CN101931850A - Micro-speaker and manufacturing method thereof - Google Patents
Micro-speaker and manufacturing method thereof Download PDFInfo
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- CN101931850A CN101931850A CN2008101903857A CN200810190385A CN101931850A CN 101931850 A CN101931850 A CN 101931850A CN 2008101903857 A CN2008101903857 A CN 2008101903857A CN 200810190385 A CN200810190385 A CN 200810190385A CN 101931850 A CN101931850 A CN 101931850A
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Abstract
The invention discloses a micro-speaker and a manufacturing method thereof. The invention has the characteristics of improving the lack of the micro-speaker in low frequency sound pressure or having pliability. The micro-speaker is provided with a sandwich-like structure, and comprises two piezoelectric material layers and a thin film configured therein. The piezoelectric material layer is in a circular structure in an example.
Description
Technical field
The present invention relates to a kind of loud speaker, and particularly relate to a kind of Microspeaker and manufacture method thereof.
Background technology
The sounding principle of loud speaker (speaker) is that the generation by the signal of telecommunication touches vibrating diaphragm and produces sound or music, and can be applicable to mobile phone, notebook computer, personal digital assistant, digital camera, flat-surface television or the like consumption electronic products.Pursue in industry under the future development trend of compact and multifunction, in order to improve the competitiveness of product in market, industrial circle wishes that all the application of advanced technology develops and make loud speaker.
The principle of loud speaker can roughly be divided into moving-coil type, piezoelectric type, and electrostatic etc. three kinds.Coil-moving speaker uses the widest at present, technology maturation, but because the shortcoming of its congenital framework, and can't be with the volume flattening.
The action principle of conventional electrostatic formula loud speaker is to seize the fixed plate electrode of two perforates on both sides by the arms conductive diaphragm to form a kind of capacitor, by the alternating voltage of supplying with the vibrating diaphragm Dc bias and giving two fixed electrode audio frequency, the electrostatic force that utilizes positive negative electric field to take place, the drive conductive diaphragm vibrates, and sound transmission is gone out.The bias voltage of conventional electrostatic formula loud speaker need reach up to a hundred or go up kilovolt, therefore needs the enlarger of external high unit price and bulkiness, is its reason that can't popularize.
Piezo-electric loudspeaker is a piezoelectric effect of utilizing piezoelectric, when additional electric field in the characteristic of material deformation that piezoelectric causes, be used for promoting vibrations film sounding, though this loud speaker flat structure microminiaturization, need carry out sintering but be limited to piezoelectric, so still can't carry out deflection.
Technology with reference to existing loud speaker, for example the U.S. the 7th, 170, No. 822 patents promptly disclose a kind of layering piezoelectric transducer and manufacture method thereof (Laminated piezoelectric transducer and method of manufacturing the same).See also Fig. 1 a.The upper and lower layer that Fig. 1 a illustrates layering piezoelectric transducer 100 is rosette 102, and its thickness is 0.005 inch, and the intermediate layer is a piezoelectricity disk 104, forms disc structure 101 to increase amplitude.The upper and lower layer packing ring 106 that is illustrated layering piezoelectric transducer 100 by Fig. 1 b can become layering piezoelectric transducer encapsulation 105 as encapsulation again.Adding then that rubber washer 108 makes becomes cavity, illustrates as Fig. 1 c.The characteristic of case is before this, and the layering piezoelectric transducer can utilize cavity to increase sound press and promote the definition of sound.And can become the loud speaker that is applied under water.Yet,,,, therefore also limited the scope of using in addition because do not possess pliability (Flexible) so that the phenomenon of acoustic pressure deficiency is arranged because of it only uses single face Piezoelectric Ceramic vibrating diaphragm.
In the 5th, 805, No. 726 patents of the U.S., disclose a kind of piezoelectric type full frequency-domain loud speaker (Piezoelectric full-range loudspeaker).See also Fig. 2 a and Fig. 2 b.Fig. 2 a illustrates the cutaway view of piezoelectric type full frequency-domain loud speaker 200.Fig. 2 b illustrates the vertical view of piezoelectric type full frequency-domain loud speaker 200.This loud speaker is by damping fin 204 of two alloying metal sheets, 202 therebetween, and the phonation unit that is combined at alloying metal sheet 202 arranged outside piezoelectric patches 206, each outwards is provided with lead 208 on alloying metal sheet 202 and the piezoelectric patches 206, and passing to electric current on lead can sound.The characteristic of this patent case is to utilize damping to obtain better acoustic fidelity, and the advantage that has possessed miniaturization, high fax, power saving and be not subjected to Electromagnetic Interference.Can be applicable to small portable electronic sound product.Yet the manufacture craft of this technology is quite complicated, and cost is also very high.In addition,, can produce the phenomenon of acoustic pressure deficiency, and, also therefore limit the scope of its application because of no pliability because use the single face piezoelectric patches to drive the lamination layer structure vibrating diaphragm.
In the 4th, 439, No. 640 patents of the U.S., disclose a kind of piezo-electric loudspeaker (Piezoelectric loudspeaker).See also Fig. 3 a.Fig. 3 a illustrates piezo-electric loudspeaker 300 and is originated as vibration by piezoelectric ceramic disk 302 and rosette 304, vibrating diaphragm 306 is incorporated into its top, and central authorities is cavity 310, to finish sonification system again.About utilize support 308 fixing.It is the structure chart of Improvement type piezo-electric loudspeaker 300A for Fig. 3 b, and is many above it in conjunction with disk film 312 and support 308.Fig. 3 c illustrates the frequency response curve of piezo-electric loudspeaker 300 and Improvement type piezo-electric loudspeaker 300A.Curve C 1 and C2 represent the performance of piezo-electric loudspeaker 300 and Improvement type piezo-electric loudspeaker 300A respectively.
Can find the disclosed Improvement type piezo-electric loudspeaker of this patent 300A structure, its stability is good than piezo-electric loudspeaker 300, and also more excellent in the low frequency performance.And the characteristic of this patent is to use piezoelectric ceramic as vibration source, makes the general piezoelectric of amplitude big.And can be applicable on the non-bendable electronic product.Yet therefore this patent also is the phenomenon that has the acoustic pressure deficiency because use the single face piezoelectric ceramic piece to drive the lamination layer structure vibrating diaphragm, and because no pliability, so limited the scope of using.
The U.S. the 7th, 166, No. 952 patents disclose a kind of piezoelectric type structure (Piezoelectric structures).See also Fig. 4 a, 4b.Fig. 4 a illustrates the vertical view of piezoelectric type structure 400.Fig. 4 b illustrates the cutaway view of piezoelectric type structure 400.This patent case is utilized the piezoelectric positive and negative electrode, is fixed to the gauffer 410 of plastic material, to reach bigger amplitude.Its characteristic is to utilize the performance characteristic of the continuous electrode 414 of the separate mesh electrode 412 on fold 410, top and bottom to make amplitude lift.Yet the manufacture craft that this patent proposed is quite complicated, and cost is quite high, and uses the piezoelectricity bar to drive the folded structure vibrating diaphragm, also has the acoustic pressure deficiency.
Summary of the invention
The object of the present invention is to provide a kind of Microspeaker and manufacture method thereof, have and improve the phenomenon of Microspeaker, and have flexual characteristic in the low-frequency sound pressure deficiency.
The invention provides a kind of Microspeaker with sandwich structure, this sandwich structure comprises the first ring-like piezoelectric, the second ring-like piezoelectric and film (Diaphragm), and wherein this film is between the first ring-like piezoelectric and the second ring-like piezoelectric.
Implement in the example one, Microspeaker proposed by the invention comprises first piezoelectric material layer, second piezoelectric material layer and a vibrating diaphragm.This vibrating diaphragm is between first piezoelectric material layer and second piezoelectric material layer.The neighboring area of this vibrating diaphragm is first piezoelectric material layer and the second piezoelectric material layer clamping, and the zone line of vibrating diaphragm is as the working region of Microspeaker output sound.
Implement in the example one, the manufacture method of Microspeaker proposed by the invention comprises a piezoelectric is provided, and forms two piezoelectric material layers that upper and lower surface has metal electrode.This two piezoelectric material layers cutting is formed first piezoelectric material layer and second piezoelectric material layer with hollow out.In conjunction with first piezoelectric material layer, a vibrating diaphragm and second piezoelectric material layer to form a sandwich structure, vibrating diaphragm and between first piezoelectric material layer and second piezoelectric material layer wherein, and the neighboring area of this vibrating diaphragm is first piezoelectric material layer and the second piezoelectric material layer clamping.And the zone line of vibrating diaphragm passes through the working region of the hollow out zone of first piezoelectric material layer and second piezoelectric material layer as the Microspeaker output sound.
For above-mentioned feature and advantage of the present invention can be become apparent, embodiment cited below particularly, and cooperate appended accompanying drawing to be described in detail below.
Description of drawings
Fig. 1 a~1c illustrates a kind of structure and its layering encapsulation schematic diagram of existing layering piezoelectric transducer;
Fig. 2 a illustrates a kind of cutaway view of existing piezoelectric type full frequency-domain loud speaker;
Fig. 2 b illustrates the top view of the piezoelectric type full frequency-domain loud speaker of Fig. 2 a;
Fig. 3 a illustrates a kind of structural profile schematic diagram of existing piezo-electric loudspeaker;
Fig. 3 b illustrates the structural profile schematic diagram that another kind of existing Improvement type piezoelectric type is raised one's voice;
Fig. 3 c illustrates the piezo-electric loudspeaker of Fig. 3 a and 3b and the frequency response curve of Improvement type piezo-electric loudspeaker;
Fig. 4 a illustrate a kind of existing piezoelectric type structure on look schematic diagram;
Fig. 4 b illustrates the cross-sectional schematic of the piezoelectric type structure of Fig. 4 a;
Fig. 5 a illustrate embodiments of the invention the Microspeaker structure on look schematic diagram;
Fig. 5 b illustrates the generalized section of the Microspeaker structure of embodiments of the invention;
Fig. 6 a~h is the manufacture method generalized section according to the Microspeaker of embodiments of the invention;
Fig. 7 is that the acoustic pressure of the double-deck ring-like piezoelectric of the existing single collar plate shape piezoelectric exciter and the embodiment of the invention compares schematic diagram;
Fig. 8 is the frequency response curve of PZT loud speaker and PVDF-PDMS loud speaker.
The main element symbol description
100: the layering piezoelectric transducer
101: disc structure
102: rosette
104: the piezoelectricity disk
105: encapsulation
106: packing ring
108: rubber washer
200: piezoelectric type full frequency-domain loud speaker
202: the alloying metal sheet
204: damping fin
206: piezoelectric patches
208: lead
300: piezo-electric loudspeaker
300A: Improvement type piezo-electric loudspeaker
302: the piezoelectric ceramic disk
304: rosette
306: vibrating diaphragm
308: support
310: cavity
400: the piezoelectric type structure
410: gauffer
412: separate mesh electrode
414: continuous electrode
500: the Microspeaker of one embodiment of the invention
501: ring-like piezoelectric
502: film
503: input electrode
504: grounding electrode
602,602A:PVDF film
604,604A: one deck silver electrode
605: ring-like PVDF structure
606: sheet glass
608: one deck release agent
The 610:PDMS film
The 611:PDMS composite construction
6a~h: the signal of the Microspeaker manufacturing process of one embodiment of the invention
Embodiment
The invention provides a kind of Microspeaker and manufacture method thereof, have and improve the phenomenon of Microspeaker, and have flexual characteristic in the low-frequency sound pressure deficiency.
Implement to the invention provides a kind of Microspeaker with sandwich structure in the example one, this sandwich structure comprises two layers of piezoelectric material layer and film (Diaphragm) between the centre.
Microspeaker with sandwich structure proposed by the invention, its piezoelectric material layer can be the pliability piezoelectric membranes.This pliability piezoelectric membrane can be for example polyvinylidene fluoride (Polyvinylidene Difluoride, PVDF), lead zirconate titanate ceramic (Composite PZT) one of them or its combination.Implement in the example one, the Microspeaker with sandwich structure proposed by the invention, its piezoelectric material layer external form for example can be ring-like external form, or other external forms.
Microspeaker with sandwich structure proposed by the invention as the film of the diaphragm of loudspeaker, can adopt the pliability vibrating diaphragm.And the material of this pliability vibrating diaphragm can adopt for example high molecular film material, for example dimethyl silicone polymer (Polydimethylsiloxane, PDMS).And implement in the example other one, this film also can be selected the rigidity vibrating diaphragm.
Implement in the example one, the present invention more provides a kind of manufacture method of Microspeaker, is included in the upper and lower surface of soft piezoelectric, plates the layer of metal electrode.Utilize the circular hole cutter, soft piezoelectric is cut out a circular hole, form ring-like soft piezoelectric structure.In addition, be coated with the last layer release agent, and utilize the rotary coating machine on this layer release agent, to be coated with one deck high molecular film material, to form vibrating diaphragm in glass sheet surface.Then, be bonding on the surface of vibrating diaphragm, and the combination of at high temperature pressurizeing, comprise the ring-like piezoelectric structure of vibrating diaphragm with formation the surface of ring-like soft piezoelectric structure.Two groups of ring-like soft piezoelectric structures and vibrating diaphragm can be formed the Microspeaker with this sandwich structure after bonding.
Based on above-mentioned, Microspeaker proposed by the invention utilizes double-deck ring-like piezoelectric, and input electrode is with vibration film, can solve conventional piezoelectric the decline phenomenon of the common low frequency sound press deficiency of type loud speaker and characteristic that can't deflection.This principle is for utilizing two rings type piezoelectric as vibration generator up and down, and plates electrode at the upper and lower faces of vibrating diaphragm, places the intermediate layer as the exciting film pliability vibrating diaphragm again, and then obtains good audio frequency curve.
Fig. 5 a and Fig. 5 b are respectively according to looking and generalized section on the Microspeaker structure of one embodiment of the invention.Microspeaker 500 has comprised two ring-like piezoelectric material layers 501, film 502, input electrode 503 and grounding electrodes 504 in the present embodiment.Film 502 is fixed with method of clamping between ring-like piezoelectric material layer 501 and 501.Ring-like piezoelectric material layer 501, film 502 pile up the formation sandwich structure with ring-like piezoelectric material layer 501.The ring-like neighboring area 534 of film 502 is ring-like piezoelectric material layer 501 and 501 clampings, and zone 532 then is the working region of Microspeaker 500 output sounds in the middle of it.
Ring-like piezoelectric material layer 501 comprises the pliability piezoelectric membrane, for example polyvinylidene fluoride (PVDF).In other embodiments, ring-like piezoelectric material layer 501 can be made up of lead zirconate titanate ceramic (Composite PZT) material.Lead zirconate titanate ceramic not only has characteristics such as high temperature resistant, corrosion-resistant, the weather resistance of traditional ceramics, and has the performance of many excellences at aspects such as electricity, magnetic, sound, light, so also be applicable to the structure of Microspeaker.
In another implemented example, this film 502 also can be the rigidity vibrating diaphragm, and its characteristic is that tonequality is higher, strong but pliable in texture but flexible not.The present invention does not do too many restriction to the material of vibrating diaphragm.
Fig. 6 is the manufacture method schematic diagram according to the Microspeaker of one embodiment of the invention.Fig. 6 a~h is the signal of its manufacturing process.Please refer to shown in Fig. 6 a~6b, at first adopt soft piezoelectric, polyvinylidene fluoride (PVDF) for example, thickness is 110 microns, can form one deck pvdf membrane 602.And plate one deck silver electrode 604 in the upper and lower surface of pvdf membrane 602.This embodiment is silver-colored in electrode material for adopting, but not as limit.
Shown in Fig. 6 c, utilize the circular hole cutter that pvdf membrane 602 is cut out a circular hole, form ring-like PVDF structure 605.Its levels comprises silver electrode 604A, and the intermediate layer is pvdf membrane 602A.So can make the sandwich structure of a ring-like hollow out.
Shown in Fig. 6 d~6e, be coated with last layer release agent 608 in the front of a sheet glass 606.
Shown in Fig. 6 f, utilize the rotary coating machine on this layer release agent 608, to be coated with one deck high molecular film material (such as PDMS), can form PDMS composite construction 611.PDMS film 610 thickness are 50 microns, and it is the usefulness as vibrating diaphragm.
Shown in Fig. 6 g, the ring-like PVDF structure 605 that is cut to ring type is bonded on the PDMS composite construction 611, the combination of pressurizeing in vacuum oven because of coating release agent in advance makes sheet glass 606 to separate with PDMS film 610 easily, forms the ring-like PVDF structure 613 that comprises the PDMS film.
At last, repeat Fig. 6 a~6g, can form have two groups of ring-like PVDF structures and between have the loadspeaker structure of PDMS film, it can be finished the Microspeaker of the embodiment of the invention after bonding, and this is ring-like engraved structure.If the selected material of Microspeaker is a macromolecular material, then can be Microspeaker with flexible characteristic.
Fig. 7 is the acoustic pressure effect comparison diagram of the double-deck ring-like piezoelectric of the existing single collar plate shape piezoelectric exciter and the embodiment of the invention.See also Fig. 7, transverse axis is represented the range frequency, and the longitudinal axis is represented displacement, and this simulation purpose is to inquire into the comparison of the double-deck ring-like piezoelectric exciter of the traditional single collar plate shape piezoelectric exciter and the embodiment of the invention.The exciting film makes with the PVDF material, and its frequency range is set in 0.2~3kHz, and drive electrode is 10Vpp.
And Simulation result shows, the curve a of upper end is the relation of double-deck ring-like piezoelectric exciter frequency and respective films displacement.The curve b of lower end is the relation of single collar plate shape piezoelectric exciter frequency and respective films displacement.The displacement that single collar plate shape piezoelectric exciter is produced is about 10
-10The yardstick of rice.Yet the displacement that double-deck ring-like piezoelectric exciter produced but can rise to 10 greatly
-7The yardstick of rice.Clearly, utilize double-deck ring-like structure not only to solve the phenomenon of conventional piezoelectric materials, also improve ring type structure simultaneously and be not so good as collar plate shape and make the result that acoustic pressure is not good in the exciting area in the low-frequency sound pressure deficiency.
Fig. 8 is the frequency response curve of PZT loud speaker and PVDF-PDMS loud speaker.See also Fig. 8.The acceptable range frequency of transverse axis representative ear, the longitudinal axis is represented acoustic pressure stratum, and represents with decibel (dB).Generally speaking, existing PZT loud speaker many with aluminium (AL) as the exciting film, the PVDF-PDMS loud speaker is the exciting film with macromolecules such as PDMS then, and with PVDF as vibration generator.There are three curve: a, b and c to represent the frequency response of background noise, PVDF-PDMS loud speaker and PZT loud speaker respectively among the figure.The sound pressure level of PVDF-PDMS loud speaker and PZT loud speaker all surpasses background noise, so can send the sound.As shown in Figure 8, the PVDF-PDMS loud speaker has the 60dB performance approximately in the sound pressure level of 200Hz, is better than conventional P ZT loud speaker.Clearly, the frequency response curve of PVDF-PDMS loud speaker will be better than the frequency response curve of PZT loud speaker.
In sum, main innovation part of the present invention is to utilize double-deck ring-like piezoelectric, and be clipped in the middle high molecular film material (similar sandwich structure).Double-deck ring-like piezoelectric is an exciting source, the oscillating membrane that macromolecule membrane is then exported for source of sound.
The mode that ring-like up and down piezoelectric drives can remedy the phenomenon that the individual layer exciting source produces the sound press deficiency.Because of the individual layer vibrating diaphragm is a flexible material, add and utilize the double-deck mode that oppositely connects electricity, can increase the amplitude of its vibration.So can significantly promote the sound press of low frequency, and then improve LF-response.Manufacture craft of the present invention is simple, so cost is low.
Especially bad, bendable making among the structure that technology also can be applicable to Microspeaker.Because characteristics such as that the product of this technology manufacturing has is in light weight, cost is extremely cheap and shock-resistant not only have dynamogenetic value, more can increase the designer in the imagination space on the product shape and the convenience that carries of user.And the characteristic of flexible of the present invention allows Microspeaker can cooperate the confined space to do suitable to scratch in the wrongly, help element to put configuration, increase the chance of product miniaturization.Can be applied to future and make Electronic Paper that the performance of " sound ", light also can be arranged on the Electronic Paper, more " sound " that Electronic Paper can be expressed moves, and can give the abundanter lively information of user.Also can do the Microspeaker of flexible on the electronics clothing future, except that providing the music, have and to notify the user with the signal of sensor on the electronics clothing in the mode of sound, allow the user except listening to the music, the function (warning) of monitoring physiological signal also can be arranged.In addition, the pliability Microspeaker can be integrated into the electronics clothing, can be look barrier with the person provide the caution sound or the zone explanation.Wear and carry the technology that the formula mobile phone adds the pliability Microspeaker, also can promote attraction greatly the user.
Though disclosed the present invention in conjunction with above embodiment; yet it is not in order to limit the present invention; be familiar with this operator in the technical field under any; without departing from the spirit and scope of the present invention; can do a little change and retouching, thus protection scope of the present invention should with enclose claim was defined is as the criterion.
Claims (17)
1. Microspeaker comprises:
First piezoelectric material layer and one second piezoelectric material layer; And
Vibrating diaphragm, between this first piezoelectric material layer and this second piezoelectric material layer, wherein the neighboring area of this vibrating diaphragm is this first piezoelectric material layer and this second piezoelectric material layer clamping, and the zone line of this vibrating diaphragm is as the working region of this Microspeaker output sound.
2. Microspeaker as claimed in claim 1, wherein this vibrating diaphragm comprises a pliability vibrating diaphragm.
3. Microspeaker as claimed in claim 2, wherein this pliability vibrating diaphragm is made up of high molecular film material.
4. Microspeaker as claimed in claim 1, wherein this film is a rigidity vibrating diaphragm.
5. Microspeaker as claimed in claim 1, wherein this first piezoelectric material layer and this second piezoelectric material layer are ring type structure, and the neighboring area of this vibrating diaphragm is to be fixed by this ring type structure clamping.
6. Microspeaker as claimed in claim 1, wherein this first piezoelectric material layer and this second piezoelectric material layer are the pliability piezoelectric material layer.
7. Microspeaker as claimed in claim 6, wherein this pliability piezoelectric material layer is by polyvinylidene fluoride (PVDF), lead zirconate titanate ceramic (Composite PZT) one of them or its combination and form.
8. Microspeaker as claimed in claim 1, wherein also comprise one first input electrode and one second input electrode, this first input electrode is connected to this first piezoelectric material layer, and this second input electrode is connected to this second piezoelectric material layer, so that this Microspeaker operating power to be provided.
9. the manufacture method of a Microspeaker comprises:
One piezoelectric is provided, and forms two piezoelectric material layers that upper and lower surface has metal electrode;
This two piezoelectric material layers cutting is formed one first piezoelectric material layer and one second piezoelectric material layer with hollow out;
Form a vibrating diaphragm; And
In conjunction with this first piezoelectric material layer, this vibrating diaphragm and this second piezoelectric material layer to form a sandwich structure, this vibrating diaphragm and between this first piezoelectric material layer and this second piezoelectric material layer wherein, and the neighboring area of this vibrating diaphragm is this first piezoelectric material layer and this second piezoelectric material layer clamping, and the zone line of this vibrating diaphragm passes through the working region of the hollow out zone of this first piezoelectric material layer and this second piezoelectric material layer as this Microspeaker output sound.
10. the manufacture method of Microspeaker as claimed in claim 9 wherein forms this method with piezoelectric material layer of metal electrode and comprises:
One piezoelectric material layer is provided;
Form a metal electrode layer on a first surface of this piezoelectric material layer and a second surface, wherein this first surface and this second surface lay respectively at the both sides of this piezoelectric material layer; And
This piezoelectric material layer cutting that will have this metal electrode layer forms middle structure with this hollow out zone, is the piezoelectric material layer that this has metal electrode.
11. the manufacture method of Microspeaker as claimed in claim 10, the mode of this piezoelectric material layer cutting that wherein will have this metal electrode layer is for utilizing the circular hole cutter, cut out this hollow out zone with circular hole external form.
12. the manufacture method of Microspeaker as claimed in claim 10, wherein this metal electrode layer comprises silver.
13. the manufacture method of Microspeaker as claimed in claim 10, wherein this piezoelectric material layer is made up of soft piezoelectric.
14. the manufacture method of Microspeaker as claimed in claim 13, wherein this soft piezoelectric comprise polyvinylidene fluoride (polyvinylidene difluoride, PVDF).
15. the manufacture method of Microspeaker as claimed in claim 9, the method that wherein forms this vibrating diaphragm comprises:
Be coated with the surface of one deck release agent in a sheet glass; And
Rotary coating one high molecular film material layer is on this layer release agent, to form this vibrating diaphragm.
16. the manufacture method of Microspeaker as claimed in claim 15, wherein this floor height molecular film material comprise dimethyl silicone polymer (Polydimethylsiloxane, PDMS).
17. the manufacture method of Microspeaker as claimed in claim 9, wherein the method in conjunction with this first piezoelectric material layer, this vibrating diaphragm and this second piezoelectric material layer comprises:
With this first piezoelectric material layer and this second piezoelectric material layer, be bonded in the surface of this vibrating diaphragm; And
Via the heating and pressurizing combination, to form this sandwich structure.
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Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
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CN103369423A (en) * | 2013-07-25 | 2013-10-23 | 瑞声科技(南京)有限公司 | In-ear earphone |
CN106792375A (en) * | 2016-12-28 | 2017-05-31 | 歌尔股份有限公司 | Diaphragm of loudspeaker component |
CN109714685A (en) * | 2017-10-26 | 2019-05-03 | 华一声学股份有限公司 | Wafer speaker |
CN110213704A (en) * | 2018-02-28 | 2019-09-06 | 太阳诱电株式会社 | Vibration machine part and electronic equipment |
WO2020055566A1 (en) * | 2018-09-13 | 2020-03-19 | Wisconsin Alumni Research Foundation | Eardrum transducer with nanoscale membrane |
CN111885468A (en) * | 2020-07-09 | 2020-11-03 | 诺思(天津)微系统有限责任公司 | MEMS piezoelectric speaker |
WO2021134672A1 (en) * | 2019-12-31 | 2021-07-08 | 瑞声声学科技(深圳)有限公司 | Piezoelectric mems microphone |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0711096A4 (en) * | 1994-05-20 | 1999-09-22 | Shinsei Corp | Sound generating device |
JP2008017433A (en) * | 2006-07-05 | 2008-01-24 | Taiyo Yuden Co Ltd | Piezoelectric electroacoustic transducer |
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2008
- 2008-12-31 CN CN2008101903857A patent/CN101931850B/en not_active Expired - Fee Related
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
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CN103369423A (en) * | 2013-07-25 | 2013-10-23 | 瑞声科技(南京)有限公司 | In-ear earphone |
CN106792375A (en) * | 2016-12-28 | 2017-05-31 | 歌尔股份有限公司 | Diaphragm of loudspeaker component |
CN106792375B (en) * | 2016-12-28 | 2019-09-17 | 歌尔股份有限公司 | Diaphragm of loudspeaker component |
CN109714685A (en) * | 2017-10-26 | 2019-05-03 | 华一声学股份有限公司 | Wafer speaker |
CN110213704A (en) * | 2018-02-28 | 2019-09-06 | 太阳诱电株式会社 | Vibration machine part and electronic equipment |
WO2020055566A1 (en) * | 2018-09-13 | 2020-03-19 | Wisconsin Alumni Research Foundation | Eardrum transducer with nanoscale membrane |
US10715939B2 (en) | 2018-09-13 | 2020-07-14 | Wisconsin Alumni Research Foundation | Eardrum transducer with nanoscale membrane |
WO2021134672A1 (en) * | 2019-12-31 | 2021-07-08 | 瑞声声学科技(深圳)有限公司 | Piezoelectric mems microphone |
CN111885468A (en) * | 2020-07-09 | 2020-11-03 | 诺思(天津)微系统有限责任公司 | MEMS piezoelectric speaker |
CN111885468B (en) * | 2020-07-09 | 2021-12-24 | 诺思(天津)微系统有限责任公司 | MEMS piezoelectric speaker |
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