CN101866865A - Packaging die and packaging method thereof - Google Patents
Packaging die and packaging method thereof Download PDFInfo
- Publication number
- CN101866865A CN101866865A CN200910106720A CN200910106720A CN101866865A CN 101866865 A CN101866865 A CN 101866865A CN 200910106720 A CN200910106720 A CN 200910106720A CN 200910106720 A CN200910106720 A CN 200910106720A CN 101866865 A CN101866865 A CN 101866865A
- Authority
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- China
- Prior art keywords
- die
- counterdie
- storage card
- glue
- plastic squeeze
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000000034 method Methods 0.000 title claims abstract description 24
- 238000004806 packaging method and process Methods 0.000 title abstract 6
- 229920005989 resin Polymers 0.000 claims abstract description 28
- 239000011347 resin Substances 0.000 claims abstract description 28
- 238000002347 injection Methods 0.000 claims abstract description 20
- 239000007924 injection Substances 0.000 claims abstract description 20
- 239000000463 material Substances 0.000 claims abstract description 15
- 239000004033 plastic Substances 0.000 claims description 27
- 238000003860 storage Methods 0.000 claims description 25
- 238000012856 packing Methods 0.000 claims description 13
- 229910000831 Steel Inorganic materials 0.000 claims description 4
- 239000003822 epoxy resin Substances 0.000 claims description 4
- 229920000647 polyepoxide Polymers 0.000 claims description 4
- 239000010959 steel Substances 0.000 claims description 4
- 238000010257 thawing Methods 0.000 claims description 4
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 4
- 239000003292 glue Substances 0.000 claims description 3
- 238000012423 maintenance Methods 0.000 claims description 3
- 238000000465 moulding Methods 0.000 claims description 3
- 238000007711 solidification Methods 0.000 claims description 3
- 230000008023 solidification Effects 0.000 claims description 3
- 239000011148 porous material Substances 0.000 abstract description 3
- 239000000853 adhesive Substances 0.000 abstract 6
- 230000001070 adhesive effect Effects 0.000 abstract 6
- 238000005538 encapsulation Methods 0.000 description 5
- 239000002775 capsule Substances 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 230000003245 working effect Effects 0.000 description 1
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- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
The invention relates to a packaging die and a packaging method. The die is used for packaging a memory card and comprises an upper die and a lower die. The upper die comprises an upper die plate and an upper die core fixed on the upper die plate. The lower die comprises a lower die core, a lower die holder, an injection device and a lower bottom plate. The lower die core is fixed on the lower die holder. The injection device and the lower die holder are arranged on the lower bottom plate. The lower die core is provided with a plurality of sleeves for placing resin material cakes. The positions on the upper die core corresponding to the sleeves are provided with runners. The injection device comprises a plurality of adhesive extruding rods with adhesive extruding heads and an adhesive extruding seat for installing the adhesive extruding rods. The adhesive extruding heads are in fit with the sleeves. The method uses the die to package the memory card. The packaging die of the invention adopts a plurality of material barrels and a plurality of adhesive extruding rods matched with the material barrels, shortens the length of the runners of the die and avoids conditions that the resin generates bubbles, pores, is not full filled and the like in the flowing process.
Description
Technical field
The present invention relates to encapsulating mould and method for packing, more particularly, relate to a kind of encapsulating mould and method for packing that is used for storage card package.
Background technology
Storage card such as ultra-thin USB storage card, Micro SD card and RS-MMC (Multi Media Card) card generally adopts the single head encapsulating mould to encapsulate.This single head encapsulating mould is commonly referred to the single cylinder mould, and it has advantages such as encapsulation is big in batches, packing forms is simple.But this mould also has its intrinsic shortcoming, it has only a barrel, resin flows to die cavity from the center of mould by runner, because this mould generally has a plurality of diaphragm capsules, such as 4～8 diaphragm capsules, successively fill in the process of die cavity from the near to the remote at resin, can be by viscous state to glassy transition, mobile performance is variation gradually, cavity pressure loss in flow field end is big, resin forming condition in the die cavity is more abominable, therefore occurs bubble easily at the product away from barrel, pore, annotate discontented, spun gold dashes phenomenons such as curved rate exceeds standard, and the mould-forming process adjusting range is narrow.Because runner is long, can cause the resin utilance low in addition, manufacturing cost increases.
Summary of the invention
The technical problem to be solved in the present invention is, the defective at above-mentioned single injection head encapsulating mould encapsulating products difficult quality guarantee of prior art provides a kind of package quality is good, rate of finished products is high storage card package mould and a kind of method for packing.
One of purpose of the present invention provides an encapsulating mould: construct a kind of encapsulating mould, be used to encapsulate storage card, comprise upper die and lower die; Described patrix comprises cope match-plate pattern and is fixed on upper cores on the cope match-plate pattern; Described counterdie comprises die, die shoe, injection device, lower shoe down, and described die down is fixed on the die shoe, and described injection device and described die shoe are arranged on the lower shoe; It is characterized in that described die down is provided with a plurality of sleeves that are used to put resin material cake, is provided with runner with described sleeve correspondence position on the described upper cores; Described injection device comprises a plurality of glue-extruding rods that have the plastic squeeze head, and the plastic squeeze seat that is used to install glue-extruding rod, and described plastic squeeze head and described sleeve are suitable.
In a kind of encapsulating mould of the present invention, be provided with the spring that is used to make the injecting glue isostasy between described glue-extruding rod and the plastic squeeze seat.
In a kind of encapsulating mould of the present invention, described patrix is provided with guide pin bushing, and described counterdie is provided with the reference column that cooperates with described guide pin bushing.
In a kind of encapsulating mould of the present invention, described upper cores is provided with the patrix thimble that is used to eject shaped article, and described die down is provided with the counterdie thimble that is used to eject shaped article.
In a kind of encapsulating mould of the present invention, described sleeve is the wolfram steel sleeve.
In a kind of encapsulating mould of the present invention, described die down is provided with the pilot pin that is used for fixing storage card PCB framework.
In a kind of encapsulating mould of the present invention, the die cavity of described upper cores is shaped as the shape of Micro SD card, RS-MMC card or USB storage card.
Another object of the present invention provides a kind of method for packing, is used to encapsulate storage card, and this method may further comprise the steps:
S1, preheated mold make the temperature of mould reach uniform temperature and keep this temperature;
S2, preheating PCB framework, described PCB framework has a plurality of storage card circuit;
S3, a plurality of described PCB frameworks are placed on the die face of counterdie, by the pilot pin on the die face of counterdie with described PCB frame fixation on the die face of counterdie;
S4, resin material cake is dropped into respectively in a plurality of sleeves that are arranged on the counterdie, keep the temperature of mould that the resin material cake in the sleeve is melted;
S5, counterdie move up, with Ccope closing machine;
S6, injection device are clamp-oned runner with the resin of the thawing in the pairing sleeve, make epoxy resin be full of whole die cavity by runner;
S7, maintenance matched moulds state certain hour make the resin solidification moulding.
In method for packing of the present invention, described storage card circuit is USB card, RS-MMC card or Mi croSD card circuit.
In method for packing of the present invention, described injection device comprises the glue-extruding rod that has the plastic squeeze head and is used to install the plastic squeeze seat of described glue-extruding rod, is provided with the spring that is used for balanced plastic squeeze pressure between described glue-extruding rod and the plastic squeeze seat.
Implement a kind of encapsulating mould of the present invention and method for packing, have following beneficial effect:
1, encapsulating mould of the present invention adopts a plurality of barrels, and a plurality of glue-extruding rods that cooperate with barrel, has shortened the flow channel length of mould, the generation of having avoided resin to produce bubble, pore and annotate situations such as being discontented with in flow process;
2, because the shortening of runner has reduced the waste of resin, improved the utilance of resin;
3, be provided with spring between glue-extruding rod and plastic squeeze seat, injection pressure is kept in balance when making injection moulding;
4, used sleeve is the wolfram steel sleeve, has advantages such as the precision high-wear resistance is good.
Description of drawings
The invention will be further described below in conjunction with drawings and Examples, in the accompanying drawing:
Fig. 1 a is the front view of patrix of first embodiment of encapsulating mould of the present invention;
Fig. 1 b is the left view of patrix of first embodiment of encapsulating mould of the present invention;
Fig. 2 a is the front view of counterdie of first embodiment of encapsulating mould of the present invention;
Fig. 2 b is the left view of counterdie of first embodiment of encapsulating mould of the present invention;
Fig. 3 a is the structural representation of first embodiment of encapsulating mould of the present invention;
Fig. 3 b is an A portion enlarged drawing among Fig. 3 a;
Fig. 4 a is the front view of patrix of second embodiment of encapsulating mould of the present invention;
Fig. 4 b is the front view of counterdie of second embodiment of encapsulating mould of the present invention;
Fig. 5 a is the front view of patrix of the 3rd embodiment of encapsulating mould of the present invention;
Fig. 5 b is the front view of counterdie of the 3rd embodiment of encapsulating mould of the present invention.
Embodiment
First embodiment of encapsulating mould of the present invention is the encapsulating mould of USB storage card, and as described in Fig. 3 a, this mould comprises upper die and lower die; Patrix comprises cope match-plate pattern 1 and is fixed on upper cores 2 on the cope match-plate pattern; Described counterdie comprises die 3, die shoe 4, injection device, lower shoe 5 down, and described die 3 down is fixed on the die shoe 4, and described injection device and described die shoe 4 are arranged on the lower shoe 5; Referring to Fig. 1 a and Fig. 2 a, following die 3 is provided with a plurality of sleeves 301 that are used to put resin material cake, is provided with runner 201 with described sleeve correspondence position on the upper cores 2; Described injection device comprises a plurality of glue-extruding rods 60 that have plastic squeeze 601, and the plastic squeeze seat 61 that is used to install glue-extruding rod 60, and described plastic squeeze 601 cooperates with described sleeve 301.For resistance to wear and the precision that guarantees sleeve 301, sleeve 301 is the sleeve of wolfram steel material.
Shown in Fig. 1 a and Fig. 2 a, in this example, the following die 3 of this mould is provided with 8 sleeves 301, the upper cores correspondence of patrix is provided with 8 runners 201, runner 201 extends to die cavity 202 to both sides, die cavity 202 has USB storage card shape, 8 * 8=64 USB storage card of every mould design encapsulation.
When guaranteeing a plurality of glue-extruding rod 60 synchronous workings, it is balanced substantially that pressure when making the plastic squeeze injection moulding in each sleeve keeps, avoid the loose problem of filling that causes because of error that the resinites in each sleeve 301 accumulate in, between glue-extruding rod 60 and plastic squeeze seat 61, be provided with the spring 62 that is used to make the injecting glue isostasy.Concrete structure is referring to Fig. 3 a and Fig. 3 b, plastic squeeze seat 61 comprises base 610 and cover plate 611, base 610 is fixed on the plastic squeeze seat slide rail 612, cover plate 611 covers on base 610, glue-extruding rod 60 is connected by a connector 63 with plastic squeeze seat 61, described connector 63 lower ends are provided with flange 630, described base 610 is provided with and is used to place spring 62 blind holes 613, the upper end of connector 63 adjacent springs 63, cover plate 611 is stretched out in the upper end of connector 63, the flange 630 of lower end is stuck on the lower surface of cover plate 611, and connector 63 links together with glue-extruding rod 60.
In the present embodiment, also be provided with the guide pin bushing (not shown) on the patrix, counterdie is provided with the reference column (not shown) that cooperates with guide pin bushing, and during matched moulds, reference column stretches in the guide pin bushing, guarantees the precision of matched moulds.
Referring to Fig. 1 b and Fig. 2 b in this example, convenient for mould unloading, upper cores 2 is provided with the patrix thimble 203 that is used to eject shaped article, and described die 3 down is provided with the counterdie thimble 302 that is used to eject shaped article.
Referring to Fig. 2 b, in the present embodiment, in order to prevent the skew of PCB framework, following die 3 is provided with the pilot pin 303 that is used for fixing storage card PCB framework.
Second embodiment of encapsulating mould of the present invention is Micro SD card encapsulating mould, Fig. 4 a and Fig. 4 b show the front view of upper die and lower die respectively, this mould is provided with 6 sleeves that are used to put resin material cake, the die cavity of patrix die face tool has the shape of Micro SD card, 8 * 9=72 Micro SD card of every mould design encapsulation, first embodiment of other structures and encapsulating mould of the present invention is similar, repeats no more.
The 3rd embodiment of encapsulating mould of the present invention is RS-MMC card encapsulating mould, Fig. 5 a and Fig. 5 b show the front view of upper die and lower die respectively, this mould has 8 sleeves that are used to place resin material cake, the die cavity of patrix die face has the shape of RS-MMC card, 8 * 4=32 RS-MMC card of every mould design encapsulation, first embodiment of other structures and encapsulating mould of the present invention is similar, repeats no more.
The embodiment of a kind of method for packing of the present invention is a kind of USB storage card package, and concrete steps are as follows:
S1, preheated mold make the temperature of mould reach uniform temperature and keep this temperature, and this temperature is 170 ± 5 degree;
S2, preheating PCB framework, described PCB framework have a plurality of USB storage card circuit;
S3, a plurality of described PCB frameworks are placed on the die face of counterdie, by the pilot pin on the die face of counterdie with described PCB frame fixation on the die face of counterdie;
S4, resin material cake is dropped into respectively in a plurality of sleeves that are arranged on the counterdie, keep the temperature of mould, the resin material cake in the sleeve is melted;
S5, startup mould move up counterdie, with Ccope closing machine;
S6, injection device are clamp-oned runner with the resin of the thawing in the pairing sleeve, make epoxy resin be full of whole die cavity by runner;
S7, maintenance matched moulds state 2 minutes make the resin solidification moulding.
Mold temperature in the above-mentioned method for packing can be decided to be other temperature according to actual needs, is not limited to 170 ± 5 degree.Used resin is an epoxy resin, and the thawing earlier at high temperature of this resin is then along with the lengthening of time solidifies.
Above-mentioned method for packing also can be used for the encapsulation of RS-MMC card or Micro SD card.In the method, described injection device comprises the glue-extruding rod that has the plastic squeeze head and is used to install the base of glue-extruding rod, is provided with the spring that is used for balanced plastic squeeze pressure between glue-extruding rod and the base.
In conjunction with the accompanying drawings embodiments of the invention are described above; but the present invention is not limited to above-mentioned embodiment; above-mentioned embodiment only is schematic; rather than it is restrictive; those of ordinary skill in the art is under enlightenment of the present invention; not breaking away under the scope situation that aim of the present invention and claim protect, also can make a lot of forms, these all belong within the protection of the present invention.
Claims (10)
1. an encapsulating mould is used to encapsulate storage card, comprises upper die and lower die; Described patrix comprises cope match-plate pattern and is fixed on upper cores on the cope match-plate pattern; Described counterdie comprises die, die shoe, injection device, lower shoe down, and described die down is fixed on the die shoe, and described injection device and described die shoe are arranged on the lower shoe; It is characterized in that described die down is provided with a plurality of sleeves that are used to put resin material cake, is provided with runner with described sleeve correspondence position on the described upper cores; Described injection device comprises a plurality of glue-extruding rods that have the plastic squeeze head, and the plastic squeeze seat that is used to install glue-extruding rod, and described plastic squeeze head and described sleeve are suitable.
2. encapsulating mould according to claim 2 is characterized in that, is provided with the spring that is used to make the injecting glue isostasy between described glue-extruding rod and the plastic squeeze seat.
3. encapsulating mould according to claim 3 is characterized in that described patrix is provided with guide pin bushing, and described counterdie is provided with the reference column that cooperates with described guide pin bushing.
4. encapsulating mould according to claim 4 is characterized in that, described upper cores is provided with the patrix thimble that is used to eject shaped article, and described die down is provided with and is used for the counterdie thimble that item goes out shaped article.
5. encapsulating mould according to claim 5 is characterized in that, described sleeve is the wolfram steel sleeve.
6. encapsulating mould according to claim 6 is characterized in that, described die down is provided with the pilot pin that is used for fixing storage card PCB framework.
7. encapsulating mould according to claim 7 is characterized in that, the die cavity of described upper cores is shaped as the shape of Micro SD card, RS-MMC card or USB storage card.
8. a method for packing is used to encapsulate storage card, it is characterized in that, this storage card package method comprises the steps:
S1, preheated mold make the temperature of mould reach uniform temperature and keep this temperature;
S2, preheating PCB framework, described PCB framework has a plurality of storage card circuit;
S3, a plurality of described PCB frameworks are placed on the die face of counterdie, by the pilot pin on the die face of counterdie with described PCB frame fixation on the die face of counterdie;
S4, resin material cake is dropped into respectively in a plurality of sleeves that are arranged on the counterdie, keep the temperature of mould that the resin material cake in the sleeve is melted;
S5, counterdie move up, with Ccope closing machine;
S6, injection device are clamp-oned runner with the resin of the thawing in the pairing sleeve, make epoxy resin be full of whole die cavity by runner;
S7, maintenance matched moulds state certain hour make the resin solidification moulding.
9. storage card package method according to claim 8 is characterized in that, described storage card circuit is USB card, RS-MMC card or Micro SD card circuit.
10. storage card package method according to claim 9, it is characterized in that, described injection device comprises the glue-extruding rod that has the plastic squeeze head and is used to install the plastic squeeze seat of described glue-extruding rod, is provided with the spring that is used for balanced plastic squeeze pressure between described glue-extruding rod and the plastic squeeze seat.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009101067205A CN101866865B (en) | 2009-04-14 | 2009-04-14 | Packaging die and packaging method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009101067205A CN101866865B (en) | 2009-04-14 | 2009-04-14 | Packaging die and packaging method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101866865A true CN101866865A (en) | 2010-10-20 |
| CN101866865B CN101866865B (en) | 2012-01-18 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009101067205A Active CN101866865B (en) | 2009-04-14 | 2009-04-14 | Packaging die and packaging method thereof |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102104013A (en) * | 2010-11-10 | 2011-06-22 | 华为终端有限公司 | Data card and assembling method thereof |
| CN102738021A (en) * | 2012-07-02 | 2012-10-17 | 苏州均华精密机械有限公司 | Positioning structure of semi-conductor chip cantilever package |
| CN104340946A (en) * | 2013-08-02 | 2015-02-11 | 无锡华润安盛科技有限公司 | MEMS (micro-electromechanical system) circuit cover and manufacturing method thereof |
| CN104552672A (en) * | 2014-12-08 | 2015-04-29 | 南通富士通微电子股份有限公司 | BGA molding mold |
| CN107053618A (en) * | 2017-03-08 | 2017-08-18 | 安徽国晶微电子有限公司 | A kind of integrated circuit plastic packaging mould injecting systems |
| CN107415168A (en) * | 2017-08-04 | 2017-12-01 | 苏州日月新半导体有限公司 | Encapsulating compound band and its injection moulding process and injection mold |
| CN111605139A (en) * | 2019-02-26 | 2020-09-01 | 日月光半导体制造股份有限公司 | Packaging mold and packaging method |
| CN112071970A (en) * | 2020-09-08 | 2020-12-11 | 贵州凯瑞嘉电子科技有限公司 | Light emitting diode packaging device |
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| CN1846965B (en) * | 2006-04-25 | 2010-09-15 | 青岛科技大学 | Multiple station vertical injection forming equipment |
| CN200948659Y (en) * | 2006-09-18 | 2007-09-19 | 深圳市欣旺达电子有限公司 | Thin-walled injection mold |
| CN200974320Y (en) * | 2006-11-27 | 2007-11-14 | 浙江苏泊尔橡塑制品有限公司 | Injection forming mould for thermosetting plastics |
| CN100548619C (en) * | 2006-11-27 | 2009-10-14 | 浙江苏泊尔橡塑制品有限公司 | A kind of injection transfer moulding method of thermosetting plastics and mould thereof |
| CN201392819Y (en) * | 2009-04-14 | 2010-01-27 | 深圳市劲升迪龙科技发展有限公司 | Sealed module |
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2009
- 2009-04-14 CN CN2009101067205A patent/CN101866865B/en active Active
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102104013A (en) * | 2010-11-10 | 2011-06-22 | 华为终端有限公司 | Data card and assembling method thereof |
| CN102104013B (en) * | 2010-11-10 | 2013-06-12 | 华为终端有限公司 | Data card and assembling method thereof |
| CN102738021A (en) * | 2012-07-02 | 2012-10-17 | 苏州均华精密机械有限公司 | Positioning structure of semi-conductor chip cantilever package |
| CN102738021B (en) * | 2012-07-02 | 2014-12-17 | 苏州均华精密机械有限公司 | Positioning structure of semi-conductor chip cantilever package |
| CN104340946A (en) * | 2013-08-02 | 2015-02-11 | 无锡华润安盛科技有限公司 | MEMS (micro-electromechanical system) circuit cover and manufacturing method thereof |
| CN104340946B (en) * | 2013-08-02 | 2016-08-31 | 无锡华润安盛科技有限公司 | A kind of MEMS circuit lid and preparation method thereof |
| CN104552672A (en) * | 2014-12-08 | 2015-04-29 | 南通富士通微电子股份有限公司 | BGA molding mold |
| CN107053618A (en) * | 2017-03-08 | 2017-08-18 | 安徽国晶微电子有限公司 | A kind of integrated circuit plastic packaging mould injecting systems |
| CN107415168A (en) * | 2017-08-04 | 2017-12-01 | 苏州日月新半导体有限公司 | Encapsulating compound band and its injection moulding process and injection mold |
| CN111605139A (en) * | 2019-02-26 | 2020-09-01 | 日月光半导体制造股份有限公司 | Packaging mold and packaging method |
| CN111605139B (en) * | 2019-02-26 | 2023-08-25 | 日月光半导体制造股份有限公司 | Packaging mold and packaging method |
| CN112071970A (en) * | 2020-09-08 | 2020-12-11 | 贵州凯瑞嘉电子科技有限公司 | Light emitting diode packaging device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101866865B (en) | 2012-01-18 |
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Effective date of registration: 20200203 Address after: Unit 6, unit 402, block 3, block 28-2, Fu'an Industrial Zone, Chonghe village, Leliu street, Shunde District, Foshan City, Guangdong Province 528000 Patentee after: Gaopuda (Guangdong) chip Co.,Ltd. Address before: 518043 Guangdong city of Shenzhen province Futian District Sha Industrial District 2 Building 2 floor Patentee before: DTT TECHNOLOGY CHINA CO.,LTD. |
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Effective date of registration: 20231206 Address after: No. 46 Chashanzheng Street, Chashanao Town, Zhuhui District, Hengyang City, Hunan Province, 421000 Patentee after: Xiao Longhua Address before: 518000 13C2-57, Chegongmiao Tianxiang Building, Shatou Street, Futian District, Shenzhen, Guangdong Patentee before: DTT TECHNOLOGY CHINA CO.,LTD. |
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