CN101969105A

CN101969105A - Substrate and evaporation method thereof

Info

Publication number: CN101969105A
Application number: CN 201010541887
Authority: CN
Inventors: 崔成晋; 车炯坤; 郭钟云
Original assignee: Sichuan CCO Display Technology Co Ltd
Current assignee: Sichuan CCO Display Technology Co Ltd
Priority date: 2010-11-12
Filing date: 2010-11-12
Publication date: 2011-02-09
Anticipated expiration: 2030-11-12
Also published as: CN101969105B

Abstract

The invention provides a substrate and an evaporation method thereof. A mask plate does not need to be disassembled during evaporation. Alignment codes are arranged at the four corners of the substrate. The evaporation method comprises the following steps of: loading the substrate into a loading chamber; loading the mask plate on a chamber body for testing materials; putting the substrate into a cushion chamber after evaporation is finished; rotating a base platform in the cushion chamber by 90 degrees, so that the substrate loaded into the cushion chamber can rotate by 90 degrees along with the base platform; and conveying the rotated substrate into the chamber body for testing to perform secondary evaporation. The alignment codes are arranged at the four corners of the substrate, the evaporation is performed after the substrate is rotated and the alignment is eliminated, so that the mask plate does not need to be taken out for material testing.

Description

Substrate and evaporation coating method thereof

Technical field

The present invention relates to the substrate and the evaporation coating method thereof that use in a kind of evaporation operation at OLED (Organic Light Emitting Diode organic light emitting diode (AMOLED) panel).

Background technology

At present in evaporation operation at OLED, on the diagonal of substrate, there are 2 to bit code, also there is pair bit code relevant position at mask plate, and the contraposition mode of using in the evaporator is to survey the mode of contrapositions with two CCD cameras, and substrate carried out contraposition to bit code and mask plate to bit code.But this mode need be taken out mask plate and substrate repeatedly, and mask plate is covered the zone that substrate need cover, and is put into to load evaporation in the chamber again, and this method wastes time and energy, and also is easy to take place the inaccurate problem of contraposition when hiding.

Summary of the invention

Technical problem to be solved by this invention does not need to unload the substrate of mask plate when providing a kind of evaporation.

The present invention also will provide a kind of evaporation coating method.

The technical scheme that technical solution problem of the present invention is adopted is: substrate all is provided with bit code on four angles of described substrate.

Evaporation coating method, above-mentioned substrate is loaded in the load chamber, mask plate loads on the cavity that will do testing of materials, after finishing evaporation described substrate is put in the cushion chamber, with the base station half-twist in the cushion chamber, the substrate that is loaded into cushion chamber so also can be followed base station half-twist together, postrotational substrate is sent to again in the cavity that will do test, carries out the evaporation second time.

The invention has the beneficial effects as follows: owing to all be provided with bit code, carry out evaporation behind rotary plate on four angles of substrate, can not produce the contraposition problem, therefore just need not take out mask plate goes to carry out testing of materials again.

Description of drawings

Fig. 1 is the schematic diagram of mask plate of the present invention and substrate.(Fig. 1 a is a mask plate, and Fig. 1 b is a substrate)

Fig. 2 is the rotation schematic diagram of substrate of the present invention.(Fig. 2 a is the reset condition schematic diagram of substrate, and Fig. 2 b is the view of half-twist metacoxal plate.)

Fig. 3 is the form schematic diagram after substrate is finished evaporation.(Fig. 3 a is the form schematic diagram after substrate is finished the evaporation first time, and Fig. 3 b is the form schematic diagram after substrate is finished the evaporation second time.)

Embodiment

As shown in Figure 1, the present invention is provided with bit code 1 at four angles of substrate, wherein Fig. 1 a is a mask plate, Fig. 1 b is a substrate, substrate is loaded in the load chamber, mask plate also loads on the cavity that will do testing of materials, evaporation coating method afterwards is the same with present mode, do not do the organic material layer of test and the same evaporation that carries out in the past, the layer of doing test also with in the past the same evaporation that carries out of method, after finishing evaporation substrate is put in the cushion chamber, base station in the cushion chamber possesses the function of half-twist, the substrate that is loaded into cushion chamber so also can be followed base station half-twist together, as shown in Figure 2, wherein Fig. 2 a is the reset condition of substrate, Fig. 2 b is the state of the substrate behind the half-twist, postrotational substrate is sent in the cavity that will do test again, carry out the evaporation second time, so just can on a substrate, carry out two kinds of condition tests because four angles of substrate of the present invention all are provided with bit code 1, so substrate it can not change to bit code 1 yet behind half-twist, so the rotation after again evaporation can not produce the contraposition problem yet, when carrying out the evaporation test, need not unload mask plate and also can test, thereby improve operating efficiency with such method.

Fig. 3 is the form schematic diagram after substrate is finished evaporation, and wherein Fig. 3 a is the form schematic diagram after substrate is finished evaporation for the first time, and Fig. 3 b is the form schematic diagram after substrate is finished evaporation for the second time, also with regard to the form schematic diagram of substrate evaporation behind half-twist.

Claims

1. substrate is characterized in that: all be provided with bit code (1) on four angles of described substrate.

2. evaporation coating method, it is characterized in that: the described substrate of claim 1 is loaded in the load chamber, mask plate is loaded on the cavity that will do testing of materials, after finishing evaporation described substrate is put in the cushion chamber, with the base station half-twist in the cushion chamber, the substrate that is loaded into cushion chamber so also can be followed base station half-twist together, postrotational substrate is sent to again in the cavity that will do test, carries out the evaporation second time.