WO2021134672A1 - Piezoelectric mems microphone - Google Patents

Piezoelectric mems microphone Download PDF

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Publication number
WO2021134672A1
WO2021134672A1 PCT/CN2019/130909 CN2019130909W WO2021134672A1 WO 2021134672 A1 WO2021134672 A1 WO 2021134672A1 CN 2019130909 W CN2019130909 W CN 2019130909W WO 2021134672 A1 WO2021134672 A1 WO 2021134672A1
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WIPO (PCT)
Prior art keywords
diaphragm
piezoelectric
mems microphone
elastic support
microphone according
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PCT/CN2019/130909
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French (fr)
Chinese (zh)
Inventor
童贝
石正雨
沈宇
李杨
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瑞声声学科技(深圳)有限公司
瑞声科技(南京)有限公司
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Priority to PCT/CN2019/130909 priority Critical patent/WO2021134672A1/en
Publication of WO2021134672A1 publication Critical patent/WO2021134672A1/en

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    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00Details of transducers, loudspeakers or microphones
    • H04R1/20Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/22Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only 
    • H04R1/28Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R17/00Piezoelectric transducers; Electrostrictive transducers
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R7/00Diaphragms for electromechanical transducers; Cones
    • H04R7/16Mounting or tensioning of diaphragms or cones

Definitions

  • the utility model relates to the field of microphones.
  • piezoelectric MEMS microphones mainly adopt the method of diaphragm bending or cantilever bending, which generates a certain stress at the anchor point, which causes the piezoelectric diaphragm covering it to be compressed, thereby generating a certain charge output.
  • the overall noise level is relatively high, and the signal-to-noise ratio can not be significantly improved by changing the thickness and stress of the film and optimizing the design of slots and holes on the diaphragm.
  • the purpose of the utility model is to provide a piezoelectric MEMS microphone with a high signal-to-noise ratio.
  • a piezoelectric MEMS microphone has a substrate with a back cavity, a diaphragm suspended in the back cavity, and an elastic support connected between the diaphragm and the substrate.
  • the diaphragm extends along the diaphragm.
  • a first piezoelectric diaphragm and a second piezoelectric diaphragm are respectively provided on both sides of the vibration direction, and the second piezoelectric diaphragm is connected in parallel with the first piezoelectric diaphragm.
  • first piezoelectric diaphragm and the second piezoelectric diaphragm have the same structure.
  • first piezoelectric diaphragm and the second piezoelectric diaphragm are directly opposite and symmetrically arranged on both sides of the vibrating diaphragm.
  • the first piezoelectric diaphragm is circular, rectangular or square.
  • the first piezoelectric membrane structure includes two electrode layers and a piezoelectric layer sandwiched between the two electrode layers.
  • the elastic support member extends from the edge of the diaphragm toward the base, and the base recesses corresponding to the elastic support member to form an escape portion, and the elastic support member is accommodated in the escape portion.
  • the elastic support includes an extension arm extending from the edge of the diaphragm toward the base and spaced apart from the base, and an end of the extension arm that is bent and extended away from the diaphragm and connected to the base.
  • the connecting wall of the substrate connection is not limited to.
  • connecting arms are respectively formed on opposite sides of the extension arm.
  • each of the connecting arms includes at least one connecting bar parallel to the extension arm.
  • At least two of the elastic support members are symmetrically connected to the outer circumference of the diaphragm.
  • the beneficial effect of the utility model is that the design mainly prepares the second piezoelectric diaphragm corresponding to the first piezoelectric diaphragm under the diaphragm, and the second piezoelectric diaphragm is connected in parallel with the first piezoelectric diaphragm.
  • the design method will slightly reduce the sensitivity, but because the capacitance is doubled after the parallel connection, the noise will be greatly reduced, so the overall signal-to-noise ratio (SNR) will be considerably improved.
  • Figure 1 is a schematic diagram of the structure of the piezoelectric MEMS microphone provided by the utility model
  • Figure 2 is a cross-sectional view taken along line A-A of Figure 1;
  • Figure 3 is a partial enlarged view of B in Figure 1;
  • Fig. 4 is a partial enlarged view of C in Fig. 1;
  • Fig. 5 is another embodiment of the piezoelectric MEMS microphone provided by the present invention.
  • Piezoelectric MEMS microphone 1. substrate; 101, back cavity; 2. diaphragm; 3. first piezoelectric diaphragm; 4. second piezoelectric diaphragm; 31, electrode layer; 32, piezoelectric layer; 5. Elastic support; 51, extension arm; 52, connecting arm; 521, connecting strip.
  • a piezoelectric MEMS microphone 100 which has a substrate with a back cavity 101, a diaphragm 2 suspended in the back cavity 101, and is connected between the diaphragm 2 and the substrate
  • the elastic support 5 of the diaphragm 2 is provided with a first piezoelectric diaphragm 3 and a second piezoelectric diaphragm 4 on both sides of the diaphragm 2 along the vibration direction of the diaphragm 2, and the second piezoelectric diaphragm 4 is connected in parallel with the first piezoelectric diaphragm 3.
  • the second piezoelectric diaphragm 4 opposite to the first piezoelectric diaphragm 3 is mainly prepared under the diaphragm 2, and the second piezoelectric diaphragm 4 is connected in parallel with the first piezoelectric diaphragm 3.
  • This design method will The sensitivity is slightly reduced, but the noise will be greatly reduced due to the increase of the capacitance after the parallel connection, so the overall signal-to-noise ratio (SNR) will be considerably improved.
  • the distance between the diaphragm 2 and the substrate 1 will change, and the first piezoelectric diaphragm 3 and the second piezoelectric diaphragm 4 will then generate electric charge output, thereby transferring the sound wave
  • the signal is converted into an electrical signal to realize the corresponding function of the microphone.
  • the first piezoelectric diaphragm 3 and the second piezoelectric diaphragm 4 have the same structure. Due to the same structure of the two, the capacitance is doubled after parallel connection, and the noise will be greatly reduced, so the overall signal-to-noise ratio (SNR) will be considerably improved.
  • SNR signal-to-noise ratio
  • the first piezoelectric diaphragm 3 and the second piezoelectric diaphragm 4 are directly opposite and symmetrically arranged on both sides of the diaphragm 2. Further reduce noise and improve signal-to-noise ratio (SNR).
  • SNR signal-to-noise ratio
  • the first piezoelectric diaphragm 3 is circular, rectangular or square. Please refer to FIG. 1, the first piezoelectric diaphragm 3 is in the shape of a strip and is arranged in two, and the two first piezoelectric diaphragms 3 are center-symmetrical and enclose a rectangle.
  • the structure of the first piezoelectric film 3 preferably includes two electrode layers 31 and a piezoelectric layer 32 sandwiched between the two electrode layers 31.
  • the two electrode layers 31 are one positive and one negative, so as to be connected to the piezoelectric layer 32.
  • the elastic support member 5 extends from the edge of the diaphragm 2 toward the direction of the base, the base 1 corresponds to the elastic support member 5 recessed to form an escape portion, the elastic support member 5 is accommodated in In the avoidance part, in this way, the compactness and consistency of the structure are good.
  • the elastic support member 5 includes an extension arm 51 extending from the edge of the diaphragm 2 toward the base and spaced apart from the base, and an end bent and extended from the extension arm 51 away from the diaphragm 2. And a connecting wall connected to the substrate.
  • the connecting arm 52 has elasticity, so that the diaphragm 2 can vibrate relative to the base.
  • the connecting arms 52 are formed on opposite sides of the extension arm 51, and the connecting arms 52 are symmetrically located on both sides of the end of the extension arm 51. In this way, the structure is compact and consistent. It is preferable that the two connecting arms 52 are in one. In a straight line.
  • each of the connecting arms 52 includes at least one connecting bar 521 parallel to the extension arm 51.
  • the connecting strips 521 are formed in an arcuate shape or a plurality of arcuate shapes, and the displacement between adjacent connecting strips 521 provides flexibility.
  • At least two of the elastic support members 5 are symmetrically connected to the outer periphery of the diaphragm 2 so that the diaphragm 2 is balanced in force.
  • the diaphragm 2 has a rectangular shape, and each of the four corners of the diaphragm 2 is provided with an elastic support member. 5.
  • the piezoelectric MENS microphone is not limited to a single model, and can also be made into an array structure of 2x2, 3x3, 4x4 or more.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Health & Medical Sciences (AREA)
  • Otolaryngology (AREA)
  • Multimedia (AREA)
  • Piezo-Electric Transducers For Audible Bands (AREA)

Abstract

Provided is a piezoelectric MEMS microphone, comprising a substrate provided with a back cavity, a vibrating diaphragm suspended in the back cavity, and an elastic support piece connected between the vibrating diaphragm and the substrate; the vibrating diaphragm is fixed on the substrate, two sides of the side surface of the vibrating diaphragm away from the back cavity along the vibration direction of the vibrating diaphragm are respectively provided with a first piezoelectric diaphragm, the side surface of the vibrating diaphragm facing the back cavity is provided with a second piezoelectric diaphragm, and the second piezoelectric diaphragm is connected in parallel to the first piezoelectric diaphragm. In the present design, a structure corresponding to the second piezoelectric diaphragm corresponding to the first piezoelectric diaphragm above the vibrating diaphragm is mainly prepared below the vibrating diaphragm, and the second piezoelectric diaphragm is connected is parallel to the first piezoelectric diaphragm. The design slightly reduces sensitivity, but significantly decreases noise since the capacitance is doubled after the parallel connection, such that the total signal-to-noise ratio (SNR) is considerably increased.

Description

压电MEMS麦克风Piezo MEMS microphone 技术领域Technical field
本实用新型涉及麦克风领域。The utility model relates to the field of microphones.
背景技术Background technique
目前压电MEMS麦克风,主要采用的是振膜弯曲或者悬臂梁弯曲的方式,在锚点处产生一定的应力,使覆盖其上的压电膜片受压,从而产生一定的电荷输出,然而其总的噪声水平较高,且通过改变膜层厚度和应力以及在振膜上开槽、开孔等等优化设计都不能显著提高其信噪比。At present, piezoelectric MEMS microphones mainly adopt the method of diaphragm bending or cantilever bending, which generates a certain stress at the anchor point, which causes the piezoelectric diaphragm covering it to be compressed, thereby generating a certain charge output. The overall noise level is relatively high, and the signal-to-noise ratio can not be significantly improved by changing the thickness and stress of the film and optimizing the design of slots and holes on the diaphragm.
因此,有必要提供一种能够提高信噪比的压电MEMS麦克风。Therefore, it is necessary to provide a piezoelectric MEMS microphone that can improve the signal-to-noise ratio.
发明概述Summary of the invention
技术问题technical problem
本实用新型的目的在于提供一种高信噪比的压电MEMS麦克风。The purpose of the utility model is to provide a piezoelectric MEMS microphone with a high signal-to-noise ratio.
问题的解决方案The solution to the problem
技术解决方案Technical solutions
本实用新型的技术方案如下:The technical scheme of the utility model is as follows:
一种压电MEMS麦克风,具有背腔的基底、悬置于所述背腔的振膜以及连接在所述振膜与所述基底之间的弹性支撑件,所述振膜沿所述振膜的振动方向的两侧分别设有第一压电膜片和第二压电膜片,所述第二压电膜片与所述第一压电膜片并联。A piezoelectric MEMS microphone has a substrate with a back cavity, a diaphragm suspended in the back cavity, and an elastic support connected between the diaphragm and the substrate. The diaphragm extends along the diaphragm. A first piezoelectric diaphragm and a second piezoelectric diaphragm are respectively provided on both sides of the vibration direction, and the second piezoelectric diaphragm is connected in parallel with the first piezoelectric diaphragm.
进一步地,所述第一压电膜片与所述第二压电膜片结构相同。Further, the first piezoelectric diaphragm and the second piezoelectric diaphragm have the same structure.
进一步地,所述第一压电膜片与所述第二压电膜片正对且对称设置在所述振膜两侧。Further, the first piezoelectric diaphragm and the second piezoelectric diaphragm are directly opposite and symmetrically arranged on both sides of the vibrating diaphragm.
进一步地,所述第一压电膜片呈圆形、矩形或正方形。Further, the first piezoelectric diaphragm is circular, rectangular or square.
进一步地,所述第一压电膜片结构包括两电极层和夹设于所述两电极层之间的压电层。Further, the first piezoelectric membrane structure includes two electrode layers and a piezoelectric layer sandwiched between the two electrode layers.
进一步地,所述弹性支撑件自所述振膜边缘朝所述基底方向延伸,所述基底对 应所述弹性支撑件凹陷形成避让部,所述弹性支撑件收容于所述避让部内。Further, the elastic support member extends from the edge of the diaphragm toward the base, and the base recesses corresponding to the elastic support member to form an escape portion, and the elastic support member is accommodated in the escape portion.
进一步地,所述弹性支撑件包括自所述振膜边缘朝所述基底方向延伸并与所述基底间隔设置的延伸臂以及自所述延伸臂远离所述振膜的一端弯折延伸并与所述基底连接的连接壁。Further, the elastic support includes an extension arm extending from the edge of the diaphragm toward the base and spaced apart from the base, and an end of the extension arm that is bent and extended away from the diaphragm and connected to the base. The connecting wall of the substrate connection.
进一步地,所述连接臂分别形成在所述延伸臂的相对两侧。Further, the connecting arms are respectively formed on opposite sides of the extension arm.
进一步地,每一所述连接臂包括至少一条与所述延伸臂平行的连接条。Further, each of the connecting arms includes at least one connecting bar parallel to the extension arm.
进一步地,至少两个所述弹性支撑件对称连接在所述振膜外周。Further, at least two of the elastic support members are symmetrically connected to the outer circumference of the diaphragm.
发明的有益效果The beneficial effects of the invention
有益效果Beneficial effect
本实用新型的有益效果在于:本设计主要在振膜的下方制备与第一压电膜片对应的第二压电膜片,第二压电膜片与第一压电膜片并联连接,该设计方法会小幅降低灵敏度,但是由于并联后电容增加了一倍,其噪声会大幅度减小,因此总的信噪比(SNR)会有可观的提升。The beneficial effect of the utility model is that the design mainly prepares the second piezoelectric diaphragm corresponding to the first piezoelectric diaphragm under the diaphragm, and the second piezoelectric diaphragm is connected in parallel with the first piezoelectric diaphragm. The design method will slightly reduce the sensitivity, but because the capacitance is doubled after the parallel connection, the noise will be greatly reduced, so the overall signal-to-noise ratio (SNR) will be considerably improved.
对附图的简要说明Brief description of the drawings
附图说明Description of the drawings
图1为本实用新型提供的压电MEMS麦克风的结构示意图;Figure 1 is a schematic diagram of the structure of the piezoelectric MEMS microphone provided by the utility model;
图2为图1沿A-A线的剖视图;Figure 2 is a cross-sectional view taken along line A-A of Figure 1;
图3为图1中B处的局部放大图;Figure 3 is a partial enlarged view of B in Figure 1;
图4为图1中C处的局部放大图;Fig. 4 is a partial enlarged view of C in Fig. 1;
图5为本实用新型提供的压电MEMS麦克风的另一实施例。Fig. 5 is another embodiment of the piezoelectric MEMS microphone provided by the present invention.
图中:In the picture:
100、压电MEMS麦克风;1、基底;101、背腔;2、振膜;3、第一压电膜片;4、第二压电膜片;31、电极层;32、压电层;5、弹性支撑件;51、延伸臂;52、连接臂;521、连接条。100. Piezoelectric MEMS microphone; 1. substrate; 101, back cavity; 2. diaphragm; 3. first piezoelectric diaphragm; 4. second piezoelectric diaphragm; 31, electrode layer; 32, piezoelectric layer; 5. Elastic support; 51, extension arm; 52, connecting arm; 521, connecting strip.
发明实施例Invention embodiment
具体实施方式Detailed ways
下面结合附图和实施方式对本实用新型作进一步说明。The present utility model will be further explained below in conjunction with the drawings and embodiments.
请参照图1和图2,提供一种压电MEMS麦克风100,具有背腔101的基底、悬置于所述背腔101的振膜2以及连接在所述振膜2与所述基底之间的弹性支撑件5,所述振膜2沿所述振膜2的振动方向的两侧分别设有第一压电膜片3和第二压电膜片4,所述第二压电膜片4与所述第一压电膜片3并联。1 and 2, a piezoelectric MEMS microphone 100 is provided, which has a substrate with a back cavity 101, a diaphragm 2 suspended in the back cavity 101, and is connected between the diaphragm 2 and the substrate The elastic support 5 of the diaphragm 2 is provided with a first piezoelectric diaphragm 3 and a second piezoelectric diaphragm 4 on both sides of the diaphragm 2 along the vibration direction of the diaphragm 2, and the second piezoelectric diaphragm 4 is connected in parallel with the first piezoelectric diaphragm 3.
本设计主要在振膜2的下方制备与第一压电膜片3相对的第二压电膜片4,第二压电膜片4与第一压电膜片3并联连接,该设计方法会小幅降低灵敏度,但是由于并联后电容增加,其噪声会大幅度减小,因此总的信噪比(SNR)会有可观的提升。In this design, the second piezoelectric diaphragm 4 opposite to the first piezoelectric diaphragm 3 is mainly prepared under the diaphragm 2, and the second piezoelectric diaphragm 4 is connected in parallel with the first piezoelectric diaphragm 3. This design method will The sensitivity is slightly reduced, but the noise will be greatly reduced due to the increase of the capacitance after the parallel connection, so the overall signal-to-noise ratio (SNR) will be considerably improved.
当振膜2在声波的作用下产生振动,振膜2与基底1之间的距离会发生变化,第一压电膜片3和第二压电膜片4随之产生电荷输出,从而将声波信号转化为了电信号,实现麦克风的相应功能。When the diaphragm 2 vibrates under the action of sound waves, the distance between the diaphragm 2 and the substrate 1 will change, and the first piezoelectric diaphragm 3 and the second piezoelectric diaphragm 4 will then generate electric charge output, thereby transferring the sound wave The signal is converted into an electrical signal to realize the corresponding function of the microphone.
优选所述第一压电膜片3与所述第二压电膜片4结构相同。由于两者结构相同,并联后电容增加了一倍,其噪声会大幅度减小,因此总的信噪比(SNR)会有可观的提升。Preferably, the first piezoelectric diaphragm 3 and the second piezoelectric diaphragm 4 have the same structure. Due to the same structure of the two, the capacitance is doubled after parallel connection, and the noise will be greatly reduced, so the overall signal-to-noise ratio (SNR) will be considerably improved.
优选所述第一压电膜片3与所述第二压电膜片4正对且对称设置在所述振膜2两侧。进一步减小噪声,提升信噪比(SNR)。Preferably, the first piezoelectric diaphragm 3 and the second piezoelectric diaphragm 4 are directly opposite and symmetrically arranged on both sides of the diaphragm 2. Further reduce noise and improve signal-to-noise ratio (SNR).
优选所述第一压电膜片3呈圆形、矩形或正方形。请参照图1,第一压电膜片3呈条状,设置为两条,两条第一压电膜片3呈中心对称并围合成矩形。Preferably, the first piezoelectric diaphragm 3 is circular, rectangular or square. Please refer to FIG. 1, the first piezoelectric diaphragm 3 is in the shape of a strip and is arranged in two, and the two first piezoelectric diaphragms 3 are center-symmetrical and enclose a rectangle.
请参照图4,优选所述第一压电膜片3结构包括两电极层31和夹设于所述两电极层31之间的压电层32。两电极层31一正一负,以和压电层32导通。Please refer to FIG. 4, the structure of the first piezoelectric film 3 preferably includes two electrode layers 31 and a piezoelectric layer 32 sandwiched between the two electrode layers 31. The two electrode layers 31 are one positive and one negative, so as to be connected to the piezoelectric layer 32.
请参照图3,优选所述弹性支撑件5自所述振膜2边缘朝所述基底方向延伸,所述基底1对应所述弹性支撑件5凹陷形成避让部,所述弹性支撑件5收容于所述避让部内,如此,结构的紧凑性和一致性好。3, preferably the elastic support member 5 extends from the edge of the diaphragm 2 toward the direction of the base, the base 1 corresponds to the elastic support member 5 recessed to form an escape portion, the elastic support member 5 is accommodated in In the avoidance part, in this way, the compactness and consistency of the structure are good.
优选所述弹性支撑件5包括自所述振膜2边缘朝所述基底方向延伸并与所述基底间隔设置的延伸臂51以及自所述延伸臂51远离所述振膜2的一端弯折延伸并与所述基底连接的连接壁。连接臂52具有弹性,使得振膜2可相对基底振动。Preferably, the elastic support member 5 includes an extension arm 51 extending from the edge of the diaphragm 2 toward the base and spaced apart from the base, and an end bent and extended from the extension arm 51 away from the diaphragm 2. And a connecting wall connected to the substrate. The connecting arm 52 has elasticity, so that the diaphragm 2 can vibrate relative to the base.
优选所述连接臂52分别形成在所述延伸臂51的相对两侧,连接臂52对称位于延伸臂51端部的两侧,如此,结构紧凑性和一致性好,优选两连接臂52在一条直 线上。Preferably, the connecting arms 52 are formed on opposite sides of the extension arm 51, and the connecting arms 52 are symmetrically located on both sides of the end of the extension arm 51. In this way, the structure is compact and consistent. It is preferable that the two connecting arms 52 are in one. In a straight line.
优选每一所述连接臂52包括至少一条与所述延伸臂51平行的连接条521。连接条521呈弓字形或多个弓字形连接形成,相邻连接条521之间的错位提供弹性。Preferably, each of the connecting arms 52 includes at least one connecting bar 521 parallel to the extension arm 51. The connecting strips 521 are formed in an arcuate shape or a plurality of arcuate shapes, and the displacement between adjacent connecting strips 521 provides flexibility.
优选至少两个所述弹性支撑件5对称连接在所述振膜2外周,如此,振膜2受力平衡,进一步地,优选振膜2呈矩形,振膜2的四角均设置一弹性支撑件5。Preferably, at least two of the elastic support members 5 are symmetrically connected to the outer periphery of the diaphragm 2 so that the diaphragm 2 is balanced in force. Further, it is preferable that the diaphragm 2 has a rectangular shape, and each of the four corners of the diaphragm 2 is provided with an elastic support member. 5.
请参照图5,在其他实施例中,压电MENS麦克风不限于单个模型,也可以做成2x2,3x3,4x4或更多的阵列式结构。Referring to FIG. 5, in other embodiments, the piezoelectric MENS microphone is not limited to a single model, and can also be made into an array structure of 2x2, 3x3, 4x4 or more.
以上所述的仅是本实用新型的实施方式,在此应当指出,对于本领域的普通技术人员来说,在不脱离本实用新型创造构思的前提下,还可以做出改进,但这些均属于本实用新型的保护范围。The above are only the embodiments of the present utility model. It should be pointed out here that for those of ordinary skill in the art, improvements can be made without departing from the inventive concept of the present utility model, but these all belong to The scope of protection of the utility model.

Claims (10)

  1. 一种压电MEMS麦克风,其特征在于,具有背腔的基底、悬置于所述背腔的振膜以及连接在所述振膜与所述基底之间的弹性支撑件,所述振膜沿所述振膜的振动方向的两侧分别设有第一压电膜片和第二压电膜片,所述第二压电膜片与所述第一压电膜片并联。A piezoelectric MEMS microphone, characterized in that a substrate with a back cavity, a diaphragm suspended in the back cavity, and an elastic support connected between the diaphragm and the substrate, the diaphragm along A first piezoelectric diaphragm and a second piezoelectric diaphragm are respectively provided on both sides of the vibration direction of the diaphragm, and the second piezoelectric diaphragm is connected in parallel with the first piezoelectric diaphragm.
  2. 根据权利要求1所述的压电MEMS麦克风,其特征在于:所述第一压电膜片与所述第二压电膜片结构相同。The piezoelectric MEMS microphone according to claim 1, wherein the first piezoelectric diaphragm and the second piezoelectric diaphragm have the same structure.
  3. 根据权利要求1所述的压电MEMS麦克风,其特征在于:所述第一压电膜片与所述第二压电膜片正对且对称设置在所述振膜两侧。The piezoelectric MEMS microphone according to claim 1, wherein the first piezoelectric diaphragm and the second piezoelectric diaphragm are directly opposite and symmetrically arranged on both sides of the vibrating diaphragm.
  4. 根据权利要求2所述的压电MEMS麦克风,其特征在于:所述第一压电膜片呈圆形、矩形或正方形。The piezoelectric MEMS microphone according to claim 2, wherein the first piezoelectric diaphragm is circular, rectangular or square.
  5. 根据权利要求1所述的压电MEMS麦克风,其特征在于:所述第一压电膜片结构包括两电极层和夹设于所述两电极层之间的压电层。The piezoelectric MEMS microphone according to claim 1, wherein the first piezoelectric diaphragm structure includes two electrode layers and a piezoelectric layer sandwiched between the two electrode layers.
  6. 根据权利要求1所述的压电MEMS麦克风,其特征在于:所述弹性支撑件自所述振膜边缘朝所述基底方向延伸,所述基底对应所述弹性支撑件凹陷形成避让部,所述弹性支撑件收容于所述避让部内。The piezoelectric MEMS microphone according to claim 1, wherein the elastic support extends from the edge of the diaphragm toward the base, and the base is recessed to form an escape portion corresponding to the elastic support, and The elastic support is contained in the avoiding part.
  7. 根据权利要求6所述的压电MEMS麦克风,其特征在于:所述弹性支撑件包括自所述振膜边缘朝所述基底方向延伸并与所述基底间隔设置的延伸臂以及自所述延伸臂远离所述振膜的一端弯折延伸并与所述基底连接的连接壁。The piezoelectric MEMS microphone according to claim 6, wherein the elastic support includes an extension arm extending from the edge of the diaphragm toward the substrate and spaced apart from the substrate, and an extension arm from the extension arm. A connecting wall that is bent and extended at one end away from the diaphragm and connected to the base.
  8. 根据权利要求7所述的压电MEMS麦克风,其特征在于,所述连接臂分别形成在所述延伸臂的相对两侧。8. The piezoelectric MEMS microphone according to claim 7, wherein the connecting arms are respectively formed on opposite sides of the extension arm.
  9. 根据权利要求7所述的压电MEMS麦克风,其特征在于,每一所述连接臂包括至少一条与所述延伸臂平行的连接条。8. The piezoelectric MEMS microphone according to claim 7, wherein each of the connecting arms includes at least one connecting bar parallel to the extension arm.
  10. 根据权利要求1所述的压电MEMS麦克风,其特征在于,至少两个 所述弹性支撑件对称连接在所述振膜外周。The piezoelectric MEMS microphone according to claim 1, wherein at least two of the elastic support members are symmetrically connected to the outer periphery of the diaphragm.
PCT/CN2019/130909 2019-12-31 2019-12-31 Piezoelectric mems microphone WO2021134672A1 (en)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101931850A (en) * 2008-12-31 2010-12-29 财团法人工业技术研究院 Micro-speaker and manufacturing method thereof
CN102065354A (en) * 2010-04-19 2011-05-18 瑞声声学科技(深圳)有限公司 Diaphragm and silicon capacitor microphone comprising same
US20120308066A1 (en) * 2011-06-03 2012-12-06 Hung-Jen Chen Combined micro-electro-mechanical systems microphone and method for manufacturing the same
CN106911990A (en) * 2017-03-09 2017-06-30 歌尔股份有限公司 MEMS sonic transducers and its manufacture method
CN110381428A (en) * 2019-08-30 2019-10-25 湖南捷力泰科技有限公司 Novel piezoelectric loudspeaker

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101931850A (en) * 2008-12-31 2010-12-29 财团法人工业技术研究院 Micro-speaker and manufacturing method thereof
CN102065354A (en) * 2010-04-19 2011-05-18 瑞声声学科技(深圳)有限公司 Diaphragm and silicon capacitor microphone comprising same
US20120308066A1 (en) * 2011-06-03 2012-12-06 Hung-Jen Chen Combined micro-electro-mechanical systems microphone and method for manufacturing the same
CN106911990A (en) * 2017-03-09 2017-06-30 歌尔股份有限公司 MEMS sonic transducers and its manufacture method
CN110381428A (en) * 2019-08-30 2019-10-25 湖南捷力泰科技有限公司 Novel piezoelectric loudspeaker

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