CN111605139B - Packaging mold and packaging method - Google Patents

Packaging mold and packaging method Download PDF

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Publication number
CN111605139B
CN111605139B CN202010104957.6A CN202010104957A CN111605139B CN 111605139 B CN111605139 B CN 111605139B CN 202010104957 A CN202010104957 A CN 202010104957A CN 111605139 B CN111605139 B CN 111605139B
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China
Prior art keywords
cavity
mold
molding
cavities
flow
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CN202010104957.6A
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Chinese (zh)
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CN111605139A (en
Inventor
简子杰
陈熙洪
曾乙修
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Advanced Semiconductor Engineering Inc
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Advanced Semiconductor Engineering Inc
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Publication of CN111605139A publication Critical patent/CN111605139A/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/27—Sprue channels ; Runner channels or runner nozzles
    • B29C45/2701—Details not specific to hot or cold runner channels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C2045/2683—Plurality of independent mould cavities in a single mould

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

A packaging mold comprises a mold body, two first cavities and a plurality of second cavities. The die body has at least one molding zone. The two first cavities are connected with the die body, each first cavity is provided with a containing cavity and at least one connecting channel, and the connecting channels are communicated with the die sealing area and the containing cavity. The second cavities are connected with the die body, each second cavity is provided with a material placing cavity and at least one feeding and pouring channel, and the feeding and pouring channels are communicated with the die sealing area and the material placing cavity. The volume of the connecting channel of the first cavity is larger than or equal to the volume of the charging and pouring channel of the second cavity.

Description

Packaging mold and packaging method
Technical Field
The present invention relates to a packaging mold and a packaging method, and more particularly, to a packaging mold and a packaging method that improve a packaging mold flow.
Background
To avoid excessive process costs, the same set of dies may be shared as much as possible during molding of different types or sizes of high complexity packaged products. However, because the cavity volume is fixed, the array combinations arranged by different product sizes are different, so that the volumes of the side runners at two sides are also different from those of the middle mold sealing area, the phenomenon of uneven mold flow between the two is easily caused, and the problems that the products of the tail row are not molded or are not completely molded are caused. At present, products of tail rows or two to three tail rows are generally sacrificed in production lines for production design. However, the above method not only greatly reduces the output of the productivity, but also causes the closing of the vacuum pumping function due to the rapid flow of the mold flow of the side flow channel to the exhaust area, so that the air in the mold sealing area cannot be smoothly exhausted, and further the problems of the wrapping phenomenon and warping of the air residues are generated.
Disclosure of Invention
In one embodiment, a packaging mold comprises a mold body, two first cavities and a plurality of second cavities. The die body has at least one molding zone. The two first cavities are connected with the die body, each first cavity is provided with a containing cavity and at least one connecting channel, and the connecting channels are communicated with the die sealing area and the containing cavity. The second cavities are connected with the die body, each second cavity is provided with a material placing cavity and at least one material feeding and pouring channel, the material feeding and pouring channels are communicated with the die sealing area and the material placing cavity, and the volume of the connecting channel of the first cavity is larger than or equal to that of the material feeding and pouring channels of the second cavity.
In one embodiment, a packaging method includes: providing a packaging mold, wherein the packaging mold comprises a mold body, two first cavities and a plurality of second cavities, the mold body is provided with a mold sealing area, and the first cavities and the second cavities are connected with the mold body and are communicated with the mold sealing area; setting at least one object to be molded in the molding area; respectively placing a plurality of first molding materials into each second cavity, and cleaning each first cavity; and extruding the first molding material into the molding area to form a first molding flow and a second molding flow which cover the object to be molded, and enabling part of the second molding flow to flow into each first cavity.
In one embodiment, a packaging method includes: providing a packaging mold, wherein the packaging mold comprises a mold body, two first cavities and a plurality of second cavities, the mold body is provided with a mold sealing area, and the first cavities and the second cavities are connected with the mold body and are communicated with the mold sealing area; setting at least one object to be molded in the molding area; placing a plurality of first molding materials into each of the second cavities, and placing a plurality of second molding materials into each of the first cavities; and extruding the first molding material and the second molding material into the molding area to form a first molding flow and a second molding flow which cover the object to be molded, and enabling part of the second molding flow to flow into each first cavity.
Drawings
Aspects of some embodiments of the invention are readily understood from the following detailed description when read in connection with the accompanying drawings. It should be noted that the various structures may not be drawn to scale and that the dimensions of the various structures may be arbitrarily increased or decreased for clarity of discussion.
Fig. 1 is a schematic perspective view of a packaging mold according to an embodiment of the invention.
Fig. 2 shows an enlarged view of the partial area a of fig. 1.
Fig. 3 shows a structural top view of the encapsulation mold of fig. 1.
Fig. 4 is a top view showing the structure of a package mold according to an embodiment of the invention.
Fig. 5 is a top view showing the structure of a package mold according to an embodiment of the invention.
Fig. 6 is a schematic structural view showing the package mold of fig. 1, in which a first plunger and a second plunger are provided (the end faces of the two plungers are located on the same plane).
Fig. 7 is a schematic view showing a structure of the package mold of fig. 1 in which a first plunger and a second plunger are provided (end faces of the two plungers are located on different planes).
Fig. 8 is a schematic structural diagram of a packaging mold in the packaging method of the present invention.
FIG. 9 is a schematic diagram showing the placement of the object to be molded in the molding region in the packaging method of the present invention.
FIG. 10 is a schematic diagram showing the placement of the first molding material into the second cavity and the clearance of the first cavity in the packaging method of the present invention.
FIG. 11 is a schematic illustration showing the extrusion of a first molding material into a molding region in a packaging process according to the present invention.
FIG. 12 is a schematic diagram showing the extrusion back of the first and second mold flows into the molding region and the receiving cavity and the connecting channel in the packaging method of the present invention.
Fig. 13 is a schematic structural diagram of a packaging mold in the packaging method of the present invention.
Fig. 14 is a schematic view showing the placement of the object to be molded in the molding region in the packaging method of the present invention.
Fig. 15 is a schematic view showing that the first molding material is placed in the second cavity and the second molding material is placed in the first cavity in the packaging method of the present invention.
FIG. 16 is a schematic illustration showing the extrusion of the first molding material and the second molding material into the molding region in the packaging method of the present invention.
FIG. 17 is a schematic diagram showing the extrusion back of the first and second mold flows into the molding region and the receiving cavity and the connecting channel in the packaging method according to the present invention.
Detailed Description
Common reference numerals are used throughout the drawings and embodiments to indicate the same or similar components. Embodiments of the present invention will be more readily understood from the following detailed description taken in conjunction with the accompanying drawings.
The following disclosure provides many different embodiments, or examples, for implementing different features of the provided subject matter. Specific examples of components and arrangements are described below to illustrate specific aspects of the invention. Of course, these components, values, operations, materials, and arrangements are merely examples and are not intended to be limiting. For example, in the description provided herein, the formation of a first feature over or on a second feature may include embodiments in which the first feature is formed or disposed in direct contact with the second feature, and may also include embodiments in which additional features may be formed or disposed between the first feature and the second feature such that the first feature and the second feature may not be in direct contact. In addition, the present disclosure may repeat reference numerals and/or letters in the various examples provided herein. Such repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed.
Fig. 1 is a schematic perspective view of an encapsulation mold 1 according to an embodiment of the invention. Fig. 2 shows an enlarged view of the partial area a of fig. 1. Fig. 3 shows a structural plan view of the encapsulation tool 1 of fig. 1, wherein the width of the side channels is greater than the width of the dicing channels. Referring to fig. 1, 2 and 3, the packaging mold 1 of the present invention includes a mold body 10, two first cavities 20 and a plurality of second cavities 30. In an embodiment, the material of the mold body 10, the first cavity 20 and the second cavity 30 is metal.
The die body 10 has at least one molding region 11, and the molding region 11 has a plurality of molding blocks 111 and a plurality of cutting lines 112. The to-be-molded blocks 111 are arranged in the molding region 11 at intervals, and are used for respectively setting to-be-molded objects. The scribe line 112 is used to define the molding block 111. In one embodiment, the molding region 11 is an inner space of the mold body 10 and is substantially a closed space. The molding region 11 is used for accommodating a substrate, and the substrate is provided with the to-be-molded block 111 and the dicing channel 112. The scribe line 112 is a path of the dicing tool in the dicing step (singulation process), and the to-be-molded block 111 is a position of a package unit (package unit) obtained after the dicing step is completed.
In addition, both sides of the molding region 11 are respectively provided with a side flow channel 12, and the side flow channels 12 are communicated with the molding region 11. In one embodiment, the side flow 12 is the space between the side of the substrate and the inner sidewall of the mold body 10.
The two first cavities 20 are connected to the mold body 10, and the two first cavities 20 are adjacent to each of the side channels 12, respectively.
In one embodiment, each first cavity 20 has a receiving cavity 21 and at least one connecting channel 22. The receiving cavity 21 may be provided with no molding material or with a small amount of molding material. The connecting channel 22 is communicated with the molding area 11 and the accommodating cavity 21. Further, the connection passage 22 has a first opening 221, and the connection passage 22 communicates with the molding region 11 via the first opening 221. In one embodiment, the connection channel 22 is funnel-shaped, and the first opening 221 is quadrilateral.
The second cavity 30 is connected to the mold body 10, and the second cavity 30 is located between the two first cavities 20.
In one embodiment, each of the second cavities 30 has a receiving cavity 31 and at least one charging pouring channel 32. The material placing cavity 31 is used for placing molding materials. The feeding pouring channel 32 is communicated with the molding area 11 and the material placing cavity 31. Furthermore, the feed pouring channel 32 has a second opening 321, via which second opening 321 the feed pouring channel 32 communicates with the molding zone 11. In one embodiment, the at least one feed pouring channel 32 comprises two feed pouring channels 32, the two feed pouring channels 32 being splayed and the second opening 321 being quadrilateral.
In an embodiment, the opening area of the first opening 221 is larger than the opening area of the second opening 321, so that the mold flow located in the side flow path 12 can pass through the first opening 221 to achieve the effect of reducing the flow rate of the mold flow.
In an embodiment, the molding zone 11 of the mold body 10 is further in communication with an exhaust zone adjacent to the sidewall of the mold body 10 and opposite to the first cavity 20 and the second cavity 30.
Fig. 4 shows a structural plan view of a packaging mold 1a according to an embodiment of the present invention, in which the width of the side runner is smaller than the width of the dicing street. Referring to fig. 3 and 4, in order to slow down the flow rate of the mold flow, the geometric arrangement of the first cavity 20 and the second cavity 30 of the present invention can be adjusted according to the width of the side flow channel 12 and the cutting channel 112, which will be described in detail below.
As shown in fig. 3, when the width W1 of the side flow channel 12 is greater than the width W2 of each of the cutting channels 112, the geometry of the first cavity 20 is different from the geometry of the second cavity 30 (e.g., the geometry of the connecting channel 22 is different from the geometry of the charging and pouring channels 32. As shown in fig. 3, the connecting channel 22 is funnel-shaped, and the two charging and pouring channels 32 are splayed), and the volume of the connecting channel 22 of the first cavity 20 is greater than the volume of the charging and pouring channels 32 of the second cavity 30, so that the die flow in the side flow channel 12 can pass through the buffer space provided by the connecting channel 22 and the accommodating cavity 21 of the first cavity 20, thereby achieving the effect of reducing the die flow velocity.
As shown in fig. 4, when the width W1 of the side flow channel 12 is smaller than or equal to the width W2 of each of the cutting channels 112, the geometry of the first cavity 20a is the same as the geometry of the second cavity 30 (e.g., the geometry of the connecting channel 22a is the same as the geometry of the charging and pouring channels 32. As shown in fig. 4, both the connecting channels 22a and the two charging and pouring channels 32 are splayed), and the volume of the connecting channel 22a of the first cavity 20a is equal to the volume of the charging and pouring channel 32 of the second cavity 30, so that the die flow in the side flow channel 12 can pass through the buffer space provided by the connecting channel 22a and the accommodating cavity 21 of the first cavity 20a, thereby achieving the effect of slowing down the flow rate of the die flow.
Fig. 5 shows a structural plan view of a packaging mold 1b according to an embodiment of the present invention. The encapsulation mold 1b of fig. 5 is substantially the same as the encapsulation mold 1 of fig. 1 to 3, except that the encapsulation mold 1b of fig. 5 is further provided with a hollow buffer 80. In order to more quickly slow down the flow rate of the mold in the side flow channel 12, in an embodiment, the packaging mold 1b may further include two hollow buffer members 80, the two hollow buffer members 80 are connected to the mold body 10, and the buffer spaces in the two hollow buffer members 80 respectively correspond to and are communicated with each side flow channel 12, so that the mold in the side flow channel 12 can pass through or enter the buffer spaces in the two hollow buffer members 80, thereby achieving the effect of quickly slowing down the flow rate of the mold.
Referring to fig. 6, a schematic structural diagram of the packaging mold 1 of fig. 1 in which a first plunger 40 and a second plunger 50 are disposed (the end faces of the two plungers are located on the same plane) is shown. In order to squeeze molding material into the molding region 11 to generate a molding flow, in one embodiment, the encapsulation tool 1 may be further provided with two first plungers 40 and a plurality of second plungers 50. The two first plungers 40 are respectively inserted into the accommodating chambers 21 of the first chambers 20, and each first plunger 40 has an end surface (upper surface) 42. The second plungers 50 are respectively inserted into the material placement chambers 31 of the second chambers 30, and each of the second plungers 50 has an end surface (upper surface) 52.
In an embodiment, when the accommodating cavity 21 of the first cavity 20 is not provided with molding materials, each first plunger 40 and each second plunger 50 move synchronously to maintain the end face 42 of each first plunger 40 and the end face 52 of each second plunger 50 on the same plane, and the accommodating cavity 21 is in a clearance state, and the cavity space can be used as a molding buffer space.
Referring to fig. 7, a schematic structural diagram of the packaging mold 1 of fig. 1 in which a first plunger 40 and a second plunger 50 are disposed (the end faces of the two plungers are located on different planes) is shown. In an embodiment, when the accommodating cavity 21 of the first cavity 20 is provided with a small amount of molding material, each of the first plungers 40 and each of the second plungers 50 do not move synchronously, so as to maintain the end face 42 of each of the first plungers 40 and the end face 52 of each of the second plungers 50 on different planes, and a distance space between the end face 42 of the first plunger 40 and the accommodating cavity 21 at this time can be used as a mold flow buffer space.
The present invention will be described in detail with respect to the packaging method using the packaging mold 1 (fig. 1 to 3), and the embodiments of the packaging method in which the first cavity 20 is not provided with the molding material and the first cavity 20 is provided with the molding material will be described in detail, but the present invention is not limited to the disclosure of these embodiments.
[ first cavity 20 is not provided with molding Material ]
Referring to fig. 8, a schematic structure of a packaging mold 1 in the packaging method of the present invention is shown. The step (a) of the packaging method of the present invention is to provide a packaging mold 1, wherein the packaging mold 1 includes a mold body 10, two first cavities 20 and a plurality of second cavities 30, the mold body 10 has a molding region 11, the molding region 11 has a plurality of to-be-molded blocks 111 and a plurality of cutting channels 112, the to-be-molded blocks 111 are arranged in the molding region 11 at intervals, and the cutting channels 112 are used for defining the to-be-molded blocks 111. The first cavity 20 and the second cavity 30 are connected to the mold body 10 and are communicated with the molding region 11.
In the step (a), each first cavity 20 has a receiving cavity 21 and at least one connecting channel 22, and the connecting channel 22 communicates with the molding region 11 and the receiving cavity 21. Each second cavity 30 has a material placing cavity 31 and at least one material charging and pouring channel 32, the material charging and pouring channel 32 is communicated with the molding area 11 and the material placing cavity 31, and the volume of the connecting channel 22 is larger than or equal to the volume of the material charging and pouring channel 32.
Referring to fig. 9, a schematic diagram of the method for packaging the object to be molded in the molding region according to the present invention is shown. Step (b) of the encapsulation method of the present invention is to dispose at least one object to be encapsulated 90 within the molding zone 11. In the step (b), the at least one object to be molded 90 includes a plurality of objects to be molded 90, and the objects to be molded 90 are respectively disposed on each of the blocks to be molded 111. In one embodiment, the object to be molded 90 may be at least one semiconductor device (e.g., a semiconductor chip) disposed on a substrate.
Referring to fig. 10, a schematic diagram of the first molding material being placed into the second cavity and the first cavity being cleaned in the packaging method of the present invention is shown. In step (c) of the packaging method of the present invention, a plurality of first molding materials 61 are respectively placed in each of the second cavities 30, and each of the first cavities 20 is cleared. In the step (c), the first molding material 61 is placed into each of the placement cavities 31.
FIG. 11 is a schematic illustration showing the extrusion of a first molding material into a molding region in a packaging process according to the present invention. Referring to fig. 10 and 11 in combination, step (d) of the packaging method of the present invention is to squeeze the first molding material 61 into the molding region 11 to form a first molding stream 71 and a second molding stream 72 covering the object to be molded 90, and make a portion of the second molding stream 72 flow into each of the first cavities 20. In one embodiment, the first molding material 61 is extruded into the molding zone 11 via a heating and pressurizing process, and the pressurizing process is performed by the punching action of the second plunger 50 shown in fig. 6.
In the step (d), the second molding flows 72 are formed at both sides of the first molding flow 71, and a portion of the second molding flow 72 flows into the connection passage 22 and the receiving chamber 21 of each of the first chambers 20. In addition, in one embodiment, a portion of the first mold flow 71 flows into the connection channel 22 and the receiving cavity 21 of each first cavity 20.
In addition, in the step (D), the first die flow 71 has a first depth D1, the second die flow 72 has a second depth D2, and the flow rate of the second die flow 72 is reduced due to the fact that the portion of the second die flow 72 flows into the connection channel 22 and the accommodating chamber 21 of each of the first cavities 20, so that the first depth D1 of the first die flow 71 is ensured to be greater than or equal to the second depth D2 of the second die flow 72.
FIG. 12 is a schematic diagram showing the extrusion back of the first and second mold flows into the molding region and the receiving cavity and the connecting channel in the packaging method of the present invention. Referring to fig. 11 and 12 in combination, after the step (d), the packaging method of the present invention further includes: step (e) extrudes the portion of the first molding stream 71 and the portion of the second molding stream 72 located in the accommodating cavity 21 and the connecting channel 22 of each first cavity 20 back to the molding zone 11, so that the first molding stream 71 and the second molding stream 72 can completely cover the object to be molded 90. In one embodiment, the first mold flow 71 and the second mold flow 72 may cover the object to be molded 90 substantially simultaneously.
The present invention uses the first cavity 20 as a die flow buffer space, so that the second die flow 72 located in the side flow 12 is decelerated and does not rapidly flow to the exhaust area, so as to maintain the smoothness of exhaust, and further avoid the wrapping phenomenon of air residue and the warpage problem. In addition, the packaging method of the present invention can completely mold all the objects to be molded 90 without sacrificing any product, thereby greatly improving the productivity output.
[ first cavity 20 is provided with a mold sealing Material ]
Referring to fig. 13, a schematic structure of a packaging mold 1 in the packaging method of the present invention is shown. The step (a) of the packaging method of the present invention is to provide a packaging mold 1, wherein the packaging mold 1 includes a mold body 10, two first cavities 20 and a plurality of second cavities 30, the mold body 10 has a molding region 11, the molding region 11 has a plurality of to-be-molded blocks 111 and a plurality of cutting channels 112, the to-be-molded blocks 111 are arranged in the molding region 11 at intervals, and the cutting channels 112 are used for defining the to-be-molded blocks 111. The first cavity 20 and the second cavity 30 are connected to the mold body 10 and are communicated with the molding region 11.
In the step (a), each first cavity 20 has a receiving cavity 21 and at least one connecting channel 22, and the connecting channel 22 communicates with the molding region 11 and the receiving cavity 21. Each second cavity 30 has a material placing cavity 31 and at least one material charging and pouring channel 32, the material charging and pouring channel 32 is communicated with the molding area 11 and the material placing cavity 31, and the volume of the connecting channel 22 is larger than or equal to the volume of the material charging and pouring channel 32.
Referring to fig. 14, a schematic diagram of the method for packaging the present invention is shown, in which the object to be molded is disposed in the molding region. Step (b) of the packaging method of the present invention is to dispose at least one object to be molded 90 in the molding region 11. In the step (b), the at least one object to be molded 90 includes a plurality of objects to be molded 90, and the objects to be molded 90 are respectively disposed on each of the blocks to be molded 111.
Referring to fig. 15, a schematic diagram of a first molding material placed in a second cavity and a second molding material placed in the first cavity in the packaging method of the present invention is shown. In step (c) of the packaging method of the present invention, a plurality of first molding materials 61 are respectively placed in each of the second cavities 30, and a plurality of second molding materials 62 are respectively placed in each of the first cavities 20. In the step (c), the first molding materials 61 are respectively placed in the material placing cavities 31, and the second molding materials 62 are respectively placed in the accommodating cavities 21. In addition, the volume of each first molding material 61 is larger than the volume of each second molding material 62, and the volume of the second molding material 62 is smaller, so that the space occupied by each accommodating cavity 21 is not large, and thus, the space can be used for buffering the mold flow.
FIG. 16 is a schematic illustration showing the extrusion of the first molding material and the second molding material into the molding region in the packaging method of the present invention. Referring to fig. 15 and 16 in combination, in step (d) of the packaging method of the present invention, the first molding material 61 and the second molding material 62 are extruded into the molding region 11 to form a first molding stream 71 and a second molding stream 72 covering the object to be molded 90, and a portion of the second molding stream 72 flows into each of the first cavities 20. In one embodiment, the first molding material 61 and the second molding material 62 are extruded into the molding region 11 through a heating and pressurizing process, and the pressurizing process is performed by the punching action of the first plunger 40 and the second plunger 50 shown in fig. 6.
In the step (d), the second molding flows 72 are formed at both sides of the first molding flow 71, and a portion of the second molding flow 72 flows into the connection passage 22 and the receiving chamber 21 of each of the first chambers 20. In addition, in one embodiment, a portion of the first mold flow 71 flows into the connection channel 22 and the receiving cavity 21 of each first cavity 20.
In addition, in the step (D), the first die flow 71 has a first depth D1, the second die flow 72 has a second depth D2, and the flow rate of the second die flow 72 is reduced due to the fact that the portion of the second die flow 72 flows into the connection channel 22 and the accommodating chamber 21 of each of the first cavities 20, so that the first depth D1 of the first die flow 71 is ensured to be greater than or equal to the second depth D2 of the second die flow 72.
FIG. 17 is a schematic diagram showing the extrusion back of the first and second mold flows into the molding region and the receiving cavity and the connecting channel in the packaging method according to the present invention. Referring to fig. 16 and 17 in combination, after the step (d), the packaging method of the present invention further includes: step (e) extrudes the portion of the first molding stream 71 and the portion of the second molding stream 72 located in the accommodating cavity 21 and the connecting channel 22 of each first cavity 20 back to the molding zone 11, so that the first molding stream 71 and the second molding stream 72 can completely cover the object to be molded 90.
The above embodiments are merely for illustrating the principles of the present invention and their effects and are not meant to limit the invention, so that modifications and variations of the above embodiments will not depart from the spirit of the invention by those skilled in the art. The scope of the invention is set forth in the following claims.

Claims (26)

1. A packaging mold, comprising:
the die body is provided with at least one die sealing area;
the two first cavities are connected with the die body, each first cavity is provided with a containing cavity and at least one connecting channel, and the connecting channels are communicated with the die sealing area and the containing cavity; a kind of electronic device with high-pressure air-conditioning system
The second cavities are connected with the die body, each second cavity is provided with a material placing cavity and at least one material feeding pouring channel, the material feeding pouring channels are communicated with the die sealing area and the material placing cavity, the volume of the connecting channels of the first cavities is larger than or equal to that of the material feeding pouring channels of the second cavities, the connecting channels of the first cavities are provided with first openings, and the connecting channels of the first cavities are communicated with the die sealing area through the first openings; the charging and pouring channel of the second cavity is provided with a second opening, the charging and pouring channel of the second cavity is communicated with the molding area through the second opening, and the opening area of the first opening is larger than that of the second opening.
2. The encapsulation mold of claim 1, wherein the geometry of the connecting channel is different from the geometry of the charge casting channel.
3. The encapsulation mold of claim 1, wherein the at least one feed pouring channel comprises two feed pouring channels, and the two feed pouring channels are splayed.
4. The packaging mold of claim 1, wherein the molding region has one side runner on each side, the side runners being in communication with the molding region.
5. The package mold of claim 4, wherein the molding region has a plurality of blocks to be molded and a plurality of dicing lanes, the blocks to be molded are arranged at intervals, the dicing lanes are used for defining the blocks to be molded, and the width of the side flow channel is larger than the width of each dicing lane.
6. The encapsulation mold of claim 5, wherein a geometry of the first cavity is different than a geometry of the second cavity.
7. The packaging mold of claim 4, further comprising two hollow buffers connected to the mold body, the two hollow buffers corresponding to and communicating with each of the side runners, respectively.
8. The encapsulation mold of claim 1, wherein a geometry of the first cavity is the same as a geometry of the second cavity.
9. The packaging mold of claim 1, further comprising two first plungers and a plurality of second plungers, the two first plungers corresponding to the receiving cavities of the first cavities, respectively, the second plungers corresponding to the placing cavities of the second cavities, respectively.
10. The encapsulation mold of claim 9, wherein each of the first plungers has an end face, each of the second plungers has an end face, and the end face of each of the first plungers is on the same plane as the end face of each of the second plungers.
11. The encapsulation mold of claim 9, wherein each of the first plungers has an end face, each of the second plungers has an end face, and the end face of each of the first plungers is located on a different plane than the end face of each of the second plungers.
12. A packaging method, comprising:
(a) Providing a packaging mold, wherein the packaging mold comprises a mold body, two first cavities and a plurality of second cavities, the mold body is provided with a mold sealing area, and the first cavities and the second cavities are connected with the mold body and are communicated with the mold sealing area;
(b) Setting at least one object to be molded in the molding area;
(c) Respectively placing a plurality of first molding materials into each second cavity, and cleaning each first cavity; a kind of electronic device with high-pressure air-conditioning system
(d) And extruding the first molding material into the molding area to form a first molding flow and a second molding flow which cover the object to be molded, and enabling part of the second molding flow to flow into each first cavity.
13. The packaging method of claim 12, wherein in the step (a), each first cavity has a receiving cavity and at least one connecting channel, the connecting channel communicates with the molding region and the receiving cavity, each second cavity has a placement cavity and at least one charging and pouring channel, the charging and pouring channel communicates with the molding region and the placement cavity, and the volume of the connecting channel is greater than or equal to the volume of the charging and pouring channel.
14. The packaging method according to claim 13, wherein in the step (d), a portion of the second mold flow flows into the connection channel and the accommodation cavity of each of the first cavities.
15. The packaging method of claim 14, wherein after the step (d), the packaging method further comprises:
(e) And extruding the parts of the second die flow in the accommodating cavity of each first cavity and the connecting channel back to the die sealing area.
16. The packaging method of claim 12, wherein in the step (d), the first die stream has a first depth, the second die stream has a second depth, and the first depth is greater than or equal to the second depth.
17. The packaging method of claim 12, wherein in the step (d), the second mold flow is formed on both sides of the first mold flow.
18. The encapsulation method of claim 12, wherein in step (d), the first molding material is extruded into the molding zone via a heating and pressurizing process.
19. A packaging method, comprising:
(a) Providing a packaging mold, wherein the packaging mold comprises a mold body, two first cavities and a plurality of second cavities, the mold body is provided with a mold sealing area, and the first cavities and the second cavities are connected with the mold body and are communicated with the mold sealing area;
(b) Setting at least one object to be molded in the molding area;
(c) Placing a plurality of first molding materials into each of the second cavities, and placing a plurality of second molding materials into each of the first cavities; a kind of electronic device with high-pressure air-conditioning system
(d) And extruding the first molding material and the second molding material into the molding area to form a first molding flow and a second molding flow which cover the object to be molded, and enabling part of the second molding flow to flow into each first cavity.
20. The packaging method of claim 19, wherein in the step (a), each first cavity has a receiving cavity and at least one connecting channel, the connecting channel communicates with the molding region and the receiving cavity, each second cavity has a placement cavity and at least one charging and pouring channel, the charging and pouring channel communicates with the molding region and the placement cavity, and the volume of the connecting channel is greater than or equal to the volume of the charging and pouring channel.
21. The packaging method of claim 20, wherein in the step (d), a portion of the second mold flow flows into the connection channel and the receiving cavity of each of the first cavities.
22. The packaging method of claim 21, wherein after the step (d), the packaging method further comprises:
(e) And extruding the parts of the second die flow in the accommodating cavity of each first cavity and the connecting channel back to the die sealing area.
23. The packaging method of claim 19, wherein in the step (c), a volume of each of the first molding materials is greater than a volume of each of the second molding materials.
24. The packaging method of claim 19, wherein in the step (d), the first die stream has a first depth, the second die stream has a second depth, and the first depth is greater than or equal to the second depth.
25. The packaging method of claim 19, wherein in the step (d), the second mold flow is formed on both sides of the first mold flow.
26. The packaging method of claim 19, wherein in the step (d), the first molding material and the second molding material are extruded into the molding region through a heating and pressurizing process.
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