CN101911855A - 固有地安全兼容性电路元件间隔 - Google Patents

固有地安全兼容性电路元件间隔 Download PDF

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Publication number
CN101911855A
CN101911855A CN2009801018226A CN200980101822A CN101911855A CN 101911855 A CN101911855 A CN 101911855A CN 2009801018226 A CN2009801018226 A CN 2009801018226A CN 200980101822 A CN200980101822 A CN 200980101822A CN 101911855 A CN101911855 A CN 101911855A
Authority
CN
China
Prior art keywords
circuit board
circuit
spacer element
standard
illusory
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2009801018226A
Other languages
English (en)
Chinese (zh)
Inventor
克里斯多佛·李·埃里克森
霍华德·大卫·戈德堡
约翰·查尔斯·迈耶
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rosemount Inc
Original Assignee
Rosemount Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rosemount Inc filed Critical Rosemount Inc
Publication of CN101911855A publication Critical patent/CN101911855A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
    • H05K1/0256—Electrical insulation details, e.g. around high voltage areas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10204—Dummy component, dummy PCB or template, e.g. for monitoring, controlling of processes, comparing, scanning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2036—Permanent spacer or stand-off in a printed circuit or printed circuit assembly
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49826—Assembling or joining

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Measuring Fluid Pressure (AREA)
  • Combinations Of Printed Boards (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
CN2009801018226A 2008-01-14 2009-01-08 固有地安全兼容性电路元件间隔 Pending CN101911855A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/008,836 US8045333B2 (en) 2008-01-14 2008-01-14 Intrinsically safe compliant circuit element spacing
US12/008,836 2008-01-14
PCT/US2009/000087 WO2009091507A1 (fr) 2008-01-14 2009-01-08 Espacement d'élément de circuit conforme à sécurité intrinsèque

Publications (1)

Publication Number Publication Date
CN101911855A true CN101911855A (zh) 2010-12-08

Family

ID=40850452

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2009801018226A Pending CN101911855A (zh) 2008-01-14 2009-01-08 固有地安全兼容性电路元件间隔

Country Status (5)

Country Link
US (1) US8045333B2 (fr)
EP (1) EP2241168B1 (fr)
JP (1) JP5485173B2 (fr)
CN (1) CN101911855A (fr)
WO (1) WO2009091507A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107535057A (zh) * 2015-04-10 2018-01-02 罗伯特·博世有限公司 控制器
CN110073728A (zh) * 2017-01-26 2019-07-30 惠普发展公司，有限责任合伙企业 虚设电子部件

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE529701C2 (sv) * 2006-01-31 2007-10-30 Delaval Holding Ab Mjölkningssystem och metod för vakuumreglering
US7784351B2 (en) * 2008-10-16 2010-08-31 Rosemount Inc. Field device with integrated temperature control
US20130003329A1 (en) * 2009-09-01 2013-01-03 Airo Wireless, Inc. Ruggedized handset housing
US8873241B2 (en) 2011-05-23 2014-10-28 Honeywell International Inc. Intrinsically safe serviceable transmitter apparatus and method
DE102013101341A1 (de) * 2013-02-12 2014-08-14 Hella Kgaa Hueck & Co. Elektronische Baueinheit mit einem Halbleiter-Leuchtmittel in geschützter Anordnung auf einem Trägerkörper
US9980381B2 (en) 2014-12-16 2018-05-22 Motorola Solutions, Inc. Method and apparatus for intrinsically safe circuit board arrangement for portable electronic devices
US10149389B2 (en) * 2015-11-16 2018-12-04 Aegex Technologies, Llc Intrinsically safe mobile device with reduction in sparking risk and surface heating

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5008777A (en) * 1988-10-14 1991-04-16 At&T Bell Laboratories Auxiliary board spacer arrangement
JPH0738227A (ja) * 1993-07-16 1995-02-07 Sanyo Electric Co Ltd プリント配線基板
JP2000175127A (ja) * 1998-12-09 2000-06-23 Citizen Watch Co Ltd 携帯テレビジョン受像機

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US3983459A (en) * 1975-07-02 1976-09-28 Honeywell Information Systems, Inc. Circuit board spacer
US4438999A (en) * 1979-08-02 1984-03-27 Allied Corporation Wire pin connector for ribbon cable
US4895031A (en) * 1985-08-29 1990-01-23 Micro Motion Inc. Sensor mounting for coriolis mass flow rate meter
AU8519891A (en) * 1990-08-01 1992-03-02 Staktek Corporation Ultra high density integrated circuit packages, method and apparatus
JP2583994Y2 (ja) * 1991-09-30 1998-10-27 旭光学工業株式会社 液晶表示パネルの固定構造
JPH06112621A (ja) * 1992-09-29 1994-04-22 Fujitsu Ltd モジュールのスタンドオフ構造
JP3269171B2 (ja) 1993-04-08 2002-03-25 セイコーエプソン株式会社 半導体装置およびそれを有した時計
JP3576727B2 (ja) * 1996-12-10 2004-10-13 株式会社デンソー 表面実装型パッケージ
WO1998052220A1 (fr) 1997-05-09 1998-11-19 Citizen Watch Co., Ltd. Procede de production d'un boitier pour semi-conducteur et systeme de carte de circuits
JP4025885B2 (ja) * 1998-02-06 2007-12-26 協伸工業株式会社 コネクタチップ及びテーピングコネクタチップ
US6203333B1 (en) * 1998-04-22 2001-03-20 Stratos Lightwave, Inc. High speed interface converter module
TW399146B (en) * 1998-05-29 2000-07-21 Oval Corp Coliolis mass flowmeter
US6748813B1 (en) * 1998-12-08 2004-06-15 Emerson Electric Company Coriolis mass flow controller
WO2000063970A1 (fr) 1999-04-16 2000-10-26 Matsushita Electric Industrial Co., Ltd. Composant modulaire et son procede de production
US6617671B1 (en) * 1999-06-10 2003-09-09 Micron Technology, Inc. High density stackable and flexible substrate-based semiconductor device modules
JP2001052121A (ja) * 1999-08-13 2001-02-23 Fci Japan Kk カードコネクタ
US6456057B1 (en) * 2000-11-06 2002-09-24 Micro Motion, Inc. Universal booster amplifier for a coriolis flowmeter
JP2003069181A (ja) * 2001-08-28 2003-03-07 Mitsubishi Electric Corp 電子機器装置及びその製造方法
US20040245674A1 (en) 2003-04-11 2004-12-09 Yew Chee Kiang Method for packaging small size memory cards
JP4412947B2 (ja) 2003-09-08 2010-02-10 株式会社ルネサステクノロジ メモリカード
US7515433B2 (en) * 2004-08-17 2009-04-07 Tac, Llc Method and apparatus for progressively connecting a controller to an external circuit of a building
US7129572B2 (en) 2004-08-18 2006-10-31 Chung-Cheng Wang Submember mounted on a chip of electrical device for electrical connection
JP4491306B2 (ja) * 2004-09-17 2010-06-30 富士通株式会社 シェルフ構造
US20060071305A1 (en) 2004-09-24 2006-04-06 Kai-Kuang Ho Electrical package structure including chip with polymer thereon
US7292453B2 (en) * 2004-10-14 2007-11-06 Kyocera Mita Corporation Bi-fold mounted printed wiring board
US7189103B1 (en) * 2005-12-07 2007-03-13 Avocent Corporation Wire comb overlying spark gap

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5008777A (en) * 1988-10-14 1991-04-16 At&T Bell Laboratories Auxiliary board spacer arrangement
JPH0738227A (ja) * 1993-07-16 1995-02-07 Sanyo Electric Co Ltd プリント配線基板
JP2000175127A (ja) * 1998-12-09 2000-06-23 Citizen Watch Co Ltd 携帯テレビジョン受像機

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107535057A (zh) * 2015-04-10 2018-01-02 罗伯特·博世有限公司 控制器
CN110073728A (zh) * 2017-01-26 2019-07-30 惠普发展公司，有限责任合伙企业 虚设电子部件

Also Published As

Publication number Publication date
JP5485173B2 (ja) 2014-05-07
EP2241168A1 (fr) 2010-10-20
EP2241168B1 (fr) 2017-07-12
JP2011517842A (ja) 2011-06-16
US8045333B2 (en) 2011-10-25
US20090180263A1 (en) 2009-07-16
EP2241168A4 (fr) 2012-09-12
WO2009091507A1 (fr) 2009-07-23

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C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20101208