CN102101999A - LED external sealant and preparation method thereof - Google Patents
LED external sealant and preparation method thereof Download PDFInfo
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- CN102101999A CN102101999A CN2010105832345A CN201010583234A CN102101999A CN 102101999 A CN102101999 A CN 102101999A CN 2010105832345 A CN2010105832345 A CN 2010105832345A CN 201010583234 A CN201010583234 A CN 201010583234A CN 102101999 A CN102101999 A CN 102101999A
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- epoxy resin
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- led
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- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
The invention relates to an LED external sealant and a preparation method thereof. The external sealant is prepared from epoxy resin, a curing agent for epoxy resin and diffusion powder; and a weight ratio of the epoxy resin to the curing agent for epoxy resin to the diffusion powder is 1:1:0.0025. The preparation method comprises the following steps of: mixing the epoxy resin and the diffusion powder at the temperature of between 25 and 45DEG C, stirring for 1.5 to 2 hours, adding the curing agent for epoxy resin, and stirring at normal temperature for 1 to 1.5 hours; or mixing the curing agent for epoxy resin and the diffusion powder at normal temperature, stirring for 1 to 1.5 hours, adding the epoxy resin, and stirring at the temperature of between 20 and 30 DEG C for 1 to 1.5 hours. The invention has the advantages that: the external sealant makes light emitted by a chip excited fluorescent powder reflected irregularly, so that the integral luminescence is uniform, light spots are concentrated and light decline is reduced.
Description
Technical field
The present invention relates to outer sealing of a kind of LED and compound method thereof.
Background technology
LED is as new type light source, because of its have reduce power consumption, pollution-free, volume is little, advantage such as flexibly easy to use, be widely used in building, the small area decorative illumination of solar street light, torch light, auto lamp, desk lamp, backlight, shot-light, garden, wall lamp, household, and collection is decorated the commercial lighting with the advertisement position one.
LED of the prior art has dual mode basically, and a kind of is many chip types, and a kind of is the single-chip type.The former can with three kinds of red, green, blues or wherein two kinds of LED wafer package make it luminous simultaneously together; The latter be blue, green or red LED wafer separately as light source, the cooperation fluorescent glue is luminous.At above-mentioned two kinds of LED forms, transparent silica gel or epoxy resin glue are all adopted in its outer sealing, and after LED lighted, output beam quality was poor, cause hot spot greatly and to be concentrated, and produce aperture, human eye is produced incompatiblely must feel.
Summary of the invention
Purpose of the present invention is exactly the weak point in the background technology, and outer sealing of a kind of LED and compound method thereof are provided.
For achieving the above object, the present invention adopts the outer sealing of following technical scheme: LED, and described outer sealing is configured to by Resins, epoxy, hardener for epoxy resin and spread powder, and the weight ratio of Resins, epoxy, hardener for epoxy resin and spread powder is 1:1:0.0025.
For a kind of optimization of the present invention, Resins, epoxy and spread powder are mixed under 25 ℃ ~ 45 ℃ temperature, stirred then 1.5 ~ 2 hours, add hardener for epoxy resin, stirred at normal temperatures then 1 ~ 1.5 hour; Perhaps hardener for epoxy resin and spread powder are mixed at normal temperatures, stirred then 1 ~ 1.5 hour, add Resins, epoxy, under 20 ℃ ~ 30 ℃ temperature, stirred 1 ~ 1.5 hour then.
The present invention compares with background technology, and this outer sealing has the light that allows the chip excitated fluorescent powder send and carries out random reflection, makes the luminous even of integral body, and hot spot is concentrated, and reduces light decay simultaneously.
Embodiment
The outer sealing of embodiment 1:LED, it is configured to by Resins, epoxy, hardener for epoxy resin and spread powder, and the weight ratio of Resins, epoxy, hardener for epoxy resin and spread powder is 1:1:0.0025.
The compound method of the outer sealing of embodiment 2:LED is mixed Resins, epoxy and spread powder under 30 ℃ temperature, stirred then 1 hour, adds hardener for epoxy resin, stirs at normal temperatures then 1.5 hours.
The compound method of the outer sealing of embodiment 3:LED is mixed Resins, epoxy and spread powder under 26 ℃ temperature, stirred then 1.7 hours, adds hardener for epoxy resin, stirs at normal temperatures then 1.5 hours.
The compound method of the outer sealing of embodiment 4:LED is mixed hardener for epoxy resin and spread powder at normal temperatures, stirs then 1 hour, adds Resins, epoxy, stirs 1.5 hours under 20 ℃ temperature then.
The compound method of the outer sealing of embodiment 5:LED is mixed hardener for epoxy resin and spread powder at normal temperatures, stirs then 1.5 hours, adds Resins, epoxy, stirs 1 hour under 29 ℃ temperature then.
What need understand is: though present embodiment is to the present invention's detailed explanation of contrasting; but these explanations, just to simple declaration of the present invention, rather than limitation of the present invention; any innovation and creation that do not exceed in the connotation of the present invention all fall within the scope of protection of the present invention.
Claims (2)
1. outer sealing of LED, it is characterized in that: described outer sealing is configured to by Resins, epoxy, hardener for epoxy resin and spread powder, and the weight ratio of Resins, epoxy, hardener for epoxy resin and spread powder is 1:1:0.0025.
2. the compound method of the outer sealing of LED is characterized in that: Resins, epoxy and spread powder are mixed under 25 ℃ ~ 45 ℃ temperature, stirred then 1.5 ~ 2 hours, add hardener for epoxy resin, stirred at normal temperatures then 1 ~ 1.5 hour; Perhaps hardener for epoxy resin and spread powder are mixed at normal temperatures, stirred then 1 ~ 1.5 hour, add Resins, epoxy, under 20 ℃ ~ 30 ℃ temperature, stirred 1 ~ 1.5 hour then.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105832345A CN102101999A (en) | 2010-12-13 | 2010-12-13 | LED external sealant and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105832345A CN102101999A (en) | 2010-12-13 | 2010-12-13 | LED external sealant and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102101999A true CN102101999A (en) | 2011-06-22 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010105832345A Pending CN102101999A (en) | 2010-12-13 | 2010-12-13 | LED external sealant and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102101999A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103400923A (en) * | 2013-07-31 | 2013-11-20 | 深圳市天电光电科技有限公司 | LED (light emitting diode) packaging structure and LED packaging method |
| CN103779455A (en) * | 2014-01-24 | 2014-05-07 | 南通苏禾车灯配件有限公司 | Sealing method for LED vehicle lamp |
| CN104017526A (en) * | 2014-05-29 | 2014-09-03 | 绍兴光彩显示技术有限公司 | Fluorescent-powder dispensing glue for white-light SMD nixie tube and application method thereof |
| CN105400470A (en) * | 2015-12-01 | 2016-03-16 | 杭州新湖电子有限公司 | Packaging adhesive for LED white-light nixie tube and preparation method of packaging adhesive |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101894898A (en) * | 2010-06-13 | 2010-11-24 | 深圳雷曼光电科技股份有限公司 | LED and package method thereof |
| CN202012756U (en) * | 2010-11-30 | 2011-10-19 | 浙江彩虹光电有限公司 | Novel LED lamp bulb |
-
2010
- 2010-12-13 CN CN2010105832345A patent/CN102101999A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101894898A (en) * | 2010-06-13 | 2010-11-24 | 深圳雷曼光电科技股份有限公司 | LED and package method thereof |
| CN202012756U (en) * | 2010-11-30 | 2011-10-19 | 浙江彩虹光电有限公司 | Novel LED lamp bulb |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103400923A (en) * | 2013-07-31 | 2013-11-20 | 深圳市天电光电科技有限公司 | LED (light emitting diode) packaging structure and LED packaging method |
| CN103779455A (en) * | 2014-01-24 | 2014-05-07 | 南通苏禾车灯配件有限公司 | Sealing method for LED vehicle lamp |
| CN103779455B (en) * | 2014-01-24 | 2016-08-24 | 南通苏禾车灯配件有限公司 | A kind of glue sealing method of LED car lamp |
| CN104017526A (en) * | 2014-05-29 | 2014-09-03 | 绍兴光彩显示技术有限公司 | Fluorescent-powder dispensing glue for white-light SMD nixie tube and application method thereof |
| CN104017526B (en) * | 2014-05-29 | 2016-04-27 | 绍兴光彩显示技术有限公司 | A kind of white light surface-mount digital tube fluorescent material point glue glue and using method thereof |
| CN105400470A (en) * | 2015-12-01 | 2016-03-16 | 杭州新湖电子有限公司 | Packaging adhesive for LED white-light nixie tube and preparation method of packaging adhesive |
| CN105400470B (en) * | 2015-12-01 | 2018-03-09 | 杭州新湖电子有限公司 | A kind of LED white-light nixie tubes packaging plastic and preparation method thereof |
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| PB01 | Publication | ||
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| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20110622 |