not show) thermo-contact, and heat is passed to this radiating fin group 13.This substrate 11 is tabular, its by heat conductivility preferably copper become.The top of this substrate 11 is provided with a faying face 111.
This radiating fin group 13 is positioned on the faying face 111 of this substrate 11, and this radiating fin group 13 is formed by some radiating fin 131 stacked in parallel, and the thickness of said radiating fin 131 is 0.3～0.4mm, its by heat conductivility preferably aluminium process.Each radiating fin 131 comprises a body 133 and a flanging 134; This flanging 134 is extended to form by the vertical bending in the bottom of this body 133; Mode through ultrasonic bonding is welded on the faying face 111 of this substrate 11 each radiating fin 131 successively in flanging 134 places, thereby forms a weld zone 136 in a side of radiating fin 131.
Ultrasonic bonding is to utilize the dither ripple to be delivered to need the face of weld of welding, under the situation of pressurization, makes the mutual friction of two face of weld phases and forms the fusion between the molecular layer.
In the above-mentioned radiator 10, this substrate 11 is processed by copper and aluminium respectively with radiating fin 131, its surface oxidation easily, and ultrasonic bonding is low to the welding surface requirements, oxidation or plating all can be welded.In addition, adopt the welding effect of ultrasonic bonding good, the welding back combines thermal resistance low, thereby can improve the heat transference efficiency of radiator 10.Secondly, ultrasonic bonding is without any need for scolder, scaling powder, thereby helps reducing the cost of radiator 10, simplifies the production process of radiator 10, and further improves the heat transference efficiency of radiator 10.What is more important and since ultrasonic bonding need with power be index with thickness of workpiece and increase severely, and the thickness of each radiating fin 131 of above-mentioned radiator 10 is 0.3～0.4mm, thickness is less, therefore can avoid unnecessary energy consumption.Once more, each radiating fin 131 is to be welded in successively on the faying face 111 of this substrate 11, thereby stays bigger weld zone 136 to welding, and the soldering tip that therefore can solve ultrasonic bonding causes being difficult for the problem of welding more greatly; Because the weld interval of ultrasonic bonding is very short, therefore each radiating fin 131 of above-mentioned heat abstractor 10 adopts the mode of welding successively also can not influence the manufacturing time of heat abstractor 10 simultaneously; Also have because supersonic welding is connected on and need pressurization in the welding process; And each radiating fin 131 of above-mentioned heat abstractor 10 adopts the mode of welding successively; Then more easily radiating fin 131 is exerted pressure, and applied pressure can be passed to (being the junction of flanging 134 with the faying face 111 of this substrate 11 of radiating fin 131) on the face of weld more equably.
Schematic perspective view for radiator 20 in the present invention's second preferred embodiment shown in Figure 3, this radiator 20 comprises a substrate 21 and a radiating fin group 23, this radiating fin group 23 is located at this substrate 21 peripheries.
Please be simultaneously with reference to Fig. 4, the bottom surface of this substrate 21 is used for and a heat-generating electronic elements (figure does not show) thermo-contact, and heat is passed to this radiating fin group 23.This substrate 21 is cylindric, its by heat conductivility preferably copper become.The columned sidewall of this substrate 21 is provided with the faying face 211 of a circle.
This radiating fin group 23 radially is arranged on the faying face 111 of this substrate 11 radially, and this radiating fin group 23 comprises some radiating fins 231, and the thickness of each radiating fin 131 is 0.3～0.4mm, its by heat conductivility preferably aluminium process.Each radiating fin 231 comprises a body 233 and a flanging 234; This flanging 234 is extended to form by the inboard vertical bending of this body 233; This body 233 comprises the section of fin once 237 that is arranged in the bottom, the fin section 238 in the middle of being positioned at and be positioned at the top one on fin section 239; Should middle fin section 238 will descend fin section 237 to be connected with last fin section 239; This time, in, the external diameter of going up fin section 237,238,239 from bottom to top increases successively, forms step surface in the outside of each radiating fin 231.Mode through ultrasonic bonding is welded on the faying face 211 of this substrate 21 each radiating fin 231 successively in flanging 234 places, thereby forms a weld zone 236 in a side of radiating fin 231.
In like manner, above-mentioned radiator 20 also can reach the effect of the radiator 10 in first preferred embodiment.
Claims (7)
1. manufacturing method of heat radiator may further comprise the steps:
One substrate and some radiating fins are provided;
The mode of each radiating fin through ultrasonic bonding is welded on this substrate successively.
2. manufacturing method of heat radiator as claimed in claim 1 is characterized in that: this substrate is made of copper, and these radiating fins are made of aluminum.
3. manufacturing method of heat radiator as claimed in claim 1 is characterized in that: this substrate is tabular, and these radiating fins are welded on this substrate abreast.
4. manufacturing method of heat radiator as claimed in claim 1 is characterized in that: this substrate is cylindric, and these radiating fins radially are welded on this substrate radially.
5. manufacturing method of heat radiator as claimed in claim 4; It is characterized in that: each radiating fin comprises the section of fin once that is arranged in the bottom, the fin section in the middle of being positioned at and be positioned at the top one on the fin section, this time, in, the from bottom to top increase successively of external diameter of going up the fin section.
6. like any described manufacturing method of heat radiator of claim 1 to 5, it is characterized in that: each radiating fin comprises a body and a flanging, and each radiating fin is welded on this substrate through the mode of ultrasonic bonding in this flanging place.
7. like any described manufacturing method of heat radiator of claim 1 to 5, it is characterized in that: the thickness of each radiating fin is 0.3～0.4mm.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008100663964A CN101549435B (en) | 2008-04-03 | 2008-04-03 | Method for manufacturing heat sink |
| US12/133,393 US20090249624A1 (en) | 2008-04-03 | 2008-06-05 | Method of making heat sink |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008100663964A CN101549435B (en) | 2008-04-03 | 2008-04-03 | Method for manufacturing heat sink |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101549435A CN101549435A (en) | 2009-10-07 |
| CN101549435B true CN101549435B (en) | 2012-06-13 |
Family
ID=41131899
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2008100663964A Expired - Fee Related CN101549435B (en) | 2008-04-03 | 2008-04-03 | Method for manufacturing heat sink |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US20090249624A1 (en) |
| CN (1) | CN101549435B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2994253B1 (en) * | 2012-08-01 | 2018-10-05 | Cooltech Applications | MONOBLOC PIECE COMPRISING A MAGNETOCALORIC MATERIAL COMPRISING AN ALLOY COMPRISING IRON AND SILICON AND AT LEAST ONE LANTHANIDE, AND PROCESS FOR PRODUCING SAID MONOBLOC PIECE |
| WO2021014002A1 (en) | 2019-07-25 | 2021-01-28 | Abb Power Grids Switzerland Ag | Arrangement of a power semiconductor module and a cooler |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1358600A (en) * | 2002-01-04 | 2002-07-17 | 大连理工大学 | Composite metal material explosion welding technology with shape protection function |
| CN2547004Y (en) * | 2002-04-15 | 2003-04-23 | 奇鋐科技股份有限公司 | Radiator of CPU |
| US6650215B1 (en) * | 2002-06-17 | 2003-11-18 | The Bergquist Company | Finned heat sinks |
| CN2682585Y (en) * | 2004-01-12 | 2005-03-02 | 徐郁彰 | Radiator forming structure |
| CN1647868A (en) * | 2004-01-21 | 2005-08-03 | 十丰科技股份有限公司 | Method for preparing welded heat radiator |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6742581B2 (en) * | 2001-11-21 | 2004-06-01 | Fujikura Ltd. | Heat sink and fin module |
| US20070261242A1 (en) * | 2006-05-15 | 2007-11-15 | Foxconn Technology Co., Ltd. | Method for manufacturing phase change type heat sink |
| TW200934362A (en) * | 2008-01-16 | 2009-08-01 | Neng Tyi Prec Ind Co Ltd | Method of manufacturing heat dissipaters having heat sinks and structure thereof |
| US8002019B2 (en) * | 2008-03-20 | 2011-08-23 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device |
-
2008
- 2008-04-03 CN CN2008100663964A patent/CN101549435B/en not_active Expired - Fee Related
- 2008-06-05 US US12/133,393 patent/US20090249624A1/en not_active Abandoned
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1358600A (en) * | 2002-01-04 | 2002-07-17 | 大连理工大学 | Composite metal material explosion welding technology with shape protection function |
| CN2547004Y (en) * | 2002-04-15 | 2003-04-23 | 奇鋐科技股份有限公司 | Radiator of CPU |
| US6650215B1 (en) * | 2002-06-17 | 2003-11-18 | The Bergquist Company | Finned heat sinks |
| CN2682585Y (en) * | 2004-01-12 | 2005-03-02 | 徐郁彰 | Radiator forming structure |
| CN1647868A (en) * | 2004-01-21 | 2005-08-03 | 十丰科技股份有限公司 | Method for preparing welded heat radiator |
Non-Patent Citations (1)
| Title |
|---|
| JP平9-331003A 1997.12.22 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101549435A (en) | 2009-10-07 |
| US20090249624A1 (en) | 2009-10-08 |
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| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
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| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120613 Termination date: 20130403 |