TWM416308U - Fin type heat sink fastening structure - Google Patents

Fin type heat sink fastening structure Download PDF

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Publication number
TWM416308U
TWM416308U TW100209642U TW100209642U TWM416308U TW M416308 U TWM416308 U TW M416308U TW 100209642 U TW100209642 U TW 100209642U TW 100209642 U TW100209642 U TW 100209642U TW M416308 U TWM416308 U TW M416308U
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Taiwan
Prior art keywords
heat
heat sink
positioning
hole
conducting seat
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Application number
TW100209642U
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Chinese (zh)
Inventor
Shi-Ming Chen
Original Assignee
Shi-Ming Chen
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Publication date
Application filed by Shi-Ming Chen filed Critical Shi-Ming Chen
Priority to TW100209642U priority Critical patent/TWM416308U/en
Publication of TWM416308U publication Critical patent/TWM416308U/en
Priority to DE201220100573 priority patent/DE202012100573U1/en
Priority to JP2012001038U priority patent/JP3175529U/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H01L21/4882—Assembly of heatsink parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Description

M416308 五、新型說明： 【新型所屬之技術領域】 [0001] 本創作係與散熱裝置有關，特別有關於一種鰭片式散熱 器的固定結構。 【先前技術】 [0002] 隨著科技日新月異，電子產品内部元件的運算速度增加 ，單位面積内所產生的熱量也大幅提升，故大多電子元 件均設置有散熱器，藉以控制工作溫度，並維持電子元 件之正常運作。 [0003] 目前市面上較為常見的散熱器大多具有多數平行排列的 散熱鰭片，該些散熱鰭片可利用鋁擠製程或沖壓成型方 式而製成；惟，鋁擠型的散熱鰭片由於製程上的限制， 各散熱鰭片之間需存在有一定距離的間隙，故在一定的 外形尺寸下所設置的散熱鰭片數量較少，致使散熱器無 法具有密度較高的散熱鰭片；反之，利用沖壓方式成型 的散熱鰭片可設置為高密度，以利用大範圍的散熱面積 來提高散熱效率，故在市場上佔有一席之地。 [0004] 沖壓型散熱鰭片的其中一種固定方式是在導熱座的表面 設有多數溝槽，並將各散熱鰭片插設在該些溝槽，接著 再沖壓該些溝槽的二側邊，令溝槽二側受力產生變形， 據以將該些散熱鰭片夾嵌在該導熱座中。然而，藉由沖 壓方式來嵌組該些散熱鰭片時，該些散熱鰭片經常無法 緊迫結合在該導熱座上，導致該些散熱鰭片容易產生鬆 動；再者，嵌固在溝槽中的散熱鰭片通常僅部分接觸導 表單編號A0101 第3頁/共21頁 M416308 熱座，因兩者之間的接觸面積小，故無法將導熱座的熱 快速地傳導至散熱鰭片。 [0005] 有鑑於此，本創作人為改善並解決上述之缺失，乃特潛 心研究並配合學理之運用，終於提出一種設計合理且有 效改善上述缺失之本創作。 【新型内容】 [0006] 本創作之一目的，在於提供一種鰭片式散熱器固定結構 ，其可將導熱座的熱快速地傳導至散熱鰭片，以提升導 熱效率。 [0007] 本創作之另一目的，在於提供一種鰭片式散熱器固定結 構，以將散熱鰭片緊密地結合在導熱座上。 [0008] 為了達成上述之目的，本創作係為一種鰭片式散熱器固 定結構，包括一導熱座、複數散熱鰭片、複數壓掣片及 複數定位體，散熱鰭片平行且間隔地設置在導熱座上， 每一散熱鰭片的底端垂直延伸有固定板，固定板設有複 數穿孔，壓掣片對應散熱鰭片設置，各壓掣片安置在固 定板上，並對應穿孔而設有複數結合孔，定位體固定在 導熱座上，定位體穿設穿孔及結合孔，並定位在壓掣片 上，以令壓掣片壓掣固定板而平面貼接導熱座。 [0009] 相較於習知技術，本創作之散熱鰭片底端的固定板上設 有複數穿孔，且在導熱座設置複數定位體，此對應散熱 鰭片設置複數壓掣片，再藉由定位體的定位壓掣而使壓 掣片壓掣固定板，藉此令固定板平面貼接導熱座，使固 定板與導熱座之間形成面對面的熱導接方式，以將導熱 表單编號A0101 第4頁/共21頁 M416308 座的熱快速地傳導至散熱鰭片，據以提升導熱效率；再 者，本創作之定位體係經壓掣而在壓掣片上形成有一壓 掣塊，可使固定板緊密地結合在導熱座，藉此達到結構 穩固且導熱效率佳的鰭片式散熱器。 【實施方式】 [0010] 有關本創作之詳細說明及技術内容，配合圖式說明如下 ，然而所附圖式僅提供參考與說明用，並非用來對本創 作加以限制者。 [0011] 請參照第一圖及第二圖，係分別為本創作鰭片式散熱器 的立體分解圖及組合示意圖；本創作之鰭片式散熱器1係 包括一導熱座10、複數散熱鰭片20、複數壓掣片30、及 複數定位體40。 [0012] 該導熱座10係由導熱性佳的金屬所構成，該些散熱鰭片 20則是平行且間隔地設置在該導熱座10上。每一散熱鰭 片20的底端垂直延伸有一固定板21，該固定板21係設有 複數穿孔210，又，該散熱鰭片20的二側分別垂直延伸有 一定位片22，相鄰散熱鰭片的固定板21及定位片22係為 相互抵接，以形成散熱通道220。 [0013] 該些壓掣片30係對應該些散熱鰭片20設置，亦即，該壓 掣片30的外型係對該固定板21的大小及形狀，故各該壓 掣片30係安置在該固定板21上，並對應該些穿孔210設有 複數結合孔30 0。再者，該些定位體40係固定在該導熱座 10上，且各該定位體40係穿設該穿孔210及該結合孔300 表單編號A0101 第5頁/共21頁 M416308 [0014] 於本實施例中，該些定位體4 〇係分别為一凸柱，且該些 定位體40與該導熱座1〇係為一體成型，該些凸柱對應該 等穿孔210而排列在該導熱座上。 [0015] 請續參照第三圖至第六圓，係分別為本創作之鰭片式散 熱器的二壓掣示意圖、壓掣後的立體外觀示意圖、及壓 掣後的組合剖視圖；承上，待將該些散熱鰭片2 〇及壓掣 片30穿設該些定位體4〇而組設在該導熱座後。接著， 進行壓掣作業，利用一壓治具2而壓掣該些定位體4〇 ,使 該些定位體40產生變形而定位在該壓掣片3〇上。本實施 例中，該定位體40係經壓掣而在該壓掣片3〇上形成有大 於s亥結合孔3 0 0及該穿孔21 〇孔徑的一壓掌塊4 〇，，該壓 掣塊40’係呈扁圓狀地壓掣該壓掣片3〇，並令該壓掣片 30壓掣該固定板21，以使該固定板21平面貼接該導熱座 10 〇 [0016] 請再參照第七圖，係為本創作之鰭片式散熱器的另一實 施例；本實施例中’鰭片式散熱器13包含有一導熱座l〇a 、複數散熱鰭片20a、設置在該導熱座10a上的複數壓掣 片30a、及複數定位體4〇a，每一散熱鰭片2〇3的底端垂 直延伸有一固定板21a，各壓掣片30a係壓掣在該固定板 21a上，s亥定位體4〇a係受壓掣產生變形而定位在該壓擎 片30a上。與第一實施例不同的地方在於該些定位體4〇a 與該導熱座10a係為分離設置，且該導熱座1〇a設有複數 凹槽100a ’該等定位趙4〇a分別固定在該凹槽i〇〇a中。 [0017] 請另參照第八圖及第九圖，係為本創作之鰭片式散熱器 又一實施例；於本實施例中，鰭片式散熱器11}包含有一 表軍編號A0101 第6頁/共21頁 導熱座10b、複數散熱鰭片20b、設置在該導熱座10b上 的複數壓掣片30b、及複數定位體40b，每一散熱鰭片 20b的底端垂直延伸有一固定板21b，該固定板21b係設 有複數穿孔210b，且該壓掣片30b設有複數結合孔300b 〇 [0018] 本實施例與第一實施例不同的地方在於該定位體40b係為 一螺栓，此外，該導熱座10b對應設有複數固定孔100b， 該結合孔300b則對應設為一螺孔，該螺栓係自該壓掣片 30b的一側邊依序穿設該固定孔100b及穿孔210b，繼而 鎖合在該螺孔300b中，據以定位在該壓掣片30b上，並令 該壓掣片30b壓掣該固定板21b，以使該固定板2lb平面 貼接該導熱座l〇b。 [0019] 請續參照第十圖，係為本創作之鰭片式散熱器的再一實 施例；本實施例中，鰭片式散熱器lc包含有一導熱座10c 、複數散熱鰭片20c、設置在該導熱座10c上的複數壓掣 片3 0c、及複數定位體40c，且每一散熱鰭片20c的底端 垂直延伸有一固定板21c，該固定板21c係設有複數穿孔 210c，該壓掣片30c設有複數結合孔300c，該定位體40c 係為一螺栓。 [0020] 本實施例與前一實施例不同的地方在於，該導熱座10c的 固定孔100b分別對應設為一螺孔，該螺栓係自該導熱座 10c的一側邊依序穿設該結合孔300c及該穿孔210c，繼 而鎖合在該螺孔中，以令該壓掌片30c壓擎該固定板21c ，並使該固定板21c平面貼接該導熱座10c，藉此提高導 熱效率。 表單編號A0101 第7頁/共21頁 [0021]M416308 [0022] [0023] [0024] [0025] [0026] [0027] [0028] [0029] [0030] [0031] [0032] [0033] [0034] [0035] 表單編號A0101 以上所述僅為本創作之較佳實施例，非用以限定本創作 之專利範圍，其他運用本創作之專利精神之等效變化， 均應俱屬本創作之專利範圍。 【圖式簡單說明】 第一圖係本創作鰭片式散熱器的立體分解圖； 第二圖係本創作鰭片式散熱器的組合示意圖； 第三圖係本創作鰭片式散熱器的壓掣示意圖之一； 第四圖係本創作鰭片式散熱器的壓掣示意圖之二； 第五圖係本創作鰭片式散熱器壓掣後的立體外觀示意圖 9 第六圖係本創作鰭片式散熱器壓掣後的組合剖視圖； 第七圖係本創作之鰭片式散熱器的另一實施例； 第八圖係本創作之鰭片式散熱器的又一實施例的組合示 意圖； 第九圖係第八圖的組合示意圖； 第十圖本創作之鰭片式散熱器的再一實施例。 【主要元件符號說明】 1鰭片式散熱器 2壓治具 10導熱座 20散熱鰭片 第8頁/共21頁 M4163.08M416308 V. New description: [New technical field] [0001] This creation is related to the heat sink, especially the fixed structure of a finned heat sink. [Prior Art] [0002] With the rapid development of technology, the computing speed of internal components of electronic products increases, and the heat generated per unit area is also greatly improved. Therefore, most electronic components are provided with heat sinks to control the operating temperature and maintain the electronics. The normal operation of the components. [0003] At present, most of the common radiators on the market have a plurality of heat-dissipating fins arranged in parallel, and the heat-dissipating fins can be formed by an aluminum extrusion process or a stamping method; however, the aluminum-extruded heat-dissipating fins are processed by the process. The upper limit is that there must be a certain distance between the fins, so the number of fins disposed in a certain outer dimension is small, so that the heat sink cannot have a heat sink fin with higher density; The heat-dissipating fins formed by stamping can be set to a high density to utilize a wide range of heat-dissipating areas to improve heat dissipation efficiency, so that they have a place in the market. [0004] One of the fixing methods of the stamping type heat dissipating fins is that a plurality of grooves are formed on the surface of the heat conducting seat, and the heat dissipating fins are inserted into the grooves, and then the two sides of the grooves are punched. The two sides of the groove are deformed by force, and the heat sink fins are clamped in the heat conducting seat. However, when the heat dissipating fins are embedded by stamping, the heat dissipating fins are often not tightly bonded to the heat conducting seat, so that the heat dissipating fins are prone to looseness; and further, embedded in the trenches. The heat sink fins are usually only partially in contact with the form number A0101. Page 3 of 21 M416308 hot seat. Because of the small contact area between the two, the heat of the heat transfer seat cannot be quickly conducted to the heat sink fins. [0005] In view of this, in order to improve and solve the above-mentioned shortcomings, the present creator has devoted himself to research and cooperates with the application of the theory, and finally proposes a creation that is reasonable in design and effective in improving the above-mentioned defects. [New Content] [0006] One of the aims of the present invention is to provide a fin-type heat sink fixing structure that can quickly conduct heat of a heat-conducting seat to a heat-dissipating fin to improve heat conduction efficiency. Another object of the present invention is to provide a finned heat sink fixing structure for tightly bonding heat radiating fins to a heat conducting seat. [0008] In order to achieve the above object, the present invention is a fin-type heat sink fixing structure, comprising a heat-conducting seat, a plurality of heat-dissipating fins, a plurality of pressing pieces and a plurality of positioning bodies, wherein the heat-dissipating fins are arranged in parallel and at intervals On the heat-conducting base, a fixing plate is vertically extended at a bottom end of each of the heat-dissipating fins, and the fixing plate is provided with a plurality of perforations, and the pressing piece is disposed corresponding to the heat-dissipating fins, and each pressing piece is disposed on the fixing plate, and is provided corresponding to the perforation The plurality of combined holes are fixed on the heat conducting seat, the positioning body is pierced through the through holes and the connecting holes, and is positioned on the pressing piece, so that the pressing piece presses the fixing plate and the surface is attached to the heat conducting seat. [0009] Compared with the prior art, the fixing plate at the bottom end of the heat dissipating fin of the present invention is provided with a plurality of perforations, and a plurality of positioning bodies are disposed on the heat conducting seat, and the corresponding cooling fins are provided with a plurality of pressing pieces, and then by positioning The positioning of the body is pressed to press the pressing plate to press the fixing plate, thereby fixing the fixing plate plane to the heat conducting seat, so that a heat conduction manner between the fixing plate and the heat conducting seat is formed to face the heat conduction form No. A0101 4 pages / a total of 21 pages M416308 seat heat is quickly transmitted to the heat sink fins, in order to improve the heat transfer efficiency; in addition, the positioning system of this creation is pressed to form a pressure block on the pressure plate, which can be fixed plate Tightly bonded to the heat transfer seat, thereby achieving a finned heat sink with stable structure and good heat conduction efficiency. [Embodiment] The detailed description and technical contents of the present invention are described below with reference to the drawings, but the drawings are only for reference and description, and are not intended to limit the creation. [0011] Please refer to the first figure and the second figure, which are respectively an exploded perspective view and a combined schematic view of the finned heat sink. The finned heatsink 1 of the present invention includes a heat conducting seat 10 and a plurality of heat radiating fins. The sheet 20, the plurality of compression tabs 30, and the plurality of positioning bodies 40. [0012] The heat conducting seat 10 is made of a metal having good thermal conductivity, and the heat radiating fins 20 are disposed on the heat conducting base 10 in parallel and at intervals. A fixing plate 21 is defined in the bottom end of each of the heat dissipating fins 20, and the fixing plate 21 is provided with a plurality of through holes 210. Further, a positioning piece 22 is vertically extended on two sides of the heat dissipating fins 20, and adjacent heat dissipating fins are respectively disposed. The fixing plate 21 and the positioning piece 22 are abutted against each other to form the heat dissipation channel 220. [0013] The pressing pieces 30 are disposed corresponding to the heat dissipating fins 20, that is, the shape of the pressing piece 30 is the size and shape of the fixing plate 21, so that the pressing pieces 30 are disposed. On the fixing plate 21, a plurality of coupling holes 30 0 are provided for the perforations 210. Furthermore, the positioning bodies 40 are fixed on the heat conducting base 10, and each of the positioning bodies 40 passes through the through holes 210 and the coupling holes 300. Form No. A0101 Page 5 of 21 M416308 [0014] In the embodiment, the positioning bodies 4 are respectively a protruding column, and the positioning bodies 40 are integrally formed with the heat conducting base 1 , and the protruding columns are aligned on the heat conducting seat corresponding to the through holes 210 . . [0015] Please continue to refer to the third to sixth circles, which are respectively a schematic view of the two-pressed fin of the created finned heat sink, a schematic view of the three-dimensional appearance after pressing, and a combined sectional view after pressing; The heat dissipating fins 2 and the pressing fins 30 are disposed through the positioning bodies 4 and are disposed behind the heat conducting seat. Then, the pressing operation is performed, and the positioning bodies 4 are pressed by a pressing jig 2, and the positioning bodies 40 are deformed to be positioned on the pressing pieces 3A. In this embodiment, the positioning body 40 is compressed to form a pressing palm block 4 大于 on the pressing piece 3 大于 which is larger than the s-sea coupling hole 300 and the hole 21 〇 aperture. The block 40' is pressed in an oblate manner to press the pressing piece 3〇, and the pressing piece 30 is pressed against the fixing plate 21 so that the fixing plate 21 is planarly attached to the heat conducting seat 10 〇 [0016] Referring to FIG. 7 again, it is another embodiment of the finned heat sink of the present invention. In the embodiment, the finned heat sink 13 includes a heat conducting seat l〇a and a plurality of heat radiating fins 20a disposed thereon. The plurality of pressing pieces 30a on the heat conducting base 10a and the plurality of positioning bodies 4a, a bottom end of each of the heat radiating fins 2〇3 vertically extends a fixing plate 21a, and each pressing piece 30a is pressed against the fixing plate 21a. Upper, the shoal positioning body 4〇a is deformed by the pressure and positioned on the pressure piece 30a. The difference from the first embodiment is that the positioning bodies 4〇a are separated from the heat conducting base 10a, and the heat conducting seat 1〇a is provided with a plurality of grooves 100a'. The groove i〇〇a. [0017] Please refer to FIG. 8 and FIG. 9 again, which is another embodiment of the finned heat sink of the present invention; in this embodiment, the finned heatsink 11} includes a form number A0101. A plurality of heat-dissipating blocks 10b, a plurality of heat-dissipating fins 20b, a plurality of pressing pieces 30b disposed on the heat-conducting seat 10b, and a plurality of positioning bodies 40b, and a fixing plate 21b extending perpendicularly from a bottom end of each of the heat-dissipating fins 20b The fixing plate 21b is provided with a plurality of through holes 210b, and the pressing piece 30b is provided with a plurality of coupling holes 300b. [0018] This embodiment is different from the first embodiment in that the positioning body 40b is a bolt, and The heat conducting base 10b is correspondingly provided with a plurality of fixing holes 100b, and the connecting holes 300b are correspondingly arranged as a screw hole. The bolts are sequentially inserted through the fixing holes 100b and the through holes 210b from one side of the pressing piece 30b. Then, it is locked in the screw hole 300b, and is positioned on the pressing piece 30b, and the pressing piece 30b is pressed against the fixing plate 21b, so that the fixing plate 11b is planarly attached to the heat conducting block lb. . [0019] Please refer to the tenth embodiment, which is a further embodiment of the finned heat sink of the present invention; in this embodiment, the finned heat sink lc includes a heat conducting seat 10c, a plurality of heat radiating fins 20c, and a setting A plurality of pressing plates 30c and a plurality of positioning bodies 40c are disposed on the heat conducting base 10c, and a fixing plate 21c is vertically extended at a bottom end of each of the heat radiating fins 20c. The fixing plate 21c is provided with a plurality of through holes 210c. The crotch panel 30c is provided with a plurality of coupling holes 300c which are a bolt. [0020] The difference between the embodiment and the previous embodiment is that the fixing holes 100b of the heat conducting base 10c are respectively corresponding to a screw hole, and the bolt is sequentially inserted from one side of the heat conducting seat 10c. The hole 300c and the through hole 210c are then locked in the screw hole to press the pressing piece 30c against the fixing plate 21c, and the fixing plate 21c is planarly attached to the heat conducting seat 10c, thereby improving heat conduction efficiency. Form No. A0101 Page 7 / 21 pages [0021] M416308 [0023] [0023] [0023] [0023] [0033] [0033] [0035] Form No. A0101 The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the patent of the present creation, and other equivalent changes of the patent spirit using the creation of the creation are all in this creation. The scope of the patent. [Simple description of the diagram] The first figure is an exploded view of the finned heat sink of the present invention; the second figure is a combination diagram of the finned heat sink; the third figure is the pressure of the finned heat sink One of the schematic diagrams; the fourth diagram is the second schematic diagram of the fin-type heat sink of the present invention; the fifth diagram is the three-dimensional appearance of the finned radiator after compression. A sectional view of a finned heat sink of the present invention; a seventh embodiment is a schematic view of a further embodiment of the finned heat sink of the present invention; 9 is a combination diagram of the eighth figure; FIG. 10 is a further embodiment of the finned heat sink of the present invention. [Main component symbol description] 1 Fin-type heat sink 2 Pressure fixture 10 Thermal relay 20 Thermal fins Page 8 of 21 M4163.08

[0036] 21 固定板 [0037] 210 穿孔 [0038] 22 定位片 [0039] 220 散熱通道 [0040] 30 壓掣片 [0041] 300 結合孔 [0042] 40 定位體 [0043] 40, 壓掣塊 [0044] 1 a 鰭片式散熱器 [0045] 10a 導熱座 [0046] 100a凹槽 [0047] 20a 散熱鰭片 [0048] 21a 固定板 [0049] 30a 壓掣片 [0050] 40a 定位體 [0051] lb 鰭片式散熱器 [0052] 10b 導熱座 [0053] 100b固定孔 [0054] 20b 散熱鰭片 表單編號A0101 第9頁/共21頁 M416308 [0055] 21b 固定板 [0056] 210b 穿孔 [0057] 30b 壓掣片 [0058] 300b 結合孔 [0059] 40b 定位體 [0060] lc鰭片式散熱器 [0061] 10c 導熱座 [0062] 100c 固定孔 [0063] 20c 散熱鰭片 [0064] 21c 固定板 [0065] 210c 穿孔 [0066] 30c 壓掣片 [0067] 300c 結合孔 [0068] 40c 定位體 表單編號A0101 第10頁/共21頁21 fixing plate [0037] 210 perforation [0038] 22 positioning piece [0039] 220 heat dissipation channel [0040] 30 compression plate [0041] 300 bonding hole [0042] 40 positioning body [0043] 40, pressing block 1 a finned heat sink [0045] 10a heat conducting seat [0046] 100a groove [0047] 20a heat sink fin [0048] 21a fixing plate [0049] 30a pressure plate [0050] 40a positioning body [0051 ] lb Fin Heat Sink [0052] 10b Thermal Conductor [0053] 100b Fixed Hole [0054] 20b Heat Sink Form No. A0101 Page 9 / Total 21 M416308 [0055] 21b Fixed Plate [0056] 210b Perforated [0057] 30b Pressure plate [0058] 300b Bonding hole [0059] 40b Positioning body [0060] lc finned heat sink [0061] 10c Thermal conductive seat [0062] 100c Fixed hole [0063] 20c Heat sink fin [0064] 21c Fixed Plate [0065] 210c Perforation [0066] 30c Pressing plate [0067] 300c Bonding hole [0068] 40c Positioning body form number A0101 Page 10 of 21

Claims (1)

M416308 「、申請專利範圍： 1 . 一種鰭片式散熱器固定結構，包括： 一導熱座； 複數散熱鰭片，平行且間隔地設置在該導熱座上，每一散 熱鰭片的底端垂直延伸有一固定板，該固定板係設有複數 穿孔； 複數壓掣片，對應該些散熱鰭片設置，各該壓掣片係安置 在該固定板上，並對應該些穿孔而設有複薇結合孔；以及 複數定位體，固定在該導熱座上，該定位體係穿設該穿孔 及該結合孔，並定位在該壓掣月上，以令該壓掣片壓掣該 固定板而平面貼接該導熱座。 2. 如請求項1所述之鰭片式·散熱器固定結構，其中該散熱鰭 片的二側分別垂直延伸有一定位片，且相鄰散熱鰭片的定 位片相互抵接。 3. 如請求項1所述之鰭片式散熱器固定結構，其中該壓掣片 的外型係對應該固定板的大小及形狀。 4. 如請求項1所述之鰭片式散熱器固定結構，其中該些定位 體係分別為一凸柱，該些凸柱係對應該等穿孔而排列在該 導熱座上。 5. 如請求項4所述之鰭片式散熱器固定結構，其中該些定位 體與該導熱座係為一體成型。 6. 如請求項4所述之鰭片式散熱器固定結構，其中該些定位 體與該導熱座係為分離設置，該導熱座設有複數凹槽，該 等定位體分別固定在該凹槽中。 7. 如請求項5或6所述之鰭片式散熱器固定結構，其中該定位 100209642 表單編號A0101 第11頁/共21頁 1002031564-0 M416308 體係經壓掣而在該壓掣片上形成有大於該結合孔孔徑的一 壓掣塊。 8 .如請求項7所述之鰭片式散熱器固定結構，其中該壓掣塊 係呈扁圓狀。 9.如請求項1所述之鰭片式散熱器固定結構，其中該定位體 係為一螺栓，該結合孔係對應設為一螺孔。 10.如請求項9所述之鰭片式散熱器固定結構，其中該導熱座 設有複數固定孔，該螺栓係穿設該固定孔及該穿孔而鎖合 在該螺孔中。 11 .如請求項1所述之鰭片式散熱器固定結構，其中該定位體 為一螺栓，該導熱座設有複數固定孔，該些固定孔分別對 應設為一螺孔，該螺栓係穿設該結合孔及該穿孔而鎖合在 該螺孔中。 100209642 表單編號A0101 第12頁/共21頁 1002031564-0M416308 ", the scope of patent application: 1. A finned heat sink fixing structure, comprising: a heat conducting seat; a plurality of heat radiating fins disposed in parallel and spaced apart on the heat conducting seat, the bottom end of each heat radiating fin extending vertically There is a fixing plate, the fixing plate is provided with a plurality of perforations; a plurality of pressing pieces are arranged corresponding to the heat dissipating fins, and each of the pressing pieces is disposed on the fixing plate, and the reaming combination is provided for the perforations And a plurality of positioning bodies fixed on the heat conducting seat, the positioning system piercing the through hole and the coupling hole, and positioning on the pressing month, so that the pressing piece is pressed against the fixing plate and planarly attached The fin-type heat sink fixing structure according to claim 1, wherein a positioning piece is vertically extended on two sides of the heat dissipating fin, and the positioning pieces of the adjacent heat dissipating fins abut each other. 3. The finned heat sink fixing structure according to claim 1, wherein the shape of the pressing piece corresponds to the size and shape of the fixing plate. 4. The finned heat sink according to claim 1 is fixed. Structure, which The fins are respectively arranged on the heat conducting seat, and the fins are fixed on the heat conducting seat. The finned heat sink fixing structure according to claim 4, wherein the positioning body and the heat conducting seat The finned heat sink fixing structure according to claim 4, wherein the positioning bodies are separated from the heat conducting base, and the heat conducting seat is provided with a plurality of grooves, and the positioning bodies are respectively The finned heat sink fixing structure according to claim 5 or 6, wherein the positioning 100209642 form number A0101 page 11 / 21 page 1002031564-0 M416308 system is compressed The pressure piece is formed with a pressure block which is larger than the hole diameter of the joint hole. The fin type heat sink fixing structure according to claim 7, wherein the pressure block is oblate. The fin-type heat sink fixing structure of the present invention, wherein the positioning system is a bolt, and the coupling hole is correspondingly configured as a screw hole. 10. The fin-type heat sink fixing structure according to claim 9, wherein the The heat conducting seat is provided with a plurality of fixing holes, and the bolts are worn The fixing hole and the through hole are locked in the screw hole. The fin type heat sink fixing structure according to claim 1, wherein the positioning body is a bolt, and the heat conducting seat is provided with a plurality of fixing holes, The fixing holes are respectively corresponding to a screw hole, and the bolt is inserted into the screw hole through the coupling hole and the through hole. 100209642 Form No. A0101 Page 12 of 21 1002031564-0
TW100209642U 2011-05-27 2011-05-27 Fin type heat sink fastening structure TWM416308U (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
TW100209642U TWM416308U (en) 2011-05-27 2011-05-27 Fin type heat sink fastening structure
DE201220100573 DE202012100573U1 (en) 2011-05-27 2012-02-21 Mounting structure of a heat sink with cooling fins
JP2012001038U JP3175529U (en) 2011-05-27 2012-02-27 Fixing structure of heatsink using fins

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI451061B (en) * 2012-03-08 2014-09-01 Asia Vital Components Co Ltd Thermal module and manufacturing method thereof

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104329978A (en) * 2014-02-26 2015-02-04 何钨辉 Cooling fin mounting disc
CN108714752B (en) * 2018-06-20 2023-12-12 江苏英杰电子器件有限公司 Welding equipment for radiator assembly unit
EP3663642A1 (en) * 2018-12-04 2020-06-10 ZKW Group GmbH Heat sink for a motor vehicle light module

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI451061B (en) * 2012-03-08 2014-09-01 Asia Vital Components Co Ltd Thermal module and manufacturing method thereof

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