CN101964392A - Organic piezoelectric film laminated device - Google Patents
Organic piezoelectric film laminated device Download PDFInfo
- Publication number
- CN101964392A CN101964392A CN201010258108.2A CN201010258108A CN101964392A CN 101964392 A CN101964392 A CN 101964392A CN 201010258108 A CN201010258108 A CN 201010258108A CN 101964392 A CN101964392 A CN 101964392A
- Authority
- CN
- China
- Prior art keywords
- piezoelectric film
- organic piezoelectric
- electrode
- laminated device
- electrodes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000012528 membrane Substances 0.000 claims description 13
- 238000000605 extraction Methods 0.000 claims description 8
- 238000003475 lamination Methods 0.000 claims description 7
- 238000009413 insulation Methods 0.000 claims description 4
- MIZLGWKEZAPEFJ-UHFFFAOYSA-N 1,1,2-trifluoroethene Chemical group FC=C(F)F MIZLGWKEZAPEFJ-UHFFFAOYSA-N 0.000 claims description 3
- 229920001038 ethylene copolymer Polymers 0.000 claims description 3
- 238000010276 construction Methods 0.000 claims description 2
- XUCNUKMRBVNAPB-UHFFFAOYSA-N fluoroethene Chemical group FC=C XUCNUKMRBVNAPB-UHFFFAOYSA-N 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 6
- 238000005516 engineering process Methods 0.000 abstract description 4
- 238000005259 measurement Methods 0.000 abstract description 2
- 239000004065 semiconductor Substances 0.000 abstract description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 8
- 229910052802 copper Inorganic materials 0.000 description 8
- 239000010949 copper Substances 0.000 description 8
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 6
- 239000004020 conductor Substances 0.000 description 6
- 239000003292 glue Substances 0.000 description 6
- 229910052709 silver Inorganic materials 0.000 description 6
- 239000004332 silver Substances 0.000 description 6
- 230000010287 polarization Effects 0.000 description 5
- 239000002033 PVDF binder Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 4
- 229910000831 Steel Inorganic materials 0.000 description 3
- 239000010959 steel Substances 0.000 description 3
- 229920001342 Bakelite® Polymers 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000004637 bakelite Substances 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- YOCUPQPZWBBYIX-UHFFFAOYSA-N copper nickel Chemical compound [Ni].[Cu] YOCUPQPZWBBYIX-UHFFFAOYSA-N 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Images
Landscapes
- Laminated Bodies (AREA)
Abstract
The invention belongs to the technical field of semiconductors, and relates to piezoelectric device design technology. The invention relates to an organic piezoelectric film laminated device, which consists of an organic piezoelectric film with double sides covered with electrodes and electrodes, wherein the continuous organic piezoelectric film (1) with double sides covered with electrodes (2) is folded into regular laminated layers, the same polarity sides of which are naturally communicated; and an electrode (3) is led out of the two covered electrodes (2) respectively, and the electrodes and the film are compacted and fixed to obtain the organic piezoelectric film laminated device. The organic piezoelectric film laminated device has the advantages of strong designing property, high reliability, simple processing technique and wide application range, effectively avoids short circuit of positive and negative electrodes, unreliable electrode connection and the like on the premise of ensuring the piezoelectric performance, and is mainly applied in the fields of impact under high overload condition, vibration signal measurement, anti-impact piezoelectric energy converters and the like.
Description
One, affiliated technical field
The invention belongs to technical field of semiconductors, relate to the piezoelectric device designing technique, particularly organic piezoelectric film laminated device designing technique.
Two, background technology
In order to improve the dynamo-electric transition effects of piezoelectric device, often adopt parallel connection of multi-layer piezoelectric material or series design, wherein the most frequently used method for designing is to adopt double-deck piezoelectric to carry out stack-design according to the electricity paralleling model, and the Design Mode of this piezoelectric bimorph is reported in many documents to some extent.For piezoelectric ceramic, because the very high (d of its piezoelectric modulus
33Generally can reach 500～1000pC/N), adopt the device of double-decker design can satisfy many application requirements; For organic piezoelectric film, because the lower (d of piezoelectric modulus
33Generally can only reach 20～30pC/N), adopt the device of double layer design to be difficult to satisfy application request.
EP 0441438A1 has reported a kind of method for designing of organic piezoelectric film laminated device, laminated device is by the organic piezoelectric film of evaporation metal electrode, conducting resinl, the lump battery lead plate, the insulation system plate is formed, adopt the organic piezoelectric film multilayer build-up of evaporation metal electrode to arrange, the positive and negative pole-face of every film keeps the dislocation of certain distance, side coated with conductive glue, the identical one side of all film polarity is linked to each other with the lump battery lead plate by conducting resinl, exert pressure by the insulation system plate that upper and lower surface is laid, form organic piezoelectric film stack device (structure as shown in Figure 1).This method technology is loaded down with trivial details; Be easy to generate the conducting resinl short circuit between the electrode; It is unreliable that lateral electrode is connected with the face electrode, in particular for alternating signal, HI high impact, high overload, high deformation electromechanical transducer spare, easily causes lump electrode and face electrode to disconnect.
Three, summary of the invention
The objective of the invention is to overcome short circuit between stacked piezoelectric device positive and negative electrode, electrode connects insecure problem, and the organic piezoelectric film that a kind of designability is strong, reliability is high laminated device is provided.
The object of the present invention is achieved like this, the regular lamination that adopts the identical one side of the folding formation polarity of continuous flexible organic piezoelectric film of two-sided covering electrodes to be communicated with naturally, compress and fix, extraction electrode obtains the organic piezoelectric film laminated device respectively on two electrode surfaces.
The organic piezoelectric film laminated device that the present invention relates to, organic piezoelectric film and electrode by two-sided covering electrodes are formed, it is characterized in that: the continuous organic piezoelectric film 1 of two-sided covering electrodes 2 is folded into the regular lamination that the identical one side of polarity is communicated with naturally, difference extraction electrode 3 on two covering electrodes 2, compress and fixing the organic piezoelectric film laminated device that obtains the present invention relates to (structural representation is in accompanying drawing 2 and accompanying drawing 3).
The organic piezoelectric film laminated device that the present invention relates to, organic piezoelectric film and electrode by two-sided covering electrodes are formed, it is characterized in that: the area of the covering electrodes 2 of described organic piezoelectric film is less than the area of film 1, and organic piezoelectric film edge leaves electrode clear area (structural representation is in accompanying drawing 2).
The organic piezoelectric film laminated device that the present invention relates to, organic piezoelectric film and electrode by two-sided covering electrodes are formed, it is characterized in that: continuous organic piezoelectric film 1 " it " font of two-sided covering electrodes 2 is folded into the regular lamination that the identical one side of polarity is communicated with naturally, difference extraction electrode 3 compresses and fixedly obtains the organic piezoelectric film laminated device (structural representation is in accompanying drawing 3) that the present invention relates on two covering electrodes 2.
The organic piezoelectric film laminated device that the present invention relates to, organic piezoelectric film and electrode by two-sided covering electrodes are formed, it is characterized in that: the continuous organic piezoelectric film 1 of two-sided covering electrodes 2 is folded in half into the regular lamination that the identical one side of polarity is communicated with naturally repeatedly, extraction electrode 3 respectively on 2 of two covering electrodes compresses and fixedly obtains the organic piezoelectric film laminated device (structural representation is in accompanying drawing 4) that the present invention relates to.
The organic piezoelectric film laminated device that the present invention relates to is made up of the organic piezoelectric film and the electrode of two-sided covering electrodes, it is characterized in that: the folding number of plies of the continuous organic piezoelectric film of two-sided covering electrodes is between 7～100.
The organic piezoelectric film laminated device that the present invention relates to is made up of the organic piezoelectric film and the electrode of two-sided covering electrodes, it is characterized in that: the folding number of plies of the continuous organic piezoelectric film of two-sided covering electrodes is an odd-level.
The organic piezoelectric film laminated device that the present invention relates to is made up of the organic piezoelectric film and the electrode of two-sided covering electrodes, it is characterized in that: the folding number of plies of the continuous organic piezoelectric film of two-sided covering electrodes is an even level.
The organic piezoelectric film laminated device that the present invention relates to is made up of the organic piezoelectric film and the electrode of two-sided covering electrodes, it is characterized in that: the laminated construction surface is with structural slab 4.
The organic piezoelectric film laminated device that the present invention relates to is made up of the organic piezoelectric film and the electrode of two-sided covering electrodes, it is characterized in that: a kind of in metallic plate or the insulation board of described structural slab 4.
The organic piezoelectric film laminated device that the present invention relates to is made up of the organic piezoelectric film and the electrode of two-sided covering electrodes, it is characterized in that: when described structural slab 4 was metallic plate, structural slab 4 was electrode 3.
The organic piezoelectric film laminated device that the present invention relates to, organic piezoelectric film and electrode by two-sided covering electrodes are formed, it is characterized in that: described organic piezoelectric film is selected from Kynoar (PVDF) piezoelectric membrane, a kind of in the Kynoar trifluoro-ethylene copolymer piezoelectric membrane (PVDF-TrFE).
The organic piezoelectric film laminated device that the present invention relates to is made up of the organic piezoelectric film and the electrode of two-sided covering electrodes, it is characterized in that: the organic piezoelectric film of described organic piezoelectric film for polarizing in advance.
The organic piezoelectric film laminated device that the present invention relates to is made up of the organic piezoelectric film and the electrode of two-sided covering electrodes, it is characterized in that: the thickness of described organic piezoelectric film is between 10 μ m～500 μ m.
The organic piezoelectric film laminated device that the present invention relates to can make any Multi-layer Parallel stack of organic piezoelectric film, and piezoelectric property obtains bigger raising, does not exist positive and negative electrode short circuit, electrode to connect unreliable equivalent risk.Designability of the present invention is strong, the reliability height, and processing technology is simple, and the scope of application is wide.Be mainly used in fields such as impact under the high overload condition, vibration signal measurement and shock resistance PZT (piezoelectric transducer).
Four, description of drawings
The organic piezoelectric film laminated device structural representation of accompanying drawing 1EP 0441438A1 report
The organic piezoelectric film schematic diagram of the two-sided covering electrodes of a kind of laminated device that accompanying drawing 2 the present invention relates to
The organic piezoelectric film laminated device structural representation of a kind of laminated device that accompanying drawing 3 the present invention relates to
The organic piezoelectric film laminated device structural representation of a kind of laminated device that accompanying drawing 4 the present invention relates to
The organic piezoelectric film laminated device structural representation of a kind of laminated device that accompanying drawing 5 the present invention relates to
The organic piezoelectric film laminated device structural representation of a kind of laminated device that accompanying drawing 6 the present invention relates to
The organic piezoelectric film laminated device structural representation of a kind of laminated device that accompanying drawing 7 the present invention relates to
The organic piezoelectric film laminated device structural representation of a kind of laminated device that accompanying drawing 8 the present invention relates to
Wherein: 1-organic piezoelectric film, 2-face/covering electrodes, 3-electrode, 4-structural slab, 5-adhesive, 6-screw
Five, embodiment
Below in conjunction with example the technical scheme that the present invention relates to is described in detail, but not as to the present invention relates to the restriction of technical scheme.
Embodiment one
A kind of organic piezoelectric film laminated device (as shown in Figure 5) adopts Kynoar (PVDF) piezoelectric membrane 1 of polarization, two sides plating aluminium electrode 2 in advance, and the white space of 0.2cm is left in the edge, film thickness 10 μ m, d
33Be 19pC/N; With 0.5cm thick steel plate double as electrode 3 and structural slab 4, adopt plastic screw 6 to fix.Organic piezoelectric film is folded into 7 layers by " in a zigzag " mode, adopt steel plate to compress as structural slab doubling poststack piezoelectric membrane, exert pressure and guarantee that adjacent two electrode surfaces reliably are communicated with, with plastic screw 6 fixing lower steel plate, the organic piezoelectric film laminated devices that obtain the present invention relates to gone up.
The piezoelectric coefficient d of this laminated device
33Be 132pC/N.
Embodiment two
A kind of organic piezoelectric film laminated device (as shown in Figure 6) adopts Kynoar (PVDF) piezoelectric membrane 1 of polarization, two sides plating aluminium electrode 2 in advance, and the white space of 0.5cm is left in the edge, and thickness is 230 μ m, d
33Be 18pC/N; Make electrode 3 with copper conductor, bond fixing with 5 pairs of up-down structure plates of HY-128 epoxyn.Film is folded into 35 layers according to " in a zigzag " mode, uses the bonding copper conductor extraction electrode 3 of conductive silver glue on two electrode surfaces respectively; Adopt the thick bakelite plate 4 of 0.8cm to compress as the piezoelectric membrane of structural slab doubling poststack, it is fixing with the HY-128 epoxyn power-on and power-off plank to be bondd, the organic piezoelectric film laminated device that obtains the present invention relates to.
The piezoelectric coefficient d of this laminated device
33Be 625pC/N.
Embodiment three
A kind of organic piezoelectric film laminated device (as shown in Figure 7) adopts Kynoar (PVDF) piezoelectric membrane 1 of polarization, two sides plate silver electrode 2 in advance, and the white space of 0.5cm is left in the edge, and thickness is 100 μ m, d
33Be 17pC/N; Make electrode 3 with copper conductor, adopt 5 pairs of up-down structure plates of E51 epoxyn to bond fixing.Film is folding according to " in a zigzag " mode, and the folding number of plies is 100, uses scolding tin weld metal copper conductor extraction electrode on two pole-faces respectively; Adopt the thick nylon sheet 4 of 0.6cm to compress as the piezoelectric membrane of structural slab doubling poststack, it is fixing with the E51 epoxyn up-down structure plate to be bondd at last, makes the organic piezoelectric film laminated device.
The piezoelectric coefficient d of this laminated device
33Be 1690pC/N.
Embodiment four
A kind of organic piezoelectric film laminated device (as shown in Figure 4), adopt Kynoar trifluoro-ethylene copolymer (PVDF-TrFE) piezoelectric membrane 1 of polarization, two sides plated nickel copper alloy electrode 2 in advance, the white space of 0.1cm is left in the edge, and thickness is 360 μ m, d
33Be 21pC/N; Make electrode 3 with the metallic copper lead, adopt conductive silver glue film to be bondd fixing.Film is folded in half into two-layer earlier, is folded in half into four layers again, doubling successively, and even brushing one deck conductive silver glue on doubling two pole-faces, the folding number of plies is 16, uses the bonding copper conductor extraction electrode of conductive silver glue on two pole-faces respectively; Doubling poststack piezoelectric membrane compresses, and it is fixing by conductive silver glue film to be bondd, and makes the organic piezoelectric film laminated device.
The piezoelectric coefficient d of this laminated device
33Be 335pC/N.
Embodiment five
A kind of organic piezoelectric film laminated device (as shown in Figure 8) adopts Kynoar (PVDE) piezoelectric membrane 1 of polarization, the silver-plated electrode 2 in two sides in advance, and the white space of 0.4cm is left in the edge, and thickness is 500 μ m, d
33Be 18pC/N; Make electrode 3 with the metallic copper lead, adopt 6 pairs of up-down structure plates of screw to fix.Film is folded in half into two-layer earlier, is folded in half into four layers again, doubling successively, and the folding number of plies is 64, difference weld metal copper conductor on two pole-faces; Adopt the thick bakelite plate 4 of 0.8cm to compress, with screw the up-down structure plate is carried out fasteningly at last, make the organic piezoelectric film laminated device as structural slab doubling poststack piezoelectric membrane.
The piezoelectric coefficient d of this laminated device
33Be 1150pC/N.
Claims (10)
1. organic piezoelectric film laminated device, organic piezoelectric film and electrode by two-sided covering electrodes are formed, it is characterized in that: the continuous organic piezoelectric film (1) of two-sided covering electrodes (2) is folded into the regular lamination that the identical one side of polarity is communicated with naturally, go up extraction electrode (3) respectively at two covering electrodes (2), compress and fixedly obtain the organic piezoelectric film laminated device.
2. the organic piezoelectric film laminated device that relates to of claim 1, organic piezoelectric film and electrode by two-sided covering electrodes are formed, it is characterized in that: the area of the covering electrodes of described organic piezoelectric film (2) is less than the area of film (1), and organic piezoelectric film edge leaves the electrode clear area.
3. the organic piezoelectric film laminated device that relates to of claim 1, organic piezoelectric film and electrode by two-sided covering electrodes are formed, and it is characterized in that: continuous organic piezoelectric film (1) " it " font of two-sided covering electrodes (2) is folded into the regular lamination that the identical one side of polarity is communicated with naturally.
4. the organic piezoelectric film laminated device that relates to of claim 1, organic piezoelectric film and electrode by two-sided covering electrodes are formed, and it is characterized in that: the continuous organic piezoelectric film (1) of two-sided covering electrodes (2) is folded in half into the regular lamination that the identical one side of polarity is communicated with naturally repeatedly.
5. the organic piezoelectric film laminated device that relates to of claim 1,3 or 4 is made up of the organic piezoelectric film and the electrode of two-sided covering electrodes, it is characterized in that: the folding number of plies of the continuous organic piezoelectric film of two-sided covering electrodes is between 7～100.
6. the organic piezoelectric film laminated device that relates to of claim 1,3 or 4 is made up of the organic piezoelectric film and the electrode of two-sided covering electrodes, it is characterized in that: the laminated construction surface is with structural slab (4).
7. the organic piezoelectric film laminated device that relates to of claim 6 is made up of the organic piezoelectric film and the electrode of two-sided covering electrodes, it is characterized in that: a kind of in metallic plate or the insulation board of described structural slab (4).
8. the organic piezoelectric film laminated device that relates to of claim 6 is made up of the organic piezoelectric film and the electrode of two-sided covering electrodes, it is characterized in that: described structural slab (4) is during for metallic plate, and structural slab (4) is electrode (3).
9. the organic piezoelectric film laminated device that relates to of claim 1,3 or 4, organic piezoelectric film and electrode by two-sided covering electrodes are formed, it is characterized in that: described organic piezoelectric film is selected from poly meta fluoroethylene piezoelectric film, a kind of in the Kynoar trifluoro-ethylene copolymer piezoelectric membrane.
10. the organic piezoelectric film laminated device that relates to of claim 1,3 or 4 is made up of the organic piezoelectric film and the electrode of two-sided covering electrodes, and it is characterized in that: the thickness of described organic piezoelectric film is between 10 μ m～500 μ m.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010258108.2A CN101964392A (en) | 2010-08-20 | 2010-08-20 | Organic piezoelectric film laminated device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010258108.2A CN101964392A (en) | 2010-08-20 | 2010-08-20 | Organic piezoelectric film laminated device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101964392A true CN101964392A (en) | 2011-02-02 |
Family
ID=43517204
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201010258108.2A Pending CN101964392A (en) | 2010-08-20 | 2010-08-20 | Organic piezoelectric film laminated device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101964392A (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102522495A (en) * | 2011-12-21 | 2012-06-27 | 贝辛电子科技（上海）有限公司 | Method for raising signal to noise ratio of piezoelectric electret film sensor |
| CN103647018A (en) * | 2013-11-28 | 2014-03-19 | 南京航空航天大学 | Laminated type PVDF actuator and active and passive hybrid vibration isolator |
| CN105655476A (en) * | 2016-01-25 | 2016-06-08 | 云南科威液态金属谷研发有限公司 | Intelligent hydrogel device and intelligent hydrogel control device |
| CN105871250A (en) * | 2016-04-11 | 2016-08-17 | 西安交通大学 | Power generation device employing load variation and reciprocating overlapped piezoelectric thin films |
| CN106763456A (en) * | 2016-11-17 | 2017-05-31 | 哈尔滨工程大学 | A kind of passive controllable isolation mounting of master based on piezoelectric photonic crystal |
| CN109100056A (en) * | 2017-06-20 | 2018-12-28 | 雅马哈株式会社 | pressure sensor |
| CN112538182A (en) * | 2020-12-03 | 2021-03-23 | 江西欧迈斯微电子有限公司 | Piezoelectric film, preparation method thereof, fingerprint identification module and electronic equipment |
| CN113285631A (en) * | 2021-06-29 | 2021-08-20 | 陕西科技大学 | Piezoelectric nano generator with laminated structure |
| EP3879590A4 (en) * | 2018-11-08 | 2021-12-29 | FUJIFILM Corporation | Laminated piezoelectric element and electro-acoustic transducer |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0441438A1 (en) * | 1990-02-07 | 1991-08-14 | Koninklijke Philips Electronics N.V. | Method of producing a multilayer piezoelectric element as well as multilayer piezoelectric element |
| GB2329514A (en) * | 1997-09-05 | 1999-03-24 | 1 Ipr Limited | Piezoelectric devices, aerogels and uses therefore |
| CN1357158A (en) * | 1999-06-19 | 2002-07-03 | 罗伯特-博希股份公司 | Piezo Element with multiple-layer structure dproduced by folding and its mfg. method |
| CN100375306C (en) * | 2002-01-17 | 2008-03-12 | 埃普科斯股份有限公司 | Piezoelectric component and method for the production thereof |
| CN101594069A (en) * | 2009-06-23 | 2009-12-02 | 南京航空航天大学 | Fold-shaped compound piezoelectric energy converting structure |
-
2010
- 2010-08-20 CN CN201010258108.2A patent/CN101964392A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0441438A1 (en) * | 1990-02-07 | 1991-08-14 | Koninklijke Philips Electronics N.V. | Method of producing a multilayer piezoelectric element as well as multilayer piezoelectric element |
| GB2329514A (en) * | 1997-09-05 | 1999-03-24 | 1 Ipr Limited | Piezoelectric devices, aerogels and uses therefore |
| CN1357158A (en) * | 1999-06-19 | 2002-07-03 | 罗伯特-博希股份公司 | Piezo Element with multiple-layer structure dproduced by folding and its mfg. method |
| CN100375306C (en) * | 2002-01-17 | 2008-03-12 | 埃普科斯股份有限公司 | Piezoelectric component and method for the production thereof |
| CN101594069A (en) * | 2009-06-23 | 2009-12-02 | 南京航空航天大学 | Fold-shaped compound piezoelectric energy converting structure |
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102522495B (en) * | 2011-12-21 | 2014-02-19 | 贝辛电子科技（上海）有限公司 | Method for raising signal to noise ratio of piezoelectric electret film sensor |
| CN102522495A (en) * | 2011-12-21 | 2012-06-27 | 贝辛电子科技（上海）有限公司 | Method for raising signal to noise ratio of piezoelectric electret film sensor |
| CN103647018A (en) * | 2013-11-28 | 2014-03-19 | 南京航空航天大学 | Laminated type PVDF actuator and active and passive hybrid vibration isolator |
| CN103647018B (en) * | 2013-11-28 | 2016-08-17 | 南京航空航天大学 | A kind of Laminated PVDF actuator and main passive hybrid isolator |
| CN105655476A (en) * | 2016-01-25 | 2016-06-08 | 云南科威液态金属谷研发有限公司 | Intelligent hydrogel device and intelligent hydrogel control device |
| CN105871250B (en) * | 2016-04-11 | 2017-09-12 | 西安交通大学 | Utilize load change and the TRT of reciprocal overlapping type piezoelectric actuator film |
| CN105871250A (en) * | 2016-04-11 | 2016-08-17 | 西安交通大学 | Power generation device employing load variation and reciprocating overlapped piezoelectric thin films |
| CN106763456A (en) * | 2016-11-17 | 2017-05-31 | 哈尔滨工程大学 | A kind of passive controllable isolation mounting of master based on piezoelectric photonic crystal |
| CN109100056A (en) * | 2017-06-20 | 2018-12-28 | 雅马哈株式会社 | pressure sensor |
| EP3879590A4 (en) * | 2018-11-08 | 2021-12-29 | FUJIFILM Corporation | Laminated piezoelectric element and electro-acoustic transducer |
| US11910159B2 (en) | 2018-11-08 | 2024-02-20 | Fujifilm Corporation | Laminated piezoelectric element and electroacoustic transducer |
| CN112538182A (en) * | 2020-12-03 | 2021-03-23 | 江西欧迈斯微电子有限公司 | Piezoelectric film, preparation method thereof, fingerprint identification module and electronic equipment |
| CN113285631A (en) * | 2021-06-29 | 2021-08-20 | 陕西科技大学 | Piezoelectric nano generator with laminated structure |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101964392A (en) | Organic piezoelectric film laminated device | |
| KR101630037B1 (en) | Multi-layered ceramic capacitor, array-type multi-layered ceramic capacitor, manufacturing method for the same and board having the same mounted thereon | |
| KR101412940B1 (en) | Multi-layered ceramic capacitor and mounting circuit of multi-layered ceramic capacitor | |
| KR101862422B1 (en) | Multi-layered ceramic capacitor and board for mounting the same | |
| KR20150118385A (en) | Multi-layered ceramic capacitor, manufacturing method for the same and board having the same mounted thereon | |
| US20140106213A1 (en) | Electrical storage device element and electrical storage device | |
| US20140131082A1 (en) | Multilayered ceramic capacitor, mounting structure of circuit board having multilayered ceramic capacitor mounted thereon, and packing unit for multilayered ceramic capacitor | |
| KR20140091926A (en) | Multi-layered ceramic capacitor, mounting circuit thereof and manufacturing method of the same | |
| JP5587442B2 (en) | Multilayer ceramic capacitor and its mounting board | |
| CN102264541B (en) | Metal foil with carrier | |
| KR20140088366A (en) | Multi-layered ceramic capacitor and mounting circuit having thereon multi-layered ceramic capacitor | |
| KR102122931B1 (en) | Multi-layered ceramic capacitor and board having the same mounted thereon | |
| US20180254403A1 (en) | Interdigitated electrode patterned multi-layered piezoelectric laminate structure | |
| CN103069599A (en) | Piezoelectric element, and stacked piezoelectric structure | |
| WO2012105187A1 (en) | Capacitance-varying type power-generation element | |
| US20140368967A1 (en) | Multilayer ceramic capacitor and board having the same mounted thereon | |
| CN107799305B (en) | Capacitor assembly | |
| CN108231993A (en) | Piezoelectric electret material component and preparation method and application | |
| US20220076884A1 (en) | Electronic component and board having the same mounted thereon | |
| CN201829543U (en) | Organic piezoelectric film lamination device | |
| EP1453114A3 (en) | Laminated electronic part | |
| CN201029221Y (en) | Multi-layer piezoelectricity type micro-displacement actuator | |
| CN101159308A (en) | Multiple layers piezoelectric type micro-displacement actuator | |
| WO2016147466A1 (en) | Laminated power storage device | |
| US11640876B2 (en) | Electronic component |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20110202 |