CN101950126B - Method for manufacturing three-dimensional smooth curved surface microstructure based on SU-8 thick photo-resist - Google Patents
Method for manufacturing three-dimensional smooth curved surface microstructure based on SU-8 thick photo-resist Download PDFInfo
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Abstract
The invention discloses a method for manufacturing a three-dimensional smooth curved surface microstructure based on SU-8 thick photo-resist. The method is characterized in that the microstructure with smooth curved surface characteristic is manufactured by combining stamping technology of polydimethyl siloxane (PDMS) and the refluxing characteristic of non-crosslinked SU-8 photo-resist. The method comprises the following steps of: manufacturing an SU-8 master die by photo-etching technology; pouring PDMS to form a female die by using the master die; converting the PDMS female die into an SU-8 male die by using the stamping technology; stripping the PDMS die; and refluxing the SU-8 male die which is not subjected to exposure and cross-linking reaction under the environment of high temperature of between 55 and 120 DEG C to form the three-dimensional microstructure with smooth curved surface characteristic. Compared with the conventional gray scale mask technology, diverging light exposure technology and positive photo-resist refluxing method, the smooth curved surface microstructure provided by the invention has the characteristics of simple and convenient machining, low cost, stable structure, large structure curvature range and the like.
Description
Technical field
The present invention relates to a kind of method for making of smooth curved surface microstructure; Relate to method for making or rather based on the three-dimensional smooth curved surface microstructure of SU-8 thick photoresist; Described method can be applicable to MEMS (Micro Electromechanical System, i.e. microelectromechanical systems) field.
Background technology
SU-8 glue is the thick photoresist of a kind of negativity, epoxide resin type, ultraviolet sensitivity; Be suitable for making the microstructure of high-aspect-ratio; Because its good mechanics, optical property, resistance to chemical corrosion and thermal stability; SU-8 is used widely in the MEMS field in recent years, comprises MOEMS (MOEMS), microfluid, machinery, sensor, actuator, biochip, little gear and truing tool etc., has become a kind of important structure material of making the MEMS device.Present conventional SU-8 manufacture craft all is to adopt traditional microelectronic processing technology to make, and often has neatly corner clearly, and its 3D surface is generally cuboid or polyhedron shape.But,, in practical application, the SU-8 manufacture craft is had higher requirement, need make the more microdevice of complicated shape and structure, the microstructure or the micro element (like lenticule) that especially have curved surface features along with the further expansion of MEMS technical application.Address that need the someone and developed GTG photomask technology; The photomask board that this techniques make use has the shade of gray distribution makes public; Make photoresist appear crosslinked in various degree or dissolving, thereby make microstructure [N.Dumbravescu, " Smooth 3-D shaping of thick resists by means of gray tone lithography " the in:Proceedings of the 1999International Semiconductor Conference that obtains having curved surface features because of experiencing the varying strength action of ultraviolet light; Sinaia; Romania, 1999, pp.217-220.].But, expensive, the high-resolution GTG photomask of GTG photomask Technology Need, such mask processed complex, cost are higher, are inappropriate for and apply.Though the curved surface microstructure of making based on the positive photoresist technique of backflow can satisfy MEMS making needs [A.Schilling, R.Merz, C.Ossmann within the specific limits; H.P.Herzig; " Surface profiles of reflow microlenses under the influence of surface tension and gravity ", Optical Engineering, 39 (2000); Pp.2171-2176.]; But because positive photoresist viscosity is relatively low usually, its spin coating thickness often less (single spin coating thickness＜50 μ m) has limited the microstructure height that can make; And positive photoresist material itself often is subject to soda acid or organic reagent corrodes, and range of application is greatly limited.Therefore, needing searching to be suitable for high aspect ratio structure makes and the stable material curved surface microstructure of physico-chemical property.SU-8 glue with traditional microelectronic technique compatibility and the characteristics that are suitable for making high aspect ratio structure, makes it become the optimal candidate material that curved surface microstructure is made owing to its good physics, chemical property.But, because the SU-8 material glass temperature after crosslinked is very high,, make it be difficult to adopt the positive photoresist reflow method near its carbonization pyrolysis temperature, promptly, make the SU-8 curved-surface structure through the flow process of photoetching, development, backflow.Therefore, to the demand of three-dimension curved surface structure fabrication, press for development SU-8 curved surface method for making new, that technology is simple, with low cost.
Summary of the invention
The method for making that the purpose of this invention is to provide a kind of three-dimensional smooth curved surface microstructure based on the SU-8 thick photoresist is to expand the SU-8 thick photoresist in the application in MEMS field and the exploitation that promotes novel MEMS device.
The method for making of a kind of three-dimensional smooth curved surface microstructure based on the SU-8 thick photoresist provided by the invention; It is characterized in that: said method for making is the manufacturing materials of smooth curved surface microstructure with negativity thick photoresist SU-8; At first make the SU-8 grand master pattern through conventional photoetching process; And cast PDMS makes master mold on this grand master pattern; Utilize compression molding techniques to pass through the PDMS master mold then former mode configuration is shifted formation without the crosslinked SU-8 formpiston of exposure, place hot environment to form microstructure through refluxing this SU-8 formpiston at last with smooth curved surface characteristic.
Particularly, the present invention adopts SU-8 as the structure fabrication material, and in the manufacturing process, at first spin coating SU-8 photoresist on substrates such as silicon chip or glass dries by the fire, develops, smokes firmly and make the SU-8 grand master pattern through soft baking, exposure, back; With PDMS (polydimethylsiloxane, dimethyl silicone polymer) performed polymer and curing agent mixture (blending ratio is mass ratio 10: 1), after the vacuum outgas, be cast on the SU-8 grand master pattern then, make the PDMS master mold; Afterwards, spin coating SU-8 photoresist on substrates such as silicon chip or glass, and remove solvent composition in the SU-8 photoresist through soft baking as far as possible, to avoid occurring the adhesion of SU-8 glue and PDMS master mold during the demoulding in the follow-up pressing mold process; Then the PDMS master mold is carried out vacuum outgas, to avoid forming bubble in the SU-8 photoresist in the pressing mold process; After the degassing; PDMS master structure face is close to SU-8 glue, exerts pressure, place (＞55 ℃) under the hot environment; Make that SU-8 is in viscous state in the pressing mold process; Have good mobility, be easy to fill in the concave structure that gets into the PDMS master mold, this pressing mold process shifts former mode configuration through the PDMS master mold and forms without the crosslinked SU-8 formpiston of exposure; After treating mold cools down to room temperature (＜30 ℃), SU-8 is converted into glassy state (solid-state) from viscous state, and peel off PDMS master mold from the SU-8 formpiston this moment, and then the SU-8 formpiston of preparation is placed that (＞55 ℃) reflux under the hot environment.Because uncrosslinked SU-8 glue glass temperature lower (55 ℃ of ≈); When environment temperature is higher than its glass temperature; SU-8 is converted into viscous state from glassy state, and mobile increasing is in (annotate: action of gravity can be ignored under the micro-meter scale) under the capillary effect; It is slick and sly that SU-8 formpiston microstructure corner will become, thereby form the three-dimensional microstructures with smooth curved surface.After SU-8 mold cools down to the room temperature after the backflow (＜30 ℃), revert to solid-state (being glassy state) again, again through uv-exposure and after baking and hard baking, accomplish the crosslinked of SU-8, guarantee the physics and the chemical stability of curved-surface structure.
Described soft baking temperature range is 60 ℃～120 ℃, and the soft baking time is 1 hour～12 hours, and soft baking temperature and time changes with the thickness of SU-8 photoresist is different, and the soft baking temperature of photoresist thicker is high more, and the soft baking time is long more, and vice versa; Described reflux temperature is 55 ℃～120 ℃, and return time is 30 seconds～3 hours, and then return time was longer when reflux temperature was low, and vice versa.
Microstructure method for making with smooth curved surface characteristic of the present invention can be used to make lenticule (seeing embodiment 2), to make up MOEMS (MOEMS, Micro-Opto-Electro-Mechanical System).Also can be used to make microfluid pipeline, have the little valve of air pressure of high sealing characteristic with structure with circular shape characteristic; Or make semisphere microfluid cavity, to realize the efficient capture and the distribution of drop or cell.
The present invention compares with existing curved surface microstructure process technology, and technology is simple, need not expensive GTG lithography mask version, and the curved surface microstructure that forms has good chemistry, calorifics and mechanical stability, and the expansion that helps the MEMS technology is used.Described smooth curved surface microstructure is slick and sly protruding curved-surface structure or is slick and sly depression curved-surface structure.
Description of drawings
Fig. 1 is the SU-8 grand master pattern synoptic diagram of making based on traditional microelectronic technique, a) is stereographic map; B) be sectional view.
Fig. 2 is the synoptic diagram of the PDMS master mold that is mould with the SU-8 grand master pattern through pouring into a mould making.
Fig. 3 is for the PDMS master mold being the synoptic diagram that mould passes through pressing mold making SU-8 formpiston.
Fig. 4 is that the SU-8 formpiston forms the synoptic diagram of curved-surface structure through refluxing.
Fig. 5 is the microlens array synoptic diagram of making based on method for making of the present invention.
Among the figure: 1 is silicon chip, and 2 is the SU-8 photoresist after crosslinked, and 3 is PDMS, and 4 is the SU-8 photoresist without exposure effect and cross-linking reaction, 5 for through reflux, the SU-8 photoresists with curved surface features of exposure effect and cross-linking reaction.
Embodiment
Embodiment 1
Adopt the SU-8 photoresist to further specify substantive distinguishing features of the present invention and obvious improvement below in conjunction with accompanying drawing.
1. utilize SU-8 photoresist common process to make the SU-8 grand master pattern, as shown in Figure 1.
2. mix PDMS performed polymer and hardening agent with 10: 1 (mass ratio) proportionings; And vacuum outgas (elimination mixes the bubble of PDMS performed polymer and hardening agent formation); Be cast on the prepared SU-8 grand master pattern of step 1, place 85 ℃ of hot plates to be cured last 1 hour then.
3. the PDMS after will solidifying peels off from the SU-8 grand master pattern, makes the PDMS master mold, and is as shown in Figure 2.
4. get and clean the back silicon chip, place 150 ℃ of bakings 20 minutes down, be cooled to room temperature after, spin coating SU-8 photoresist, and place on the hot plate 90 ℃ of bakings 1 hour is cooled to room temperature then.
5. after getting the PDMS master mold vacuum outgas of above-mentioned preparation, structural plane is attached on the SU-8 glue of baking back, and presses weight, place on the hot plate 90 ℃ of bakings 3 hours, be cooled to room temperature after, peel off the PDMS master mold, make the SU-8 formpiston, as shown in Figure 3.
6. the SU-8 formpiston with preparation places on the hot plate 70 ℃ of bakings 3 minutes, SU-8 formpiston microstructure is refluxed form the smooth curved surface structure, and baking 1 hour behind uv-exposure, 85 ℃ then makes the SU-8 smooth curved surface microstructure of stable performance, and is as shown in Figure 4.
Embodiment 2
Utilize the process of the making SU-8 smooth curved surface microstructure of embodiment 1 proposition to make microlens array (as shown in Figure 5) with different curvature; Lenticule curvature can be controlled through size, the shaped design of regulating SU-8 grand master pattern thickness and photo etched mask translucent construction; SU-8 grand master pattern thickness is between 10 μ m～1000 μ m; The shape of lithography mask version translucent construction can be regular polygon or circle, and the length of side or diameter are 10 μ m～1000 μ m.The made microlens array can be applicable to fields such as FPD, three-dimensional imaging, fiber coupler, microfocus, little projection.
Claims (8)
1. the method for making of a three-dimensional smooth curved surface microstructure; It is characterized in that: said method for making is the manufacturing materials of smooth curved surface microstructure with negativity thick photoresist SU-8; At first make the SU-8 grand master pattern through conventional photoetching process; And cast PDMS makes master mold on this grand master pattern; Utilize compression molding techniques to pass through the PDMS master mold then and former mode configuration is shifted form without the crosslinked SU-8 formpiston of exposure, at last this SU-8 formpiston is placed＞55 ℃～120 ℃ hot environment refluxes and forms three-dimensional smooth curved surface microstructure.
2. method for making as claimed in claim 1 is characterized in that making step comprises:
A) spin coating SU-8 photoresist on silicon chip or glass substrate at first is through soft baking, exposure, back baking, develop, smoke firmly and make the SU-8 grand master pattern;
B) then with PDMS performed polymer and curing agent mixture, the mass ratio that both mix 10: 1 after the vacuum outgas, is cast on the SU-8 grand master pattern, processes master mold;
C) follow spin coating SU-8 photoresist on silicon chip or glass substrate, and remove the solvent composition in the SU-8 photoresist, then the PDMS master mold is carried out vacuum outgas through soft baking; After the degassing; The structural plane of PDMS master mold is close to SU-8 glue; Exert pressure, place＞55 ℃～120 ℃ of hot environments under, make that SU-8 is in viscous state in the pressing mold process; Fill in the concave structure that gets into the PDMS master mold, through the PDMS master mold former mode configuration is shifted forming in this pressing mold process without the crosslinked SU-8 formpiston of exposure;
D) treat mold cools down after be lower than 30 ℃, SU-8 is converted into glassy state from viscous state, and peel off the PDMS master mold from the SU-8 formpiston this moment, and then the SU-8 formpiston of preparation is placed＞reflux under 55 ℃～120 ℃ hot environments; SU-8 is converted into viscous state from glassy state, mobile increasing, and under capillary effect, it is slick and sly that SU-8 formpiston microstructure corner will become, thereby form three-dimensional smooth curved surface microstructure.
3. method for making as claimed in claim 2, it is characterized in that step a) and c) described in soft baking temperature be 60 ℃～120 ℃, the soft baking time is 1 hour～12 hours.
4. method for making as claimed in claim 2 is characterized in that the return time under＞55 ℃～120 ℃ reflux temperatures is 30 seconds～3 hours.
5. according to claim 1 or claim 2 method for making is characterized in that described three-dimensional smooth curved surface microstructure is for slick and sly protruding curved-surface structure or be slick and sly depression curved-surface structure.
6. according to claim 1 or claim 2 method for making; It is characterized in that making the microlens array with different curvature by three-dimensional smooth curved surface microstructure, lenticule curvature is through regulating mask translucent construction size or shaped design control in SU-8 grand master pattern thickness and the photoetching process.
7. method for making as claimed in claim 6 is characterized in that SU-8 grand master pattern thickness is between 10-1000 μ m.
8. method for making as claimed in claim 6 is characterized in that the mask translucent construction is regular polygon or circle in the described photoetching process; The length of side of regular polygon or circular diameter are 10-1000 μ m.
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| CN102435376A (en) * | 2011-10-24 | 2012-05-02 | 中北大学 | Flexible three-dimensional force sensor and decoupling method and manufacturing method thereof |
| CN102674241B (en) * | 2012-05-31 | 2015-01-28 | 东南大学 | Method for manufacturing variable-height micro flow channel based on maskless gray-scale lithography |
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| CN102967890B (en) * | 2012-11-20 | 2015-03-11 | 中国科学院大连化学物理研究所 | Simple preparation method and application of polydimethylsiloxane (PDMS) polymer microlens array |
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| CN108073034B (en) * | 2016-11-14 | 2020-07-17 | 大连理工大学 | SU-8 photoresist film with micro taper hole, preparation method and application |
| CN108242398A (en) * | 2016-12-23 | 2018-07-03 | 上海新微技术研发中心有限公司 | Method for Forming Complex Curved Surface on Wafer Surface |
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| CN113419301A (en) * | 2021-07-21 | 2021-09-21 | 上海芯物科技有限公司 | Preparation method of micro-lens array and wafer |
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