201102603 六、發明說明： 【發明所屬之技術領域】 本發明涉及一種散熱裝置及其製法，尤其涉及 僅需使用沖壓方式即能將一散熱鰭片組褒設到一導 熱板之散熱裝置及製法。 【先前技術】 一般散熱裝置主要係由一散熱鰭片組及一導熱 板相結合所構成。傳統上，該散熱裴置的組裝主要 疋利用錫貧或導熱膠將該散熱籍片組焊接或黏接至 該導熱板。就「錫焊」而言，該散熱鰭片組與導熱 板需經過表面處理（例如：電鍍）、錫膏塗佈、及迴 焊等繁複製程才能完成，導致成本居高不下。另一 方面，若是採用「膠黏」的方式，該散熱鰭片組與 底板僅係藉由導熱膠黏合，故兩者在結合上的穩定 性較差，散熱錯片組有鬆、脫之虞。此外，因導熱 膠的熱傳導係數明顯低於金屬材質的散熱鰭片組或 導熱板，使得整個散熱裝置的散熱效率嚴重受限。 台灣新型M337724號案揭露一夾心式散熱模 組，其包括一銅底座、複數設於該銅底座上之金屬 錯片、抵接於該些金屬鰭片之間的一銅夾心元件’ 以及連接於該銅底座與該銅夾心元件之間的一銅熱 201102603 導管。此外，該央心式散熱模組更包括—鎖固元件， 穿設於該些金屬鰭片與該銅夹心元侔 υ叶 < 間，以將該 些金屬鰭片與該銅夾心元件鎖固在一起，因此相: 費時費工。又’單憑該鎖固元件仍报難迫使該些鋼 夾心元件緊密夾住該些散熱片，尚需使用焊接之方 式才能將該銅夾心元件抵接於該些金屬鰭片之間。 換言之，該夹心式散熱模組的組裝方式需要螺合迫 緊並配合錫焊作業，相當費時費工，亟待改進。 【發明内容】 本發明提供一種僅需使用沖壓方式即能完成組 裝的散熱裝置及其製造方法，該散熱裝置不僅具有 良好散熱效率，同時結構穩固。 詳而言之，該散熱裝置包括一導熱夾板、一導 熱爽板、一導熱管及一散熱鰭片組。該導熱夾板與 該導熱夾板係相互疊合，而該導熱管係夾設於該導 熱失板與該導熱基板的界面之間。該導熱夹板形成 有複數交錯排列的通道與分隔塊。該導熱基板形成 有複數間隔排列的凸條於同一面。當該導熱夾板與 該導熱夾板係相互疊合時，該導熱基板之該些凸條 係分別對應地楔入該導熱夾板之該些通道。此外， 該散熱鰭片組具有複數散熱片，其間隔排列地豎立 201102603 在該相疊合的導熱夾板與導熱基板上。每一散熱片 的一部分係被緊夾於每對相鄰的分隔塊與凸條之 間。 另一方面，本發明之製造該散熱裝置的方法包 括下列步驟： 提供一導熱夾板、一導熱基板、一導熱管及一 散熱鰭片組，該導熱夾板形成有複數交錯排列的通 道與为隔塊，該導熱基板形成有複數間隔排列的凸 條於於同一面，該些凸條的大小與位置恰能楔入該 導熱夾板之通道；且該散熱鰭片組具有複數散熱片； 將該導熱夾板疊至該散熱鰭片組上，並使該導 熱夾板的每一分隔塊的兩側壁對應地貼靠著該散熱 鰭片組的兩相鄰散熱片； 將該導熱基板疊至該導熱夾板上，並使該導熱 基板上的每一凸條分別對著該導熱夾板上相對應的 通道； 將該導熱管置於該導熱基板與該導熱夾板之 間；及 執行一沖壓程序’使得該導熱基板、該導熱管 及孩‘熱夾板参者緊密重疊在一起，且使該散熱鰭 片、、的每放熱片各有一部份被緊夾在每一對交錯 的分隔塊與凸條之間。 201102603 如此，本發明藉由一沖壓程序即完成將該導熱 夾板、導熱基板’散熱管及散熱鰭片組四者組成一 散熱裝置的任務，且無須先前技術中繁複的焊錫或 螺合迫緊工序，具有省時、省工及低製造成本之優 勢。 至於本發明的其它發明内容與更詳細的技術及 功效說明’將揭露於隨後的說明。 【實施方式】 第一圖係顯示本發明之散熱裝置的一較佳實施 例，其中指出該散熱裝置1〇〇包括一導熱基板1、 一導熱官（heat pipe) 2、一導熱夾板3及一散熱鰭 片組4。 如第一圖所示’該導熱基板1的頂面形成有複 數間隔排列的凸條1 〇，且沿著其長度方向界定有一 長溝12供該導熱管2的底部設置。該導熱夾板3 形成有複數交錯排列的通道3〇與分隔塊31，且該 導熱夾板3的底面沿著其長度方向界定有一長溝32 供該導熱官2的頂部設置。如此，該導熱管2可夾 設於該導熱基板1與該導熱夾板3的界面之間。此 外’該導熱夾板3之該些通道30係貫穿該導熱夾板 3的頂、底兩面’供該導熱基板1的該些凸條10穿 201102603 設。該散熱鰭片組4具有複數散熱片4卜間隔排列 地丑立在相宜合的該導熱基板1與該導熱夾板3上。 上述各構件可選用相同或不同的導熱材料，例 如铭或銅。較佳是全部使用同—材料，例如銘，以 方便製作。另外，該導熱基板1與該導熱夾板3可 隨意利用電鍍形成不同顏色，或是利用印刷形成不 同顏色或/及圖案。 第二及三圖顯示該散熱裝置100運用於一電路 板5上|f开/該月欠熱裝i J 纟要係供該電路板5 上的電子元件4(例如：一中央處理器）散熱之 用。其中，該散熱鰭片組3的週圍還有由一背板6 及兩擋板7所組成的框架。 復參閱第三圖’當該導熱基板丨與該導熱央板 3相互疊合時，該導熱基板丨之該些凸條1〇係分別 對應地楔入該導熱夾板3之該些通道3〇中。又，該 散熱鰭片組4的該些散熱片41係間隔排列地豎立在 該相疊合的導熱基板i與導熱夾板3上，且每一散 熱片41的一部分係被緊夾於每對相鄰的凸條1〇與 分隔塊31之間。如此，當該電路板5上的該電子元 件4因為運作而產生廢熱時，該廢熱會經由該導熱 基板1的底面傳到其上的凸條1〇及該導熱夾板3 上的分隔塊31，使得被夾在每一對凸條1〇與分隔 201102603 鬼31間的每散熱片4卜都能狗很快地將來自每 . 對凸條1G與分隔塊“該廢㈣遞出去 每《•凸條10與分隔塊31及該些被央住的散轨片 41都是以大面積的方式接觸，所以本發明之散熱裝 置具有極佳的散熱效率且結構相當穩固。 此外4 V熱夾板3的每一分隔塊31的底面係 貼靠在該導熱基板！的頂面上，而每—分隔塊Μ 鲁的頂部則形成有-V形凹槽3U ’其深度接近該分 隔塊31的底部。事實上，如第四圖所示，該導熱夾 板3在尚未疊至該導熱基板丨時，每一分隔塊31 的頂部係形成具有開叉且外擴的兩分支31〇。如 此’當該導熱夾板3與該導熱基板1相互疊合後， 如第二圖所示’該兩分支310會向内擠壓’使得每 一散熱片41更能夠被其兩旁的分支310與凸條1〇 鲁 緊迫’藉此牢固地楔入成對的分支310與凸條1〇 之間。 參閱第三及五圖’為方便該導熱基板1的該些 凸條10能夠分別對應地楔入該導熱夾板3的該些通 道30内，該導熱基板1的每一凸條10的頂部形成 有導角101 ( chamfer)。較佳地’該導熱基板1的 母一凸條10的寬度由底部在頂部小幅漸縮，如第五 圖所示。如此，當該導熱夾板3與該導熱基板1藉 201102603 由冲壓而相互疊合時，該些凸條1 0能夠緊密地楔於 該些通道30中。 第六（A )〜六（F )圖係顯示一種製造該散熱 裝置的方法，其包括下列步驟。首先，如第六（A) 圖所示將該散熱鰭片組3架設於一治具8上，其中 該些散熱片41係成對地位於該治具8的每一支持柱 8〇的兩側。其次，如第六（B)圖所示地將該導熱 失板3倒置於該散熱鰭片組4上，使得該導熱爽板 3的每一分隔塊31的兩側壁對應地貼靠著該散熱鰭 片組4的兩相鄰散熱片41。換言之，該散熱縛片組 4的該些散熱片41係成對地貼靠在每一分隔塊31 的兩側壁上。又，该導熱夾板3的該些分隔塊31 係同時分別受該治具8的支持柱80所支撐。如第六 (B)圖所示’該些支持柱80恰分別對應地頂底於 每一分隔塊31的兩分支310之間。 接著’如第六（C)圖所示地將該導熱管2安置 於δ亥導熱炎板3的長溝32内。隨後，如第六（d) 圖所示地將該導熱基板1倒置疊放在該導熱夾板3 及該導熱管2上，並使遠導熱基板1的每一凸條Μ 分別對著該導熱夾板3上相對應的通道30。此時， 該導熱管2恰容置於該導熱基板1的長溝31與該導 熱夾板3的長溝32之間。緊接著，使用沖壓機械來 2〇11〇26〇3 * 執行冲壓紅序，使得該導熱基板1、該導熱管2 、 及該導熱夾板3三者緊密疊合在-起，如第六（E) 圖所示。如此一來，該散熱鰭片組的每一散熱片41 各有一部份會被緊密地夾在每一對交錯的分隔塊 31與凸條1〇之間。最後，移除該治具8即可得到 如第六（F)圖所示的本發明之散熱裝置。 如上所述’由於該導熱基板1、該導熱夾板3 鲁 及°亥散熱韓片組4分別具有上述構造，所以才能夠 如第六（D)〜六（E)圖所示地使用沖壓機械快速 將它們組成一個完整的散熱裝置。相較於先前技 術’本發明之散熱裝置的製造過程，不需要焊接， 也不為要螺合’省時省工而具有較低製造成本的優 勢。更特別的是’由於該導熱基板1上的每一凸條 1 〇的頂部的兩相對長邊係如第五圖所示地形成有 • 導角。如此’可使該些凸條1〇在上述沖壓過程 中’能夠較順暢地楔入該導熱夹板3的通道30内。 此外’由於該些分隔塊31頂部的特殊結構，使得在 該些凸條1〇分別被楔入該些通道30的沖壓過程 中’每一分隔塊31的兩分支310會順勢被對應的凸 條10向内擠直，達到密合的目地。 綜上所述，由於該導熱基板1及該導熱夾板3 分別具有如上所述的構造，所以該導熱基板1及該 11 201102603 導熱夾板3兩者不但可以順暢地組合在一起，而且 能夠消除它們在製作上所產生的公差，使得該 丁 基板1及該導熱夾板3兩者最終能夠緊密地相互疊 合在一起，並使得每一散熱片30都能被每一對的凸 條10與分隔塊31緊密夾住。 無論如何，任何人都可以從上述例子的說明獲 得足夠教導，並據而了解本發明内容確實不同於先 前技術，且具有產業上之利用性，及足具進步性。 是本發明確已符合專利要件，爰依法提出申請。 12 201102603 【圖式簡單說明】 - 第一圖，係本發明散熱裝置之一較佳實施例之立體分 ' 解圖。 第二圖，係該散熱裝置運用於一電路板上之示意圖。 第三圖’係第二圖之一剖面圖。 第四圖，顯示該散熱裝置之散熱夾板的局部放大刮面 圖。 第五圖，顯示該散熱裝置之散熱基板的局部放大剖面 ® 圖。 第六（A)〜（F)圖，係顯示該散熱裝置之製法的製 程剖面圖，其係第一圖沿線A-A之截面而來。 【主要元件符號說明】 1導熱基板 10凸條 100散熱裝置 101導角 12長溝 2導熱管 3導熱夹板 30通道 31分隔塊 310分支 311V形凹槽 32長溝 4散熱韓片組 41散熱片 5電路板 6背板 13 201102603 7擋板 8治具 80支持柱BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat dissipating device and a method of manufacturing the same, and more particularly to a heat dissipating device and a method for disposing a heat dissipating fin set to a heat conducting plate using only a stamping method. [Prior Art] A general heat sink is mainly composed of a combination of a heat sink fin group and a heat conductive plate. Conventionally, the assembly of the heat dissipating device is mainly to weld or bond the heat dissipating film set to the heat conducting plate by using a lean or thermal conductive paste. In the case of "soldering", the heat-dissipating fin group and the heat-conducting plate are subjected to surface treatment (for example, electroplating), solder paste coating, and reflow, and the like, resulting in high cost. On the other hand, if the "adhesive" method is used, the heat-dissipating fin group and the bottom plate are only bonded by the heat-conducting adhesive, so that the stability of the two is poor in combination, and the heat-dissipating chip group is loose and loose. In addition, since the thermal conductivity of the thermal conductive adhesive is significantly lower than that of the metal fin or heat conducting plate, the heat dissipation efficiency of the entire heat dissipating device is severely limited. Taiwan's new M337724 case discloses a sandwich heat dissipation module comprising a copper base, a plurality of metal strips disposed on the copper base, a copper sandwich member abutting between the metal fins, and a connection to A copper heat 201102603 conduit between the copper base and the copper sandwich component. In addition, the central core heat dissipation module further includes a locking component disposed between the metal fins and the copper sandwich 侔υ leaf to lock the metal fins and the copper sandwich component Together, so phase: Time-consuming labor. Moreover, the locking element alone still reports difficulty in forcing the steel sandwich members to tightly sandwich the heat sinks, and welding is required to abut the copper sandwich members between the metal fins. In other words, the assembly method of the sandwich type heat dissipation module needs to be screwed tightly and matched with the soldering operation, which is time consuming and laborious, and needs to be improved. SUMMARY OF THE INVENTION The present invention provides a heat dissipating device that can be assembled using only a stamping method and a method of manufacturing the same, which not only has good heat dissipation efficiency, but also has a stable structure. In detail, the heat dissipating device comprises a heat conducting plate, a heat conducting plate, a heat conducting tube and a heat dissipating fin set. The heat conducting clip and the heat conducting clip are overlapped with each other, and the heat conducting tube is sandwiched between the heat guiding plate and the interface of the heat conducting substrate. The thermally conductive cleat is formed with a plurality of staggered channels and partitions. The thermally conductive substrate is formed with a plurality of ribs arranged at equal intervals on the same side. When the heat conducting plate and the heat conducting plate are overlapped with each other, the protruding strips of the heat conducting substrate are respectively wedged into the channels of the heat conducting plate. In addition, the heat dissipating fin set has a plurality of heat sinks which are erected at intervals in the array of 201102603 on the laminated heat conducting splint and the heat conducting substrate. A portion of each fin is clamped between each pair of adjacent spacers and ribs. In another aspect, the method for manufacturing the heat sink of the present invention comprises the steps of: providing a heat conducting splint, a heat conducting substrate, a heat conducting tube and a heat dissipating fin set, wherein the heat conducting splint is formed with a plurality of staggered channels and spacers The heat-conducting substrate is formed with a plurality of spaced-apart ribs on the same surface, and the ribs are sized and positioned to be wedged into the channel of the heat-conducting clip; and the heat-dissipating fin set has a plurality of heat-dissipating fins; Stacked on the heat dissipating fins, and the two side walls of each of the heat dissipating blocks are correspondingly disposed on the two adjacent heat sinks of the heat dissipating fin set; And each of the ribs on the heat-conducting substrate respectively face a corresponding channel on the heat-conducting plate; placing the heat-conducting tube between the heat-conducting substrate and the heat-conducting plate; and performing a stamping process to make the heat-conducting substrate, The heat pipe and the child's hot splint are closely overlapped, and a portion of each of the heat sink fins is clamped to each pair of staggered partition blocks and ribs. . Thus, the present invention accomplishes the task of forming a heat dissipating device by forming a heat dissipating plate, a heat conducting substrate 'heat pipe and a heat dissipating fin group by a stamping process, and does not require complicated soldering or screwing pressing process in the prior art. It has the advantages of time saving, labor saving and low manufacturing cost. Other inventive aspects and more detailed technical and functional descriptions of the present invention will be disclosed in the following description. [Embodiment] The first figure shows a preferred embodiment of the heat sink of the present invention, wherein the heat sink 1 includes a heat-conducting substrate 1, a heat pipe 2, a heat-dissipating plate 3, and a heat-dissipating device Heat sink fin set 4. As shown in the first figure, the top surface of the thermally conductive substrate 1 is formed with a plurality of ribs 1 间隔 arranged at intervals, and a long groove 12 is defined along the length thereof for the bottom of the heat transfer tube 2. The heat conducting splint 3 is formed with a plurality of staggered channels 3 and partitioning blocks 31, and the bottom surface of the heat conducting splint 3 defines a long groove 32 along the length thereof for the top of the heat conducting member 2. Thus, the heat pipe 2 can be interposed between the heat conducting substrate 1 and the interface of the heat conducting plate 3. In addition, the channels 30 of the heat conducting splint 3 are disposed through the top and bottom surfaces of the heat conducting plate 3 for the ribs 10 of the heat conducting substrate 1 to pass through 201102603. The heat dissipating fin group 4 has a plurality of fins 4 spaced apart from each other on the heat conducting substrate 1 and the heat conducting splint 3. The above components may be selected from the same or different heat conductive materials, such as Ming or copper. It is preferred to use all of the same materials, such as Ming, for ease of fabrication. In addition, the thermally conductive substrate 1 and the thermally conductive plate 3 can be formed by plating to form different colors or by printing to form different colors or/and patterns. The second and third figures show that the heat sink 100 is applied to a circuit board 5, and the electronic component 4 (for example, a central processing unit) on the circuit board 5 is cooled. Use. There is also a frame composed of a back plate 6 and two baffles 7 around the heat dissipation fin group 3. Referring to the third figure, when the heat conducting substrate and the heat conducting plate 3 are overlapped with each other, the ribs 1 of the heat conducting substrate are respectively wedged into the channels 3 of the heat conducting plate 3 respectively. . Moreover, the heat dissipating fins 41 of the heat dissipating fin group 4 are erected on the stacked heat conducting substrate i and the heat conducting splint 3, and a part of each fin 41 is clamped to each pair of phases. Between the adjacent ribs 1 〇 and the partition block 31. In this way, when the electronic component 4 on the circuit board 5 generates waste heat due to operation, the waste heat is transmitted to the ridge 1 〇 on the thermal conductive substrate 1 and the partition block 31 on the heat conduction plate 3 via the bottom surface of the heat conductive substrate 1 . So that each of the heat sinks 4 that are sandwiched between each pair of ribs 1 分隔 and the partition 201102603 鬼 31 can quickly come from each of the ribs 1G and the partition block "the waste (four) is handed out every "• convex The strip 10 is in contact with the partition block 31 and the separated rail pieces 41 in a large area, so the heat sink of the present invention has excellent heat dissipation efficiency and a relatively stable structure. Further, the 4 V hot splint 3 The bottom surface of each partition block 31 abuts against the top surface of the heat-conducting substrate!, and the top of each partition block is formed with a -V-shaped groove 3U' with a depth close to the bottom of the partition block 31. As shown in the fourth figure, when the heat-conducting splint 3 has not been stacked on the heat-conducting substrate ,, the top of each partition block 31 is formed with two branches 31〇 having a split and an outer expansion. Thus, when the heat-dissipating plate 3, after the heat-conducting substrate 1 is superposed on each other, as shown in the second figure, the two branches 310 The inward pressing 'so that each fin 41 is more capable of being squeezed by the branches 310 and the ribs 1 on both sides thereof' is firmly wedged between the pair of branches 310 and the ribs 1 。. The ribs 10 of the heat-conducting substrate 1 can be correspondingly wedged into the channels 30 of the heat-conducting plate 3 respectively. The top of each rib 10 of the heat-conducting substrate 1 is formed with a lead angle 101 ( Preferably, the width of the female rib 10 of the thermally conductive substrate 1 is slightly tapered from the bottom at the top, as shown in the fifth figure. Thus, when the thermal paste plate 3 and the thermally conductive substrate 1 are stamped by 201102603 When overlapping each other, the ribs 10 can be tightly wedged in the channels 30. The sixth (A) to six (F) diagrams show a method of manufacturing the heat sink, which includes the following steps. The heat sink fins 3 are mounted on a jig 8 as shown in FIG. 6(A), wherein the heat sinks 41 are disposed in pairs on both sides of each support post 8 of the jig 8. Secondly, the thermal loss plate 3 is placed on the heat dissipation fin group 4 as shown in the sixth (B) diagram, so that the guide The two side walls of each of the partitioning blocks 31 of the heat-dissipating plate 3 are correspondingly abutted against the two adjacent heat-dissipating fins 41 of the heat-dissipating fin group 4. In other words, the heat-dissipating fins 41 of the heat-dissipating die set 4 are paired Abutting against the two side walls of each of the partitioning blocks 31. Further, the partitioning blocks 31 of the heat conducting splint 3 are simultaneously supported by the support columns 80 of the jig 8 respectively, as shown in the sixth (B) diagram. The support columns 80 are respectively correspondingly placed between the two branches 310 of each partition block 31. Then, the heat pipe 2 is placed on the heat conduction plate 3 as shown in the sixth (C) diagram. The heat transfer substrate 1 is placed upside down on the heat transfer plate 3 and the heat transfer tube 2 as shown in the sixth (d), and each ridge of the far heat conductive substrate 1 is respectively opposed. The corresponding channel 30 on the heat conducting splint 3 is placed. At this time, the heat pipe 2 is disposed between the long groove 31 of the heat conductive substrate 1 and the long groove 32 of the heat transfer plate 3. Then, the stamping machine is used to perform the stamping red sequence, so that the heat conducting substrate 1, the heat conducting tube 2, and the heat conducting splint 3 are closely overlapped, such as the sixth (E). ) The picture shows. As a result, a portion of each of the fins 41 of the fin group is tightly sandwiched between each pair of interleaved spacers 31 and ribs 1 。. Finally, the jig 8 is removed to obtain the heat sink of the present invention as shown in the sixth (F) diagram. As described above, since the heat-conducting substrate 1, the heat-dissipating plate 3, and the heat-dissipating heat-dissipating group 4 have the above-described configurations, it is possible to use the press machine as shown in the sixth (D) to the sixth (E). Combine them into a complete heat sink. Compared to the prior art 'the manufacturing process of the heat sink of the present invention, no soldering is required, and there is no advantage of having a lower manufacturing cost for the screwing to save time and labor. More specifically, the two opposite long sides of the top of each of the ribs 1 on the thermally conductive substrate 1 are formed as a guide angle as shown in the fifth figure. Thus, the ridges 1 can be smoothly wedged into the passage 30 of the heat-conducting cleat 3 during the above-described stamping process. In addition, due to the special structure of the tops of the partition blocks 31, in the stamping process in which the ribs 1 楔 are respectively wedged into the channels 30, the two branches 310 of each partition block 31 will be correspondingly convex ribs. 10 straight inward to achieve a close purpose. In summary, since the heat-conducting substrate 1 and the heat-conducting plate 3 have the structures as described above, the heat-conducting substrate 1 and the 11201102603 heat-conducting plate 3 can be smoothly combined, and they can be eliminated. The tolerances produced in the fabrication are such that the butyl plate 1 and the thermally conductive plate 3 are finally able to be closely stacked one upon another, and each fin 30 can be affixed to each pair of ribs 10 and spacers 31. Tightly clamped. In any case, anyone can obtain sufficient teaching from the description of the above examples, and it is understood that the present invention is indeed different from the prior art, and is industrially usable and progressive. It is the invention that has indeed met the patent requirements and has filed an application in accordance with the law. 12 201102603 [Simple description of the drawings] - The first figure is a three-dimensional 'de-pattern' of a preferred embodiment of the heat sink of the present invention. The second figure is a schematic diagram of the heat sink applied to a circuit board. The third figure is a cross-sectional view of the second figure. The fourth figure shows a partial enlarged scraping view of the heat sink of the heat sink. The fifth figure shows a partial enlarged section of the heat sink substrate of the heat sink. The sixth (A) to (F) drawings are process sectional views showing the manufacturing method of the heat dissipating device, which is the cross section of the first drawing along the line A-A. [Main component symbol description] 1 Thermal substrate 10 rib 100 heat sink 101 lead angle 12 long groove 2 heat pipe 3 thermal splint 30 channel 31 partition block 310 branch 311V groove 32 long groove 4 heat sink Korean group 41 heat sink 5 circuit board 6 back plate 13 201102603 7 baffle 8 fixture 80 support column
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