CN101937898A - 一种用于防潮的整流器结构 - Google Patents

一种用于防潮的整流器结构 Download PDF

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CN101937898A
CN101937898A CN201010251524XA CN201010251524A CN101937898A CN 101937898 A CN101937898 A CN 101937898A CN 201010251524X A CN201010251524X A CN 201010251524XA CN 201010251524 A CN201010251524 A CN 201010251524A CN 101937898 A CN101937898 A CN 101937898A
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张雄杰
何洪运
姜旭波
程琳
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Suzhou Good Ark Electronics Co Ltd
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Abstract

一种用于防潮的整流器结构，包括：第一引线框、第二引线框、连接片、二极管芯片，该第一引线框一端是与二极管芯片连接的支撑区，所述二极管芯片一端通过焊锡膏与该支撑区连接；所述第二引线框一端是与所述连接片一端连接的焊接区；所述连接片另一端与二极管芯片另一端通过焊锡膏连接；所述第一引线框的支撑区与引脚区之间区域设有沟槽，该沟槽从第一引线框一侧延伸至另一侧；所述第一引线框的支撑区与引脚区之间区域设有通孔；所述第一引线框的支撑区与引脚区之间区域的两侧设有凸块。本发明整流器能有效防止水汽渗入和环氧封装体与引线框之间的分层问题。

Description

一种用于防潮的整流器结构
技术领域
本发明涉及一种整流器结构，尤其涉及一种需要防潮设计的整流器结构。
背景技术
整流器是利用二极管的单向导电特性对交流电进行整流，故被广泛应用于交流电转换成直流电的电路中。现有二极管产品防潮或防水气常见结构为折弯结构。当引线框厚度不够厚的时候，沟槽不足以阻断可靠性试验时水汽渗入。单纯折弯结构，经过切筋弯脚化学软化等后制程，环氧与管脚之间易出现分层。由此导致的可靠性失效是二极管封装工艺面临的主要挑战之一。
因此，如何研发一种用于防潮的整流器，解决现有水汽渗入和环氧与引线框之间的分层问题，便成为本领域技术人员努力的方向。
发明内容
本发明目的是提供一种用于防潮的整流器结构，该结构能有效防止水汽渗入和环氧封装体与引线框之间的分层问题。
为达到上述目的，本发明采用的技术方案是：一种用于防潮的整流器结构，包括：第一引线框、第二引线框、连接片、二极管芯片，该第一引线框一端是与二极管芯片连接的支撑区，所述二极管芯片一端通过焊锡膏与该支撑区连接，第一引线框另一端是引脚区，该第一引线框的引脚区作为所述整流器的电流传输端；
所述第二引线框一端是与所述连接片一端连接的焊接区，该第二引线框另一端为引脚区，该第二引线框的引脚区作为所述整流器的电流传输端；
所述连接片另一端与二极管芯片另一端通过焊锡膏连接；
所述第一引线框的支撑区与引脚区之间区域设有沟槽，该沟槽从第一引线框一侧延伸至另一侧；
所述第一引线框的支撑区与引脚区之间区域设有通孔；
所述第一引线框的支撑区与引脚区之间区域的两侧设有凸块；
所述第二引线框的焊接区与引脚区之间区域设有沟槽，该沟槽从第一引线框一侧延伸至另一侧；
所述第二引线框的焊接区与引脚区之间区域设有通孔；
所述第二引线框的焊接区与引脚区之间区域的两侧设有凸块；
所述沟槽、通孔和凸块均位于环氧封装体内。
上述技术方案中的有关内容解释如下：
1、上述方案中，所述通孔位于所述沟槽上。
2、上述方案中，所述通孔为圆孔。
由于上述技术方案运用，本发明与现有技术相比具有下列优点和效果：
本发明提供一种用于防潮的整流器结构，该整流器结构的引线框设置了圆孔、多重沟槽和锯齿边缘(翅膀)结构的凸块。圆孔为通孔，封装成型后圆孔内被环氧体贯穿，形成锁定结构；多重沟槽对可靠性试验中外界的高压水汽形成多重防线；锯齿结构的凸块可阻断或减少后制程中由外部管脚传导至防潮结构区的机械应力，从而大幅降低环氧与管脚之间分层的可能性。
附图说明
附图1为现有技术的引线框结构示意图；
附图2为本发明的引线框结构示意图；
附图3为本发明整流器结构示意图；
附图4为附图3的仰视示意图。
以上附图中：1、第一引线框；2、第二引线框；3、连接片；4、二极管芯片；5、支撑区；6、引脚区；7、焊接区；8、沟槽；9、通孔；10、凸块；11、环氧封装体。
具体实施方式
下面结合附图及实施例对本发明作进一步描述：
实施例：一种用于防潮的整流器结构，
包括：第一引线框1、第二引线框2、连接片3、二极管芯片4，该第一引线框1一端是与二极管芯片4连接的支撑区5，所述二极管芯片4一端通过焊锡膏与该支撑区5连接，第一引线框1另一端是引脚区6，该第一引线框1的引脚区6作为所述整流器的电流传输端；
所述第二引线框2一端是与所述连接片3一端连接的焊接区7，该第二引线框2另一端为引脚区6，该第二引线框2的引脚区6作为所述整流器的电流传输端；
所述连接片3另一端与二极管芯片4另一端通过焊锡膏连接；
所述第一引线框1的支撑区5与引脚区6之间区域设有沟槽8，该沟槽8从第一引线框1一侧延伸至另一侧；
所述第一引线框1的支撑区5与引脚区6之间区域设有通孔9；
所述第一引线框1的支撑区5与引脚区6之间区域的两侧设有凸块10；
所述第二引线框2的焊接区7与引脚区6之间区域设有沟槽8，该沟槽从第一引线框一侧延伸至另一侧；
所述第二引线框2的焊接区7与引脚区6之间区域设有通孔9；
所述第二引线框2的焊接区7与引脚区6之间区域的两侧设有凸块10；
所述沟槽8、通孔9和凸块10均位于环氧封装体11内。
所述通孔9位于所述沟槽8上。
所述通孔9为圆孔9。
上述实施例只为说明本发明的技术构思及特点，其目的在于让熟悉此项技术的人士能够了解本发明的内容并据以实施，并不能以此限制本发明的保护范围。凡根据本发明精神实质所作的等效变化或修饰，都应涵盖在本发明的保护范围之内。

Claims (3)

1.一种用于防潮的整流器结构，包括：第一引线框(1)、第二引线框(2)、连接片(3)、二极管芯片(4)，该第一引线框(1)一端是与二极管芯片(4)连接的支撑区(5)，所述二极管芯片(4)一端通过焊锡膏与该支撑区(5)连接，第一引线框(1)另一端是引脚区(6)，该第一引线框(1)的引脚区(6)作为所述整流器的电流传输端；
所述第二引线框(2)一端是与所述连接片(3)一端连接的焊接区(7)，该第二引线框(2)另一端为引脚区(6)，该第二引线框(2)的引脚区(6)作为所述整流器的电流传输端；
所述连接片(3)另一端与二极管芯片(4)另一端通过焊锡膏连接；
其特征在于：
所述第一引线框(1)的支撑区(5)与引脚区(6)之间区域设有沟槽(8)，该沟槽(8)从第一引线框(1)一侧延伸至另一侧；
所述第一引线框(1)的支撑区(5)与引脚区(6)之间区域设有通孔(9)；
所述第一引线框(1)的支撑区(5)与引脚区(6)之间区域的两侧设有凸块(10)；
所述第二引线框(2)的焊接区(7)与引脚区(6)之间区域设有沟槽(8)，该沟槽从第一引线框一侧延伸至另一侧；
所述第二引线框(2)的焊接区(7)与引脚区(6)之间区域设有通孔(9)；
所述第二引线框(2)的焊接区(7)与引脚区(6)之间区域的两侧设有凸块(10)；
所述沟槽(8)、通孔(9)和凸块(10)均位于环氧封装体(11)内。
2.根据权利要求1所述的整流器结构，其特征在于：所述通孔(9)位于所述沟槽(8)上。
3.根据权利要求1所述的整流器结构，其特征在于：所述通孔(9)为圆孔(9)。
CN201010251524XA 2010-08-12 2010-08-12 一种用于防潮的整流器结构 Pending CN101937898A (zh)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103117355A (zh) * 2013-02-01 2013-05-22 苏州固锝电子股份有限公司 贴片式二极管器件结构
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