CN101930962B - Capsulation module for electronic components - Google Patents
Capsulation module for electronic components Download PDFInfo
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- CN101930962B CN101930962B CN 200910150211 CN200910150211A CN101930962B CN 101930962 B CN101930962 B CN 101930962B CN 200910150211 CN200910150211 CN 200910150211 CN 200910150211 A CN200910150211 A CN 200910150211A CN 101930962 B CN101930962 B CN 101930962B
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- electronic components
- lead frame
- lid
- capsulation module
- groove
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
The invention relates to a capsulation module for electronic components, which comprises a lead frame, an insulating layer and at least one electronic component, wherein the lead frame is a patterned metal sheet and is provided with a first surface and a second surface which are opposite and a run-through groove for communicating the first surface and the second surface; a bearing part and a plurality of pin parts positioned on the periphery of the bearing part are defined on the lead frame by the run-through groove; the second surface of the lead frame exposes from the capsulation module for the electronic components; the insulating layer is arranged in the run-through groove and is provided with a third surface which is flush with the first surface substantially and a fourth surface which is flush with the second surface substantially; and the electronic components are arranged on the first surface and are electrically connected with the lead frame. In the capsulation module, the lead frame is used as a substrate for bearing the electronic components, so the heat generated in the operation process of electronic components can be conducted to the outside world quickly through the lead frame.
Description
Technical field
The present invention relates to a kind of encapsulating structure, particularly relate to a kind of capsulation module for electronic components.
Background technology
In the society that information is flourishing now, electronic product is dispersed throughout in the daily life, and is accompanied by electronics technology evolution constantly, and electronic product is towards light, thin, short, little trend design.Therefore, also correspondence is developed many highdensity encapsulation technologies in the field that encapsulates (Package), for example system's formula encapsulation encapsulation technologies such as (System In A Package).System's formula encapsulation is system combination structure dress, just electronic component is integrated in the single packaging body, comprises electronic components such as passive device, memory and electric power connector in it.
Fig. 1 illustrates the cutaway view of a kind of system formula encapsulating structure of existing convention.Please with reference to Fig. 1, system's formula encapsulating structure 100 of existing convention is that a plurality of chips 110 are disposed on the wiring board 120, and chip 110 is electrically connected to wiring board 120 by many leads 140, and utilizes a packing colloid 130 to coat these chips 110.System's formula encapsulating structure 100 has 110 of chips and electrically connects advantages such as the short and line configuring volume of circuit is little.
Yet when system's formula encapsulating structure 100 was exposed in the air, packing colloid 130 was prone to absorb airborne aqueous vapor so that system's formula encapsulating structure 100 during with other electronic components welding packing colloid 130 be prone to produce popcorn effect because of being heated.In addition, because system's formula encapsulating structure 100 is to utilize packing colloid 130 coating chips 110, therefore, and when chip 110 damages or lead 140 when opening circuit (or short circuit), can't heavy industry and be difficult for carrying out the Failure analysis (failure analysis) of element.In addition, because the thermal conductive property of packing colloid 130 and wiring board 120 is very poor, so the heat that chip 110 produces in running is prone to be accumulated in system's formula encapsulating structure 100, so that chip 110 is easily because of overheated operation mistake or inefficacy.
This shows that above-mentioned existing encapsulating structure obviously still has inconvenience and defective, and demands urgently further improving in structure and use.In order to solve the problem of above-mentioned existence; Relevant manufacturer there's no one who doesn't or isn't seeks solution painstakingly; But do not see always that for a long time suitable design is developed completion, and common product does not have appropriate structure to address the above problem, this obviously is the problem that the anxious desire of relevant dealer solves.Therefore how to found a kind of new-type electronic component package module, real one of the current important research and development problem that belongs to, also becoming the current industry utmost point needs improved target.
Because the defective that above-mentioned existing encapsulating structure exists; The inventor is based on being engaged in this type of product design manufacturing abundant for many years practical experience and professional knowledge; And cooperate the utilization of studying the science, actively study innovation, in the hope of founding a kind of new-type electronic component package module; Can improve general existing encapsulating structure, make it have more practicality.Through constantly research, design, and, found out the present invention of true tool practical value finally through after studying sample and improvement repeatedly.
Summary of the invention
Main purpose of the present invention is, overcomes the defective that existing encapsulating structure exists, and a kind of new-type electronic component package module is provided, and technical problem to be solved is to make it have good heat radiating efficient, is very suitable for practicality.
The object of the invention and solve its technical problem and adopt following technical scheme to realize.A kind of capsulation module for electronic components according to the present invention's proposition; It comprises: a lead frame; This lead frame is a pattern metal sheet; This lead frame has a first surface, with respect to a second surface of this first surface and the consistent groove that is communicated with this first surface and this second surface, this lead frame passes through slot definition by this and goes out a supporting part a plurality of pin portion peripheral with being positioned at this supporting part, this second surface of this lead frame is exposed to the outside of this capsulation module for electronic components; One insulating barrier is disposed at this and passes through in the groove, and this insulating barrier one the 4th surface of having in fact one the 3rd surface that trims with this first surface and trimming with this second surface in fact; And at least one electronic component, be disposed on this first surface and electrically connect with this lead frame.
The object of the invention and solve its technical problem and also can adopt following technical measures further to realize.
Aforesaid capsulation module for electronic components, the coefficient of heat conduction of wherein said insulating barrier is more than or equal to 0.75W/ (mK).
Aforesaid capsulation module for electronic components, the wherein said groove that passes through is divided into a plurality of sub-supporting part separated from one another with this supporting part.
Aforesaid capsulation module for electronic components, wherein said this a little bearing part those pin portions other and at least partly are connected.
Aforesaid capsulation module for electronic components, this first surface and the distance between this second surface of wherein said lead frame are less than or equal to 0.5 millimeter in fact.
Aforesaid capsulation module for electronic components, wherein said lead frame are a single layer structure.
Aforesaid capsulation module for electronic components, wherein said lead frame has a plurality of grooves, and those grooves pass through with this, and groove is communicated with and this insulating barrier is filled in those grooves.
Aforesaid capsulation module for electronic components, wherein said groove are formed on this first surface or the second surface of this lead frame.
Aforesaid capsulation module for electronic components, the transverse cross-sectional shape of wherein said groove are U-shaped, semicircle, V-arrangement, square, trapezoidal, mushroom shape, stairstepping, dovetail flute profile or irregular shape.
Aforesaid capsulation module for electronic components, wherein said groove lays respectively at the end of those pin portions, and those end face are to this supporting part.
Aforesaid capsulation module for electronic components, wherein said lead frame have a plurality of sidewalls that connect this first surface and this second surface, and those grooves are formed on those sidewalls.
Aforesaid capsulation module for electronic components, wherein said groove is not communicated with this first surface and second surface.
Aforesaid capsulation module for electronic components, wherein said groove is communicated with this first surface and second surface.
Aforesaid capsulation module for electronic components; It more comprises a lid, and this lid has a containing groove, and this lid is disposed on this first surface; And this lead frame and this insulating barrier seal this containing groove and form an accommodation space, and this electronic component is arranged in this accommodation space.
Aforesaid capsulation module for electronic components, the material of wherein said lid comprises metal, resin, natural gum, plastic cement or pottery.
Aforesaid capsulation module for electronic components, the material of wherein said lid are electric conducting material, and this capsulation module for electronic components more comprise one the insulation framework, this insulation framework is arranged between the edge of this lead frame and this lid.
Aforesaid capsulation module for electronic components; The material that wherein said lead frame has a plurality of grooves and this lid is an electric conducting material; Form those grooves on the one edge of this lid of vicinity of those pin portions, this insulating barrier be filled in those grooves and between the edge and this lead frame of this lid.
Aforesaid capsulation module for electronic components, it more comprises a framework, this framework is connected between the edge of this lead frame and this lid, and has a ultrasonic waves weld interface between the edge of this framework and this lid.
Aforesaid capsulation module for electronic components, it more comprises an adhesion layer, is connected between the edge of this lead frame and this lid.
Aforesaid capsulation module for electronic components; It more comprises at least one clip bar; Be disposed at outside this accommodation space, this clip bar has two ends and a central part that is connected this two end, and this two end is fixed on this insulating barrier; This central part extends to the end face away from this lead frame of this lid, and is bearing on this end face.
Aforesaid capsulation module for electronic components; It more comprises at least one connected structure; Have a cylinder and a stop section, this cylinder has one first relative end and one second end, and this first end links to each other with this lid; This second end runs through this insulating barrier and links to each other with this stop section, and this stop section is bearing on the 4th surface of this insulating barrier.
Aforesaid capsulation module for electronic components, it more comprises an engaging frame, be disposed on this insulating barrier, and this engaging frame interference is tight with in the edge of this lid.
Aforesaid capsulation module for electronic components, it more comprises a soft glue material, is filled in this accommodation space.
Aforesaid capsulation module for electronic components, the material of wherein said lid are metal material, and a surface of this electronic component directly contacts with an inner surface of this lid.
Aforesaid capsulation module for electronic components, wherein said respectively this pin portion has an external connection end that protrudes in this insulating barrier.
The present invention compared with prior art has tangible advantage and beneficial effect.Know by above,, the invention provides a kind of capsulation module for electronic components with good heat radiating efficient for achieving the above object.Comprise a lead frame, an insulating barrier and at least one electronic component.Lead frame is a pattern metal sheet; Lead frame has a first surface, with respect to second surface of first surface and the consistent groove that is communicated with first surface and second surface; Lead frame goes out a supporting part a plurality of pin portion peripheral with being positioned at supporting part by passing through slot definition, and the second surface of lead frame is exposed to the outside of capsulation module for electronic components.Insulating barrier is disposed at and passes through in the groove, and insulating barrier one the 4th surface that has in fact one the 3rd surface that trims with first surface and trim with second surface in fact.Electronic component arrangements electrically connects on first surface and with lead frame.
In one embodiment of this invention, the coefficient of heat conduction of insulating barrier is more than or equal to 0.75W/ (mK).
In one embodiment of this invention, pass through groove supporting part is divided into a plurality of sub-supporting part separated from one another.
In one embodiment of this invention, sub-supporting part respectively with at least the part pin portion be connected.
In one embodiment of this invention, the first surface of lead frame and the distance between the second surface are less than or equal to millimeter in fact.
In one embodiment of this invention, lead frame is a single layer structure.
In one embodiment of this invention, lead frame has a plurality of grooves, and groove with pass through that groove is communicated with and insulating barrier is filled in the groove.
In one embodiment of this invention, groove is formed on the first surface or the second surface of lead frame.
In one embodiment of this invention, the transverse cross-sectional shape of groove is U-shaped, semicircle, V-arrangement, square, trapezoidal, mushroom shape, stairstepping, dovetail flute profile or irregular shape.
In one embodiment of this invention, groove lays respectively at the end of pin portion.
In one embodiment of this invention, lead frame has a plurality of sidewalls that connect first surface and second surface, and groove is formed on the sidewall.
In one embodiment of this invention, groove is not communicated with first surface and second surface.
In one embodiment of this invention, groove is communicated with first surface and second surface.
In one embodiment of this invention, capsulation module for electronic components more comprises a lid, and it has a containing groove, and lid is disposed on the first surface, and lead frame and insulating barrier sealing containing groove and form an accommodation space, and electronic component is arranged in accommodation space.
In one embodiment of this invention, the material of lid comprises metal, resin, natural gum, plastic cement or pottery.
In one embodiment of this invention, the material of lid is an electric conducting material, and capsulation module for electronic components more comprise one the insulation framework, the insulation framework be arranged between the edge of lead frame and lid.
In one embodiment of this invention, the material that lead frame has a plurality of grooves and lid is an electric conducting material, forms groove on the one edge of the adjacent caps of pin portion, insulating barrier be filled in the groove and between the edge and lead frame of lid.
In one embodiment of this invention, capsulation module for electronic components more comprises a framework, and framework is connected between the edge of lead frame and lid, and has a ultrasonic waves weld interface between the edge of framework and lid.
In one embodiment of this invention, capsulation module for electronic components more comprises an adhesion layer, and it is connected between the edge of lead frame and lid.
In one embodiment of this invention; Capsulation module for electronic components more comprises at least one clip bar; It is disposed at outside the accommodation space, and the clip bar has two ends and a central part that is connected two ends, and two ends are fixed on the insulating barrier; Central part extends to the end face away from lead frame of lid, and is bearing on the end face.
In one embodiment of this invention; Capsulation module for electronic components more comprises at least one connected structure; It has a cylinder and a stop section, and cylinder has one first relative end and one second end, and first end links to each other with lid; Second end runs through insulating barrier and links to each other with the stop section, and the stop section is bearing on the 4th surface of insulating barrier.
In one embodiment of this invention, capsulation module for electronic components more comprises an engaging frame, and it is disposed on the insulating barrier, and the interference of engaging frame is tight with in the edge of lid.
In one embodiment of this invention, capsulation module for electronic components more comprises a soft glue material, and it is filled in the accommodation space.
In one embodiment of this invention, the material of lid is a metal material, and a surface of electronic component directly contacts with an inner surface of lid.
In one embodiment of this invention, each pin portion has an external connection end that protrudes in insulating barrier.
By technique scheme, capsulation module for electronic components of the present invention has advantage and beneficial effect at least: the present invention replaces the packing colloid of existing convention with lid, so can avoid the easy problem that absorbs aqueous vapor of packing colloid in the existing known techniques.In addition, the present invention is that therefore, the heat that electronic component is produced in running can promptly conduct to the external world via lead frame with the substrate of lead frame as the carrying electronic component.
In sum, the invention relates to a kind of capsulation module for electronic components, comprise a lead frame, an insulating barrier and at least one electronic component.Lead frame is a pattern metal sheet and the consistent groove with a relative first surface, a second surface and connection first surface and second surface; Lead frame goes out a supporting part a plurality of pin portion peripheral with being positioned at supporting part by passing through slot definition, and the second surface of lead frame is exposed to the outside of capsulation module for electronic components.Insulating barrier is disposed at one the 4th surface of passing through in the groove and having in fact one the 3rd surface that trims with first surface and trim with second surface in fact.Electronic component arrangements electrically connects on first surface and with lead frame.The present invention has obvious improvement technically, and has tangible good effect, really is the new design of a novelty, progress, practicality.
Above-mentioned explanation only is the general introduction of technical scheme of the present invention; Understand technological means of the present invention in order can more to know; And can implement according to the content of specification, and for let of the present invention above-mentioned with other purposes, feature and advantage can be more obviously understandable, below special act preferred embodiment; And conjunction with figs., specify as follows.
Description of drawings
Fig. 1 is the cutaway view of a kind of system formula encapsulating structure of existing convention.
Fig. 2 A, Fig. 2 B and Fig. 2 C are respectively sketch map, cutaway view and the explosive views of the capsulation module for electronic components of one embodiment of the invention.
Fig. 2 D is the sketch map of the lead frame of Fig. 2 A.
Fig. 3 A is a kind of sketch map of variation of the capsulation module for electronic components of Fig. 2 A.
Fig. 3 B is the explosive view of the capsulation module for electronic components of Fig. 3 A.
Fig. 4 A～Fig. 4 J is the partial schematic diagram of multiple variations of the lead frame of Fig. 2 D.
Fig. 5 is the cutaway view of capsulation module for electronic components of the lead frame with Fig. 4 A of one embodiment of the invention.
Fig. 6 A～Fig. 6 I is the sketch map of transverse cross-sectional shape of first groove or second groove of the lead frame of one embodiment of the invention.
Fig. 7 is the sketch map of the capsulation module for electronic components of one embodiment of the invention.
Fig. 8 is the sketch map of the capsulation module for electronic components of one embodiment of the invention.
Fig. 9 A is the sketch map of the capsulation module for electronic components of one embodiment of the invention.
Fig. 9 B is the end view of the capsulation module for electronic components of Fig. 9 A.
Figure 10 A is the sketch map of the capsulation module for electronic components of one embodiment of the invention.
Figure 10 B is the end view of the capsulation module for electronic components of Figure 10 A.
Figure 11 A is the sketch map of the capsulation module for electronic components of one embodiment of the invention.
Figure 11 B is the end view of the capsulation module for electronic components of Figure 11 A.
Figure 12 A is the explosive view of the capsulation module for electronic components of one embodiment of the invention.
Figure 12 B is the cutaway view of the capsulation module for electronic components of Figure 12 A.
100: system's formula encapsulating structure 110: chip
120: wiring board 130: packing colloid
140: lead 200: capsulation module for electronic components
202,204: side 210: lead frame
212: first surface 212a, 214a: groove
214: second surface 216: pass through groove
216a: sidewall
216b, 216c, 216d, 216e, 216f, 216g: groove
220: 222: the three surfaces of insulating barrier
224: the four surfaces 230: electronic component
232: semiconductor element 234: choke
234a: surface 240: lid
242: containing groove 242a: inner surface
244: edge 246: end face
250: lead 260: the insulation framework
270: packing colloid 280: carrier
710: framework 810: adhesion layer
910: clip bar 912,914, E: end
916: central part 1010: connected structure
1012: cylinder 1012a: first end
1012b: second end 1014: stop section
1210: engaging frame A: zone
C: supporting part C1: sub-supporting part
H1, H2: apart from I: ultrasonic waves weld interface
L: the N of pin portion: necking section
S: accommodation space
Embodiment
Reach technological means and the effect that predetermined goal of the invention is taked for further setting forth the present invention; Below in conjunction with accompanying drawing and preferred embodiment; To its embodiment of capsulation module for electronic components, structure, characteristic and the effect thereof that proposes according to the present invention, specify as after.
Relevant aforementioned and other technology contents, characteristics and effect of the present invention can clearly appear in the following detailed description that cooperates with reference to graphic preferred embodiment.Explanation for ease, in following embodiment, components identical is represented with identical numbering.
See also shown in Fig. 2 A, Fig. 2 B and Fig. 2 C, illustrate sketch map, cutaway view and the explosive view of the capsulation module for electronic components of one embodiment of the invention respectively; Fig. 2 D illustrates the sketch map of the lead frame of Fig. 2 A.Fig. 3 A is a kind of variation of the capsulation module for electronic components of Fig. 2 A, and Fig. 3 B is the explosive view of the capsulation module for electronic components of Fig. 3 A.
Please be simultaneously with reference to Fig. 2 A, Fig. 2 B and Fig. 2 C, the capsulation module for electronic components 200 of present embodiment comprises a lead frame (lead frame) 210, one insulating barrier 220, at least one electronic component 230 and a lid 240.Lead frame 210 is a pattern metal sheet, and lead frame 210 has a first surface 212, with respect to second surface 214 of first surface 212 and the consistent groove 216 that is communicated with first surface 212 and second surface 214.In the present embodiment, the first surface 212 and the distance H 1 between the second surface 214 of lead frame 210 are less than or equal to 0.5 millimeter in fact, and in other words, the thickness of lead frame 210 is less than or equal to 0 in fact.5 millimeters.In the present embodiment, the second surface 214 of lead frame 210 is exposed to the outside of package module 200.Lead frame 210 is that a single layer structure and material for example are copper.
Please with reference to Fig. 2 D, lead frame 210 defines a supporting part C and a plurality of pin L of portion that are positioned at the periphery of supporting part C by passing through groove 216.In detail, pass through groove 216 and also can supporting part C be divided into a plurality of sub-supporting part C1 separated from one another, and sub-supporting part C1 is connected with the L of pin portion of part respectively, remaining L of pin portion separates with supporting part C.
Please be simultaneously with reference to Fig. 2 A, Fig. 2 B and Fig. 2 C; Insulating barrier 220 is disposed at and passes through in the groove 216; And insulating barrier 220 has 222 and 1 the 4th surface 224, one the 3rd surface, and wherein the 3rd surface 222 trims in fact in first surface 212, the four surfaces 224 and trims in fact in second surface 214.Know that by aforementioned distance H 2 (being the thickness of insulating barrier 220) between the 222 and the 4th surface 224, the 3rd surface of insulating barrier 220 can be less than or equal to 0.5 millimeter in fact.The coefficient of heat conduction of insulating barrier 220 is more than or equal to 0.75W/ (mK), and the material of insulating barrier 220 for example is resin or the high insulating material of other coefficients of heat conduction.The L of each pin portion that it should be noted that lead frame 210 has an external connection end that protrudes in insulating barrier 220, with the electronic installation of following single order (for example: motherboard) electrically connect.
Please with reference to Fig. 2 B and Fig. 2 C, electronic component 230 is disposed on the first surface 212 and with lead frame 210 and electrically connects.In detail, electronic component 230 can directly be disposed on the first surface 212 or see through a carrier 280 (like printed substrate or ceramic substrate) and be disposed on the first surface 212.Moreover electronic component 230 can be only to be disposed at supporting part C to go up, be disposed on supporting part C and the insulating barrier 220 simultaneously or be disposed at simultaneously on supporting part C, the L of pin portion and the insulating barrier 220.Electronic component 230 can be active member (for example: semiconductor element 232) or passive device (for example: choke 234); And can be naked crystal grain (die), chip (chip) or plug-in unit kenel, and can chip bonding, technology such as routing or surface mount electrically connect with lead frame 210.When electronic component 230 for example is semiconductor element 232 (like the PWM control chip); Can see through the L of pin portion that many leads 250 are electrically connected to lead frame 210; The material of lead 250 for example is gold, copper or aluminium, and can have packing colloid 270 coating semiconductor elements 232 and lead 250.Electronic component 230 for example is choke (chock) 234 o'clock, and surface mount technology capable of using and lead frame 210 electrically connect.It should be noted that in the present embodiment, can the electronic component (like choke 234 or high-power die etc.) that running the time can produce more heat transfer directly be disposed on the lead frame 210, directly dispel the heat to see through lead frame 210, and have good radiating efficiency.
Please with reference to Fig. 2 B, lid 240 has a containing groove 242, and lid 240 is disposed on the first surface 212 of lead frame 210, and lead frame 210 is with insulating barrier 220 sealing containing grooves 242 and form an accommodation space S, and electronic component 230 is arranged in accommodation space S.The material of lid 240 for example is the material of metal, resin, natural gum, plastic cement, pottery or other high heat-conduction coefficients.In addition, be the electronic component 230 in the protection accommodation space S, optionally in accommodation space S, fill a soft glue material (not illustrating).
It should be noted that because present embodiment is the packing colloid that replaces existing convention with lid 240, therefore, present embodiment can be avoided the easy problem that absorbs aqueous vapor of packing colloid in the existing known techniques.In addition, the lid of present embodiment 240 is independently detachable and reinstall, therefore, and the capsulation module for electronic components 200 easy heavy industrys of present embodiment and carry out the Failure analysis of element easily.In addition; Because present embodiment is the outside that is exposed to package module 200 with lead frame 210 as the second surface 214 of substrate that carries electronic component 230 and lead frame 210; Therefore, the heat of electronic component 230 generation in running can promptly conduct to the external world via lead frame 210.And; Present embodiment can adopt the lid 240 of metal material; Thus; The external structure of capsulation module for electronic components 200 almost is to be made up of the splendid metal of thermal conductive property (lead frame 230 and lid 240), and heat-conducting effect is promoted, and the lid 240 of metal material can provide the effect of electromagnetic shielding.
Moreover; Because insulating barrier 220 adopts the material of the coefficient of heat conduction more than or equal to 0.75W/ (mK) in the present embodiment; Make the heat of the electronic component 230 on the sub-supporting part C1 can see through insulating barrier 220 and be distributed to remaining sub-supporting part C1 and the L of pin portion apace; And make the heat distribution of overall package module 200 even, to promote radiating efficiency.
Please, when the material of lid 240 is electric conducting material, an insulation framework 260 can be set, between the edge 244 of lead frame 210 and lid 240 so that lead frame 210 is electrically insulated with lid 240 each other with reference to Fig. 3 A and Fig. 3 B.Insulation framework 260 and insulating barrier 220 structure that for example is formed in one.Edge 244 that it should be noted that lid 240 is meant the edge (being the lower edge of lid 240) that lid 240 and lead frame 210 are adjacent.Moreover; When the material of lid 240 is metal material; (for example: surperficial 234a choke 234) directly contacts with an inner surface 242a (as shown in Figure 5) of lid 240 can running the time can be produced the electronic component of more heat transfer; Make the radiator of lid 240, promptly conduct to the external world and the heat penetration of choke 234 is crossed lid 240 as choke 234.
Fig. 4 A～Fig. 4 J illustrates the partial schematic diagram of multiple variations of the lead frame of Fig. 2 D.It should be noted that Fig. 4 A～Fig. 4 J is the part that is positioned at regional A that illustrates the lead frame 210 of Fig. 2 D.In addition, mentioned insulating barrier is the insulating barrier 220 among Fig. 2 A～Fig. 2 C in the embodiment of Fig. 4 A～Fig. 4 J.In the present embodiment, lead frame 210 more can have a plurality of grooves (like 212a, 214a, the 216b-216f among Fig. 4 A～Fig. 4 J), and groove with pass through that groove 216 is communicated with and insulating barrier (not illustrating) is filled in the groove.Groove can be formed at least one surface (like first surface 212, second surface 214 or the connection first surface 212 sidewall 216a with second surface 214) of lead frame 210, and groove makes the surface of lead frame 210 form a depressed part and a protuberance.Do not influencing under the electrical situation, groove can optionally be formed on the supporting part C or the L of pin portion of lead frame 210.Since groove with pass through groove 216 and be communicated with, therefore, insulating barrier be arranged in the part that is arranged in groove that the part of passing through groove 216 can directly connect insulating barrier.Thus, groove can increase the contact area of lead frame 210 and insulating barrier, to increase the engaging force of lead frame 210 and insulating barrier.In addition, but on the L of pin portion, form the fixedly effect of the L of pin portion of groove reinforced insulation layer.And following will give an example multiple design with the explanation groove the position is set, and following design of giving an example is merely and illustrates, and is not in order to limit the present invention.
Please with reference to Fig. 4 A, groove 212a is formed on the first surface 212 of lead frame 210 and does not run through lead frame 210, and groove 212a can optionally be formed on the supporting part C or the L of pin portion of lead frame 210.When the material of lid 240 is electric conducting material, can on the part at the edge 244 of the adjacent caps 240 of the L of pin portion, forms a plurality of groove 212a (as shown in Figure 5), and insulating barrier 220 is filled among the groove 212a.Thus, insulating barrier 220 can be between the edge 244 and lead frame 210 of lid 240, so that lid 240 is electrically insulated with lead frame 210.
Please with reference to Fig. 4 B, groove 214a is formed on the second surface 214 of lead frame 210 and does not run through lead frame 210, and groove 214a can optionally be formed on the supporting part C or the L of pin portion of lead frame 210.Please with reference to Fig. 4 C, be the embodiment that combines Fig. 4 B and Fig. 4 A, on the first surface 212 of lead frame 210 and second surface 214, form a plurality of groove 212a and a plurality of groove 214a respectively respectively.
Please with reference to Fig. 4 D, sidewall 216a and groove 216b that groove 216b is formed on lead frame 210 are not communicated with first surface 212 and second surface 214, and groove 216b can optionally be formed on the supporting part C or the L of pin portion of lead frame 210.In the present embodiment, part groove 216b is that part groove 216b is positioned on the sidewall 216a of supporting part C on the sidewall 216a of the end E (being the surface of the L of pin portion towards supporting part C) that is positioned at the L of pin portion.
In Fig. 4 E, two groove 216c lay respectively on the relative two sidewall 216a of a L of pin portion, and groove 216c all is communicated with first surface 212.In Fig. 4 F, two groove 216d lay respectively on the relative two sidewall 216a of a L of pin portion, and groove 216d all is communicated with second surface 214.With reference to Fig. 4 G, be the embodiment that combines Fig. 4 E and Fig. 4 F please, two groove 216c lay respectively on the relative two sidewall 216a of a L of pin portion, and groove 216c all is communicated with first surface 212.In addition, two groove 216d lay respectively on the sidewall 216a of the L of pin portion, and groove 216d all is communicated with second surface 214.
Please with reference to Fig. 4 H, single sidewall 216a and groove 216e that groove 216e is formed on lead frame 210 are communicated with first surface 212 and second surface 214 simultaneously, make the other necking section N of formation of groove 216e.Please with reference to Fig. 4 I, groove 216e and groove 216f are respectively formed on the relative two sidewall 216a of the L of pin portion of lead frame 210.Groove 216e and groove 216f are communicated with first surface 212 and second surface 214 simultaneously, and have a necking section N between groove 216e and the groove 216f.
Please with reference to Fig. 4 J, sidewall 216a and groove 216g that groove 216g is formed on lead frame 210 are communicated with first surface 212 and second surface 214.In the present embodiment, groove 216g is on the sidewall 216a of the end E (being the surface of the L of pin portion towards supporting part C) that is positioned at the L of pin portion.
Fig. 6 A～Fig. 6 I illustrates the sketch map of transverse cross-sectional shape of groove of the lead frame of one embodiment of the invention.In addition; In the embodiment of Fig. 4 A～Fig. 4 J, the transverse cross-sectional shape of groove for example is semicircle (shown in Fig. 6 A), U-shaped (shown in Fig. 6 B), V-arrangement (shown in Fig. 6 C), square (shown in Fig. 6 D), trapezoidal (shown in Fig. 6 E), dovetail flute profile (shown in Fig. 6 F), stairstepping (shown in Fig. 6 G), mushroom shape (shown in Fig. 6 H) or irregular shape (shown in Fig. 6 I).
The lid 240 that below will introduce Fig. 2 A is fixed on the several different methods on the lead frame 210, and following several different methods of giving an example is merely and illustrates, and is not in order to limit the present invention.
Fig. 7 illustrates the sketch map of the capsulation module for electronic components of one embodiment of the invention.Please with reference to Fig. 7, when the material of lid 240 is resin, natural gum or plastic cement, can between the edge 244 of lead frame 210 and lid 240, dispose a framework 710, the material of framework 710 is resin, natural gum or plastic cement.Then, the edge 244 of framework 710 and lid 240 is carried out the ultrasonic waves welding, and between the edge 244 of framework 710 and lid 240 generation one ultrasonic waves weld interface I.
Fig. 8 illustrates the sketch map of the capsulation module for electronic components of one embodiment of the invention.Please with reference to Fig. 8, can between the edge 244 of lid 240 and lead frame 210, an adhesion layer 810 be set.
Fig. 9 A illustrates the sketch map of the capsulation module for electronic components of one embodiment of the invention, and Fig. 9 B illustrates the end view of the capsulation module for electronic components of Fig. 9 A.Please can outside the accommodation space of capsulation module for electronic components 200, dispose two clip bars 910 simultaneously with reference to Fig. 9 A and Fig. 9 B.Each clip bar 910 has two ends 912,914 and a central part 916 that is connected two ends 912,914; Wherein two ends 912,914 are fixed on the insulating barrier 220; Central part 916 extends to the end face 246 away from lead frame 210 of lid 240, and is bearing on the end face 246.In the present embodiment, two clip bars 910 are disposed at the relative two side faces 202,204 of capsulation module for electronic components 200 respectively.
Figure 10 A illustrates the sketch map of the capsulation module for electronic components of one embodiment of the invention, and Figure 10 B illustrates the end view of the capsulation module for electronic components of Figure 10 A.Figure 11 A illustrates the sketch map of the capsulation module for electronic components of one embodiment of the invention, and Figure 11 B illustrates the end view of the capsulation module for electronic components of Figure 11 A.Please a plurality of connected structures 1010 can be set simultaneously with reference to Figure 10 A and Figure 10 B on lid 240.Connected structure 1010 has a cylinder 1012 and a stop section 1014; Cylinder 1012 has one first relative end 1012a and one second end 1012b; The first end 1012a links to each other with lid 240; The second end 1012b runs through insulating barrier 220 and links to each other with stop section 1014, and stop section 1014 is bearing on the 4th surface 224 of insulating barrier 220.Connected structure 1010 for example is a trip (shown in Figure 10 A) or a rivet (shown in Figure 11 A and Figure 11 B).
Figure 12 A illustrates the explosive view of the capsulation module for electronic components of one embodiment of the invention, and Figure 12 B illustrates the cutaway view of the capsulation module for electronic components of Figure 12 A.Please can on insulating barrier 220, dispose one and engage frame 1210 simultaneously with reference to Figure 12 A and Figure 12 B, and the edge 244 that makes lid 240 with engage frame 1210 interference close-fittings.
Though the present invention discloses as above with embodiment; Right its is not in order to limit the present invention; Has common knowledge the knowledgeable in the technical field under any; Do not breaking away from the spirit and scope of the present invention, when doing a little change and retouching, so protection scope of the present invention is as the criterion when looking accompanying the claim person of defining.
The above only is preferred embodiment of the present invention, is not the present invention is done any pro forma restriction; Though the present invention discloses as above with preferred embodiment; Yet be not in order to limiting the present invention, anyly be familiar with the professional and technical personnel, in not breaking away from technical scheme scope of the present invention; When the technology contents of above-mentioned announcement capable of using is made a little change or is modified to the equivalent embodiment of equivalent variations; In every case be the content that does not break away from technical scheme of the present invention, to any simple modification, equivalent variations and modification that above embodiment did, all still belong in the scope of technical scheme of the present invention according to technical spirit of the present invention.
Claims (25)
1. capsulation module for electronic components is characterized in that it comprises:
One lead frame; This lead frame is a pattern metal sheet; This lead frame has a first surface, with respect to a second surface of this first surface and the consistent groove that is communicated with this first surface and this second surface; This lead frame passes through slot definition by this and goes out a supporting part a plurality of pin portion peripheral with being positioned at this supporting part, and this second surface of this lead frame is exposed to the outside of this capsulation module for electronic components;
One insulating barrier is disposed at this and passes through in the groove, and this insulating barrier has one the 3rd surface that trims with this first surface and one the 4th surface that trims with this second surface; And
At least one electronic component is disposed on this first surface and electrically connects with this lead frame.
2. capsulation module for electronic components according to claim 1, the coefficient of heat conduction that it is characterized in that wherein said insulating barrier is more than or equal to 0.75W/ (mK).
3. capsulation module for electronic components according to claim 1 is characterized in that the wherein said groove that passes through is divided into a plurality of sub-supporting part separated from one another with this supporting part.
4. capsulation module for electronic components according to claim 3 is characterized in that wherein said this a little bearing part those pin portions other and at least partly are connected.
5. capsulation module for electronic components according to claim 1 is characterized in that this first surface of wherein said lead frame and the distance between this second surface are less than or equal to 0.5 millimeter.
6. capsulation module for electronic components according to claim 1 is characterized in that wherein said lead frame is a single layer structure.
7. capsulation module for electronic components according to claim 1 is characterized in that wherein said lead frame has a plurality of grooves, and those grooves pass through with this, and groove is communicated with and this insulating barrier is filled in those grooves.
8. capsulation module for electronic components according to claim 7 is characterized in that wherein said groove is formed on this first surface or the second surface of this lead frame.
9. capsulation module for electronic components according to claim 7, the transverse cross-sectional shape that it is characterized in that wherein said groove are U-shaped, semicircle, V-arrangement, square, trapezoidal, mushroom shape, stairstepping, dovetail flute profile or irregular shape.
10. capsulation module for electronic components according to claim 7 is characterized in that wherein said groove lays respectively at the end of those pin portions, and those end face are to this supporting part.
11. capsulation module for electronic components according to claim 7 is characterized in that wherein said lead frame has a plurality of sidewalls that connect this first surface and this second surface, those grooves are formed on those sidewalls.
12. capsulation module for electronic components according to claim 11 is characterized in that wherein said groove is not communicated with this first surface and second surface.
13. capsulation module for electronic components according to claim 11 is characterized in that wherein said groove is communicated with this first surface and second surface.
14. capsulation module for electronic components according to claim 1; It is characterized in that it more comprises a lid; This lid has a containing groove; This lid is disposed on this first surface, and this lead frame and this insulating barrier this containing groove of sealing and form an accommodation space, and this electronic component is arranged in this accommodation space.
15. capsulation module for electronic components according to claim 14 is characterized in that the material of wherein said lid comprises metal, resin, natural gum, plastic cement or pottery.
16. capsulation module for electronic components according to claim 14; The material that it is characterized in that wherein said lid is an electric conducting material; And this capsulation module for electronic components more comprises an insulation framework, and this insulation framework is arranged between the edge of this lead frame and this lid.
17. capsulation module for electronic components according to claim 14; It is characterized in that the material that wherein said lead frame has a plurality of grooves and this lid is an electric conducting material; Form those grooves on the one edge of this lid of vicinity of those pin portions, this insulating barrier be filled in those grooves and between the edge and this lead frame of this lid.
18. capsulation module for electronic components according to claim 14 is characterized in that it more comprises a framework, this framework is connected between the edge of this lead frame and this lid, and has a ultrasonic waves weld interface between the edge of this framework and this lid.
19. capsulation module for electronic components according to claim 14 is characterized in that it more comprises an adhesion layer, is connected between the edge of this lead frame and this lid.
20. capsulation module for electronic components according to claim 14; It is characterized in that it more comprises at least one clip bar; Be disposed at outside this accommodation space, this clip bar has two ends and a central part that is connected this two end, and this two end is fixed on this insulating barrier; This central part extends to the end face away from this lead frame of this lid, and is bearing on this end face.
21. capsulation module for electronic components according to claim 14; It is characterized in that it more comprises at least one connected structure; Have a cylinder and a stop section, this cylinder has one first relative end and one second end, and this first end links to each other with this lid; This second end runs through this insulating barrier and links to each other with this stop section, and this stop section is bearing on the 4th surface of this insulating barrier.
22. capsulation module for electronic components according to claim 14 is characterized in that it more comprises an engaging frame, be disposed on this insulating barrier, and this engaging frame interference is tight with in the edge of this lid.
23. capsulation module for electronic components according to claim 14 is characterized in that it more comprises a soft glue material, is filled in this accommodation space.
24. capsulation module for electronic components according to claim 14, the material that it is characterized in that wherein said lid is a metal material, and a surface of this electronic component directly contacts with an inner surface of this lid.
25. capsulation module for electronic components according to claim 1 is characterized in that wherein said each those pin portion have an external connection end that protrudes in this insulating barrier.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200910150211 CN101930962B (en) | 2009-06-19 | 2009-06-19 | Capsulation module for electronic components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200910150211 CN101930962B (en) | 2009-06-19 | 2009-06-19 | Capsulation module for electronic components |
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| Publication Number | Publication Date |
|---|---|
| CN101930962A CN101930962A (en) | 2010-12-29 |
| CN101930962B true CN101930962B (en) | 2012-06-20 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN 200910150211 Active CN101930962B (en) | 2009-06-19 | 2009-06-19 | Capsulation module for electronic components |
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| CN (1) | CN101930962B (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200516737A (en) * | 2003-11-05 | 2005-05-16 | Cyntec Co Ltd | Chip package and substrate |
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Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200516737A (en) * | 2003-11-05 | 2005-05-16 | Cyntec Co Ltd | Chip package and substrate |
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| CN101930962A (en) | 2010-12-29 |
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