CN101925464A - 用于喷墨打印头的共基极横向双极结型晶体管电路 - Google Patents
用于喷墨打印头的共基极横向双极结型晶体管电路 Download PDFInfo
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Abstract
一种喷墨打印机的打印头电路，包括：被布置成多个行的多个行加热元件；被布置成多个列的多个列加热元件；以及多个横向双极结型晶体管(BJT)，每个横向BJT连接在所述多个行加热元件中的对应一个行加热元件和所述多个列加热元件中的对应一个列加热元件之间并且与所述对应一个行加热元件和所述对应一个列加热元件串联连接，所述多个横向BJT具有共基极；其中所述多个行加热元件和所述多个列加热元件被选择性地激励从而以期望的图案加热喷墨打印机中的墨以用于打印介质，且其中所述多个横向BJT的每个操作以允许激励与该BJT串联连接的对应行和列加热元件。
Description
背景技术
典型的喷墨打印头包含墨储存器，其中墨完全地包围形成打印头电路的内部加热器阵列。该加热器阵列典型地包含多个加热元件，诸如薄膜或厚膜电阻器、二极管和/或晶体管。加热元件以规则的图案被布置以用于把墨加热到沸点。加热器阵列中的每个加热元件可以被单独地或多重地选择并且与其它加热元件结合被激励从而以各种期望的图案(诸如字母数字字符)加热墨。在选择的加热元件上方的沸腾墨通过加热器阵列正上方的喷墨打印头中的对应孔径射出。喷墨微滴被推到打印纸或其它打印介质上，在那里它们以期望的图案被记录。
图1示出喷墨打印机中的典型的加热器阵列或者打印头电路100。该打印头电路包括：多个行选择线A1到AM，其中示出选择线A1到A3；以及多个列选择线B1到BN，其中示出选择线B1到B3。跨越行和列选择线的是表示为与开关元件串联的电阻器R11到RMN的加热元件，其中示出电阻器R11到R33，所述开关元件典型地是金属氧化物半导体场效应晶体管(MOSFET)M11到MMN，其中示出MOSFET M11到M33。列选择线B1到BN耦合到MOSFET的栅极并且选择性地激励或激发(fire up)MOSFET的栅极。实际上没有加热电流流过列选择线。行选择线A1到AM耦合到电阻器R11到R1N、R21到R2N、R31到R3N等等的行并且选择性地提供加热电流到所述电阻器的行。因此，可以通过激励对应的行和列选择线来选择单独的电阻器以进行高分辨率打印。例如通过用对应的行选择线激励或激发电阻器行并且激励或激发列选择线以激励特定电阻器的栅极(以及特定电阻器的列中的其它MOSFET的栅极)，来选择和激励该特定电阻器。
打印头电路100的一个问题是常规用来制造要求单独控制电阻器的这种电路的昂贵的集成电路工艺及设计技术。例如，利用当前的MOS技术，必须使用最少七个半导体掩模来制造MOSFET M11到MMN，这延长了打印头电路100的制造工艺并提高了打印头电路100的制造工艺的成本。
因而，存在对这样的打印头电路的低成本设计的期望，所述打印头电路可以使用较短且较简单的半导体制造工艺来制作以用于期望打印质量较低、打印速度快的应用(诸如交易打印等等)。
附图说明
实施例通过示例的方式被示出并且不限于(一个或多个)以下附图，在以下附图中相同的数字指示相同的元件，其中：
图1示出在喷墨打印机的打印头中使用的典型加热器阵列。
图2示出依据一个实施例的喷墨打印机的打印头电路的示意图。
图3A-3B示出通过同时激发喷墨打印机中的多个加热元件来打印各种图案。
图4A-I示出依据实施例的用于制造BJT电路的工艺步骤。
图5示出依据一个实施例的温度测量电路。
具体实施方式
为了简单性和说明性的目的，实施例的原理是通过主要参考其示例来描述的。在以下描述中，阐述众多具体细节以便提高对实施例的彻底理解。然而本领域的普通技术人员要明白，这些实施例可以在不限于这些具体细节的情况下被实践。在其它情况下，不详细描述众所周知的方法和结构以便不会不必要地使实施例晦涩难懂。
本文描述用于低成本喷墨打印头电路的系统和方法，该喷墨打印头电路使用双极结型晶体管(BJT)来实现典型地不要求高打印分辨率或质量或单独激发电阻器控制的打印作业的高速打印。如本文中提及的，喷墨打印机是采用诸如热喷墨、压电喷墨、连续喷墨等等之类的喷墨技术的打印机。典型地不要求高打印分辨率的打印作业包括用于商业交易的打印作业，诸如条形码打印、账单与收据打印、传真机、现金出纳机打印、自动柜员机(ATM)打印、或者打印质量不重要只要被打印介质可辨认即可的任何其它打印作业。
图2示出依据一个实施例的喷墨打印机的打印头电路200的示意图。打印头电路200包括多个行选择线A1到AM，其中示出选择线A1和A2；以及多个列选择线B1到BN，其中示出选择线B1和B2。跨越行选择线的是表示为与BJT T11到TMN串联的电阻器Rr1到RrM的加热元件，其中示出电阻器Rr1(跨行1)和电阻器Rr2(跨行2)，其中示出T11到T22。跨越列选择线的是表示为电阻器Rc1到RcN的加热元件，其中示出多个电阻器Rc1(沿列1)和多个电阻器Rc2(沿列2)。
图2示出具有共基极(即每组横向布置BJT(例如每行或列BJT)的共基极)的横向BJT的示例。此外，在这个示例中共基极连接到地。然而，应当理解每列(或行)BJT的共基极在整个电路上是相同的。此外，共基极可以处于任何电位以致当列选择线B1到BM被激励时BJT充当一个方向上的正向偏置的二极管而当行选择线A1到AN被激励时BJT充当相反方向上的正向偏置的二极管。跨每行(例如行1)的电阻器Rr1可以被一起成组为多个组以致每组电阻器可以被一起激励或激发。同样，沿每列(例如列1)的电阻器Rc1可以被一起成组为多个组以致每组电阻器可以被一起激励或激发以用于更快的打印。例如，如图2所示，两个行电阻器Rr1可以被成组在一起，两个行电阻器Rr2可以被成组在一起，两个列电阻器Rc1可以被成组在一起，并且两个列电阻器Rc2可以被成组在一起。
接下来描述如图2所示的2×2矩阵电路200中的行和列选择线的激发序列以用特定半色调处理来打印字母“I”，如图3A所例示的。如本领域中理解的，因为包括喷墨打印机在内的打印机不能打印连续的色调，所以在打印机中典型地使用半色调处理来把一系列打印点布置成特定图案从而模仿要打印的期望信息的连续色调图像的外观。这里可以使用任何半色调处理。
如图3A所示，由矩形盒标记的四个点可以通过在相应的行和列选择线处顺序地施加电压脉冲而由图2所示的2×2矩阵电路200的4个行电阻器(2个电阻器Rr1和2个电阻器Rr2)或4个列电阻器(2个电阻器Rc1和2个电阻器Rc2)打印。因此，通过以预定次序或布置激发每组电阻器以实现同时打印多个墨滴来提供快速打印，因为在不要求高打印质量的打印应用中不需要单独电阻器激发。例如，列选择线B1首先用电压脉冲进行激励(如由钩号指示的)而其它行和列选择线处于绝对地(GND)，电流流过列1中的两个电阻器Rc1以实现由喷墨打印机头打印图3A所示的第一列液滴中的两个墨滴。没有电流流过其它列电阻器，因为它们的列选择线没有被激励。没有电流流过行电阻器Rr1到RrM中的任一个，因为其行选择线未被激励。特别地，对于其中列选择线B1被激励的列1处的电阻器Rr1和Rr2，晶体管T11和T21表现为正向偏置的二极管以允许电流流过列电阻器Rc1到达共基极而不到达列1处的电阻器Rr1和Rr2，因为针对Rr1和Rr2的T11和T21的相应基极到n+结二极管未被正向偏置。
接着，列选择线B2用电压脉冲进行激励而其它行和列选择线处于GND，并且电流将流过列2中的两个电阻器Rc2以实现由喷墨打印机头打印第二列液滴中的两个墨滴从而完成由图3中的矩形盒所标识的四个点。再次，没有电流流过其它列电阻器，因为它们的列选择线未被激励。此外，没有电流流过行电阻器Rr1到RrM中的任一个，因为其行选择线未被激励。特别地，对于其中列选择线B2被激励的列2处的电阻器Rr1和Rr2，晶体管T12和T22表现为正向偏置的二极管以允许电流流过列电阻器Rc2到达共基极而不到达列2处的电阻器Rr1和Rr2，因为针对Rr1和Rr2的T12和T22的二极管未被正向偏置。
以类似的方式，因为不需要单独液滴控制，可以通过激发每组电阻器以实现同时打印多个墨滴来提供其中打印质量不重要的其它交易打印作业的快速打印。例如，如图3B所示的，条形码打印可以通过同时激发若干组的一个或多个列电阻器以实现(在箭头右侧的)多个墨滴的打印来完成，其中期望的半色调处理算法用以提供(在箭头左侧的)条形码的光学外观。
图4A-I示出依据一个实施例的用于制造BJT电路(诸如BJT打印头电路，其中以横截面图示出BJT)的工艺步骤。仅为了说明性目的而不对其限制，在打印头电路200的背景下描述工艺步骤。
现在参考图4A，打印头电路200包括半导体衬底401，其可以是硅(诸如硅晶片)层或者任何合适的材料层。材料的选择取决于喷墨打印头用于的确切应用。一般而言，衬底材料可以从典型地用于制造共基极横向npn晶体管的材料中进行选择，其中衬底401是p型层，其中附加考虑热稳定性、易于制造、成本以及耐久性。
接着参考图4B，厚绝缘层402(诸如二氧化硅(SiO2)层)被生长或沉积在衬底401的顶部上。绝缘层402的材料和厚度被选择成使其高得足以防止反转底下的p掺杂Si衬底401。
接着参考图4C，使用第一掩模来按期望的图案蚀刻(例如干法蚀刻)绝缘层402，以便打开绝缘层402从而暴露底下衬底401上的掺杂区。
接着参考图4D，基于通过第一掩模进行的图案化，衬底401的所暴露区被掺杂有掺杂层403(诸如磷层)以形成BJT T11到TMN的发射极和集电极区。一般而言，选择掺杂材料以便在所暴露的发射极和集电极区处把Si衬底401的导电性从p型改变为n型。
接着参考图4E，在绝缘层402上沉积第一金属层404以形成电阻器(喷墨加热元件)Rr1到RrM和Rc1到RcN、BJT T11到TMN的发射极和集电极区的金属接触、以及功率载体(power carrier)金属线(即行和列选择线)。在所示的示例中，沉积钽铝(TaAl)/铝铜(AlCu)材料以形成功率载体金属线、到发射极/集电极的接触、以及喷墨电阻器。
接着参考图4F，使用第二掩模来蚀刻(例如干法蚀刻)404处的第一导体层(其包括例如TaAl和AlCu两者)以为BJT限定404处的功率载体金属线和406处的喷墨电阻器的宽度。因为第一导体层404相对于SiO2绝缘层402的良好蚀刻选择性，进行干法过蚀刻以去除(如由第二掩模所暴露的)基极开口处的再一些SiO2。
接着参考图4G，使用第三掩模来进一步蚀刻(例如干法或湿法蚀刻)第一导体层404以限定406处的喷墨电阻器的长度。并且因此完整地制造喷墨电阻器。一旦完成这种蚀刻，钝化层405(另一个介电膜)被沉积在基极开口和第一导体层404的蚀刻区的顶部上。选择钝化材料以便保护第一导体层404以免与要沉积在其顶部上的任何附加材料反应。
接着参考图4H，使用第四掩模来在钝化层405中蚀刻开口或通孔(例如通过干法通孔蚀刻)以在其中创建用于连接到下面的导体层404的开口或通道。第四掩模也用于进一步蚀刻以清除基极开口处的材料从而形成BJT的基极接触。在一个实施例中，选择绝缘层402、第一导体层404和钝化层405的材料以提供良好的蚀刻选择性以便在蚀刻期间清除那些层从而根据需要达到底下的衬底401。
接着参考图4I，第二导体层407沉积在钝化层405上。然后使用第五掩模来蚀刻过多的第二导体材料407并且这完成了BJT T11到TMN的基极接触和到第一导体层404的连接并且这完成了横向BJT与喷墨电阻器的制造。作为这个过程的副产品，金属绝缘体金属(MIM)电容器可以由第一和第二导体层404、407以及充当其间的电介质的钝化层405形成。MIM电容器可以用来存储用以控制打印头的具体功能的数据。因而，共基极(T11到Tmn上是共同的)横向BJT打印头电路通过5掩模制造工艺来制造，这实现了这种电路的更廉价且更快的制作。
考虑可选的实施例，其中5掩模制造工艺可以用来制造具有共基极的任何横向BJT电路。例如，可以基于简单温度相关电路通过前述的5掩模制造工艺来制造温度测量或感测电路，其是与由电阻器或阻抗R1和R2表示的负载串联的p-n+结二极管，如图5所示。恒流源I1将引起二极管D1两端的电位降，该电位降将随温度而变化。随着温度的提高，二极管D1变得更加导电。因此，可以测量二极管D1两端的电压降以用于温度预测以便控制电阻器的激发能量。
本文已说明和描述的是实施例及其一些变型。本文使用的术语、描述和数字仅通过说明的方式被阐述而并非打算作为限制。本领域的技术人员会意识到许多变型在本主题的精神和范围内是可能的，所述主题的精神和范围旨在由所附权利要求及其等价物限定，在权利要求中所有术语以其最广泛的合理意义被解释，除非另外指出。
Claims (20)
1.一种喷墨打印机的打印头电路，包括：
被布置成多个行的多个行加热元件；
被布置成多个列的多个列加热元件；以及
多个横向双极结型晶体管(BJT)，每个横向BJT连接在所述多个行加热元件中的对应一个行加热元件和所述多个列加热元件中的对应一个列加热元件之间并且与所述对应一个行加热元件和所述对应一个列加热元件串联连接，所述多个横向BJT具有共基极；
其中所述多个行加热元件和所述多个列加热元件被选择性地激励从而以期望的图案加热喷墨打印机中的墨以用于打印介质，且其中所述多个横向BJT的每个操作以允许激励与该BJT串联连接的对应行或列加热元件。
2.权利要求1的打印头电路，其中共基极连接到共同电位。
3.权利要求1的打印头电路，还包括：
多个行选择线，每个行选择线操作以同时激励所述多个加热元件的对应行；以及
多个列选择线，每个列选择线操作以同时激励所述多个加热元件的对应列。
4.权利要求3的打印头电路，其中当所述多个列选择线中的至少一个用来同时激励所述多个加热元件的对应列时，所述多个行选择线被设定成绝对地电位。
5.权利要求4的打印头电路，其中所述多个列选择线的其余列选择线被设定成绝对地电位。
6.权利要求3的打印头电路，其中当所述多个行选择线中的至少一个用来同时激励所述多个加热元件的对应行时，所述多个列选择线被设定成绝对地。
7.权利要求6的打印头电路，其中所述多个行选择线的其余行选择线被设定成绝对地电位。
8.权利要求3的打印头电路，其中当列选择线中的对应一个用来激励所述多个列加热元件的对应一个时，至少一个BJT操作为正向偏置的二极管以允许电流流过连接到其的所述多个列加热元件的该对应一个。
9.权利要求3的打印头电路，其中当行选择线中的对应一个用来激励所述多个行加热元件的对应一个时，至少一个BJT操作为正向偏置的二极管以允许电流流过连接到其的所述多个行加热元件的该对应一个。
10.权利要求1的打印头电路，其中喷墨打印机操作以执行商业交易的打印作业，其包括条形码打印、账单与收据打印、传真机打印和自动柜员机(ATM)打印中的一个。
11.一种制造喷墨打印机的打印头电路的方法，包括：
提供半导体衬底；
在所述半导体衬底上形成绝缘层；
用第一掩模按期望的图案来图案化所述绝缘层；
基于第一期望的图案用掺杂层来掺杂所述半导体衬底的第一和第二区，所述半导体衬底的第一和第二区提供所述打印头电路中的多个横向双极结型晶体管(BJT)的发射极和集电极区；
在所述绝缘层之上形成第一导体层；
用第二掩模图案化所述半导体衬底的第一和第二区之上的所述第一导体层；
用第三接触掩模进行图案化以蚀刻所述第一导体层；
在所述第一导体层和绝缘层之上形成钝化层；
用第四掩模进行图案化以蚀刻所述钝化层从而在其中提供到所述半导体衬底的第一和第二区处的第一导体层的开口以及到第三区处的半导体衬底的另一个开口；
在所述钝化层之上沉积第二导体层；以及
用第五掩模进行图案化以蚀刻所述第二导体层从而在所述另一个开口处为所述多个横向BJT中的一个以上横向BJT的每组形成共基极并且以便完成在所述打印头电路中制造所述多个横向BJT。
12.权利要求11的方法，还包括：
形成第二导体层以在由第四掩模创建的钝化层中的开口处电连接到第一导体层。
13.权利要求11的方法，其中：
用所述第二掩模进行图案化以限定加热元件的宽度；以及
用所述第三掩模进行图案化以进一步限定所述加热元件的长度。
14.权利要求13的方法，其中用第四掩模进行图案化以开通到第三区处的半导体衬底的路径从而在第三区处形成横向BJT的基极。
15.权利要求14的方法，还包括：
在通过用第四掩模进行图案化而打开的半导体衬底的第三区的顶部上形成第二导体层。
16.权利要求11的方法，还包括：
由第一和第二导体层以及钝化层形成电容器。
17.权利要求12的方法，还包括：
把以多个行布置的多个行加热元件电连接到第二导体层、经过钝化层中的开口电连接到在半导体衬底的第一区处的第一导体层。
18.权利要求17的方法，还包括：
把以多个列布置的多个列加热元件电连接到第二导体层、经过钝化层中的开口电连接到在半导体衬底的第二区处的第一导体层。
19.一种制造和使用温度感测电路的方法，包括：
提供半导体衬底；
在所述半导体衬底上形成绝缘层；
用第一掩模按第一期望的图案来图案化所述绝缘层；
基于所述第一期望的图案来用掺杂层掺杂所述半导体衬底的第一和第二区，所述半导体衬底的第一和第二区用以限定所述温度感测电路中的p-n+结二极管；
在所述绝缘层之上沉积第一导体层；
用第二掩模图案化所述温度感测电路中的半导体衬底的第一和第二区之上的第一导体层；
在所述第一导体层和所述绝缘层之上沉积钝化层；
用第四掩模进行图案化以蚀刻所述钝化层从而在其中提供到在所述半导体衬底的第一和第二区处的第一导体层的开口以及到第三区处的所述半导体衬底的另一个开口；
在所述钝化层之上沉积第二导体层以在所述钝化层中的开口处电连接到所述第一导体层从而连接所述半导体衬底的第一和第二区并且与所述第三区处的半导体衬底接触；
用第五掩模进行图案化以蚀刻所述第二导体层从而形成BJT的基极并且完成在所述温度感测电路中制造BJT；
把负载电连接到所述半导体衬底的第一和第二区之上的钝化层中的至少一个开口；
通过测量流过二极管的电流来测量所述负载的温度。
20.权利要求19的方法，还包括：
正向偏置其两端的电压降随温度改变的二极管。
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| TW496827B (en) | 2000-08-04 | 2002-08-01 | Benq Corp | Driving circuit capable of maintaining heat equilibrium of a print head nozzle |
| TW479022B (en) | 2000-08-29 | 2002-03-11 | Acer Peripherals Inc | Drive circuit of ink-jet head with temperature detection function |
| US6582042B1 (en) * | 2000-10-30 | 2003-06-24 | Hewlett-Packard Development Company, L.P. | Method and apparatus for transferring information to a printhead |
| GB2371268B (en) * | 2000-12-11 | 2002-12-11 | Macroblock Inc | Printhead circuit |
| US7415441B1 (en) | 2001-03-22 | 2008-08-19 | Ricoh Company, Ltd. | Printing system, apparatus and method for automatically printing records of electronic transactions |
| TW514604B (en) * | 2001-08-10 | 2002-12-21 | Int United Technology Co Ltd | Recognition circuit for an ink jet printer |
| JP3846259B2 (ja) | 2001-10-26 | 2006-11-15 | セイコーエプソン株式会社 | 印刷装置 |
| US6800497B2 (en) * | 2002-04-30 | 2004-10-05 | Hewlett-Packard Development Company, L.P. | Power switching transistor and method of manufacture for a fluid ejection device |
| US6942318B2 (en) | 2002-05-31 | 2005-09-13 | Hewlett-Packard Development Company, L.P. | Chamber having a protective layer |
| US6729715B2 (en) | 2002-08-14 | 2004-05-04 | Hewlett-Packard Development Company, L.P. | Fluid ejection |
| TWI258431B (en) * | 2004-03-09 | 2006-07-21 | Benq Corp | Fluid jet head with driving circuit of a heater set |
| TWI277816B (en) | 2005-01-05 | 2007-04-01 | Toppoly Optoelectronics Corp | Thin film transistor array and fabricating method thereof |
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-
2008
- 2008-01-28 US US12/747,570 patent/US8733872B2/en not_active Expired - Fee Related
- 2008-01-28 CN CN200880125764.6A patent/CN101925464B/zh not_active Expired - Fee Related
- 2008-01-28 WO PCT/US2008/052164 patent/WO2009096940A1/en active Application Filing
- 2008-01-28 EP EP08714048.9A patent/EP2237957B1/en not_active Not-in-force
-
2009
- 2009-01-22 TW TW098102533A patent/TWI449628B/zh not_active IP Right Cessation
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103619601A (zh) * | 2011-07-01 | 2014-03-05 | 惠普发展公司，有限责任合伙企业 | 调节打印头温度的方法和装置 |
| CN103619601B (zh) * | 2011-07-01 | 2015-10-21 | 惠普发展公司，有限责任合伙企业 | 调节打印头温度的方法和装置 |
| US10421273B2 (en) | 2011-07-01 | 2019-09-24 | Hewlett-Packard Development Company, L.P. | Method and apparatus to regulate temperature of printheads |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101925464B (zh) | 2012-10-03 |
| TWI449628B (zh) | 2014-08-21 |
| EP2237957B1 (en) | 2014-03-12 |
| EP2237957A4 (en) | 2013-03-27 |
| US20100271641A1 (en) | 2010-10-28 |
| TW200934666A (en) | 2009-08-16 |
| WO2009096940A1 (en) | 2009-08-06 |
| EP2237957A1 (en) | 2010-10-13 |
| US8733872B2 (en) | 2014-05-27 |
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