CN101894898A - LED and package method thereof - Google Patents
LED and package method thereof Download PDFInfo
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- CN101894898A CN101894898A CN 201010200780 CN201010200780A CN101894898A CN 101894898 A CN101894898 A CN 101894898A CN 201010200780 CN201010200780 CN 201010200780 CN 201010200780 A CN201010200780 A CN 201010200780A CN 101894898 A CN101894898 A CN 101894898A
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Abstract
The invention discloses an LED and a packaging method thereof. The packaging method comprises the following steps: an LED blue wafer is fixed on a stacker by an adhesive; the anode and cathode of the LED blue wafer are respectively connected with the positive electrode and negative electrode of the stacker; a layer of fluorescent glue is arranged on the surface of the LED blue wafer; a diffusant or diffusion powder is mixed with epoxy resin by weight ratio of 10:0.3 to 10:3 to form an external sealing compound; and the surface of the LED blue wafer provided with the fluorescent glue is packaged by using the external sealing compound. In the LED of the invention, the diffusant is added into the external sealing compound arranged outside the LED wafer, mineral substances contained in the diffusant can uniform the light emitted by the LED blue wafer and the external sealing compound, which is formed by mixing the diffusant with epoxy resin according to a certain ratio can play the role of diffuse reflection, therefore the light emitted by the LED blue wafer can be evenly radiated by the external sealing compound, and the light emitted by the whole LED has unanimous uniformity.
Description
Technical field
The present invention relates to a kind of lamp, particularly relate to a kind of LED and method for packing thereof.
Background technology
LED is as a kind of new type light source, rely on it low power consuming, pollution-free, volume is little and advantage such as flexibly easy to use, be widely used in building, the small size decorative lighting of solar street light, flashlight, auto lamp, desk lamp, backlight, shot-light, garden, wall lamp, household and collection are decorated with advertisement is the commercial lighting etc. of one.
LED generally all has one and is used for luminous LED wafer, see also Fig. 1, it is the structural representation of existing a kind of LED wafer, comprise a LED wafer 101 and carry the stacker 102 of this LED wafer, the surface of described LED wafer also is packaged with one deck one outer sealing 103, described outer sealing 103 is that fluorescent material and epoxy resin form by necessarily relatively mixing, and described outer sealing 103 is a transparence.
Yet the variable thickness of the outer sealing 103 on the above-mentioned LED of spreading upon wafer 101 surfaces causes, i.e. intrinsic LED wafer 101 height H in the metal cup
2With LED wafer 101 height H admittedly not
1The space in different size, so it is also inconsistent to smear the thickness of outer sealing 103, cause the LED issued light inhomogeneous so easily; And used outer sealing is a transparence, so also can not be beneficial to light and evenly disperse, thereby also cause the LED bright dipping inhomogeneous.
Summary of the invention
The technical problem that the present invention mainly solves provides a kind of LED and method for packing thereof, and that can improve LED goes out light consistency and uniformity.
For solving the problems of the technologies described above, the technical scheme that the present invention adopts is: a kind of LED method for packing is provided, comprises the steps:
A, provide a stacker and a LED blue light wafer, described LED blue light wafer is fixed on the described stacker by bonding agent;
B, be connected with the positive and negative electrode of described stacker respectively with the positive and negative electrode of lead with described LED blue light wafer;
C, on LED blue light wafer surface, one deck fluorescent glue is set;
D, diffusant or spread powder and epoxy resin mixed than 10: 0.3～10: 3 by weight form outer sealing, the described LED blue light wafer surface that is provided with fluorescent glue is encapsulated with described outer sealing.
Wherein, described diffusant mixed the described outer sealing that forms by weight with epoxy resin than 10: 0.5.
Wherein, contain silicon dioxide SiO in described diffusant or the spread powder
2
Wherein, described fluorescent glue is that epoxy resin OXY or silica gel SILICONE and fluorescent material mix.
Wherein, in steps A, comprise step: toast reinforcing after being fixed on described LED blue light wafer on the described stacker by bonding agent.
Wherein, in steps A, described binding agent is elargol or insulating cement.
For solving the problems of the technologies described above, the technical scheme that the present invention adopts is: a kind of LED is provided, the stacker that comprises a LED blue light wafer and this LED blue light wafer of carrying, sealing outside the surface of described LED blue light wafer is provided with in the described stacker, contain diffusant or spread powder in the described outer sealing, described outer sealing was mixed by diffusant or spread powder and epoxy resin in 10: 0.3 in proportion～10: 3.
Wherein, contain SiO in described diffusant or the spread powder
2
Wherein, described outer sealing is creamy white.
Wherein, also be provided with one deck fluorescent glue between described LED blue light wafer and the described outer sealing.
The invention has the beneficial effects as follows: be different from the LED of prior art owing to spread upon the variable thickness of the fluorescent glue of LED blue light wafer surface and cause the situation that causes the LED non-uniform light, LED of the present invention is by being provided with diffusant in the outer sealing of described LED wafer outer setting, well disperse evenly by the light that the mineral mass-energy that contains in the diffusant is sent the LED wafer, and described diffusant can play irreflexive effect with the outer sealing that epoxy resin mixes formation by a certain percentage, the light that thereby LED blue light wafer can be sent exhales uniformly by outer sealing, the optical uniformity unanimity that whole LED is sent.
Description of drawings
Fig. 1 is the structural representation of existing LED;
Fig. 2 is the structural representation of LED of the present invention;
Fig. 3 is the diffuse reflection schematic diagram that contains diffusant in the outer sealing of LED among Fig. 2;
Fig. 4 adopts the inventive method to make the process chart of LED.
Embodiment
By describing technology contents of the present invention, structural feature in detail, realized purpose and effect, give explanation below in conjunction with execution mode and conjunction with figs. are detailed.
See also Fig. 2, LED of the present invention comprises a LED blue light wafer 1 and the stacker 2 that carries the spill of this LED blue light wafer 1.Described LED blue light wafer 1 is fixed on by a chemical bonding agent 3 in the stacker 2 of described spill, and in the present embodiment, described bonding agent is elargol or insulating cement.Described LED blue light wafer 1 has positive and negative two electrodes that can switch on, and the stacker 2 of described matrix has positive and negative electrode.With lead 4 positive and negative electrode of described LED blue light wafer 1 is welded with the positive and negative electrode of described stacker 2 respectively.The surface of described LED blue light wafer 1 is coated with one deck fluorescent glue 5, and described fluorescent glue 5 is to be mixed by a certain percentage by fluorescent material and glue to form, and described glue is epoxy resin OXY or silica gel SILICONE.Described fluorescent glue 5 top also is packaged with the outer sealing 6 of one deck, and outer sealing described in the present embodiment is that diffusant or spread powder mixed than 10: 0.3～10: 3 by weight with epoxy resin, contains silicon dioxide SiO in described diffusant or the spread powder
2In the present embodiment, described diffusant mixed the outer sealing that forms by weight with epoxy resin and encapsulates the consistency in look district, back than adopting existing method for packing look district delivery rate can improve 8.2% than 10: 0.5.
See also Fig. 3, contain mineral matter SiO in diffusant that contains in the outer sealing of LED of the present invention or the spread powder
2The light that this mineral mass-energy is sent LED blue light wafer is well dispersed evenly, and described epoxy resin or silica gel mix the outer sealing that forms and are creamy white and can play the diffuse reflection effect with diffusant or spread powder, the light that thereby LED blue light wafer can be sent exhales uniformly by outer sealing, the optical uniformity unanimity that whole LED is sent.
See also Fig. 4, the invention provides a kind of LED method for packing and comprise the steps:
At first, provide the stacker 2 of a LED blue light wafer 1 and a spill, LED blue light wafer is fixed in the stacker 2 of described spill by chemical bonding agent 3, toast and strengthen fixing, described bonding agent is elargol or insulating cement;
Secondly, with lead 4 positive and negative electrode of described LED blue light wafer 1 is welded with the positive and negative electrode of described stacker 2 respectively;
Smear the fluorescent glue 5 that one deck contains a certain proportion of fluorescent material composition on the surface of LED blue light wafer 1 again, toast then its hardened forming, described fluorescent glue 5 is that epoxy resin OXY or silica gel SILICONE mix formation with fluorescent material;
Then, diffusant or spread powder were mixed the outer sealing 6 of formation in 10: 0.3 in proportion～10: 3 with epoxy resin, the coated semi-finished product that have LED blue light wafer 1, stacker 2, fluorescent glue 5 with outer sealing 6 encapsulation, are carried out the baking hardening moulding then;
At last, the finished product after the moulding is toasted once more, cut pin then and peel off, beam split color separation, packing warehouse-in.
Be different from the LED of prior art and cause the situation that causes the LED non-uniform light owing to spread upon the variable thickness of the fluorescent glue of LED blue light wafer surface, LED of the present invention is by being provided with diffusant in the outer sealing 6 of smearing in described LED blue light wafer 1 outside, well disperse evenly by the light that the mineral mass-energy that contains in the diffusant is sent LED blue light wafer 1, and described diffusant can play irreflexive effect with the outer sealing 6 that epoxy resin mixes formation by a certain percentage, the light that thereby LED blue light wafer can be sent exhales uniformly by outer sealing, the optical uniformity unanimity that whole LED is sent.
In sum, the light-emitting uniformity unanimity of the LED that use method for packing of the present invention is made, bright dipping is effective.
The above only is embodiments of the invention; be not so limit claim of the present invention; every equivalent structure or equivalent flow process conversion that utilizes specification of the present invention and accompanying drawing content to be done; or directly or indirectly be used in other relevant technical fields, all in like manner be included in the scope of patent protection of the present invention.
Claims (9)
1. the method for packing of a LED is characterized in that, comprises the steps:
A, provide a stacker and a LED blue light wafer, described LED blue light wafer is fixed on the described stacker by bonding agent;
B, be connected with the positive and negative electrode of described stacker respectively with the positive and negative electrode of lead with described LED blue light wafer;
C, on LED blue light wafer surface, one deck fluorescent glue is set;
D, diffusant or spread powder and epoxy resin mixed than 10: 0.3～10: 3 by weight form outer sealing, the described LED blue light wafer surface that is provided with fluorescent glue is encapsulated with described outer sealing.
2. the method for packing of LED according to claim 1 is characterized in that, described diffusant mixed the described outer sealing that forms by weight with epoxy resin than 10: 0.5.
The method for packing of 3 LED according to claim 1 is characterized in that, contains silicon dioxide SiO in described diffusant or the spread powder
2
4. the method for packing of LED according to claim 1 is characterized in that, described fluorescent glue is that epoxy resin OXY or silica gel SILICONE and fluorescent material mix.
5. the method for packing of LED according to claim 1 is characterized in that, comprises step in steps A: toast reinforcing after being fixed on described LED blue light wafer on the described stacker by bonding agent.
6. the method for packing of LED according to claim 1 is characterized in that, in steps A, described binding agent is elargol or insulating cement.
7. LED, the stacker that comprises a LED blue light wafer and this LED blue light wafer of carrying, it is characterized in that, sealing outside the surface of described LED blue light wafer is provided with in the described stacker, contain diffusant or spread powder in the described outer sealing, described outer sealing was mixed than 10: 0.3～10: 3 with epoxy resin by weight by diffusant or spread powder.
8. LED according to claim 7 is characterized in that, contains SiO in described diffusant or the spread powder
2
9. LED according to claim 7 is characterized in that, described outer sealing is creamy white.
10. LED according to claim 7 is characterized in that, also is provided with one deck fluorescent glue between described LED blue light wafer and the described outer sealing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010200780 CN101894898B (en) | 2010-06-13 | 2010-06-13 | LED and package method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010200780 CN101894898B (en) | 2010-06-13 | 2010-06-13 | LED and package method thereof |
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| Publication Number | Publication Date |
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| CN101894898A true CN101894898A (en) | 2010-11-24 |
| CN101894898B CN101894898B (en) | 2013-07-17 |
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| CN 201010200780 Active CN101894898B (en) | 2010-06-13 | 2010-06-13 | LED and package method thereof |
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Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102101999A (en) * | 2010-12-13 | 2011-06-22 | 杭州彩虹光电有限公司 | LED external sealant and preparation method thereof |
| CN102120212A (en) * | 2010-12-09 | 2011-07-13 | 惠州雷曼光电科技有限公司 | LED and dispensing method of LED fluorescent powder |
| CN102185079A (en) * | 2011-03-31 | 2011-09-14 | 惠州雷曼光电科技有限公司 | Light Emitting Diode (LED) and manufacturing process thereof |
| CN102751394A (en) * | 2011-04-19 | 2012-10-24 | 陈可 | LED (light emitting diode) pixel tube light distribution process and novel LED pixel tube |
| CN103515512A (en) * | 2012-06-29 | 2014-01-15 | 四川柏狮光电技术有限公司 | LED secondary packing process and LED pixel tube manufactured through process |
| CN104017526A (en) * | 2014-05-29 | 2014-09-03 | 绍兴光彩显示技术有限公司 | Fluorescent-powder dispensing glue for white-light SMD nixie tube and application method thereof |
| CN106025045A (en) * | 2016-07-14 | 2016-10-12 | 江门吉华光电精密有限公司 | Multi-light-color phosphor colloid digital tube |
| CN106601897A (en) * | 2017-01-10 | 2017-04-26 | 蔡艺伟 | Method for manufacturing chip on board (COB) light source with white adhesive surface package |
| CN107331750A (en) * | 2016-12-29 | 2017-11-07 | 辽宁东方普照科技有限公司 | A kind of bimodal small power LED street lamp lamp bead of single-chip |
| US10373535B2 (en) | 2013-12-31 | 2019-08-06 | Ultravision Technologies, Llc | Modular display panel |
| US10706770B2 (en) | 2014-07-16 | 2020-07-07 | Ultravision Technologies, Llc | Display system having module display panel with circuitry for bidirectional communication |
| US10871932B2 (en) | 2013-12-31 | 2020-12-22 | Ultravision Technologies, Llc | Modular display panels |
Families Citing this family (1)
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| CN107887481A (en) * | 2017-11-09 | 2018-04-06 | 江苏稳润光电科技有限公司 | The preparation method and white light LEDs product of a kind of consistent white light LEDs product of hot spot |
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| WO2010041968A2 (en) * | 2008-10-06 | 2010-04-15 | Perkinelmer Optoelectronics Philippines, Ltd. | Nanocomposites for optoelectronic devices |
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| US20070013057A1 (en) * | 2003-05-05 | 2007-01-18 | Joseph Mazzochette | Multicolor LED assembly with improved color mixing |
| US20090050911A1 (en) * | 2007-08-24 | 2009-02-26 | Cree, Inc. | Light emitting device packages using light scattering particles of different size |
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Cited By (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102120212A (en) * | 2010-12-09 | 2011-07-13 | 惠州雷曼光电科技有限公司 | LED and dispensing method of LED fluorescent powder |
| CN102120212B (en) * | 2010-12-09 | 2013-07-17 | 惠州雷曼光电科技有限公司 | LED and dispensing method of LED fluorescent powder |
| CN102101999A (en) * | 2010-12-13 | 2011-06-22 | 杭州彩虹光电有限公司 | LED external sealant and preparation method thereof |
| CN102185079A (en) * | 2011-03-31 | 2011-09-14 | 惠州雷曼光电科技有限公司 | Light Emitting Diode (LED) and manufacturing process thereof |
| CN102185079B (en) * | 2011-03-31 | 2013-03-20 | 惠州雷曼光电科技有限公司 | Light Emitting Diode (LED) and manufacturing process thereof |
| CN102751394A (en) * | 2011-04-19 | 2012-10-24 | 陈可 | LED (light emitting diode) pixel tube light distribution process and novel LED pixel tube |
| CN103515512A (en) * | 2012-06-29 | 2014-01-15 | 四川柏狮光电技术有限公司 | LED secondary packing process and LED pixel tube manufactured through process |
| US10373535B2 (en) | 2013-12-31 | 2019-08-06 | Ultravision Technologies, Llc | Modular display panel |
| US10871932B2 (en) | 2013-12-31 | 2020-12-22 | Ultravision Technologies, Llc | Modular display panels |
| US10540917B2 (en) | 2013-12-31 | 2020-01-21 | Ultravision Technologies, Llc | Modular display panel |
| US10410552B2 (en) | 2013-12-31 | 2019-09-10 | Ultravision Technologies, Llc | Modular display panel |
| US10380925B2 (en) | 2013-12-31 | 2019-08-13 | Ultravision Technologies, Llc | Modular display panel |
| CN104017526B (en) * | 2014-05-29 | 2016-04-27 | 绍兴光彩显示技术有限公司 | A kind of white light surface-mount digital tube fluorescent material point glue glue and using method thereof |
| CN104017526A (en) * | 2014-05-29 | 2014-09-03 | 绍兴光彩显示技术有限公司 | Fluorescent-powder dispensing glue for white-light SMD nixie tube and application method thereof |
| US10706770B2 (en) | 2014-07-16 | 2020-07-07 | Ultravision Technologies, Llc | Display system having module display panel with circuitry for bidirectional communication |
| CN106025045A (en) * | 2016-07-14 | 2016-10-12 | 江门吉华光电精密有限公司 | Multi-light-color phosphor colloid digital tube |
| CN107331750A (en) * | 2016-12-29 | 2017-11-07 | 辽宁东方普照科技有限公司 | A kind of bimodal small power LED street lamp lamp bead of single-chip |
| CN106601897B (en) * | 2017-01-10 | 2018-11-13 | 蔡艺伟 | The production method of the white glue surface of integrated optical source COB encapsulation on a kind of plate |
| CN106601897A (en) * | 2017-01-10 | 2017-04-26 | 蔡艺伟 | Method for manufacturing chip on board (COB) light source with white adhesive surface package |
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|---|---|
| CN101894898B (en) | 2013-07-17 |
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