CN102522495B - Method for raising signal to noise ratio of piezoelectric electret film sensor - Google Patents
Method for raising signal to noise ratio of piezoelectric electret film sensor Download PDFInfo
- Publication number
- CN102522495B CN102522495B CN201110433714.8A CN201110433714A CN102522495B CN 102522495 B CN102522495 B CN 102522495B CN 201110433714 A CN201110433714 A CN 201110433714A CN 102522495 B CN102522495 B CN 102522495B
- Authority
- CN
- China
- Prior art keywords
- piezo
- thin film
- electric electret
- electret thin
- lamination
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
Abstract
The invention discloses a method for raising a signal to noise ratio of a piezoelectric electret film sensor. A lamination method is employed to carry out series connection or parallel connection lamination on piezoelectric electret films, charge and voltage output quantity of the piezoelectric electret film sensor are raised by times so as to raise the sensitivity of the sensor. Simultaneously, the invention also discloses a screen printing method, and a flexible shielding layer is added to the piezoelectric electret film sensor so as to raise the anti-interference capability of the sensor. According to the invention, operation is simple, energy consumption is low, work efficiency is substantially raised, and under the premise of flexibility, being ultrathin, free bending, random cutting, durability, and a low price, the sensitivity and the anti-interference capability of the sensor are raised. Thus the application of the piezoelectric electret film sensor at a high sensitivity demand occasion and in a strong electromagnetic interference environment is developed, and the sensor caters to a market demand more.
Description
Technical field
The present invention relates to transducer and technical field of function materials, particularly a kind of method that improves piezo-electric electret thin film transducer signal to noise ratio.
Background technology
Piezo-electric electret (Piezoelectret, also claim ferroelectret Ferroelectret) be that a kind of inside is containing the thin polymer film of nonpolar microcellular structure, after suitable electric polarization is processed, can present higher piezoelectric property, at functional material and sensor field, be paid close attention to widely.It not only have high sensitivity, lightweight ultra-thin, can large area film forming, cheap environmental protection, size can arbitrarily be cut out and with the advantage such as the acoustic matching of air, water, human body is good.At acoustics and ultrasonic, medical treatment, have wide practical use with transducer and actuator field aspect health, control and detection, intelligent transportation, security protection, consumer electronics, man-machine interface.
Conventional P VDF piezoelectric film sensor sensitivity (piezoelectric charge coefficients d33 is about 25pC/N) is low, thereby make its electric charge, Voltage-output amount lower, need in actual applications the gain that configuration is very large, not only increase manufacturing cost, and to sensitivity, required high acoustic applications occasion to be very restricted at microphone, hydrophone, ultrasonic transducer etc.And piezo-electric electret thin film transducer sensitivity (piezoelectric charge coefficients d33) is higher, can reach 400pC/N left and right, in above-mentioned these applications, can access good application.Nonetheless, the further raising of piezo-electric electret thin film sensitivity, improves and has very crucial effect these acoustic applications signal to noise ratios.Improving the essential feature that guarantees that piezo-electric electret thin film is flexible, ultra-thin simultaneously.
In addition, piezo-electric electret thin film transducer in actual use, is vulnerable to the interference of electromagnetic wave, power frequency component and other noises in external environment, causes distorted signals.Therefore need to shield these interference, and the method for traditional shielding piezoelectric is mainly to adopt rigid metal housing to shield, not only cost is high, complex process, and this does not mate with piezo-electric electret thin film transducer flexibility characteristics, greatly limited its use under flexible, crooked application scenario.
Summary of the invention
For existing many deficiencies in above mentioned present technology, the object of the invention is: guaranteeing that piezo-electric electret thin film transducer is ultra-thin, free bend, arbitrarily cut out, under durable in use, cheap prerequisite, improve its sensitivity, antijamming capability and signal to noise ratio, thereby expand its application under high sensitivity demand occasion and strong electromagnetic interference environment.
The technical solution adopted for the present invention to solve the technical problems is:
Improve a method for piezo-electric electret thin film transducer signal to noise ratio, adopt the method for series connection lamination, concrete implementation step is as follows:
S1: commercially available conductive double sided adhesive tape is laminated to piezo-electric electret thin film 1 back side that preparation is coated with metal electrode;
S2: the piezo-electric electret thin film 1 that the back side is stained with to conducting resinl is laminated to the commercially available front that is coated with metal electrode piezo-electric electret thin film 2, lamination is realized lamination series connection successively;
S3: use commercially available plastic packaging machine, by the good piezo-electric electret thin film of lamination cold mount or thermoplastic to commercially available one side containing on non-conductive adhesive packaging film, double-faced packaging then.
The preferred version of the thickness of described lamination can be from 2～10 layers.
Another kind of implementation of the present invention:
Improve a method for piezo-electric electret thin film transducer signal to noise ratio, adopt the method for lamination in parallel, concrete implementation step is as follows:
(1), commercially available conductive double sided adhesive tape is laminated to commercially available piezo-electric electret thin film 1 back side that is coated with metal electrode;
(2), by the back side be stained with the commercially available piezo-electric electret thin film 1 of conducting resinl folding after lamination again, realize lamination parallel connection;
(3), use commercially available plastic packaging machine, by the good piezo-electric electret thin film of lamination cold mount or thermoplastic to commercially available one side containing on non-conductive adhesive packaging film, double-faced packaging then.
The preferred version of the thickness of described lamination is 2 layers.
More than realizing, in the process of any scheme, also relate to the method for silk screen printing, object is at piezo-electric electret thin film encapsulated layer silk-screen metal electrode, and as flexible shielding layer, its concrete implementation step is as follows:
(1), by encapsulation after piezo-electric electret thin film transducer, be placed on commercially available screen printer, by commercially available electrically conductive ink silk-screen on encapsulated layer;
(2), again by the good piezo-electric electret thin film assembly of silk-screen, be placed in baking box 100 degrees Celsius and dry after 30 minutes and take out;
(3), use commercially available plastic packaging machine, by the good piezo-electric electret thin film assembly of lamination cold mount or thermoplastic to commercially available one side containing on non-conductive adhesive packaging film, double-faced packaging then.
More than realizing in the process of any scheme, also relate to the method that metal terminal thrusts, object is that piezo-electric electret thin film transducer positive and negative electrode is drawn, its concrete implementation step is: piezo-electric electret thin film upper/lower electrode pin is staggered, and the negative pole pin of screen metal electrode pin and piezo-electric electret thin film transducer remains in same plane, and is pierced through connection by same metal terminal.
Piezo-electric electret thin film transducer described in above two schemes, is comprised of thin polymer film and the electrode of the nonpolar microcellular structure of two-sided covering electrodes.
The invention has the beneficial effects as follows: adopt laminating method that piezo-electric electret thin film is carried out to series and parallel connections lamination, significantly improve piezo-electric electret thin film transducer electric charge and Voltage-output amount, to improve its sensitivity.Adopt cold mount or thermoplastic method encapsulates piezo-electric electret thin film transducer, reduced the loss of sensitivity that encapsulation causes piezo-electric electret thin film transducer; Take method for printing screen using metal electrode silk-screen to encapsulated layer as flexible shielding layer simultaneously, reduced the noise jamming of environment to piezo-electric electret thin film transducer, improved the signal to noise ratio of piezo-electric electret thin film transducer.
The present invention is simple to operate, energy consumption is lower, operating efficiency improves greatly, having guaranteed that piezo-electric electret thin film transducer is flexible, ultra-thin, free bend, arbitrarily cut out, under durable in use, cheap prerequisite, improved its sensitivity and antijamming capability.Thereby expanded the application of piezo-electric electret thin film transducer under high sensitivity demand occasion and strong electromagnetic interference environment, the demand of more having catered to market.
In the present invention, piezo-electric electret thin film adopts the eTouch piezoelectric membrane that Bei Xin electronics technology (Shanghai) Co., Ltd. produces.
Accompanying drawing explanation
Fig. 1 is that series connection lamination adds screen encapsulation schematic diagram;
Fig. 2 is stacked package schematic diagram in parallel;
Fig. 3 is that individual layer adds screen encapsulation schematic diagram;
Fig. 4 is the contrast schematic diagram of stacked in series transducer 1 and single layer sensor 2 output voltages;
Fig. 5 is the contrast schematic diagram of stacked transducer 1 in parallel and single layer sensor 2 output charges;
Fig. 6 is the single layer sensor signal output schematic diagram containing screen;
Fig. 7 does not export schematic diagram containing the single layer sensor signal of screen.
Embodiment
In conjunction with the accompanying drawings, the present invention is further detailed explanation.
Case study on implementation one [as accompanying drawing 1]
Commercially available conductive double sided adhesive tape is laminated to the piezo-electric electret thin film that the is coated with metal electrode 1 positive electricity pole-face of preparation.Above-mentioned positive electricity pole-face is stained with to the piezo-electric electret thin film 1 of conducting resinl, is laminated to the commercially available negative electricity pole-face that is coated with metal electrode piezo-electric electret thin film 2, piezo-electric electret thin film 1 and piezo-electric electret thin film 2 are sticked together.Then by commercially available plastic film 3 and 4, cold mounting at above-mentioned piezo-electric electret thin film 1 negative electricity pole-face and piezo-electric electret thin film 2 positive electricity pole-faces respectively.By commercially available electrically conductive ink 5 silk-screens on the outer surface of the plastic film 3 of piezo-electric electret thin film assembly, after said modules is placed in baking box to 100 degrees Celsius dries after 30 minutes and take out.Finally by cold electrically conductive ink 4 upper surfaces of mounting at above-mentioned piezo-electric electret thin film assembly of commercially available plastic film 6.Draw metal terminal, complete the lamination transducer that piezo-electric electret thin film series connection adds shielding.
The contrast schematic diagram that above-mentioned stacked in series transducer 1 and single layer sensor 2 outputs are pressed is as shown in 4.
Case study on implementation two [as accompanying drawing 2]
Commercially available conductive double sided adhesive tape is laminated to the piezo-electric electret thin film that the is coated with metal electrode 1 positive electricity pole-face of preparation.The commercially available piezo-electric electret thin film 1 that positive electricity pole-face is stained with to conducting resinl is to positive electricity pole-face infolding poststack lamination again.Then by commercially available plastic film 2 and 3, cold mounting at the upper and lower negative electricity pole-face of above-mentioned piezo-electric electret thin film 1 assembly respectively.Draw metal terminal, complete the lamination transducer of piezo-electric electret thin film self-shileding in parallel.
The contrast schematic diagram of the stacked transducer 1 of above-mentioned parallel connection and single layer sensor 2 output charges is as shown in 5.
Case study on implementation three [as accompanying drawing 3]
By commercially available plastic film 2 and 3, cold mounting at commercially available piezo-electric electret thin film 1 positive and negative electrode face respectively.By commercially available electrically conductive ink 4 silk-screens on the outer surface of the plastic film 2 of piezo-electric electret thin film assembly, after said modules is placed in baking box to 100 degrees Celsius dries after 30 minutes and take out.Finally by cold electrically conductive ink 4 upper surfaces of mounting at above-mentioned piezo-electric electret thin film assembly of commercially available plastic film 5.Draw metal terminal, complete the lamination transducer that piezo-electric electret thin film series connection adds shielding.
The above-mentioned output of the single layer sensor containing screen schematic diagram is as shown in 6;
Containing the single layer sensor 2 of screen, do not export schematic diagrames as shown in 7.
Case study on implementation four [as accompanying drawing 1]
Commercially available conductive double sided adhesive tape is laminated to the piezo-electric electret thin film that the is coated with metal electrode 1 positive electricity pole-face of preparation.Above-mentioned positive electricity pole-face is stained with to the piezo-electric electret thin film 1 of conducting resinl, is laminated to the commercially available negative electricity pole-face that is coated with metal electrode piezo-electric electret thin film 2, piezo-electric electret thin film 1 and piezo-electric electret thin film 2 are sticked together.Then by commercially available plastic film 3 and 4, thermoplastic is at above-mentioned piezo-electric electret thin film 1 negative electricity pole-face and piezo-electric electret thin film 2 positive electricity pole-faces respectively.By commercially available electrically conductive ink 5 silk-screens on the outer surface of the plastic film 3 of piezo-electric electret thin film assembly, after said modules is placed in baking box to 100 degrees Celsius dries after 30 minutes and take out.Last electrically conductive ink 4 upper surfaces at above-mentioned piezo-electric electret thin film assembly by commercially available plastic film 6 thermoplastics.Draw metal terminal, complete the lamination transducer that piezo-electric electret thin film series connection adds shielding.
The contrast schematic diagram that above-mentioned stacked in series transducer 1 and single layer sensor 2 outputs are pressed is as shown in 4.
Claims (6)
1. a method that improves piezo-electric electret thin film transducer signal to noise ratio, is characterized in that, adopts the method for series connection lamination, and concrete implementation step is as follows:
S1: the piezo-electric electret thin film that is coated with metal electrode 1 back side that conductive adhesive layer is pressed in to preparation;
S2: the piezo-electric electret thin film 1 that the back side is stained with to conducting resinl is laminated to the front that is coated with metal electrode piezo-electric electret thin film 2, lamination forms piezo-electric electret thin film series connection stacked wafer module successively;
S3: with plastic packaging machine, mount to one side containing on non-conductive adhesive packaging film described piezo-electric electret thin film series connection stacked wafer module is cold, then reverse side is cold mounts to one side containing on non-conductive adhesive packaging film.
2. a kind of method that improves piezo-electric electret thin film transducer signal to noise ratio as claimed in claim 1, is characterized in that, the preferred version of the laminated thickness of described piezo-electric electret thin film series connection stacked wafer module can be from 2～10 layers.
3. a method that improves piezo-electric electret thin film transducer signal to noise ratio, is characterized in that, adopts the method for lamination in parallel, and concrete implementation step is as follows:
(1), conductive adhesive layer is pressed in to commercially available piezo-electric electret thin film 1 back side that is coated with metal electrode;
(2), by the back side be stained with the commercially available piezo-electric electret thin film 1 of conducting resinl folding after lamination again, form piezo-electric electret thin film stacked wafer module in parallel;
(3), with plastic packaging machine, mount to one side containing on non-conductive adhesive packaging film described piezo-electric electret thin film stacked wafer module in parallel is cold, then reverse side is cold mounts to one side containing on non-conductive adhesive packaging film.
4. a kind of method that improves piezo-electric electret thin film transducer signal to noise ratio as claimed in claim 3, is characterized in that, the preferred version of the laminated thickness of described piezo-electric electret thin film stacked wafer module in parallel is 2 layers.
5. a kind of method that improves piezo-electric electret thin film transducer signal to noise ratio as described in claim 1 or 3, it is characterized in that, also relate to the method for silk screen printing, object is at piezo-electric electret thin film encapsulated layer silk-screen metal electrode, as flexible shielding layer, its concrete implementation step is as follows:
(1), by encapsulation after piezo-electric electret thin film serial or parallel connection stacked wafer module, be placed on screen printer, by electrically conductive ink silk-screen on encapsulated layer;
(2), again by described on encapsulated layer silk-screen have the piezo-electric electret thin film serial or parallel connection stacked wafer module of electrically conductive ink, be placed in baking box 100 degrees Celsius and dry after 30 minutes and take out, form the piezo-electric electret thin film screen assembly of serial or parallel connection lamination;
(3), with plastic packaging machine, mount to one side containing on non-conductive adhesive packaging film the silk-screen electrically conductive ink face of the piezo-electric electret thin film screen assembly of described serial or parallel connection lamination is cold.
6. a kind of method that improves piezo-electric electret thin film transducer signal to noise ratio as described in claim 1 or 3, is characterized in that, described piezo-electric electret thin film transducer is comprised of thin polymer film and the electrode of the nonpolar microcellular structure of two-sided covering electrodes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110433714.8A CN102522495B (en) | 2011-12-21 | 2011-12-21 | Method for raising signal to noise ratio of piezoelectric electret film sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110433714.8A CN102522495B (en) | 2011-12-21 | 2011-12-21 | Method for raising signal to noise ratio of piezoelectric electret film sensor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102522495A CN102522495A (en) | 2012-06-27 |
| CN102522495B true CN102522495B (en) | 2014-02-19 |
Family
ID=46293344
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110433714.8A Active CN102522495B (en) | 2011-12-21 | 2011-12-21 | Method for raising signal to noise ratio of piezoelectric electret film sensor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102522495B (en) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102012221833A1 (en) * | 2012-11-29 | 2014-06-05 | Robert Bosch Gmbh | Transducer with at least one electrode of a first type, an electrode of a second type and at least one ferroelectret |
| CN104617216B (en) * | 2015-01-15 | 2017-07-18 | 华中科技大学 | A kind of electret film preparation method that solid film is heated based on laser |
| CN105552209B (en) * | 2015-12-15 | 2019-02-15 | 感至源电子科技（上海）有限公司 | Multilayer self-shileding type piezoelectric film sensor and preparation method |
| CN105588585A (en) * | 2015-12-15 | 2016-05-18 | 感至源电子科技（上海）有限公司 | Composite shielding type piezoelectric film sensor |
| CN105655476A (en) * | 2016-01-25 | 2016-06-08 | 云南科威液态金属谷研发有限公司 | Intelligent hydrogel device and intelligent hydrogel control device |
| JP2019007749A (en) * | 2017-06-20 | 2019-01-17 | ヤマハ株式会社 | pressure sensor |
| CN110327052B (en) * | 2019-06-25 | 2022-04-05 | 同济大学 | Sign monitoring system based on intelligent seat |
| CN110764573B (en) * | 2019-09-18 | 2021-07-16 | 维沃移动通信有限公司 | Mobile terminal |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5113566A (en) * | 1990-02-07 | 1992-05-19 | U.S. Philips Corporation | Method of producing a multilayer piezoelectric element |
| CN1357158A (en) * | 1999-06-19 | 2002-07-03 | 罗伯特-博希股份公司 | Piezo Element with multiple-layer structure dproduced by folding and its mfg. method |
| CN101594069A (en) * | 2009-06-23 | 2009-12-02 | 南京航空航天大学 | Fold-shaped compound piezoelectric energy converting structure |
| CN101714608A (en) * | 2009-12-01 | 2010-05-26 | 同济大学 | Method for encapsulating piezoelectric polymer thin-film sensor |
| CN101964392A (en) * | 2010-08-20 | 2011-02-02 | 中国兵器工业集团第五三研究所 | Organic piezoelectric film laminated device |
-
2011
- 2011-12-21 CN CN201110433714.8A patent/CN102522495B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5113566A (en) * | 1990-02-07 | 1992-05-19 | U.S. Philips Corporation | Method of producing a multilayer piezoelectric element |
| CN1357158A (en) * | 1999-06-19 | 2002-07-03 | 罗伯特-博希股份公司 | Piezo Element with multiple-layer structure dproduced by folding and its mfg. method |
| CN101594069A (en) * | 2009-06-23 | 2009-12-02 | 南京航空航天大学 | Fold-shaped compound piezoelectric energy converting structure |
| CN101714608A (en) * | 2009-12-01 | 2010-05-26 | 同济大学 | Method for encapsulating piezoelectric polymer thin-film sensor |
| CN101964392A (en) * | 2010-08-20 | 2011-02-02 | 中国兵器工业集团第五三研究所 | Organic piezoelectric film laminated device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102522495A (en) | 2012-06-27 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102522495B (en) | Method for raising signal to noise ratio of piezoelectric electret film sensor | |
| CN103900741A (en) | Wearable smart measuring system and smart shoe | |
| CN113938216B (en) | Underwater communication system based on very-low-frequency magnetoelectric antenna and manufacturing method | |
| TWI589163B (en) | Electrostatic electroacoustic transducer | |
| CN106225811B (en) | A kind of flexible piezoelectric sensors array and preparation method thereof with generating function | |
| WO2018020887A1 (en) | Pickup sensor and biometric sensor | |
| CN101545957B (en) | Gate-structure magnetoelectric magnetic filed sensor and manufacturing method thereof | |
| CN205451012U (en) | Polaroid and touch -sensitive display device with touch -control and forced induction function | |
| JP2019516255A (en) | Electric generator provided with magnetoelectric transducer and method of manufacturing the same | |
| CN101714608B (en) | Method for encapsulating piezoelectric polymer thin-film sensor | |
| CN203216645U (en) | Multilayer piezoelectric ceramic pressure sensor | |
| CN107958199A (en) | Detect module, display device and electronic equipment | |
| CN107832671A (en) | Display device and electronic equipment | |
| CN112768907B (en) | Magnetic-electromechanical coupling type miniaturized signal receiving antenna and manufacturing method thereof | |
| JP2020508025A (en) | New RF microwave energy collection device based on electron spin attribute | |
| CN102387456A (en) | Midget microphone and manufacturing method thereof | |
| CN209882084U (en) | Novel waterproof microphone | |
| CN106842207A (en) | Sensing device further | |
| CN207182315U (en) | Display module and electronic installation | |
| CN204119513U (en) | A kind of piezoelectricity vocal structure and mobile terminal | |
| CN108613688A (en) | Multi-functional set sensing device based on magnetic electric compound material and electret | |
| CN208398897U (en) | A kind of multi-functional set sensing device based on magnetic electric compound material and electret | |
| CN208031197U (en) | flexible piezoelectric sensing device | |
| KR20110128968A (en) | Transparent and directivity-allowed speaker made with cellulose piezo-paper | |
| CN203455012U (en) | Piezoelectric film sensor for musical instrument |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: BEIGU NEW MATERIAL TECHNOLOGY (SHANGHAI) CO., LTD. Free format text: FORMER OWNER: BEIXIN ELECTRONIC TECHNOLOGY (SHANGHAI) CO., LTD. Effective date: 20140814 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: YANGPU, SHANGHAI TO: 200082 YANGPU, SHANGHAI |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20140814 Address after: 200082 Shanghai city Yangpu District Yixian Road No. 13 Building 25 room 1701D4 Patentee after: New material technology (Shanghai) Co., Ltd. Address before: Room 4, building 65, No. 257, Chifeng Road, Shanghai, Yangpu District Patentee before: Bese Electronic Technology (Shanghai) Co., Ltd. |
|
| CP03 | Change of name, title or address |
Address after: Room 313, Building 4, 45 Songbei Road, Suzhou Industrial Park, Suzhou City, Jiangsu Province Patentee after: Suzhou Beibei New Material Technology Co., Ltd. Address before: Room 1701D4, Building 25, No. 13 Yixian Road, Yangpu District, Shanghai 200082 Patentee before: New material technology (Shanghai) Co., Ltd. |
|
| CP03 | Change of name, title or address |