CN101893401A - 平板式热管及其制造方法 - Google Patents
平板式热管及其制造方法 Download PDFInfo
- Publication number
- CN101893401A CN101893401A CN200910302451.XA CN200910302451A CN101893401A CN 101893401 A CN101893401 A CN 101893401A CN 200910302451 A CN200910302451 A CN 200910302451A CN 101893401 A CN101893401 A CN 101893401A
- Authority
- CN
- China
- Prior art keywords
- loading plate
- support column
- plate heat
- heat tube
- flat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2225/00—Reinforcing means
- F28F2225/04—Reinforcing means for conduits
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2240/00—Spacing means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/4935—Heat exchanger or boiler making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49826—Assembling or joining
- Y10T29/49888—Subsequently coating
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
Claims (10)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200910302451.XA CN101893401B (zh) | 2009-05-19 | 2009-05-19 | 平板式热管及其制造方法 |
US12/534,880 US8377214B2 (en) | 2009-05-19 | 2009-08-04 | Vapor chamber and method for manufacturing the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200910302451.XA CN101893401B (zh) | 2009-05-19 | 2009-05-19 | 平板式热管及其制造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101893401A true CN101893401A (zh) | 2010-11-24 |
CN101893401B CN101893401B (zh) | 2013-02-20 |
Family
ID=43102668
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200910302451.XA Expired - Fee Related CN101893401B (zh) | 2009-05-19 | 2009-05-19 | 平板式热管及其制造方法 |
Country Status (2)
Country | Link |
---|---|
US (1) | US8377214B2 (zh) |
CN (1) | CN101893401B (zh) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102589333A (zh) * | 2011-01-18 | 2012-07-18 | 奇鋐科技股份有限公司 | 薄型热管结构及其制造方法 |
US20140082943A1 (en) * | 2011-01-18 | 2014-03-27 | Asia Vital Components Co., Ltd. | Thin heat pipe structure and method of manufacturing same |
CN108204754A (zh) * | 2016-12-20 | 2018-06-26 | 北京丰联奥睿科技有限公司 | 一种导热板 |
CN109405608A (zh) * | 2018-03-20 | 2019-03-01 | 奇鋐科技股份有限公司 | 散热装置的中间件及其散热装置 |
CN111811306A (zh) * | 2019-04-11 | 2020-10-23 | 讯凯国际股份有限公司 | 散热装置及其制造方法 |
US11131508B2 (en) | 2018-03-19 | 2021-09-28 | Asia Vital Components Co., Ltd. | Middle member of heat dissipation device and the heat dissipation device |
CN113686186A (zh) * | 2018-12-13 | 2021-11-23 | 荣耀终端有限公司 | 一种薄型热管、薄型热管的制作方法及电子设备 |
CN114739220A (zh) * | 2022-04-25 | 2022-07-12 | 恒为科技(上海)股份有限公司 | 一种均温板 |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9163883B2 (en) | 2009-03-06 | 2015-10-20 | Kevlin Thermal Technologies, Inc. | Flexible thermal ground plane and manufacturing the same |
CN101988811B (zh) * | 2009-08-05 | 2013-07-03 | 富准精密工业(深圳)有限公司 | 平板式热管及其制造方法 |
CN102003904B (zh) * | 2009-09-03 | 2013-08-07 | 富准精密工业(深圳)有限公司 | 平板式热管及其制造方法 |
TWM383720U (en) * | 2009-12-08 | 2010-07-01 | Cooler Master Co Ltd | Heat dissipation plate |
TWM405558U (en) * | 2011-01-18 | 2011-06-11 | Asia Vital Components Co Ltd | Structure improvement of heat pipe |
TW201248108A (en) * | 2011-05-31 | 2012-12-01 | Asia Vital Components Co Ltd | Vapor chamber structure and manufacturing method thereof |
CN102651331A (zh) * | 2011-06-14 | 2012-08-29 | 京东方科技集团股份有限公司 | 基板托盘及柔性电子器件制造方法 |
US9685393B2 (en) | 2013-03-04 | 2017-06-20 | The Hong Kong University Of Science And Technology | Phase-change chamber with patterned regions of high and low affinity to a phase-change medium for electronic device cooling |
US10731925B2 (en) * | 2014-09-17 | 2020-08-04 | The Regents Of The University Of Colorado, A Body Corporate | Micropillar-enabled thermal ground plane |
US11598594B2 (en) | 2014-09-17 | 2023-03-07 | The Regents Of The University Of Colorado | Micropillar-enabled thermal ground plane |
CN104713395B (zh) * | 2015-02-11 | 2017-01-04 | 上海卫星装备研究所 | 高耐压性平板热管及其加工方法 |
US10352626B2 (en) * | 2016-12-14 | 2019-07-16 | Shinko Electric Industries Co., Ltd. | Heat pipe |
WO2018198372A1 (ja) * | 2017-04-28 | 2018-11-01 | 株式会社村田製作所 | ベーパーチャンバー |
US20190285357A1 (en) * | 2018-03-19 | 2019-09-19 | Asia Vital Components Co., Ltd. | Middle member of heat dissipation device and the heat dissipation device |
US11219940B2 (en) * | 2018-10-03 | 2022-01-11 | Asia Vital Components Co., Ltd. | Manufacturing method of middle member structure |
EP3798564B1 (en) | 2019-09-27 | 2022-08-03 | ABB Schweiz AG | Vapor chamber for cooling an electronic component |
JP7463557B2 (ja) | 2020-05-14 | 2024-04-08 | シグニファイ ホールディング ビー ヴィ | べーパーチャンバ要素 |
WO2021258028A1 (en) | 2020-06-19 | 2021-12-23 | Kelvin Thermal Technologies, Inc. | Folding thermal ground plane |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2362092Y (zh) * | 1999-03-22 | 2000-02-02 | 李嘉豪 | 超薄热板结构 |
CN1504715A (zh) * | 2002-12-03 | 2004-06-16 | 徐惠群 | 热管成型结构 |
TWI284190B (en) * | 2004-11-11 | 2007-07-21 | Taiwan Microloops Corp | Bendable heat spreader with metallic screens based micro-structure and method for fabricating same |
-
2009
- 2009-05-19 CN CN200910302451.XA patent/CN101893401B/zh not_active Expired - Fee Related
- 2009-08-04 US US12/534,880 patent/US8377214B2/en not_active Expired - Fee Related
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102589333A (zh) * | 2011-01-18 | 2012-07-18 | 奇鋐科技股份有限公司 | 薄型热管结构及其制造方法 |
US20140082943A1 (en) * | 2011-01-18 | 2014-03-27 | Asia Vital Components Co., Ltd. | Thin heat pipe structure and method of manufacturing same |
CN102589333B (zh) * | 2011-01-18 | 2014-06-04 | 奇鋐科技股份有限公司 | 薄型热管结构及其制造方法 |
CN108204754A (zh) * | 2016-12-20 | 2018-06-26 | 北京丰联奥睿科技有限公司 | 一种导热板 |
US11131508B2 (en) | 2018-03-19 | 2021-09-28 | Asia Vital Components Co., Ltd. | Middle member of heat dissipation device and the heat dissipation device |
CN109405608A (zh) * | 2018-03-20 | 2019-03-01 | 奇鋐科技股份有限公司 | 散热装置的中间件及其散热装置 |
CN113686186A (zh) * | 2018-12-13 | 2021-11-23 | 荣耀终端有限公司 | 一种薄型热管、薄型热管的制作方法及电子设备 |
CN111811306A (zh) * | 2019-04-11 | 2020-10-23 | 讯凯国际股份有限公司 | 散热装置及其制造方法 |
CN114739220A (zh) * | 2022-04-25 | 2022-07-12 | 恒为科技(上海)股份有限公司 | 一种均温板 |
Also Published As
Publication number | Publication date |
---|---|
CN101893401B (zh) | 2013-02-20 |
US20100294200A1 (en) | 2010-11-25 |
US8377214B2 (en) | 2013-02-19 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: JIANGSU HUAYU PRINTING AND COATING EQUIPMENT GROUP Free format text: FORMER OWNER: BEIJING ZHONGCAI WYSE EDUCATION TECHNOLOGY CO., LTD. Effective date: 20141120 Owner name: BEIJING ZHONGCAI WYSE EDUCATION TECHNOLOGY CO., LT Free format text: FORMER OWNER: FUHUAI (SHENZHENG) PRECISION INDUSTRY CO., LTD. Effective date: 20141120 Free format text: FORMER OWNER: HONGZHUN PRECISION INDUSTRY CO., LTD. Effective date: 20141120 |
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C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 518109 SHENZHEN, GUANGDONG PROVINCE TO: 100083 HAIDIAN, BEIJING Free format text: CORRECT: ADDRESS; FROM: 100083 HAIDIAN, BEIJING TO: 226324 NANTONG, JIANGSU PROVINCE |
|
TR01 | Transfer of patent right |
Effective date of registration: 20141120 Address after: 226324, Jiangsu, Nantong province Tongzhou District two a town, Yuan Village Patentee after: JIANGSU HUAYU PRINTING & COATING EQUIPMENT Co.,Ltd. Address before: 100083 Beijing Haidian District Zhongguancun Road No. 18 smartfortune International Building B706 Patentee before: Beijing Zhongcai Wyse Education Technology Co.,Ltd. Effective date of registration: 20141120 Address after: 100083 Beijing Haidian District Zhongguancun Road No. 18 smartfortune International Building B706 Patentee after: Beijing Zhongcai Wyse Education Technology Co.,Ltd. Address before: 518109 Guangdong city of Shenzhen province Baoan District Longhua Town Industrial Zone tabulaeformis tenth East Ring Road No. 2 two Patentee before: Fuzhun Precision Industry (Shenzhen) Co.,Ltd. Patentee before: Foxconn Technology Co.,Ltd. |
|
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130220 Termination date: 20180519 |
|
CF01 | Termination of patent right due to non-payment of annual fee |