CN101900788B - Test method for detecting reliability of product - Google Patents
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Abstract
The invention discloses a test method for detecting reliability of a electronic product, and the method comprises the following steps: sequentially carrying out temperature step stress test, rapid temperature change stress test, vibration step stress test and temperature and vibration comprehensive test on the product to be detected, and carrying out the functional detection on the product to be detected. The test method can rapidly find out the defects in the design and the manufacture of the product, improve the design defects, increase the reliability of the product and shorten the period of coming into the market; simultaneously, the test method can set up basic data for design capacity and the product reliability, so as to be used as an important basis for the further research and the development.
Description
Technical field
The present invention relates to the reliability field, particularly relate to a kind of test method of testing product reliability.
Background technology
Now, many products all need to trouble-freely turn round thousands of hours under extremely harsh environmental stress, therefore, need to confirm design defect or checking predicted life by test.
Marginal stress test is the high stress test (HAST that accelerates, highly accelerated stress test) a kind of, it has stipulated to determine or estimate the method for microelectronic component maximum capacity, the maximum stress that these abilities comprise absolute maximum rating (therefrom can release the safe design ultimate value), can apply when screening or test under the prerequisite that does not cause degeneration, to the special screening that do not cause degeneration or the susceptibility of test, and relevant failure modes and mechanisms with it.
Along with the high speed development of electronic technology, just incipient test method has no longer adapted to current technology several years ago, and especially those are specially for the accelerated test of microelectronic product.For example, due to the plastic integrated circuit package development, need to take the inefficacy that just can detect new-type integrated circuit in thousand hours with temperature/humidity test traditional, general received 85 ℃/85%RH now.In most of the cases, any inefficacy does not occur in test sample in whole test.But the test of not losing efficacy does not illustrate any problem, and product in use may lose efficacy once in a while.Therefore, require further improvement test method.Marginal stress test is exactly the method for replacing old temperature/humidity test to develop.The reliability testing means that electronic product is general, generally to adopt traditional different humiture case of performance to verify the reliability performance that improves product when research and development, as " research of module level electronic product reliability strenuous test method ", Chu Weihua, " CDMD (doctor) Information technology is collected ", the 2nd phase in 2005, on June 15th, 2005; What online production was adopted is the conventional test methodologies of aging life-span (being high temperature etc.), usually needs the long test period of cost, only relies on above these traditional means of testing, reach the high-quality technical indicator of electronic product, still exists certain difficulty.
Summary of the invention
The purpose of this invention is to provide a kind of test method that can find out rapidly the defective of product design and manufacturing.
For achieving the above object, technical scheme of the present invention provides a kind of test method of detected electrons product reliability, said method comprising the steps of: treat testing product and carry out successively temperature step stress test, quick temperature variable-stress level test, vibration step stress test, temperature and vibration integrated test, and in above-mentioned each process of the test and after each off-test, product to be measured is carried out Function detection;
Wherein, described temperature step stress test comprises low temperature step stress test and high temperature step stress test, and wherein, the low temperature step stress test comprises the following steps:
Stress starts from initial temperature, then take the stepping temperature as variable, progressively descends;
after each phase temperature is stable, kept 10 minutes, carry out afterwards functional test at least one times under the stage equilibrium temperature, normally temperature is progressively descended again as all, and keep after temperature stabilization and carried out again functional test in 10 minutes, the rest may be inferred until during the generating function fault, temperature is returned to normal temperature and stable after, carry out again functional test, whether observe its function recovers, normally recover as function, the low-temperature values before fault is recorded as the low-temperature operation limit, again temperature is descended piecemeal simultaneously until find still can't make the function low temperature of recovery automatically when recovering normal temperature, this low temperature is the low temperature damage limit,
The high temperature step stress test comprises the following steps:
Stress starts from initial temperature, then take the stepping temperature as variable, progressively rises;
Then carry out the step identical with above-mentioned low temperature step stress test, determine the high-temperature operation limit and breaking limit.
Wherein, in above-mentioned low temperature step stress test and high temperature step stress test, the temperature spot residence time of each phase temperature at least 10 minutes, or residence time wants long enough until the temperature monitoring thermopair on product to be detected reaches stable, the functional test of product to be detected reaches at sample temperature to be carried out after stable, perhaps carries out in whole process of the test always.
Wherein, described stepping temperature is 10 ℃.
Wherein, described quick temperature variable-stress level test comprises the following steps:
advance in stress test resulting low temperature and the high-temperature operation limit as the height of quick temperature variable-stress level test with above-mentioned temperature step, the low temperature limit, or select higher 10 ℃ and than the height of the low 10 ℃ of quick temperature variable-stress level tests of conduct of the high-temperature operation limit than the above-mentioned low-temperature operation limit, the low temperature limit, and with the maximum temperature variable Rate of equipment as the fast temperature rate of change, at height, the high and low temperature that carries out at least 5 circulations between the low temperature limit region changes, in the residence time of the maximum temperature of each circulation and minimum temperature, carry out functional test after temperature stabilization, check whether determinand the restorability fault occurs, obtain the operating limit of the quick temperature variable-stress level test of product to be detected.
Wherein, described vibration step stress test specifically comprises:
The vibration level of on-test is 2～5Grms, and frequency increases progressively with the vibration level of 2～5Grms and tests between 2Hz～2000Hz; Residence time at each vibration level is not less than 10 minutes, and in whole process of the test, and at each vibration level after resident at least 10 minutes, all described product to be measured is carried out Function detection, until determine the operating limit of described product to be measured or the capacity limit that the proof stress grade reaches chamber, stop test.
Wherein, after the operating limit of determining described product to be measured, also comprise:
In operating limit and the breaking limit of described product to be measured, or between the capacity limit of chamber, continue vibration level with 2～5Grms and increase progressively and test.
Wherein, 5 circulations are carried out in described temperature and vibration integrated test at least;
In test, the temperature extremal of temperature cycles curve setting is within the value up and down of sample operation ultimate temperature, test resident at least 10 minutes at each temperature extremal point;
Initial vibration magnitude in test is 1/5 of the maximum vibration magnitude of vibration in step stress test, in each circulation, vibration level increases progressively later on, increasing progressively magnitude is the initial vibration magnitude, if do not find the maximum vibration magnitude in vibration in step stress test, test just begins and increases progressively with 1/5 of the maximum vibration magnitude of testing equipment so;
In whole process of the test, and after resident at least 10 minutes, all product to be measured is carried out Function detection at each vibration level.
Technique scheme has following advantage: the present invention is by allowing measured object bear different stress, and then finds scarce limit and potential vulnerability in its design, by increasing the ultimate value of measured object, and then increases its soundness and reliability.Utilize the mode of ladder stress to be added to product, can find in early days product defects, operational design limit and structural limit, its stress that is added to product has vibration, high low temperature, temperature cycles, power switch circulation, voltage limit and frequency marginal test etc.Utilize the method can find out rapidly the defective of product design and manufacturing, improve design defect, increase product reliability and shorten its listing cycle, also can set up simultaneously the basic data of designed capacity, product reliability, as the important evidence of researching and developing in the future.
Description of drawings
Fig. 1 is the process flow diagram of test method of a kind of detected electrons product reliability of the embodiment of the present invention.
Embodiment
Below in conjunction with drawings and Examples, the specific embodiment of the present invention is described in further detail.Following examples are used for explanation the present invention, but are not used for limiting the scope of the invention.
In conjunction with Fig. 1, the test method of the detected electrons product reliability of the present embodiment comprises that treating testing product carries out temperature step stress test, quick temperature variable-stress level test, vibration step stress test, temperature and vibration integrated test successively, and in above-mentioned each process of the test and after each off-test, product to be measured is carried out Function detection.
Wherein, temperature step stress test concrete steps are as follows:
The temperature stepstress comprises low temperature step stress test and high temperature step stress test:
(1) low temperature step stress test: stress starts from 20 ℃, and then temperature is with 10 ℃ of past declines of per step.
(2) phase temperature was kept 10 minutes after stablizing, carry out afterwards functional test at least one times under the stage equilibrium temperature, normally temperature is fallen 10 ℃ again as all, and keep after temperature stabilization and carried out again functional test in 10 minutes, the rest may be inferred until during the generating function fault, temperature is returned to normal temperature and stable after, carry out again functional test, whether observe its function recovers, to judge whether to reach operating limit or breaking limit, normally recover as function, but the low-temperature values before fault is recorded as operating limit, again temperature is descended piecemeal simultaneously until find still can't make the function low temperature of recovery automatically when recovering normal temperature, this low temperature is the low temperature damage limit.
(3) high temperature step stress test: stress starts from 20 ℃, and then temperature is with 10 ℃ of past risings of per step.Then carry out the program identical with the low temperature step stress test, determine the high-temperature operation limit and breaking limit.
(4) the temperature spot residence time is at least 10 minutes, and residence time wants long enough until the temperature monitoring thermopair on sample reaches stable, and the functional test of sample can reach at sample temperature to be carried out after stable, also can carry out in whole process of the test always.
Quick temperature variable-stress level test concrete steps are as follows:
This test is resulting low temperature and the high-temperature operation limit conduct high and low temperature limit herein in the stress test of temperature stage before, or select higher 10 ℃ and than low 10 ℃ of maximum temperature operating limit than minimum temperature operating limit, and with the maximum temperature variable Rate of equipment as the fast temperature rate of change, the high and low temperature that carries out at least 5 circulations in this interval changes.Maximum temperature and minimum temperature in each circulation will stop 5 minutes at least, and carried out functional test after making temperature stabilization again.Check whether determinand the restorability fault occurs, but seek its operating limit.Need not seek breaking limit in this test.
The temperature extremal residence time is confirmed according to following three conditions: 1, resident at least 5 minutes; 2, residence time is wanted long enough until the temperature monitoring galvanic couple on sample reaches stable; 3, residence time is also wanted suitable prolongation, until on sample, the temperature stress of the parts of thermal capacity maximum is not less than 80% of proof stress.
The confirmation of residence time: condition 2 and 3 is the conditions that must satisfy, that is: the residence time temperature monitoring galvanic couple that should satisfy on sample reaches stable, allows again the temperature stress of thermal capacity maximum part be not less than 80% of proof stress.If satisfied above-mentioned two conditions in 5 minutes, just can be only resident 5 minutes.If can not satisfy in 5 minutes, will wait until that condition 2 and 3 has all satisfied just and can stop residence time.
In the whole process of quick temperature variable-stress level test, all tackle sample and carry out function monitoring, whether can be due to rate temperature change fast and initiating failure to judge test specimen.
Vibration step stress test concrete steps are as follows:
(1) vibration level of on-test is 2～5Grms(Gs in a root mean square, acceleration root-mean-square value, physical meaning is to the square root of oscillation power spectral density after the frequency upper integral) (recommending 5Grms), frequency is between 2Hz～2000Hz, perhaps in higher frequency range.Upper frequency limit needs to decide according to the actual conditions of equipment, advises being 2000Hz.After resident and sample Function detection is completed at each vibration level, then recommend 5Grms with 2～5Grms() vibration level increase progressively and test.
(2) test should be not less than 10 minutes at the residence time of each vibration level, and then product is carried out Function detection.Therefore each vibration level residence time also will be determined by the time of completing once whole sample Function detection.Attention: although in whole process of the test, all sample is carried out function monitoring,,, all tackle sample and carry out Function detection after resident at least 10 minutes at each vibration level.
(3) until find the operating limit of sample or the capacity limit that the proof stress grade has reached chamber, can stop test.
(4) determine the operating limit of product after, the vibration Step test should be proceeded, the range of stress is between the capacity limit of the operating limit of sample and breaking limit or chamber, vibration stress stepping grade is according to top grade setting.Due in this vibration stress scope, sample may lose efficacy, so, being necessary at each grade vibration stress test bay, vibration stress is reduced, and it is normal whether judgement sample can recover.
As: vibration stress is transferred to vibration level between 0Grms or 0Grms and vibration operating limit.
Temperature and combination of vibrations test concrete steps are as follows:
(1) the initial vibration magnitude in composite test be in the stepping vibration test maximum vibration magnitude (the flutter failure limit magnitude of product) 1/5, later on each the circulation in vibration level increase progressively, increasing progressively magnitude is the initial vibration magnitude.For example: in the stepping vibration test, the maximum vibration magnitude of product is 35Grms, so, the initial vibration magnitude of beginning composite test is 7Grms, and after each humid test cyclic test, vibration level increases 7Grms, so, vibration level in 5 cyclic tests is respectively 7Grms, 14Grms, 21Grms, 28Grms and 35Grms.If do not find maximum vibration magnitude (the maximum vibration magnitude is greater than the maximum vibration magnitude of testing equipment) in the stepping vibration test, test just begins and increases progressively with 1/5 of the maximum vibration magnitude of testing equipment so.(annotating: also can suitably adopt less initial vibration level in test and increase progressively magnitude)
(2) in the test, the temperature extremal of temperature cycles curve setting is within the value up and down of sample operation ultimate temperature in quick temperature change test, test resident at least 10 minutes at each temperature extremal point.
(3) 5 circulations are carried out in the test of temperature and combination of vibrations at least, until hard fault (irrecoverability fault) appears in test in test specimen.
(4), all tackle sample and carry out Function detection after resident a period of time in each test class.The test residence time will detect required time according to product function and extend.Attention: although in whole process of the test, all sample is carried out function monitoring,,, all tackle sample and carry out Function detection after resident at least 10 minutes at each vibration level.
As can be seen from the above embodiments, the embodiment of the present invention is by adopting the environmental stress that systematically applies working stress and progressively increase, excite fault, weak link in the exposing product design, for improving product design scheme, the developer provides foundation, so that design deficiency of product is revised timely.Improve product sturdy degree in use, guarantee satisfactory trouble-free the finishing the work of product.Estimate working limit and the breaking limit of product, the reliability of assessment product under actual service conditions, and provide foundation for the selection of stress types and magnitude of stress.
The above is only the preferred embodiment of the present invention; should be pointed out that for those skilled in the art, under the prerequisite that does not break away from the technology of the present invention principle; can also make some improvements and modifications, these improvements and modifications also should be considered as protection scope of the present invention.
Claims (7)
1. the test method of a detected electrons product reliability, is characterized in that, said method comprising the steps of:
Treat testing product and carry out successively temperature step stress test, quick temperature variable-stress level test, vibration step stress test, temperature and vibration integrated test, and in above-mentioned each process of the test and after each off-test, product to be measured is carried out Function detection;
Described temperature step stress test comprises low temperature step stress test and high temperature step stress test, and wherein, the low temperature step stress test comprises the following steps:
Stress starts from initial temperature, then take the stepping temperature as variable, progressively descends;
after each phase temperature is stable, kept 10 minutes, carry out afterwards functional test at least one times under the stage equilibrium temperature, normally temperature is progressively descended again as all, and keep after temperature stabilization and carried out again functional test in 10 minutes, the rest may be inferred until during the generating function fault, temperature is returned to normal temperature and stable after, carry out again functional test, whether observe its function recovers, normally recover as function, the low-temperature values before fault is recorded as the low-temperature operation limit, again temperature is descended piecemeal simultaneously until find still can't make the function low temperature of recovery automatically when recovering normal temperature, this low temperature is the low temperature damage limit,
The high temperature step stress test comprises the following steps:
Stress starts from initial temperature, then take the stepping temperature as variable, progressively rises;
Then carry out the step identical with above-mentioned low temperature step stress test, determine the high-temperature operation limit and breaking limit.
2. the test method of detected electrons product reliability as claimed in claim 1, it is characterized in that, in above-mentioned low temperature step stress test and high temperature step stress test, the temperature spot residence time of each phase temperature at least 10 minutes, or residence time wants long enough until the temperature monitoring thermopair on product to be detected reaches stable, the functional test of product to be detected reaches at sample temperature to be carried out after stable, perhaps carries out in whole process of the test always.
3. the test method of detected electrons product reliability as claimed in claim 1, is characterized in that, described stepping temperature is 10 ℃.
4. the test method of detected electrons product reliability as claimed in claim 1, is characterized in that, described quick temperature variable-stress level test comprises the following steps:
advance in stress test resulting low temperature and the high-temperature operation limit as the height of quick temperature variable-stress level test with above-mentioned temperature step, the low temperature limit, or select higher 10 ℃ and than the height of the low 10 ℃ of quick temperature variable-stress level tests of conduct of the high-temperature operation limit than the above-mentioned low-temperature operation limit, the low temperature limit, and with the maximum temperature variable Rate of equipment as the fast temperature rate of change, at height, the high and low temperature that carries out at least 5 circulations between the low temperature limit region changes, in the residence time of the maximum temperature of each circulation and minimum temperature, carry out functional test after temperature stabilization, check whether determinand the restorability fault occurs, obtain the operating limit of the quick temperature variable-stress level test of product to be detected.
5. the test method of detected electrons product reliability as claimed in claim 1, is characterized in that, described vibration step stress test specifically comprises:
The vibration level of on-test is 2～5Grms, and frequency increases progressively with the vibration level of 2～5Grms and tests between 2Hz～2000Hz; Residence time at each vibration level is not less than 10 minutes, and in whole process of the test, and at each vibration level after resident at least 10 minutes, all described product to be measured is carried out Function detection, until determine the operating limit of described product to be measured or the capacity limit that the proof stress grade reaches chamber, stop test.
6. the test method of detected electrons product reliability as claimed in claim 5, is characterized in that, after the operating limit of determining described product to be measured, also comprises:
In operating limit and the breaking limit of described product to be measured, or between the capacity limit of chamber, continue vibration level with 2～5Grms and increase progressively and test.
7. the test method of detected electrons product reliability as claimed in claim 5, is characterized in that, 5 circulations are carried out in described temperature and vibration integrated test at least;
In test, the temperature extremal of temperature cycles curve setting is within the value up and down of sample operation ultimate temperature, test resident at least 10 minutes at each temperature extremal point;
Initial vibration magnitude in test is 1/5 of the maximum vibration magnitude of vibration in step stress test, in each circulation, vibration level increases progressively later on, increasing progressively magnitude is the initial vibration magnitude, if do not find the maximum vibration magnitude in vibration in step stress test, test just begins and increases progressively with 1/5 of the maximum vibration magnitude of testing equipment so;
In whole process of the test, and after resident at least 10 minutes, all product to be measured is carried out Function detection at each vibration level.
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