CN101969105B

CN101969105B - Substrate and evaporation method thereof

Info

Publication number: CN101969105B
Application number: CN201010541887A
Authority: CN
Inventors: 崔成晋; 车炯坤; 郭钟云
Original assignee: Sichuan CCO Display Technology Co Ltd
Current assignee: Sichuan CCO Display Technology Co Ltd
Priority date: 2010-11-12
Filing date: 2010-11-12
Publication date: 2012-09-19
Anticipated expiration: 2030-11-12
Also published as: CN101969105A

Abstract

The invention provides a substrate and an evaporation method thereof. A mask plate does not need to be disassembled during evaporation. Alignment codes are arranged at the four corners of the substrate. The evaporation method comprises the following steps of: loading the substrate into a loading chamber; loading the mask plate on a chamber body for testing materials; putting the substrate into a cushion chamber after evaporation is finished; rotating a base platform in the cushion chamber by 90 degrees, so that the substrate loaded into the cushion chamber can rotate by 90 degrees along with the base platform; and conveying the rotated substrate into the chamber body for testing to perform secondary evaporation. The alignment codes are arranged at the four corners of the substrate, the evaporation is performed after the substrate is rotated and the alignment is eliminated, so that the mask plate does not need to be taken out for material testing.

Description

Substrate and evaporation coating method thereof

Technical field

The present invention relates to a kind of to the substrate and the evaporation coating method thereof that use in the vapor deposition operation of OLED (Organic Light Emitting Diode organic light emitting diode (AMOLED) panel).

Background technology

At present in being directed against the vapor deposition operation of OLED; On the diagonal of substrate, there are 2 to bit code; Also there is pair bit code relevant position at mask plate, and the contraposition mode of using in the evaporator is to survey the mode of contrapositions with two CCD cameras, and substrate carried out contraposition to bit code and mask plate to bit code.But this mode need be taken out mask plate and substrate repeatedly, and mask plate is covered substrate needs region covered, is put into to load vapor deposition in the chamber again, and this method wastes time and energy, and also is easy to take place the inaccurate problem of contraposition when hiding.

Summary of the invention

Technical problem to be solved by this invention need not unload the substrate of mask plate when providing a kind of vapor deposition.

The present invention also will provide a kind of evaporation coating method.

The technical scheme that technical solution problem of the present invention is adopted is: substrate all is provided with bit code on four angles of said substrate.

Evaporation coating method; Above-mentioned substrate is loaded in the load chamber, and mask plate loads on the cavity that will do testing of materials, behind the completion vapor deposition said substrate is put in the cushion chamber; With the base station half-twist in the cushion chamber; The substrate that is loaded into cushion chamber so also can be followed base station half-twist together, postrotational substrate is sent to again in the cavity that will do test, carries out the vapor deposition second time.

The invention has the beneficial effects as follows: owing on four angles of substrate, all be provided with bit code, behind rotary plate, carry out vapor deposition, can not produce the contraposition problem, therefore just need not take out mask plate goes to carry out testing of materials again.

Description of drawings

Fig. 1 is the sketch map of mask plate of the present invention and substrate.(Fig. 1 a is a mask plate, and Fig. 1 b is a substrate)

Fig. 2 is the rotation sketch map of substrate of the present invention.(Fig. 2 a is the reset condition sketch map of substrate, and Fig. 2 b is the view of half-twist metacoxal plate.)

Fig. 3 is the form sketch map after substrate is accomplished vapor deposition.(Fig. 3 a is the form sketch map after substrate is accomplished the vapor deposition first time, and Fig. 3 b is the form sketch map after substrate is accomplished the vapor deposition second time.)

Embodiment

As shown in Figure 1, the present invention is provided with bit code 1 at four angles of substrate, and wherein Fig. 1 a is a mask plate; Fig. 1 b is a substrate, and substrate is loaded in the load chamber, and mask plate also loads on the cavity that will do testing of materials; Evaporation coating method afterwards is the same with present mode, does not do the organic material layer of test and the same vapor deposition that carries out in the past, the layer that do test also with in the past the same vapor deposition that carries out of method; After accomplishing vapor deposition substrate is put in the cushion chamber, the base station in the cushion chamber possesses the function of half-twist, and the substrate that is loaded into cushion chamber so also can be followed base station half-twist together; As shown in Figure 2, wherein Fig. 2 a is the reset condition of substrate, and Fig. 2 b is the state of the substrate behind the half-twist; Postrotational substrate is sent in the cavity that will do test again, carries out the vapor deposition second time, so just can on a substrate, carry out two kinds of condition tests; Because four angles of substrate of the present invention all are provided with bit code 1, thus substrate it can not change to bit code 1 yet behind half-twist, so after the rotation again vapor deposition can not produce the contraposition problem yet; When carrying out the vapor deposition test, need not unload mask plate and also can test, thereby improve operating efficiency with such method.

Fig. 3 is the form sketch map after substrate is accomplished vapor deposition, and wherein Fig. 3 a is the form sketch map after substrate is accomplished vapor deposition for the first time, and Fig. 3 b is the form sketch map after substrate is accomplished vapor deposition for the second time, also with regard to the form sketch map of substrate vapor deposition behind half-twist.

Claims

1. the evaporation coating method of substrate; It is characterized in that: on four angles of said substrate, all be provided with, said substrate is loaded in the load chamber, mask plate is loaded on the cavity that will do testing of materials bit code (1); After accomplishing vapor deposition said substrate is put in the cushion chamber; With the base station half-twist in the cushion chamber, the substrate that is loaded into cushion chamber so also can be followed base station half-twist together, and substrate it can not change to bit code (1) yet behind half-twist; Postrotational substrate is sent in the cavity that will do test again, need not unloads mask plate and carry out the vapor deposition second time.