CN101989113B - Heat dissipation system and computer with same - Google Patents
Heat dissipation system and computer with same Download PDFInfo
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- CN101989113B CN101989113B CN 200910089990 CN200910089990A CN101989113B CN 101989113 B CN101989113 B CN 101989113B CN 200910089990 CN200910089990 CN 200910089990 CN 200910089990 A CN200910089990 A CN 200910089990A CN 101989113 B CN101989113 B CN 101989113B
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Abstract
The invention discloses a heat dissipation system and a computer with the same, which are used for transferring heat produced by at least one heating element in a first device of turnover type opening equipment to a second device to dissipate the heat. The heat dissipation system comprises a first heat pipe, a second heat pipe and a heat dissipation connector, wherein the first heat pipe comprises a first end and a second end; the first end is connected with the at least one heating element; the second heat pipe comprises a third end and a fourth end; the third end is connected with a heat dissipation component on the second device; the heat dissipation connector is fixedly connected with the first device; the outer side face of the heat dissipation connector is connected with the second end; a hollow cavity with an opening is also formed on the heat dissipation connector; the fourth end is inserted into the hollow cavity through the opening to close the opening; and the second device turns over relative to the first device and drives the second heat pipe to rotate relative to the heat dissipation connector through the heat dissipation component. In the heat dissipation system and the computer, the heat pipe and the heat dissipation connector are arranged in the way that the two can rotate relatively so as to adapt to the turnover structure of a notebook computer.
Description
Technical field
The present invention relates to field of computer technology, refer in particular to a kind of cooling system and have the computing machine of this cooling system.
Background technology
As everyone knows, computing machine in the course of the work, the key components such as the key chip such as inner central processing unit, north and south bridge, video card and hard disk, internal memory can produce heat raises the computer-internal temperature, because the normal operation of each chip and component has certain requirement to working temperature in the computing machine, can generating chip when excess Temperature and element job insecurity even the situation such as be damaged, so cooling system plays vital effect to the reliable and stable operation of computing machine.
The cooling system of existing notebook computer, normally utilize heat pipe that the heat that main frame internal heat generation element produces is conducted to radiating fin, convection heat transfer by fan and radiating fin to reduce the temperature of heater element, reaches the purpose of cooling heat dissipation with dissipation of heat.
And because the casing of liquid crystal display has larger area of dissipation, can greatly strengthen the radiating efficiency of whole notebook system by utilizing this part casing surface radiating.Because the main frame of turnover type notebook connects by rotating shaft with liquid crystal display, liquid crystal display can be overturn with respect to main frame, therefore how on the shell of transferring to the notebook computer liquid crystal display with element heat high efficient and reliable in the system, while can adapt to the overturn structure of notebook computer, becomes the design focal point of laptop radiating system.
Summary of the invention
The purpose of technical solution of the present invention provides a kind of cooling system and has the computing machine of this cooling system, and the rotational structure of described cooling system adapts to the convertible equipment characteristic of opening, and safety, reliable.
For achieving the above object, one aspect of the present invention provides a kind of cooling system, conducts on the second device for the heat that the convertible interior at least one heater element of first device of opening equipment is produced to distribute, and described cooling system comprises:
The first heat pipe comprises first end and the second end, and wherein said first end is connected with described at least one heater element;
The second heat pipe comprises the 3rd end and the 4th end, wherein said the 3rd end with described second the device on thermal component be connected;
The heat radiation connector, be fixedly connected with described first device, the lateral surface of described heat radiation connector is connected with described the second end, also form a hollow cavity with opening on the described heat radiation connector, described the 4th end of described the second heat pipe is inserted in the described hollow cavity by described opening, by described the 4th end with described closure of openings;
Described the second device drives described the second heat pipe by the described thermal component on described the second device and rotates relative to the described heat radiation connector that is fixed on the described first device with respect to described first device upset.
Preferably, cooling system described above, described heat radiation connector comprises the first heat radiator and the second heat radiator, be formed with the first groove on described the first heat radiator, be formed with the second groove on described the second heat radiator, fasten relative with described the second groove of described the first groove consists of described hollow cavity.
Preferably, cooling system described above, the office, joint portion of described the first heat radiator and described the second heat radiator arranges O-ring seal, is used for sealing described hollow cavity.
Preferably, cooling system described above, described hollow cavity internal circulation has heat-conducting medium, by described heat-conducting medium the heat of described heat radiation connector is conducted to described the 4th end, and be formed with groove and/or aperture on the inwall of described hollow cavity, store and carry described heat-conducting medium by described groove and/or aperture.
Preferably, cooling system described above is respectively arranged with hygrosensor on described the first heat pipe and described the second heat pipe, is used for the temperature of described the first heat pipe of Real-Time Monitoring and described the second heat pipe.
The present invention also provides a kind of computing machine on the other hand, comprise main frame and liquid crystal display, described main frame is connected by turning axle with described liquid crystal display, described computing machine also comprises a cooling system, the shell that conducts to described liquid crystal display for the heat that at least one heater element in the described main frame is produced distributes, and described cooling system comprises:
The first heat pipe comprises first end and the second end, and wherein said first end is connected with described at least one heater element;
The second heat pipe comprises the 3rd end and the 4th end, and wherein said the 3rd end is connected with described shell;
The heat radiation connector, be fixedly connected with described main frame, the lateral surface of described heat radiation connector is connected with described the second end, also form a hollow cavity with opening on the described heat radiation connector, described the 4th end of described the second heat pipe is inserted in the described hollow cavity by described opening, by described the 4th end with described closure of openings;
Described liquid crystal display is overturn with respect to described main frame, and the described shell by described liquid crystal display drives described the second heat pipe and rotates relative to the described heat radiation connector that is fixed on the described main frame.
Preferably, computing machine described above, described hollow cavity and the described rotating shaft coaxle heart arrange, and described the second heat pipe passes described turning axle and extends setting at the medial surface of described shell.
Preferably, computing machine described above, described heat radiation connector comprises the first heat radiator and the second heat radiator, is formed with the first groove on described the first heat radiator, be formed with the second groove on described the second heat radiator, fasten relative with described the second groove of described the first groove consists of described hollow cavity.
Preferably, computing machine described above is respectively arranged with hygrosensor on described the first heat pipe and described the second heat pipe, is used for the temperature of described the first heat pipe of Real-Time Monitoring and described the second heat pipe.
Preferably, computing machine described above is provided with a thermofin between the display panels of described the second heat pipe and described liquid crystal display.
In the technique scheme at least one has following beneficial effect:
(1) described cooling system and have the computing machine of this cooling system with being set to relatively rotate form between heat pipe and the heat radiation connector, can be adapted to the convertible structure of notebook computer;
(2) by seal with elastometic washer being set, using the rubber shell fragment to fix that heat pipe, internal groove store/transmit heat-conducting medium and with the temperature of hygrosensor monitoring heat pipe, can guarantee heat transfer efficiency and the fiduciary level of cooling system.
Description of drawings
Fig. 1 is the unitized construction schematic diagram of the described cooling system of the specific embodiment of the invention;
Fig. 2 is the decomposition texture schematic diagram of the described cooling system of the specific embodiment of the invention;
Fig. 3 is the structural representation of the heat radiation of first in the described cooling system of specific embodiment of the invention lamellar body;
Fig. 4 is the structural representation of the described computing machine of the specific embodiment of the invention.
Embodiment
For making the purpose, technical solutions and advantages of the present invention clearer, describe the present invention below in conjunction with the accompanying drawings and the specific embodiments.
The described cooling system of the specific embodiment of the invention is set to by dispel the heat connector and heat pipe can counterrotating version, described cooling system can be adapted to have the equipment of two relative overturn structures, when wherein a device is with respect to another device upset, the heat pipe of cooling system rotates with respect to the heat radiation connector thereupon, the heat of a wherein device inner part generation is conducted to another device, and guarantee heat conducting high efficiency, reliability and safety.
In the described cooling system of the specific embodiment of the invention, the heat radiation connector connects two heat pipes, this two heat pipe is connected to respectively the heater element of first device and the heat dissipation element of the second device, this heat radiation connector has a hollow cavity, wherein a heat pipe is inserted in this cavity and sealing, and wherein a heat pipe can be with respect to the rotation of heat radiation connector in this cavity for this, when making like this first device with respect to the second device upset, this wherein a heat pipe rotate thereupon, be the equipment that overturn structure is opened to adapt to this.
Below will be described in detail the described cooling system of the specific embodiment of the invention.
Fig. 1 is the unitized construction schematic diagram of the described cooling system of the specific embodiment of the invention.Consult Fig. 1, described cooling system comprises heat radiation connector 10, the first heat pipe 20 and the second heat pipe 30.
Consult Fig. 1, described the first heat pipe 20 comprises first end and the second end, wherein first end be connected to one with contacted heat conduction copper billet 50, the second ends of heater element be connected to the heat radiation connector 10.It will be understood by those skilled in the art that common cooling system also comprises a heat conductor, heat conductor is positioned between heater element and the heat conduction copper billet 50.The first heat pipe 20 is connected with heat conduction copper billet 50, by heat conduction copper billet 50 heat that the heater element (not shown) produces is conducted to the first heat pipe 20, by the first heat pipe 20 heat is conducted on the heat radiation connector 10 afterwards.In addition, as shown in Figure 1, heat conduction copper billet 50 and the first heat pipe 20 also support placement by supporting copper billet 40 respectively.
The inside formation one of described heat radiation connector 10 has the hollow cavity of opening, described the second heat pipe 30 comprises the 3rd end and the 4th end, wherein the 4th end is inner by the hollow cavity that opening is inserted in heat radiation connector 10, and the insertion by this end makes closure of openings, the 4th end of the second heat pipe 30 is at the opening part and heat radiation connector 10 close contacts of hollow cavity, more can extend insertion hollow cavity inside is connected with heat radiation connector 10 close contacts, the heat of heat radiation connected body 10 can be transmitted on the second heat pipe 30 effectively, and this second heat pipe 30 can also rotate in hollow cavity with respect to heat radiation connector 10 in addition.The 3rd end of described the second heat pipe 30 is connected to a thermal component (not shown), working as like this first heat pipe 20 is fixedly installed in the first device with heat radiation connector 10, when thermal component overturns with respect to first device, can drive the second heat pipe 30 and in the hollow cavity of heat radiation connector 10, relatively rotate, to adapt to the device of this overturn structure.
Fig. 2 is the decomposition texture schematic diagram of the described cooling system of the specific embodiment of the invention, and described heat radiation connector 10 comprises the first heat radiation lamellar body 11 and the second heat radiation lamellar body 12.Being formed with respectively a cross section on this first heat radiation lamellar body 11 and the second heat radiation lamellar body 12 is semicircular groove 111 (consulting the bottom surface structure schematic diagram of the first heat radiation lamellar body 11 of Fig. 3) and 121, this first heat radiation lamellar body 11 and the second heat radiation lamellar body 12 are installed by screw association, make two grooves 111 fastening relative to 121 be sealing all around, only have an end to have the hollow cavity of opening, the cross section of this hollow cavity is combined as circle.
Consult Fig. 2, the 4th end of described the second heat pipe 30 is set to cylindrical structural, and make the length of the second heat pipe 30 the 4th end cylindrical structural identical with the length of heat radiation connector 10 hollow cavities, these the second heat pipe 30 cylindrical the 4th ends are inserted in the hollow cavity, and can rotate with respect to heat radiation connector 10 in hollow cavity.
It will be understood by those skilled in the art that as improving the heat conduction efficiency of cooling system, be welded to connect between the first heat pipe 20 and the heat radiation connector 10; Need to fill heat-conducting medium between heat radiation connector 10 hollow cavities and the second heat pipe 30.Consult Fig. 3, the medial surface of the first heat radiation lamellar body 11 also is formed with many grooves 112 and a plurality of aperture 113, in order to store and to carry heat-conducting medium, guarantee that the second heat pipe 30 has enough heat-conducting mediums when rotating with respect to heat radiation connector 10, guarantee the good heat transfer effect of 10 of the second heat pipe 30 and heat radiation connectors, pass through like this heat-conducting medium, can greatly improve the heat conduction efficiency of cooling system, the heat that further effectively heater element is produced conducts to the thermal component place by the first heat pipe 20, heat radiation connector 10 and the second heat pipe 30.
When avoiding the second heat pipe 30 to rotate in heat radiation connector 10 hollow cavities heat-conducting medium rush down leakage, the first heat radiation lamellar body 11 also is provided with a rubber ring 31 with the junction that is connected of the second heat radiation lamellar body 12, is used for making the opening part sealing of the connection joint of two heat radiation lamellar bodies and second heat pipe 30 of planting.In addition, in heat radiation connector 10 hollow cavities, also be provided with two rubber Figure 32 on this part second heat pipe 30 of cylindrical structure, when the first heat radiation lamellar body 11 and 12 combination of the second heat radiation lamellar body, two rubber rings 32 are fixed in the hollow cavity, and be fastened on the second heat pipe 30, when guaranteeing that the second heat pipe 30 rotates in heat radiation connector 10 hollow cavities can with heat radiation connector 10 good contacts.
In the described cooling system of the specific embodiment of the invention, best, the first heat pipe 20 first ends are near the position of heat conduction copper billet 50 junctions that contact with euthermic chip, and the middle part of the second heat pipe 30 arranges respectively a hygrosensor, in order to the temperature of Real-Time Monitoring the first heat pipe 20 and the second heat pipe 30, guarantee the security of cooling system.
In addition, such as Fig. 2, the link position of the first heat pipe 20 and heat radiation connector 10, be positioned at the opposite side that the second heat radiation lamellar body 12 forms groove, best, identical for guaranteeing that the first heat pipe 20 can effectively conduct to heat heat radiation connector 10, the first heat pipes 20 and heat radiation connector 10 the dispel the heat length of lamellar body 12 of the length and first of part that combines, these the first heat pipe 20 belows arrange copper billet 21 in addition, and heat conducts to the efficient of heat radiation connector 10 and increases structural strength on the first heat pipe 20 to strengthen.
It will be appreciated by those skilled in the art that, the cooling system of said structure can be applied to a notebook computer, therefore the present invention also provides a kind of computing machine with above-mentioned cooling system on the other hand, the main frame of this computing machine is connected by turning axle with liquid crystal display, and liquid crystal display can be opened with respect to the main frame upset by turning axle.
Be the structural representation of computing machine as described in the specific embodiment of the invention such as Fig. 4, heater element 60 in the computing machine, as be central processing unit, video card or north bridge chips, fitting with the heat conduction copper billet 50 (consulting Fig. 1) of cooling system is connected and is positioned on the heat conduction copper billet 50, and this heat conduction copper billet 50, heater element 60 and the first heat pipe 20 support and are positioned in the main frame 100 by supporting copper billet 40 respectively.This heater element 60 is connected with the first end of the first heat pipe 20 by this heat conduction copper billet 50, and the second end of this first heat pipe 20 is connected to heat radiation connector 10.
Consult Fig. 4, this heat radiation connector 10 arranges with the rotating shaft concentric of notebook computer, and is fixedly installed on the main frame 100, and the structure of heat radiation connector 10 is consulted shown in Figure 2, comprises the first heat radiation lamellar body 11 and the second heat radiation lamellar body 12.Being formed with respectively a cross section on the first heat radiation lamellar body 11 and the second heat radiation lamellar body 12 is semicircular groove 111 and 121, this first heat radiation lamellar body 11 and the second heat radiation lamellar body 12 are installed by screw association, make two grooves 111 fastening relative to 121 for around sealing, only have an end to have opening, cross section and be circular hollow cavity.
The second heat pipe 30 comprises the 3rd end and the 4th end, the 4th end is inserted in the hollow cavity of heat radiation connector 10 after passing the rotating shaft 300 of notebook computer, the 3rd end extends along the case surface of liquid crystal display 200, the heat of main frame 100 internal heat generation elements 60 generations namely can conduct to by heat conduction copper billet 50, the first heat pipe 20, heat radiation connector 10 and the second heat pipe 30 case surface of liquid crystal display like this, by this case surface with the heat bulk storage in environment, to reduce the temperature of heater element 60, reach the purpose of cooling heating element 60.
Because the second heat pipe 30 passes rotating shaft 300 and is inserted in the heat radiation connector 10, and heat radiation connector 10 is fixing with respect to main frame 100, therefore when liquid crystal display 200 with respect to main frame 100 Unscrews or when closing, rotation along with rotating shaft 300, the second heat pipe 30 rotates with respect to heat radiation connector 10 thereupon, therefore the structural design that cooperates with the heat radiation connector of this kind heat pipe can adapt to the convertible structure of notebook computer, the heat of component generation in the main frame effectively is transferred to the shell of liquid crystal display and distributes.
Based on above-mentioned cooling system, for avoiding the liquid-crystal display section excess Temperature of liquid crystal display 200, best, a thermofin (not shown) is set in addition also between the second heat pipe 30 and the display panels, overheated and damage to avoid display panels.
In addition, in the specific embodiment of the invention, the first heat pipe 20 first ends near with the position of heat conduction copper billet 50 junctions, and the middle part of the second heat pipe 30 arranges respectively a hygrosensor, in order to the temperature of Real-Time Monitoring the first heat pipe 20 and the second heat pipe 30, guarantee the prompting under the second heat pipe 30 and the heat radiation connector 10 Joint failure situations.
It will be understood by those skilled in the art that the first heat pipe 20 is welded and fixed with heat radiation connector 10 in order to improve the heat conduction efficiency of cooling system; Also fill heat-conducting medium in heat radiation connector 10 hollow cavities, the heat of described heat radiation connector is conducted to the 4th end of described the second heat pipe 30 by described heat-conducting medium, and the medial surface of the first heat radiation lamellar body 11 also is formed with many grooves 112 and a plurality of aperture 113, in order to store and to carry heat-conducting medium, guarantee that the second heat pipe 30 has enough heat-conducting mediums when rotating with respect to heat radiation connector 10, guarantee the good heat transfer effect of 10 of the second heat pipe 30 and heat radiation connectors.
When avoiding the second heat pipe 30 to rotate in heat radiation connector 10 hollow cavities heat-conducting medium rush down leakage, such as Fig. 2, the first heat radiation lamellar body 11 also is provided with a rubber ring 31 with the junction that is connected of the second heat radiation lamellar body 12, is used for making the opening part sealing of the connection joint of two heat radiation lamellar bodies and second heat pipe 30 of planting.In addition, in heat radiation connector 10 hollow cavities, also be provided with two rubber rings 32 on this part second heat pipe 30 of cylindrical structure, when the first heat radiation lamellar body 11 and 12 combination of the second heat radiation lamellar body, two rubber rings 32 are fixed in the hollow cavity, and be fastened on the second heat pipe 30, when guaranteeing that the second heat pipe 30 rotates in heat radiation connector 10 hollow cavities can with heat radiation connector 10 good contacts.
Comprehensively above-mentioned, the described cooling system of the specific embodiment of the invention and have the computing machine of this cooling system, to be set to relatively rotate form between heat pipe and the heat radiation connector, can be adapted to the convertible structure of notebook computer, and by seal with elastometic washer being set, using the rubber shell fragment to fix heat pipe, utilize internal groove to store/transmit heat-conducting medium and adopt hygrosensor to monitor the temperature of heat pipe, guaranteed heat transfer efficiency and the fiduciary level of cooling system.
The above only is preferred implementation of the present invention; should be pointed out that for those skilled in the art, under the prerequisite that does not break away from the principle of the invention; can also make some improvements and modifications, these improvements and modifications also should be considered as protection scope of the present invention.
Claims (8)
1. a cooling system distributes for the convertible heat of opening the interior at least one heater element generation of first device of equipment is conducted on the second device, it is characterized in that, described cooling system comprises:
The first heat pipe comprises first end and the second end, and wherein said first end is connected with described at least one heater element;
The second heat pipe comprises the 3rd end and the 4th end, wherein said the 3rd end with described second the device on thermal component be connected;
The heat radiation connector, be fixedly connected with described first device, the lateral surface of described heat radiation connector is connected with described the second end, also form a hollow cavity with opening on the described heat radiation connector, described the 4th end of described the second heat pipe is inserted in the described hollow cavity by described opening, by described the 4th end with described closure of openings;
Described heat radiation connector comprises the first heat radiator and the second heat radiator, is formed with the first groove on described the first heat radiator, is formed with the second groove on described the second heat radiator, and fasten relative with described the second groove of described the first groove consists of described hollow cavity;
Be provided with rubber ring in the described hollow cavity, and described rubber ring is fastened on the second heat pipe;
Described the second device drives described the second heat pipe by the described thermal component on described the second device and rotates relative to the described heat radiation connector that is fixed on the described first device with respect to described first device upset.
2. cooling system as claimed in claim 1 is characterized in that, the office, joint portion of described the first heat radiator and described the second heat radiator arranges O-ring seal, is used for sealing described hollow cavity.
3. cooling system as claimed in claim 1 or 2, it is characterized in that, described hollow cavity internal circulation has heat-conducting medium, by described heat-conducting medium the heat of described heat radiation connector is conducted to described the 4th end, and be formed with groove and/or aperture on the inwall of described hollow cavity, store and carry described heat-conducting medium by described groove and/or aperture.
4. cooling system as claimed in claim 1 is characterized in that, is respectively arranged with hygrosensor on described the first heat pipe and described the second heat pipe, is used for the temperature of described the first heat pipe of Real-Time Monitoring and described the second heat pipe.
5. computing machine, comprise main frame and liquid crystal display, described main frame is connected by turning axle with described liquid crystal display, it is characterized in that, described computing machine also comprises a cooling system, the shell that conducts to described liquid crystal display for the heat that at least one heater element in the described main frame is produced distributes, and described cooling system comprises:
The first heat pipe comprises first end and the second end, and wherein said first end is connected with described at least one heater element;
The second heat pipe comprises the 3rd end and the 4th end, and wherein said the 3rd end is connected with described shell;
The heat radiation connector, be fixedly connected with described main frame, the lateral surface of described heat radiation connector is connected with described the second end, also form a hollow cavity with opening on the described heat radiation connector, described the 4th end of described the second heat pipe is inserted in the described hollow cavity by described opening, by described the 4th end with described closure of openings;
Described heat radiation connector comprises the first heat radiator and the second heat radiator, is formed with the first groove on described the first heat radiator, is formed with the second groove on described the second heat radiator, and fasten relative with described the second groove of described the first groove consists of described hollow cavity;
Be provided with rubber ring in the described hollow cavity, and described rubber ring is fastened on the second heat pipe;
Described liquid crystal display is overturn with respect to described main frame, and the described shell by described liquid crystal display drives described the second heat pipe and rotates relative to the described heat radiation connector that is fixed on the described main frame.
6. computing machine as claimed in claim 5 is characterized in that, described hollow cavity and the described rotating shaft coaxle heart arrange, and described the second heat pipe passes described turning axle and extends setting at the medial surface of described shell.
7. computing machine as claimed in claim 5 is characterized in that, is respectively arranged with hygrosensor on described the first heat pipe and described the second heat pipe, is used for the temperature of described the first heat pipe of Real-Time Monitoring and described the second heat pipe.
8. such as each described computing machine of claim 5 to 7, it is characterized in that, be provided with a thermofin between the display panels of described the second heat pipe and described liquid crystal display.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200910089990 CN101989113B (en) | 2009-07-30 | 2009-07-30 | Heat dissipation system and computer with same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200910089990 CN101989113B (en) | 2009-07-30 | 2009-07-30 | Heat dissipation system and computer with same |
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| Publication Number | Publication Date |
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| CN101989113A CN101989113A (en) | 2011-03-23 |
| CN101989113B true CN101989113B (en) | 2013-05-01 |
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| CN 200910089990 Active CN101989113B (en) | 2009-07-30 | 2009-07-30 | Heat dissipation system and computer with same |
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Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105224016B (en) * | 2015-09-02 | 2019-03-29 | 联想(北京)有限公司 | A kind of electronic equipment |
| CN108983931A (en) * | 2018-08-17 | 2018-12-11 | 英业达科技有限公司 | Electronic device and heat pipe assembly |
| CN109814696A (en) * | 2019-03-31 | 2019-05-28 | 联想(北京)有限公司 | A kind of electronic equipment |
| TWI694762B (en) * | 2019-06-10 | 2020-05-21 | 英業達股份有限公司 | Portable electronic device |
| TWI784830B (en) * | 2021-12-07 | 2022-11-21 | 啓碁科技股份有限公司 | Communication device |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2694357Y (en) * | 2004-04-21 | 2005-04-20 | 仁宝电脑工业股份有限公司 | Heat sink of portable computer system |
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Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2694357Y (en) * | 2004-04-21 | 2005-04-20 | 仁宝电脑工业股份有限公司 | Heat sink of portable computer system |
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