CN103471795A - Method for highly accelerated life testing of mainboard - Google Patents
Method for highly accelerated life testing of mainboard Download PDFInfo
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- CN103471795A CN103471795A CN2013104210131A CN201310421013A CN103471795A CN 103471795 A CN103471795 A CN 103471795A CN 2013104210131 A CN2013104210131 A CN 2013104210131A CN 201310421013 A CN201310421013 A CN 201310421013A CN 103471795 A CN103471795 A CN 103471795A
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Abstract
The invention provides a method for highly accelerated life testing of a mainboard. The specific testing process of the method for highly accelerated life testing of the mainboard comprises the steps of (1) carrying out a temperature stress test, wherein the temperature stress test comprises a low-temperature stress test and a high-temperature stress test; (2) carrying out a vibration stress test; (3) carrying out a combined stress test, namely, combining the step (1) and the step (2) together to carry out a stress test. Compared with the prior art, the method for highly accelerated life testing of the mainboard reduces design cost, the design defects can be rapidly found in the product research and development stage, the defects of the manufacturing technology can be monitored, the product quality problem caused by the manufacturing procedure is solved in advance in the research and development stage, practicability is good, and popularization is easy.
Description
Technical field
The present invention relates to field of computer technology, but a kind ofly specifically save the design cost short time and find out the high accelerated aging method of testing of mainboard of product defects.
Background technology
Along with the arrival in cloud computing epoch, various new application emerges in an endless stream.The product quality problem more and more is subject to the client and pays close attention to, and the quality quality of product directly determines the experience of client to product, also determines approval and the market share of client to product.
The inefficacy that product occurs under long-time low-stress is equal to the inefficacy of product in heavily stressed lower generation of short time. and effect shows as:
1. find fast the defect of design phase and processing procedure.
2. improve the plan boundary value of product, the quality of enhanced products.
3. fiduciary level is ripe during production marketing.
4. reduce development time and cost.
5. improve client's satisfaction.
Given this, need a kind of new, the method that just can avoid in advance the product quality problem that causes due to processing procedure in development, the product here refers to mainboard.
Summary of the invention
Technical assignment of the present invention is to solve the deficiencies in the prior art, provide a kind of by harsh acceleration stress condition is provided, find the high accelerated aging method of testing of mainboard of product defects in the short time.
Technical scheme of the present invention realizes in the following manner, the high accelerated aging method of testing of this kind of mainboard, and its concrete test process is:
1) at first carry out the temperature stress test, this temperature stress test comprises: low temperature stress test and high temperature stress test;
2) then carry out the vibration stress test;
3) finally combined stress test, be about to step 1) and step 2) stress test of joining together simultaneously to carry out.
The detailed process of the temperature stress test in described step 1) comprises:
The low temperature stress test, below 0 ℃ according to the cooling of certain cooling extent, often fall a temperature and start to test a period of time and carry out functional check, after temperature arrives set point, maintain certain hour and move the program of test function;
Reach the limit of technical manual by test, find operating limit and breaking limit;
Plus external carbuncle when product test;
The high temperature stress test, heating up according to certain cooling extent more than 0 ℃, and every liter of temperature starts to test a period of time and carries out functional check, after temperature arrives set point, waits for ten minutes and move the program of test function;
Reach the limit of technical manual by test, find operating limit and breaking limit;
Plus external carbuncle when product test.
In the low temperature stress test process of described temperature stress test, the initial stage cooling extent is 10 ℃, and when the close setting of temperature limit point, cooling extent changes 5 ℃ into, and while dropping to a temperature value, the test duration is 10 minutes at every turn; When high temperature stress is tested, increasing extent of temperature is 1 ℃, and while being raised to a temperature value, the test duration is 10 minutes at every turn.
The detailed process of the vibration stress test described step 2) is:
Understand the vibration mark of product, in order to set limit point;
Start test and gain in weight according to certain increasing degree, the test of the rear maintenance certain time length of at every turn gaining in weight is also carried out functional check, after weight reaches set point, waits for ten minutes and moves test procedure;
Continue test until the limit of technical manual;
Plus external carbuncle when product test.
The recruitment of the weight of described product vibration is 3～5G, the test that the rear retention time of at every turn gaining in weight is ten minutes.
The detailed process of described step 3) is: in the temperature stress test, merge and carry out the vibration stress test, at this moment the recruitment of vibration is 5G, start to increase the vibration feedback when above when being increased to 20G, and judge whether the inefficacy of product is influenced at high G-value, and just detect in low G value.
The beneficial effect that the present invention compared with prior art produced is:
The high accelerated aging method of testing of a kind of mainboard of the present invention, for product development stage, provides the extremely high stress condition that accelerates of harshness, finds out at short notice the defect of product, then analyzes failure cause, strengthens the fiduciary level of product; And then the saving design cost, find fast design defect in the research and development of products stage; Can monitor simultaneously manufacturing process flaw, avoid in advance the product quality problem caused due to processing procedure in development, practical, be easy to promote.
The accompanying drawing explanation
Accompanying drawing 1 is low temperature stress test process flow diagram of the present invention.
Accompanying drawing 2 is high temperature stress test flow charts of the present invention.
Accompanying drawing 3 is vibration stress test flow charts of the present invention.
Embodiment
Below in conjunction with accompanying drawing, the high accelerated aging method of testing of a kind of mainboard of the present invention is elaborated.
Now provide a kind of mainboard high accelerated aging method of testing, its concrete test process is:
1) at first carry out the temperature stress test, this temperature stress test comprises: low temperature stress test and high temperature stress test;
2) then carry out the vibration stress test;
3) finally combined stress test, be about to step 1) and step 2) stress test of joining together simultaneously to carry out.
Temperature stress test flow chart as shown in Figure 1, its detailed process comprises:
The low temperature stress test, below 0 ℃ according to the cooling of certain cooling extent, often fall a temperature and start to test a period of time and carry out functional check, after temperature arrives set point, maintain certain hour and move the program of test function;
Reach the limit of technical manual by test, find operating limit and breaking limit;
Plus external carbuncle when product test.
High temperature stress test as shown in Figure 2, heating up according to certain cooling extent more than 0 ℃, and every liter of temperature starts to test a period of time and carries out functional check, after temperature arrives set point, waits for ten minutes and move the program of test function;
Reach the limit of technical manual by test, find operating limit and breaking limit;
Plus external carbuncle when product test.
In the low temperature stress test process of described temperature stress test, the initial stage cooling extent is 10 ℃, and when the close setting of temperature limit point, cooling extent changes 5 ℃ into, and while dropping to a temperature value, the test duration is 10 minutes at every turn; When high temperature stress is tested, increasing extent of temperature is 1 ℃, and while being raised to a temperature value, the test duration is 10 minutes at every turn.
The detailed process of the vibration stress test described step 2 as shown in Figure 3) is:
Understand the vibration mark of product, in order to set limit point;
Start test and gain in weight according to certain increasing degree, the test of the rear maintenance certain time length of at every turn gaining in weight is also carried out functional check, after weight reaches set point, waits for ten minutes and moves test procedure;
Continue test until the limit of technical manual;
Plus external carbuncle when product test.
The recruitment of the weight of described product vibration is 3～5G, the test that the rear retention time of at every turn gaining in weight is ten minutes, and the G here is writing a Chinese character in simplified form of weight Grms.
The detailed process of described step 3) is: in the temperature stress test, merge and carry out the vibration stress test, at this moment the recruitment of vibration is 5G, start to increase the vibration feedback when above when being increased to 20G, and judge whether the inefficacy of product is influenced at high G-value, and just detect in low G value.
Except the described technical characterictic of instructions, be the known technology of those skilled in the art.
Claims (6)
1. the high accelerated aging method of testing of mainboard, is characterized in that, its concrete test process is:
1) at first carry out the temperature stress test, this temperature stress test comprises: low temperature stress test and high temperature stress test;
2) then carry out the vibration stress test;
3) finally combined stress test, be about to step 1) and step 2) stress test of joining together simultaneously to carry out.
2. the high accelerated aging method of testing of a kind of mainboard according to claim 1, is characterized in that, the detailed process of the temperature stress test in described step 1) comprises:
The low temperature stress test, below 0 ℃ according to the cooling of certain cooling extent, often fall a temperature and start to test a period of time and carry out functional check, after temperature arrives set point, maintain certain hour and move the program of test function;
Reach the limit of technical manual by test, find operating limit and breaking limit;
Plus external carbuncle when product test;
The high temperature stress test, heating up according to certain cooling extent more than 0 ℃, and every liter of temperature starts to test a period of time and carries out functional check, after temperature arrives set point, waits for ten minutes and move the program of test function;
Reach the limit of technical manual by test, find operating limit and breaking limit;
Plus external carbuncle when product test.
3. the high accelerated aging method of testing of a kind of mainboard according to claim 2, it is characterized in that, in the low temperature stress test process of described temperature stress test, the initial stage cooling extent is 10 ℃, when the close setting of temperature limit point, cooling extent changes 5 ℃ into, and while dropping to a temperature value, the test duration is 10 minutes at every turn; When high temperature stress is tested, increasing extent of temperature is 1 ℃, and while being raised to a temperature value, the test duration is 10 minutes at every turn.
4. the high accelerated aging method of testing of a kind of mainboard according to claim 1, is characterized in that described step 2) in the detailed process of vibration stress test be:
Understand the vibration mark of product, in order to set limit point;
Start test and gain in weight according to certain increasing degree, the test of the rear maintenance certain time length of at every turn gaining in weight is also carried out functional check, after weight reaches set point, waits for ten minutes and moves test procedure;
Continue test until the limit of technical manual;
Plus external carbuncle when product test.
5. the high accelerated aging method of testing of a kind of mainboard according to claim 4, is characterized in that, the recruitment of the weight of described product vibration is 3～5G, the test that the rear retention time of at every turn gaining in weight is ten minutes.
6. the high accelerated aging method of testing of a kind of mainboard according to claim 1, it is characterized in that, the detailed process of described step 3) is: in the temperature stress test, merge and carry out the vibration stress test, at this moment the recruitment of vibration is 5G, start to increase the vibration feedback when above when being increased to 20G, and whether the inefficacy of judging product be influenced at high G-value, and just detect in low G value.
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106932294A (en) * | 2017-03-22 | 2017-07-07 | 中国电子产品可靠性与环境试验研究所 | Computer motherboard method of testing and device |
| CN108917979A (en) * | 2018-03-27 | 2018-11-30 | 浙江研祥智能科技有限公司 | Sample test method, apparatus, computer equipment and storage medium |
| CN111190407A (en) * | 2019-12-26 | 2020-05-22 | 中国家用电器研究院 | Detection method for rapidly exciting and positioning faults in HALT test based on software self-inspection |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5715180A (en) * | 1995-10-16 | 1998-02-03 | Ford Motor Co. | Method to reduce sample size in accelerated reliability verification tests |
| CN101639488A (en) * | 2009-08-22 | 2010-02-03 | 中北大学 | Test method of micro-accelerometer reliability intensifying test |
| CN101900788A (en) * | 2009-05-25 | 2010-12-01 | 北京圣涛平试验工程技术研究院有限责任公司 | Test method for detecting reliability of product |
| CN102426089A (en) * | 2011-10-11 | 2012-04-25 | 三一重机有限公司 | Method and device for realizing quick stress screen of product |
| CN102954865A (en) * | 2011-08-26 | 2013-03-06 | 上海移远通信技术有限公司 | Highly accelerated life testing system for electronic products and method using same |
-
2013
- 2013-09-16 CN CN2013104210131A patent/CN103471795A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5715180A (en) * | 1995-10-16 | 1998-02-03 | Ford Motor Co. | Method to reduce sample size in accelerated reliability verification tests |
| CN101900788A (en) * | 2009-05-25 | 2010-12-01 | 北京圣涛平试验工程技术研究院有限责任公司 | Test method for detecting reliability of product |
| CN101639488A (en) * | 2009-08-22 | 2010-02-03 | 中北大学 | Test method of micro-accelerometer reliability intensifying test |
| CN102954865A (en) * | 2011-08-26 | 2013-03-06 | 上海移远通信技术有限公司 | Highly accelerated life testing system for electronic products and method using same |
| CN102426089A (en) * | 2011-10-11 | 2012-04-25 | 三一重机有限公司 | Method and device for realizing quick stress screen of product |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106932294A (en) * | 2017-03-22 | 2017-07-07 | 中国电子产品可靠性与环境试验研究所 | Computer motherboard method of testing and device |
| CN108917979A (en) * | 2018-03-27 | 2018-11-30 | 浙江研祥智能科技有限公司 | Sample test method, apparatus, computer equipment and storage medium |
| CN111190407A (en) * | 2019-12-26 | 2020-05-22 | 中国家用电器研究院 | Detection method for rapidly exciting and positioning faults in HALT test based on software self-inspection |
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Application publication date: 20131225 |