CN101941179A

CN101941179A - Chemical mechanical grinding equipment

Info

Publication number: CN101941179A
Application number: CN2009100545021A
Authority: CN
Inventors: 闫大鹏
Original assignee: Semiconductor Manufacturing International Shanghai Corp
Current assignee: Semiconductor Manufacturing International Shanghai Corp
Priority date: 2009-07-07
Filing date: 2009-07-07
Publication date: 2011-01-12

Abstract

The invention provides chemical mechanical grinding equipment comprises a bearing device and a transmitting device capable of moving to the part right above the bearing device, wherein the bearing device comprises a bearing bench outer cover; the edge of the bearing bench outer cover is provided with more than one holes; the bearing bench outer cover is provided with cleaning nozzles corresponding to the positions of the holes inside; the transmitting device comprises wafer clamp rings; and when the transmitting device moves to the part right above the bearing device, the positions of the cleaning nozzles correspond to the positions of the wafer clamp rings. A plurality of holes and cleaning nozzles are added in the positions, which correspond to the wafer clamp rings, on the edge of the bearing bench outer cover, thus being convenient for the cleaning nozzles to clean the wafer clamp rings after a grinding head completes clamping and taking the wafers and avoiding wafer surface pollution and scratch caused by adhesion of fine polymeric material dust generated by grinding to the two sides of the wafer clamp rings.

Description

Chemical-mechanical grinding device

Technical field

The present invention relates to a kind of chemical-mechanical grinding device.

Background technology

At present, in the semiconductor fabrication process, a plurality of manufacture crafts all need to adopt chemical-mechanical grinding device that crystal column surface is done planarization, such as, in interconnection line is made, be used for the cmp metallic copper, therefore, chemical-mechanical grinding device is an equipment important in the semiconductor fabrication process.

Existing chemical-mechanical grinding device all comprises bogey usually, conveyer and lapping device, with reference to the accompanying drawings shown in the 1a, described bogey comprises plummer outer cover 104, and the plummer 106 that is positioned at the plummer outer cover, wafer 105 just was placed on the wafer carrying platform 104 before entering the grinding wafer program.

Shown in the 1a, conveyer comprises mechanical arm 101 with reference to the accompanying drawings, grinding head 102, and wafer snap ring 103, mechanical arm 101 is connected directly over the grinding head 102, drives described conveyer and moves between bogey and lapping device; Wafer snap ring 103 is arranged at the edge of grinding head 102, and outward flange is corresponding with the outward flange position of grinding head, is used for grasping silicon wafer, and wafer snap ring 103 diameters are a bit larger tham the diameter wafer that needs extracting.The diameter of grinding head 102 is identical with the diameter of plummer.

Shown in the 1b, lapping device comprises grinding pad 202 and grinds rotating disk 201 with reference to the accompanying drawings.Grinding pad 202 is horizontally placed on and grinds directly over the rotating disk 201 and link together, and the size of grinding pad 202 is consistent with grinding rotating disk 201, but much larger than wafer 105 shapes of required grinding.

1a and accompanying drawing 1b with reference to the accompanying drawings, after the wafer level of needs grinding is placed into plummer 106 centers, mechanical arm 101 drives grinding head 102 and moves to directly over the wafer 105, grinding head 102 is pushed down wafer vertically downward, make wafer snap ring 103 block wafer 105 outers, grinding head 102 gripping wafers leave plummer 106 vertically upward.Next step grinding head 102 moves to the top of grinding rotating disk 201, all the time be in rotation status and grind rotating disk 201, grinding head 102 gripping wafers are pressed vertically downward and are made wafer 105 contact with the grinding pad 202 that grinds rotating disk 201 surfaces, and grinding pad 202 makes that the irregular part of crystal column surface is ground owing to grind the rotation of rotating disk 201.

During wafer snap ring 103 gripping wafers, the wafer 105 of institute's gripping embeds wafer snap ring 103, and the corresponding face of wafer snap ring 103 and wafer 105 and grinding pad 202 is substantially at same horizontal plane, so when grinding head 102 vertical depression wafers 105 grind to grinding pad 202, wafer snap ring 103 same and grinding pad 202 CONTACT WITH FRICTION.And wafer snap ring 103 adopts is the plastic material with certain degree of hardness, and what grinding pad 202 adopted is softer polymeric material, so wafer snap ring 103 during with grinding pad 202 CONTACT WITH FRICTION, deformation take place grinding pad 202.When grinding pad 202 deformation, a large amount of polymer micronic dusts 204 sticks on the wafer snap ring 103 owing to grinding can produce in the both sides of wafer snap ring 103, shown in 203 positions that are positioned at wafer card ring both sides among Fig. 1 C.Therefore, after using repeatedly, the polymer micronic dust on the wafer snap ring 103 increases makes once more the wafer 105 surface generation scratches that card is got and a large amount of micronic dusts that drop to crystal column surface, influences the wafer yield.

Summary of the invention

The technical problem that the present invention solves be since the wafer snap ring of existing chemical-mechanical grinding device after long-time the use, a large amount of polymeric material micronic dusts can be built up in wafer snap ring both sides, the scratch wafer and the defective of bringing micronic dust to crystal column surface into when causing wafer snap ring gripping wafer.

In order to overcome the problems referred to above, the invention provides a kind of chemical-mechanical grinding device, comprising: bogey, described bogey comprises the plummer outer cover, the edge of described plummer outer cover offers an above hole, is provided with washer jet in the described hole; Be movable to the conveyer directly over the bogey, described conveyer comprises the wafer snap ring, and when described conveyer moved to directly over the bogey, the position of washer jet was corresponding with the position of wafer snap ring.

The shape of plummer outer cover and wafer snap ring all are circular.

Optionally, to bump the quantity of mouth be 6-8 for described hole or cleaning.

Optionally, when described conveyer moved to directly over the bogey, the center of wafer snap ring overlapped with the center of plummer outer cover.

Owing to adopted technique scheme, compared with prior art, the present invention has the following advantages:

Described chemical-mechanical grinding device increases several perforates in the position of the corresponding wafer snap ring in the edge of plummer outer cover and mouth is bumped in cleaning, be convenient to clean and bump mouth and the wafer snap ring is cleaned, avoided owing to grind the polymeric material micronic dust that produces and adhere to the crystal column surface that causes with wafer snap ring both sides and pollute and scratch in grinding head gripping wafer action finishing back.

Description of drawings

Fig. 1 a is the plummer structural representation of existing chemical-mechanical grinding device;

Fig. 1 b uses schematic diagram for the grinding turntable of existing chemical-mechanical grinding device;

Fig. 1 c causes the enlarged drawing of grinding pad deformation for the wafer snap ring of existing chemical-mechanical grinding device;

Fig. 2 a is the plummer of the chemical-mechanical grinding device that one embodiment of the invention provided and the vertical view of plummer outer cover thereof;

Fig. 2 b is the use schematic diagram of the chemical-mechanical grinding device that one embodiment of the invention provided.

The specific embodiment

Below in conjunction with the drawings and specific embodiments the chemical-mechanical grinding device that the present invention proposes is described in further detail.According to following narration, advantages and features of the invention will be clearer.It should be noted that accompanying drawing all adopts very the form of simplifying and all uses non-ratio accurately, only in order to convenient, the purpose of the aid illustration embodiment of the invention lucidly.

The invention provides a kind of chemical-mechanical grinding device, shown in 2a and the accompanying drawing 2b, described chemical-mechanical grinding device comprises three parts with reference to the accompanying drawings: bogey, conveyer and lapping device.

Bogey comprises: plummer outer cover 104 is shaped as annular; Plummer 106 is positioned at plummer outer cover 104 centers; Perforate 301 is opened on described outer cover 104 edge surfaces; Washer jet 302, be opened in all described holes 301 under the position.Optionally, the quantity of described perforate 301 is 6-8.

Conveyer comprises: grinding head 102 is used for pressing down wafer 105 at process of lapping; Wafer snap ring 103 is shaped as annular, and wafer snap ring 103 diameters are a bit larger tham wafer 105 diameters that need extracting, be arranged at the edge of grinding head 102, and outward flange is corresponding with the outward flange position of grinding head 102; Mechanical arm 101, as control grinding head 102 rotation, with shown in grinding head 102 fixedly connected, as shown in accompanying drawing 1a, be positioned at grinding head 102 directly over.

Please refer to Fig. 1 b, lapping device comprises: grind turntable 201, grind wafer with rotation mode in process of lapping; Grinding pad 202 is made by polymeric material, is installed on the upper surface that grinds turntable.

As stated in the Background Art; described wafer snap ring 103 is used for gripping wafer 105 in grinding pad 202 surface grindings; shown in Fig. 1 c; grinding head 102 presses down friction and makes grinding pad 202 deformation; adhere to a large amount of abrasive flours on snap ring 103 surfaces; offer several perforates 301 at plummer outer cover upper surface; corresponding cleaning is set under the hole bumps mouth 302; corresponding wafer snap ring 103 directly over capable of washing; avoid wafer snap ring 103 by the polymeric material dust pollution of grinding pad; the wafer 105 that sheet need grind under the protection, the effect of grinding is improved on scratch wafer 105 surfaces when preventing 103 grippings of wafer snap ring.

Continue with reference to figure 2b, plummer diameter L1 is identical with the inside diameter of described wafer snap ring, and the width L2 of plummer outer cover equates with the h of wafer snap ring.And the outside diameter of plummer outer cover outside diameter L3 and wafer snap ring is roughly the same.

In this specification, the thickness h of described wafer snap ring refers to the poor of the overall diameter of wafer snap ring and madial wall diameter.

Below in conjunction with Fig. 2 a and Fig. 2 b, introduce the course of work of this chemical-mechanical grinding device, when required wafer 105 needs to grind, mechanical arm 101 drives grinding head 102 and moves to directly over the plummer 106, grinding head 102 slow vertical depression wafers 105 also contacts with wafer 105 surface, and while wafer snap ring 103 blocks wafer 105 outer gripping wafers 105.After gripping finished, mechanical arm 101 drove grinding head 102 risings and moves to and is in grinding turntable 201 tops of rotation at a high speed all the time.Grinding head 102 makes 202 frictions of wafer 105 surface contact grinding pads begin to grind slowly vertically downward.And the wafer snap ring since press to grinding pad 202 and with 202 friction and the deformation of this grinding pad, adhere to the polymeric material micronic dust on grinding pad surface.After grinding finished, mechanical arm 101 drove grinding head 102 vertically upward and leaves the grinding turntable, and moved to plummer 106 tops, and grinding head 102 is placed back wafer on the plummer, and the operation of cmp is finished.Next step begins wafer snap ring 103 mattings, grinding head 102 vertically downward, contact with plummer outer cover 104, the cleaning washer jet 302 of plummer outer cover 104 lower inner is aimed at the perforate 301 of plummer outer cover upper surface correspondence, jet cleaning liquid is to wafer snap ring 103 surfaces from lower to upper, cleans in process of lapping owing to wafer snap ring 103 presses down grinding pad and makes these grinding pad 202 deformation adhered polymer micronic dust that rubs.After cleaning finishes, begin the wafer cmp flow process of a slice down.

Described wafer snap ring 103 cleaning processes have been avoided because the both sides of wafer snap ring 103 adhere to a large amount of grinding pad polymeric material micronic dusts and the polluting wafer surface, even the scratch crystal column surface, have guaranteed the wafer yield.

Though oneself discloses the present invention as above with preferred embodiment, the present invention is defined in this.Any those skilled in the art without departing from the spirit and scope of the present invention, all can do various changes and modification, so protection scope of the present invention should be as the criterion with claim institute restricted portion.

Claims

1. a chemical-mechanical grinding device is characterized in that, comprising:

Bogey, described bogey comprises the plummer outer cover, the edge of described plummer outer cover offers an above hole, also has the washer jet corresponding with the position in described hole in the plummer outer cover;

Be movable to the conveyer directly over the bogey, described conveyer comprises the wafer snap ring, and when described conveyer moved to directly over the bogey, the position of washer jet was corresponding with the position of wafer snap ring.

2. chemical-mechanical grinding device according to claim 1 is characterized in that, described plummer outer cover and wafer snap ring be shaped as circle.

3. chemical-mechanical grinding device according to claim 2 is characterized in that, the diameter of plummer outer cover is identical with the diameter of described wafer snap ring.

4. chemical-mechanical grinding device according to claim 1 is characterized in that, when described conveyer moved to directly over the bogey, the center of wafer snap ring overlapped with the center of plummer outer cover.

5. chemical-mechanical grinding device according to claim 1 is characterized in that, the quantity in described hole is 6-8.

6. according to claim 1 or 5 described chemical-mechanical grinding devices, it is characterized in that the quantity of described washer jet is 6-8.